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Network

William Paul King

Person: Academic

Gaurav Bahl

Person: Academic

Blake Everett Johnson

Person: Academic

Placid Mathew Ferreira

Person: Academic

Jennifer Amos

Person: Academic

Stefan Elbel

Person: Academic

Abigail Wooldridge

Person: Academic

A. John Hart

  • University of Michigan, Ann Arbor
  • Massachusetts Institute of Technology
  • KU Leuven
  • Mechanosynthesis Group
  • Department of Mechanical Engineering, Laboratory for Manufacturing and Productivity, Massachusetts Institute of Technology
  • Mechanosynthesis Group
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering and Laboratory for Manufacturing and Productivity
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Mechanosynthesis Group
  • Department of Mechanical Engineering
  • University of Michigan, Ann Arbor

External person

Michaël F L De Volder

  • Interuniversitair Micro-Elektronica Centrum
  • Division PMA
  • Harvard University
  • KU Leuven
  • KULeuven
  • Department of Mechanical Engineering, Katholieke Universiteit Leuven
  • Mechanosynthesis Group
  • University of Michigan, Ann Arbor
  • University of Cambridge
  • Department of Mechanical Engineering
  • School of Engineering and Applied Sciences, Wyss Institute for Biologically Inspired Engineering, Harvard University
  • Department of Mechanical Engineering
  • Department of Engineering, Cambridge Univ
  • Mechanosynthesis Group
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Massachusetts Institute of Technology
  • University of Michigan, Ann Arbor
  • Harvard University

External person

Sei Jin Park

  • University of Michigan, Ann Arbor
  • Mechanosynthesis Group
  • Massachusetts Institute of Technology
  • Department of Mechanical Engineering, Laboratory for Manufacturing and Productivity, Massachusetts Institute of Technology
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Mechanosynthesis Group
  • Department of Mechanical Engineering
  • University of Michigan, Ann Arbor

External person

Eric R. Meshot

  • University of Michigan, Ann Arbor
  • Interuniversitair Micro-Elektronica Centrum
  • KU Leuven
  • Mechanosynthesis Group
  • Department of Mechanical Engineering
  • University of Michigan, Ann Arbor

External person

Mostafa Bedewy

  • University of Michigan, Ann Arbor
  • Massachusetts Institute of Technology
  • Department of Mechanical Engineering and Laboratory for Manufacturing and Productivity
  • Department of Mechanical Engineering
  • Research Laboratory of Electronics (RLE)
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Mechanosynthesis Group
  • University of Michigan, Ann Arbor

External person

Kaihao Zhang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

D. Copic

  • University of Michigan, Ann Arbor
  • Mechanosynthesis Group
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Mechanosynthesis Group
  • Department of Mechanical Engineering
  • University of Michigan, Ann Arbor

External person

Davis J. McGregor

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Jonathan Bunyan

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois
  • Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Ali Kanj

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering

External person

Alireza Mojahed

  • University of Illinois Urbana-Champaign
  • Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Massachusetts Institute of Technology

External person

Chongan Wang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering

External person

Erik S. Polsen

  • University of Michigan, Ann Arbor
  • Mechanosynthesis Group
  • Department of Mechanical Engineering
  • Mechanosynthesis Group
  • Department of Mechanical Engineering
  • University of Michigan, Ann Arbor

External person

Matthew R. Maschmann

  • University of Missouri
  • Wright-Patterson AFB
  • Universal Technology Corporation
  • Air Force Research Laboratory
  • Materials and Manufacturing Directorate
  • Department of Mechanical and Aerospace Engineering
  • Air Force Research Laboratory
  • Air Force Research Lab.

External person

Anna Brieland-Shoultz

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Aly EL-Shafei

  • Cairo University
  • Department of Mechanical Design and Production
  • Faculty of Engineering

External person

Alexander Pagano

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Michael J. Leamy

  • Georgia Institute of Technology
  • School of Mechanical Engineering
  • Mechanical Engineering
  • School of Mechanical Engineering

External person

Eric A. Verploegen

  • Massachusetts Institute of Technology
  • Stanford University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Chemical Engineering
  • Stanford University

External person

Brian Chien

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Matthew D. Fronk

  • Georgia Institute of Technology
  • School of Mechanical Engineering
  • Mechanical Engineering
  • School of Mechanical Engineering

External person

Abhinav Rao

  • University of Michigan, Ann Arbor
  • Massachusetts Institute of Technology
  • Department of Mechanical Engineering and Laboratory for Manufacturing and Productivity
  • University of Michigan, Ann Arbor

External person

Wei Lu

  • University of Michigan, Ann Arbor
  • Mechanosynthesis Group
  • University of Michigan, Ann Arbor

External person

Zhouzhou Zhao

  • University of Michigan, Ann Arbor
  • Mechanosynthesis Group
  • University of Michigan, Ann Arbor

External person

Ch Androulidakis

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Matthew Poss

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Tongxi Yan

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. Anne Juggernauth

  • University of Michigan, Ann Arbor
  • Mechanosynthesis Group
  • Macromolecular Science and Engineering Research Center
  • Macromolec. Science and Engineering
  • Department of Mechanical Engineering
  • University of Michigan, Ann Arbor

External person

Daniel O. Vidaud

  • University of Michigan, Ann Arbor
  • Mechanosynthesis Group
  • University of Michigan, Ann Arbor

External person

Ping Ju Chen

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Intel

External person

Hao Xin

  • University of Arizona
  • Center for Electronic Packaging Research
  • Department of Physics

External person

M. S. Raafat

  • Cairo University

External person

Ryan Siu

  • University of Illinois at Urbana-Champaign

External person

Min Liang

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Samuel Rylowicz

  • Fast Radius, Inc

External person

C. Lamuta

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Iowa
  • Department of Mechanical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Iowa
  • University of Iowa

External person

Jong G. Ok

  • University of Michigan, Ann Arbor
  • Mechanosynthesis Group
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor

External person

Yun Seong Kim

  • University of Illinois at Urbana-Champaign

External person

Nigamaa Nayakanti

  • Massachusetts Institute of Technology
  • Department of Mechanical Engineering

External person

Wei Hua

  • College of Electronics and Information Engineering
  • Sichuan University
  • University of Arizona
  • Center for Electronic Packaging Research

External person

Daniel Baker

  • Fast Radius, Inc

External person

M. O.A. Mokhtar

  • Cairo University
  • Department of Mechanical Design and Production

External person

Rhinithaa P. Thanalakshme

  • University of Illinois at Urbana-Champaign

External person

C. Ryan Oliver

  • University of Michigan, Ann Arbor
  • Mechanosynthesis Group
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • University of Michigan, Ann Arbor

External person

Mitisha Surana

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Keegan J. Moore

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Mechanical Science and Engineering
  • University of Nebraska-Lincoln
  • University of Illinois at Urbana-Champaign
  • University of Nebraska-Lincoln
  • University of Illinois

External person

Qi Zhu

  • University of Science and Technology of China
  • Chinese Academy of Sciences
  • Electronic Engineering and Information Science
  • Key Laboratory of Electromagnetic Space Information

External person

Jonghyun Ha

  • University of Illinois at Urbana-Champaign

External person

M. Robertson

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

C. Daraio

  • California Institute of Technology
  • Swiss Federal Institute of Technology Zurich
  • Computational Science and Engineering Laboratory
  • Graduate Aerospace Laboratories
  • Department of Mechanical Engineering and Applied Physics
  • Graduate Aerospace Laboratories (GALCIT)
  • Department of Aeronautics and Applied Physics
  • Division of Engineering and Applied Science
  • Division of Engineering and Applied Science
  • California Institute of Technology

External person

Yongyi Zhang

  • University of Michigan, Ann Arbor
  • Mechanosynthesis Group
  • University of Michigan, Ann Arbor

External person

G. M. Aziz

  • Cairo University
  • Faculty of Engineering

External person

Shuangbao Li

  • University of China
  • College of Science Civil Aviation
  • Civil Aviation University of China
  • College of Science

External person

Si Li

  • University of Arizona
  • University of Science and Technology of China
  • Chinese Academy of Sciences
  • Electronic Engineering and Information Science
  • Center for Electronic Packaging Research
  • Key Laboratory of Electromagnetic Space Information

External person

Miles V. Bimrose

  • University of Illinois at Urbana-Champaign

External person

Arthur R. Woll

  • Cornell University
  • Cornell High Energy Synchrotron Source (CHESS)

External person

Charles Wood

  • Fast Radius, Inc

External person

Mingguang Tuo

  • University of Arizona
  • Center for Electronic Packaging Research

External person

Ray H. Baughman

  • University of Texas at Dallas
  • Department of Chemistry

External person

Eric Wood

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gary Durack

  • University of Illinois Urbana-Champaign
  • UIUC Biotechnology Center
  • Flow Cytometry Facility
  • Department of Food Science and Human Nutrition
  • University of Illinois at Urbana-Champaign
  • Tekmill

External person

Aaron J. Schmidt

  • University of Michigan, Ann Arbor
  • Boston University
  • Department of Mechanical Engineering, Boston University
  • Mechanical Engineering
  • Department of Mechanical Engineering
  • Massachusetts Institute of Technology
  • University of Michigan, Ann Arbor

External person

Geoffrey M. Spinks

  • University of Wollongong

External person

Carter S. Haines

  • Opus 12 Incorporated
  • University of Texas at Dallas

External person

Oleg V. Gendelman

  • Technion-Israel Institute of Technology
  • RAS - Institute of Problems of Chemical Physics
  • RAS - N.N. Semenov Institute of Chemical Physics
  • Institute of Chemical Physics
  • Faculty of Mechanical Engineering
  • Faculty of Mechanical Engineering
  • Faculty of Mechanical Engineering
  • Faculty of Mechanical Engineering
  • Institute of Chemical Physics
  • Faculty of Mechanical Engineering
  • Institute of Chemical Physics
  • Russian Academy of Sciences
  • Faculty of Mechanical Engineering

External person

Jinsong Leng

  • Harbin Institute of Technology

External person

Hyungjun Kim

  • Seoul National University
  • University of Texas at Dallas

External person

Robert E. Cohen

  • Massachusetts Institute of Technology
  • Department of Chemical Engineering

External person

Jerry O’Leary

  • Fast Radius, Inc

External person

Max Newberger

  • Fast Radius, Inc

External person

Kai Sun

  • University of Michigan, Ann Arbor
  • Macromolecular Science and Engineering Research Center
  • University of Michigan, Ann Arbor

External person

David Null

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tushar K. Talukdar

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Lucas J. Koerner

  • Johns Hopkins Applied Physics Laboratory
  • Cornell University
  • Applied Physics Laboratory
  • Department of Physics
  • Applied Physics Laboratory
  • Johns Hopkins University

External person

Eliot B. Bethke

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kun Hyuck Lee

  • University of Illinois Urbana-Champaign
  • Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Hugh T. Philipp

  • Cornell University
  • Department of Physics
  • Lab. of Atom./Solid State Physics

External person

Elisabeth Bralts

  • University of Illinois at Urbana-Champaign

External person

Steven Barcelo

  • Hewlett Packard Enterprise
  • Hewlett Packard Enterprise

External person

Kewen Han

  • Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • ACRC
  • MechSE department
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign

External person

C. Sandin

  • NASA Goddard Space Flight Center
  • NASA Ames Research Center
  • University of Illinois at Urbana-Champaign

External person

S. Messelot

  • Université PSL
  • ESPCI

External person

Brian Stewart

  • Carle Foundation Hospital

External person

Lucas O’Bryan

  • University of Illinois at Urbana-Champaign

External person

C. Shipley

  • University of Illinois Urbana-Champaign
  • Department of Veterinary Clinical Medicine
  • Department of Clinical Veterinary Medicine, College of Veterinary Medicine, University of Illinois
  • Department of Veterinary Clinical Medicine
  • Department of Veterinary Clinical Medicine
  • Department of Veterinary Clinical Medicine
  • Veterinary Pathobiology
  • University of Illinois at Urbana-Champaign

External person

Hetao Chu

  • Harbin Institute of Technology
  • University of Texas at Dallas

External person

Gregory J. Ehlert

  • Wright-Patterson AFB
  • Materials and Manufacturing Directorate
  • Air Force Research Laboratory
  • Universal Technology Corporation
  • University of Florida

External person

Jae Yong Lee

  • University of Michigan, Ann Arbor

External person

Dongwoo Shin

  • Sungkyunkwan University
  • Sungkyunkwan University School of Medicine
  • Dept. of Molecular Cell Biology
  • Department of Molecular Cell Biology
  • School of Medicine

External person

Yue Liang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ryan M. Corey

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Matthew Shlian

  • University of Michigan, Ann Arbor
  • Department of Materials Science and Engineering
  • School of Art and Design
  • University of Michigan, Ann Arbor

External person

Luca Pizzuto

  • Fast Radius, Inc

External person

Christophor Prohoda

  • Department of Mechanical Engineering
  • Massachusetts Institute of Technology

External person

Hyoung Won Baac

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor

External person

C. Galiotis

  • Department of Chemical Engineering
  • University of Patras
  • Institute of Chemical Engineering and High Temperature Chemical Processes

External person

Derek J. Milner

  • Center for Advanced Study, Department of Cell and Developmental Biology, Molecular and Integrative, University of Illinois
  • University of Illinois Urbana-Champaign
  • Department of Animal Sciences, University of Illinois-Urbana Champaign
  • Department of Cell and Development Biology
  • Regenerative Biology and Tissue Engineering
  • Departments of Molecular and Integrative Physiology
  • Institute for Genomic Biology, University of Illinois
  • Institute for Genomic Biology, University of Illinois Urbana-Champaign
  • Wallace H. Coulter Department of Biomedical Engineering
  • Georgia Institute of Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Ji Young Oh

  • Electronics and Telecommunications Research Institute
  • University of Texas at Dallas

External person

S. M. Gruner

  • Cornell University
  • Department of Physics, Cornell University
  • Department of Physics
  • Lab. of Atom./Solid State Physics
  • Kavli Institute at Cornell for Nanoscale Science
  • Cornell High Energy Synchrotron Source (CHESS)

External person

Paolo F. Ferrari

  • University of Illinois at Urbana-Champaign

External person

David Sias

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

L. Jay Guo

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • Applied Physics Program
  • University of Michigan, Ann Arbor

External person

Brian Ricconi

  • Creative Thermal Solutions
  • Inc.

External person

Mazharul Islam

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Xinghao Hu

  • Jiangsu University
  • University of Texas at Dallas

External person

Joselito M. Razal

  • Deakin University

External person

Javad Foroughi

  • University of Wollongong

External person

Mingze Chen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Steven Nielsen

  • University of Texas at Dallas

External person

Matthew N. Petrucci

  • University of Illinois Urbana-Champaign
  • Neuroscience Program, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Stanford University
  • Department of Neurology and Neurological Sciences
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Minnesota Twin Cities

External person

Yuhang Yang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Megan J. Roberts

  • Mechanosynthesis Group
  • Department of Mechanical Engineering

External person

E. N. Koukaras

  • School of Science and Technology
  • Hellenic Open University
  • Institute of Chemical Engineering and High Temperature Chemical Processes

External person

Xiaoshuang Zhou

  • Changzhou University

External person

Alvin Orbaek White

  • Massachusetts Institute of Technology

External person

Shaoli Fang

  • University of Texas at Dallas

External person

Ziming Wang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Khek Khiang Chia

  • Massachusetts Institute of Technology
  • Department of Chemical Engineering

External person

Andy Musser

  • Creative Thermal Solutions

External person

Katherine S. Green

  • Cornell University
  • Department of Physics

External person

John Kolaczynski

  • Fast Radius, Inc

External person

Lauren Kovanko

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alexander Pagano

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yichao Tang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Jake Fava

  • University of Illinois at Urbana-Champaign

External person

Oyuna Angatkina

  • University of Illinois Urbana-Champaign
  • Tomsk Polytechnic University
  • Institute of Cybernetics
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Eli Wilken-Resman

  • University of Illinois at Urbana-Champaign

External person

Evan M. Widloski

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Honglu He

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Kevin M. Lyons

  • University of Michigan, Ann Arbor
  • Mechanosynthesis Group
  • Georgia Institute of Technology
  • University of Michigan, Ann Arbor

External person

P. Pochet

  • CEREM-SRMP
  • CE-Saclay
  • Sect. de Rech. de Metall. Physique
  • CE Saclay
  • DEN-DMN-SRMP
  • CEA-Saclay
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Université Grenoble Alpes
  • Commissariat a L'Energie Atomique CEA
  • Atomistic Simulation Laboratory (L-Sim)
  • Laboratoire de Simulation Atomistique (L-Sim)
  • Université Paris-Saclay
  • Laboratory of Atomistic Simulation (L-Sim)

External person

Richard T. Haasch

  • Frederick Seitz Mat. Research Lab.
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Center for Microanalysis of Materials
  • Department of Mechanical Science and Engineering, University of Illinois
  • Materials Research Laboratory
  • Center for Microanalysis of Materials
  • Department of Chemistry
  • Department of Mechanical Science and Engineering
  • Center for Microanalysis of Materials
  • University of Illinois at Urbana-Champaign

External person

Shandra Jamison

  • University of Illinois at Urbana-Champaign

External person

Si Qin

  • Deakin University

External person

Michael Rogalski

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

John Kulikowski

  • University of Illinois at Urbana-Champaign

External person

Maenghyo Cho

  • Seoul National University
  • University of Texas at Dallas

External person

Ralf Moller

  • University of Illinois at Urbana-Champaign

External person

K. O'Brien

  • Intel
  • University of California, Berkeley
  • NSF Nanoscale Science and Engineering Center (NSEC)
  • University of California at Berkeley

External person

Jong Woo Park

  • Hanyang University

External person

Jiang Xu

  • Jiangsu University

External person

Ningyi Yuan

  • Changzhou University

External person

Brian Pianfetti

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Kyeongjae Cho

  • University of Texas at Dallas
  • Physics Department

External person

José Bico

  • École Supérieure de Physique et de Chimie Industrielles
  • ESPCI
  • Université PSL
  • ComUE Paris-Saclay

External person

Patrick Conlin

  • University of Texas at Dallas

External person

Keval D. Patel

  • University of Michigan, Ann Arbor
  • Department of Mechanical Engineering
  • University of Michigan, Ann Arbor

External person

Nicole Herndon

  • University of Illinois at Urbana-Champaign

External person

Jiuke Mu

  • University of Texas at Dallas

External person

Marianne Hromalik

  • SUNY Albany
  • Cornell University
  • Computer Science Department
  • Department of Physics
  • SUNY Oswego

External person

C. Van Hoof

  • Interuniversitair Micro-Elektronica Centrum

External person

Jiheng Jing

  • University of Illinois at Urbana-Champaign

External person

Rachel D. Switzky

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kevin A. Alberto

  • University of Texas at Dallas

External person

Jonghyun Hwang

  • University of Illinois at Urbana-Champaign

External person

Aaron Brenzel

  • Fast Radius, Inc

External person

Jonathan Mosley

  • University of Illinois at Urbana-Champaign

External person

J. Yaacoub

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Morgan K. Boes

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Bioengineering
  • University of Illinois at Urbana-Champaign

External person

Dongwoo Shin

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Desirée L. Plata

  • Woods Hole Oceanographic Institution
  • Massachusetts Institute of Technology
  • Department of Civil and Environmental Engineering, Massachusetts Institute of Technology
  • Department of Marine Chemistry and Geochemistry

External person

Zhong Wang

  • University of Texas at Dallas

External person

Jinjing Li

  • University of Michigan, Ann Arbor

External person

K. Papagelis

  • Department of Physics
  • Aristotle University of Thessaloniki
  • Institute of Chemical Engineering and High Temperature Chemical Processes

External person

Justin Beroz

  • University of Michigan, Ann Arbor
  • Department of Mechanical Engineering
  • University of Michigan, Ann Arbor

External person

Gaurav Singh

  • University of Illinois Urbana-Champaign
  • Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Joerg Lahann

  • University of Michigan, Ann Arbor
  • Departments of Chemical Engineering
  • Department of Chemical Engineering
  • Karlsruhe Institute of Technology
  • University of Michigan, Ann Arbor

External person

Brandon Leung

  • University of Illinois Urbana-Champaign

External person

Shengtai Shi

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Michael L. Philpott

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shorya Awtar

  • University of Michigan, Ann Arbor
  • Department of Mechanical Engineering
  • University of Michigan, Ann Arbor

External person

Sun Phil Kim

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Hallee Deutchman

  • Fast Radius, Inc

External person

J. Haseltine

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Courtney Hayes

  • University of Illinois at Urbana-Champaign

External person

Junhwan Kim

  • Department of Mechanical Science and Engineering
  • Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • ACRC
  • MechSE department
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Inbar Grinberg

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Rachael Dietkus

  • University of Illinois at Urbana-Champaign

External person

Chenzhang Xiao

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

David Pick

  • Fast Radius, Inc

External person

Marcello Rubessa

  • University of Illinois Urbana-Champaign
  • Institute for Genomic Biology, University of Illinois Urbana-Champaign
  • Department of Animal Sciences
  • Institute for Genomic Biology, University of Illinois
  • Department of Animal Sciences, University of Illinois-Urbana Champaign
  • Dept. Animal Sciences
  • University of Illinois at Urbana-Champaign

External person

Alex Pille

  • Fast Radius, Inc

External person

Xiaopei Deng

  • University of Michigan, Ann Arbor
  • Department of Macromolecular Science and Engineering
  • Department of Macromolecular Science and Engineering
  • University of Michigan, Ann Arbor

External person

Chengzhang Li

  • University of Illinois at Urbana-Champaign

External person

Ganesh Ananthakrishnan

  • University of Illinois at Urbana-Champaign

External person

Jianning Ding

  • Jiangsu University
  • Changzhou University

External person

Seon Jeong Kim

  • Hanyang University

External person

Mark W. Tate

  • Cornell University
  • Department of Physics
  • Lab. of Atom./Solid State Physics

External person

Na Li

  • Millipore Sigma
  • University of Texas at Dallas

External person