Network

Alexander Gerhard Schwing

Person: Academic

Zhizhen Zhao

Person: Academic

Fan Lam

Person: Academic

Zhi Quan Luo

  • University of Minnesota Twin Cities
  • Chinese University of Hong Kong
  • Chinese University of Hong Kong
  • Department of Electrical and Computer Engineering
  • Dept. of ECE
  • The Chinese University of Hong Kong, Shenzhen
  • Xidian University
  • Shenzhen Research Institute of Big Data

External person

Mingyi Hong

  • University of Minnesota Twin Cities
  • Iowa State University
  • Department of Electrical and Computer Engineering
  • Department of Industrial and Manufacturing Systems Engineering
  • Digital Technology Center
  • University of Illinois Urbana-Champaign
  • University of Minnesota
  • University of Illinois at Urbana-Champaign
  • Iowa State University
  • Iowa State University
  • University of Illinois at Urbana-Champaign

External person

Shiyu Liang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dawei Li

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Quan Bo Ge

  • Hangzhou Dianzi University
  • Institute of Systems Science and Control Engineering

External person

Tian Ding

  • Chinese University of Hong Kong

External person

Hadi Baligh

  • Huawei Technologies Co., Ltd.
  • Huawei Technologies
  • Huawei Technologies Canada

External person

Chenglin Wen

  • Henan University of Technology
  • Hangzhou Dianzi University
  • Institute of Systems Science and Control Engineering
  • College of Electrical Engineering

External person

Tiantian Fang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Peijun Xiao

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yinyu Ye

  • Stanford University
  • Department of Management Science and Engineering
  • Department of Management Science and Engineering
  • Stanford University
  • Stanford University

External person

Yixuan Li

  • Cornell University
  • Meta

External person

Meisam Razaviyayn

  • University of Minnesota Twin Cities
  • Department of Electrical and Computer Engineering

External person

Dachao Lin

  • Peking University

External person

Maziar Sanjabi

  • University of Minnesota Twin Cities
  • Department of Electrical and Computer Engineering
  • University of Minnesota System

External person

Jiawei Zhang

  • The Chinese University of Hong Kong, Shenzhen

External person

Zhihua Zhang

  • Peking University

External person

Naman Shukla

  • Deepair LLC
  • University of Illinois at Urbana-Champaign
  • Deepair Solutions

External person

Akhil Gupta

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yuan Ting Hu

  • University of Illinois Urbana-Champaign
  • Uiuc
  • University of Illinois at Urbana-Champaign
  • UIUC
  • Toyota Technological Institute at Chicago
  • Toyota Technological Institute at Chicago
  • University of Illinois at Urbana-Champaign

External person

Wei Cheng Liao

  • University of Minnesota Twin Cities
  • Department of Electrical and Computer Engineering

External person

Shaodong Chen

  • Luoyang Institute of Electro Optical Equipment of AVIC
  • Luoyang Institute of Electro Optical Equipment of AVIC

External person

Arinbjörn Kolbeinsson

  • Imperial College London

External person

Sijia Liu

  • Massachusetts Institute of Technology
  • IBM Research
  • IBM
  • Michigan State University
  • IBM
  • Amazon.com, Inc.

External person

Zhisheng Xiao

  • The University of Chicago

External person

Teng Shao

  • Hangzhou Dianzi University
  • Institute of Systems Science and Control Engineering

External person

Ayis Pyrros

  • University of Illinois Urbana-Champaign
  • Dupage Medical Group
  • Dupage Medical Group
  • University of Illinois at Urbana-Champaign
  • DuPage Medical Group
  • Radiology Associates
  • Radiology
  • Radiology
  • DuPage Medical Group
  • University of Illinois at Chicago

External person

And R. Srikant

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Haoxiang Wang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • UIUC

External person

Wei Liu

  • Xidian University

External person

Yushun Zhang

  • The Chinese University of Hong Kong, Shenzhen

External person

Nasir Siddiqui

  • DuPage Medical Group
  • Dupage Medical Group
  • Dupage Medical Group
  • Radiology Associates
  • Radiology
  • Radiology

External person

Yuan Li

  • Shenyang Institute of Chemical Technology
  • Information Engineering School

External person

Qingjiang Shi

  • Shanghai Jiao Tong University
  • Dept. of EE

External person

Xiangyi Chen

  • University of Minnesota Twin Cities

External person

Zi Xu

  • College of Sciences
  • Shanghai University

External person

Zepeng Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Enbin Song

  • Sichuan University
  • College of Mathematics

External person

Wen Bin Li

  • Hangzhou Dianzi University
  • Institute of Systems Science and Control Engineering

External person

Aritra Konar

  • University of Minnesota Twin Cities

External person

Jason D. Lee

  • Stanford University
  • Institute for Computational and Mathematical Engineering
  • University of Southern California
  • Princeton University
  • Stanford University
  • University of Southern California

External person

Yahang Li

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yite Wang

  • University of Illinois at Urbana-Champaign

External person

Ishan Deshpande

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nicholas D. Sidiropoulos

  • Technical University of Crete
  • University of Minnesota Twin Cities
  • Dept. of ECE
  • University of Virginia

External person

Naichen Shi

  • University of Michigan
  • University of Michigan, Ann Arbor

External person