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Network

David G Cahill

Person: Academic

William Paul King

Person: Academic

K. Nordlund

  • Accelerator Laboratory
  • University of Kaiserslautern
  • University of Helsinki
  • Technische Universität Darmstadt
  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Department of Physics
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Yinon Ashkenazy

  • Hebrew University of Jerusalem
  • University of Illinois Urbana-Champaign
  • Racah Institute of Physics, Hebrew University of Jerusalem
  • Racah Institute of Physics
  • Dept. of Mat. Sci. and Engineering
  • Racah Institute of Physics
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Materials Research Laboratory
  • Center Nanoscience & Nanotechnology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Mai Ghaly

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Nuclear Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Dept. Mat. Sci. Eng. Mat. Res. Lab.
  • Agency for Science, Technology and Research, Singapore
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Horst Hahn

  • Department of Materials Science
  • Paul Scherrer Institute
  • Technische Universität Darmstadt
  • Department of Materials Science and Engineering
  • Joint Research Laboratory Nanomaterials, Technische Universität Darmstadt
  • Argonne National Laboratory
  • Argonne Natl Lab, Argonne, IL, USA
  • Engineering University of Illinois at Urbana
  • University of Illinois Urbana-Champaign
  • Karlsruhe Institute of Technology
  • Rutgers - The State University of New Jersey, New Brunswick
  • Institute of Nanotechnology
  • Institute of Nanotechnology
  • Institute of Materials Science
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

J. Murray Gibson

  • Materials Research Laboratory
  • Agency for Science, Technology and Research, Singapore
  • University of Illinois Urbana-Champaign
  • Argonne National Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Materials Science Division, Argonne National Laboratory
  • Department of Materials Science
  • Materials Science Division, Argonne National Laboratory
  • Departments of Physics and Materials Science
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Physics and Science
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • United States Department of Energy
  • University of Illinois at Urbana-Champaign

External person

R. Benedek

  • Materials Science Division, Argonne National Laboratory
  • Northwestern Polytechnical University Xian
  • Technische Universität Darmstadt
  • Argonne National Laboratory
  • Northwestern University
  • SUNY Albany
  • University of Illinois Urbana-Champaign
  • Materials Science Division
  • Materials Science Division
  • Materials Science Division, Argonne National Laboratory
  • Department of Materials Science
  • Department of Physics, SUNY at Albany
  • Physics Department
  • Material Science Division
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory

External person

L. E. Rehn

  • Materials Science and Technology Division, Argonne National Laboratory
  • Argonne National Laboratory
  • Argonne Natl Lab, Argonne, IL, USA
  • Materials Science Division, Argonne National Laboratory
  • Materials Science Division Argonne National Laboratory Argonne
  • Materials Science Division, Argonne National Laboratory
  • Argonne Natl Lab, Materials Science
  • Materials Science Division
  • The University of Chicago
  • Argonne National Laboratory

External person

N. Q. Vo

  • NanoAl LLC
  • University of Illinois Urbana-Champaign
  • Northwestern University
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Minnesota Twin Cities
  • University of Illinois at Urbana-Champaign

External person

Mark Yeadon

  • Natl. Univ. of Singapore, 119260
  • National University of Singapore
  • Agency for Science, Technology and Research, Singapore
  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. Ehrhart

  • University of Illinois Urbana-Champaign
  • Jülich Research Centre
  • Kernforschungsanlage Jülich
  • Inst. für Festkörperforschung
  • University of Illinois at Urbana-Champaign

External person

P. R. Okamoto

  • Northwestern Polytechnical University Xian
  • Materials Science and Technology Division, Argonne National Laboratory
  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • Materials Science Division Argonne National Laboratory Argonne
  • MSD, Argonne National Laboratory
  • Northwestern University
  • Materials Science Division
  • Materials Science Division, Argonne National Laboratory
  • Argonne Natl Lab, Materials Science
  • Materials Science Division
  • The University of Chicago
  • Argonne National Laboratory

External person

J. J. Coleman

  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Materials Research Laboratory
  • Engineering Research Center for Compound Semiconductor Microelectronics
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • NASA Goddard Space Flight Center
  • University of Texas at Dallas
  • Ctr. Compd. Semiconduct. M.
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Department of Materials Science
  • Microeectronics Laboratory
  • Materials Research Laboratory and Everitt Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Center for Nutrition
  • Materials Research Laboratory and Microelectronics Laboratory
  • Micro and Nanotechnology Lab
  • Department of Electrical Engineering
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Texas at Dallas

External person

J. L. Klatt

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. Diaz de la Rubia

  • University of Illinois Urbana-Champaign
  • Argonne National Laboratory
  • Lawrence Livermore National Laboratory
  • Department of Materials Science and Engineering
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • SUNY Albany
  • University of Illinois at Urbana-Champaign

External person

P. Partyka

  • CE Saclay
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Université Paris-Saclay
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

H. J. Höfler

  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Materials Research Laboratory
  • Engineering University of Illinois at Urbana
  • Engineering University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Rutgers - The State University of New Jersey, New Brunswick
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Dept. Mechanics and Materials Sci.
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

K. Albe

  • Technische Universität Darmstadt
  • Fachgebiet Materialmodellierung
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Institut fur Materialwissenschaft
  • Dept. of Mat. Sci. and Engineering
  • Institut f�r Materialwissenschaft
  • Seitz Materials Research Laboratory
  • Institute of Materials Science
  • Materials Research Laboratory
  • Institute of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. L. Merkle

  • Materials Science Division, Argonne National Laboratory
  • Argonne National Laboratory
  • Materials Science Division
  • Material Science Division
  • The University of Chicago
  • Argonne National Laboratory

External person

C. P. Flynn

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Materials Research Laboratory
  • Department of Physics and the Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

U. Herr

  • Universität Augsburg
  • Augsburg University
  • University of Illinois Urbana-Champaign
  • Institute of Physics, University of Augsburg
  • Dept. of Mat. Sci. and Engineering
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

P. Krasnochtchekov

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Judith C. Yang

  • Department of Chemical and Petroleum Engineering, University of Pittsburgh
  • University of Pittsburgh
  • Department of Materials Science and Engineering
  • Department of Chemical and Petroleum Engineering
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering and Materials Science
  • Department of Mechanical Engineering and Materials Science
  • Department of Materials Science and Engineering
  • Agency for Science, Technology and Research, Singapore
  • University of Illinois at Urbana-Champaign
  • University of Pittsburgh
  • University of Illinois at Urbana-Champaign

External person

Xuan Zhang

  • Argonne National Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • Argonne National Laboratory
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin

External person

S. G. Mayr

  • Georg-August-Univ. Göttingen
  • I. Physikalisches Institut
  • University of Illinois Urbana-Champaign
  • Leipzig University
  • University of Göttingen
  • Leibniz Institute of Surface Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • II Physikalisches Institut
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Translational Center for Regenerative Medicine
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

L. J. Thompson

  • Materials Science Division, Argonne National Laboratory
  • Argonne National Laboratory
  • Materials Science and Technology Division, Argonne National Laboratory
  • Materials Science Division
  • Material Science Division
  • Chemistry and Materials Science Division
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

H. Zhu

  • IBM Research
  • IBM System and Technology Group
  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Dept. Mat. Sci. Eng. Mat. Res. Lab.
  • IBM
  • University of Illinois at Urbana-Champaign

External person

Carl Altstetter

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Engineering University of Illinois at Urbana
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign

External person

Daniel Schwen

  • Los Alamos National Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Horngming Hsieh

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David V. Forbes

  • Rochester Institute of Technology
  • University of Illinois Urbana-Champaign
  • Microelectronics Laboratory
  • Materials Research Laboratory
  • Center for Nutrition
  • Materials Research Laboratory and Microelectronics Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. A. Nicolet

  • California Institute of Technology
  • Pasadena, CA, USA
  • Department of Electrical Engineering
  • Applied Physics and Electrical Engineering, 116-81
  • California Institute of Technology
  • California Institute of Technology Division of Engineering and Applied Science

External person

D. L. Olynick

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Department of Materials Science
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign

External person

D. N. Seidman

  • Northwestern Polytechnical University Xian
  • Argonne National Laboratory
  • Northwestern University
  • Technische Universität Darmstadt
  • Cornell University
  • Department of Materials Science and Engineering
  • Materials Science Division, Argonne National Laboratory
  • Department of Materials Science and Engineering, Cornell University
  • Materials Science Division
  • Department of Materials Science and Engineering
  • Center for Atom-Probe Tomography (NUCAPT)
  • Center for Interdisciplinary Exploration and Research in Astrophysics (CIERA)
  • The University of Chicago
  • Argonne National Laboratory

External person

Sezer Özerinç

  • Department of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Middle East Technical University
  • Dept. of Mat. Sci. and Engineering
  • Department of Mechanical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

I. K. Robinson

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Materials Research Laboratory
  • Department of Physics
  • University College London
  • Departments of Physics Astronomy
  • Department of Physics
  • Department of Physics
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. Klassen

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Shipeng Shu

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

Bryan C. Gundrum

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. J. Kim

  • California Institute of Technology
  • Pasadena, CA, USA
  • Argonne Natl Lab, Argonne, IL, USA
  • Argonne National Laboratory
  • Department of Electrical Engineering
  • Applied Physics and Electrical Engineering, 116-81
  • California Institute of Technology
  • California Institute of Technology Division of Engineering and Applied Science

External person

C. G. Zimmermann

  • Universität Augsburg
  • Augsburg University
  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Institute of Physics, University of Augsburg
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. S. Lee

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

L. Wei

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Y. Zhong

  • University of Illinois Urbana-Champaign
  • University of Delaware
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

John A. Beach

  • University of Illinois Urbana-Champaign
  • Argonne National Laboratory
  • Dept. of Mat. Sci. and Engineering
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

Hyuk Chang

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign

External person

K. Samwer

  • Universität Augsburg
  • Georg-August-Univ. Göttingen
  • Augsburg University
  • University of Göttingen
  • University of Illinois Urbana-Champaign
  • I. Physics Institute
  • 1st Physics Institute
  • II Physikalisches Institut
  • Institute of Physics, University of Augsburg
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David Peak

  • Argonne National Laboratory
  • Union College

External person

R. P. Bryan

  • Sandia National Laboratories
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Keinonen

  • University of Helsinki
  • Accelerator Laboratory

External person

Xiaoyuan Hu

  • AlliedSignal
  • Research Engineer
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

A. Caro

  • Lawrence Livermore National Laboratory
  • Paul Scherrer Institute
  • Materials
  • Chemistry, Materials, and Life Sciences Directorate
  • Chemistry

External person

Lisa Kim

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Nirab Pant

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

See W. Chee

  • Arizona State University
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • LeRoy Eyring Center for Solid State Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wai Lun Chan

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Calvin R. Lear

  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • University of Michigan, Ann Arbor
  • Department of Nuclear Engineering and Radiological Sciences
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Michigan, Ann Arbor
  • University of Illinois at Urbana-Champaign

External person

T. J. Colla

  • University of Kaiserslautern
  • Fachbereich Physik

External person

F. Ren

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Southern University of Science and Technology
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. Tao

  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Engineering University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Timothy G. Lach

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Miao Wang

  • University of Illinois Urbana-Champaign
  • Alphabet Inc.
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kaiping Tai

  • Chinese Academy of Sciences
  • Shenyang National Laboratory for Materials Science (SYNL), Chinese Academy of Sciences (CAS)
  • Dept. of Mat. Sci. and Engineering
  • Shenyang National Laboratory for Materials Science (SYNL), Institute of Metal Research (IMR), Chinese Academy of Sciences (CAS)
  • CAS - Institute of Metal Research
  • University of Illinois Urbana-Champaign
  • Shenyang National Laboratory for Materials Science
  • Functional Films and Interfaces Division
  • Department of Materials Science and Engineering
  • Shenyang National Laboratory for Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Odunuga

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

I. M. Robertson

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Argonne National Laboratory
  • University of Wisconsin-Madison
  • Kyushu University
  • University of Oregon
  • Dept. of Mat. Sci. and Engineering
  • International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University
  • Department of Mechanical Science and Engineering
  • Department of Materials Science
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Materials Science Division, Argonne National Laboratory
  • Department of Materials Science
  • Department of Engineering Physics
  • Department of Materials Science and Engineering and Department of Engineering Physics
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Mechanical Science and Engineering
  • Department of Physics
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • Argonne National Laboratory
  • University of Wisconsin-Madison
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin

External person

Marquis A. Kirk

  • Argonne Natl Lab, Argonne, IL, USA
  • Argonne National Laboratory
  • University of Illinois Urbana-Champaign
  • Brandeis University
  • Academia Sinica Taiwan
  • Academia Sinica - Institute of Physics
  • University of Florida
  • Duke University
  • CAS - Changchun Institute of Optics Fine Mechanics and Physics
  • Institute of Physics
  • Materials Science Division, Argonne National Laboratory
  • Institute of Physics
  • Material Science Division
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • Duke University

External person

W. Wagner

  • Paul Scherrer Institute
  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • Materials Science and Technology Division, Argonne National Laboratory
  • Materials Science Division Argonne National Laboratory Argonne
  • Dipartimento di Fisica
  • Karlsruhe Institute of Technology
  • Academia Sinica - Institute of Physics
  • Academia Sinica Taiwan
  • Institute of Physics
  • Materials Science Division
  • The University of Chicago
  • Argonne National Laboratory

External person

Gowtham S. Jawaharram

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Youhong Li

  • Engineered Material Arresting Systems
  • University of Illinois Urbana-Champaign
  • Zodiac Aerospace
  • Engineered Material Arresting Systems
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

H. M. Urbassek

  • University of Kaiserslautern
  • Fachbereich Physik

External person

J. Zhou

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Soochow University
  • Shagang School of Iron and Steel
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. Wiedersich

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • Materials Science Division Argonne National Laboratory Argonne
  • Materials Science Division
  • The University of Chicago
  • Argonne National Laboratory

External person

M. Pouryazdan

  • Technische Universität Darmstadt
  • Joint Research Laboratory Nanomaterials, Technische Universität Darmstadt
  • Joint Research Laboratory Nanomaterials at Technische Universität Darmstadt
  • Karlsruhe Institute of Technology
  • Institute of Nanotechnology

External person

S. J. Rothman

  • Materials Science Division, Argonne National Laboratory
  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Brad Stumphy

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Young Sun

  • Rice University
  • University of Illinois Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shimin Mao

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • International Centre for Advanced Materials (ICAM; UIUC Spoke)
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. Garnier

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. B. Salamon

  • University of Texas at Dallas
  • Vanderbilt University
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Physics
  • Dept. Phys. Sci. Technol. Ctr. S.
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Department of Physics and Astronomy
  • Department of Physics
  • Physics Department
  • School of Natural Sciences and Mathematics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. Zhu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. Hattar

  • Sandia National Laboratories
  • University of Illinois Urbana-Champaign
  • Department of Radiation Solid Interactions
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Andrew I. Van Sambeek

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

M. H. Yang

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

W. Jäger

  • Institut für Festkörperforschung Forschungszentrum, Jülich
  • Inst. F. Festkorperforschung F.
  • Jülich Research Centre
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. C. Baily

  • Northwestern Polytechnical University Xian
  • Argonne National Laboratory
  • Materials Science and Technology Division, Argonne National Laboratory
  • Northwestern University
  • Materials Science Division
  • The University of Chicago
  • Argonne National Laboratory

External person

Wai Lun Chan

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nisha Verma

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Donald A. Walko

  • Advanced Photon Source Argonne National Laboratory
  • Argonne National Laboratory
  • University of Illinois Urbana-Champaign
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • United States Department of Energy

External person

R. C. Birtcher

  • Materials Science Division, Argonne National Laboratory
  • Argonne National Laboratory
  • Materials Science Division
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

A. Barbu

  • CEA
  • CEA/CEREM/DTM/Laboratoire des Solides Irradiés École Polytechnique
  • École polytechnique
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • ComUE Paris-Saclay
  • Commissariat a L'Energie Atomique CEA

External person

J. Hofler

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Salman N. Arshad

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Lahore University of Management Sciences
  • Department of Aerospace Engineering, University of Illinois Urbana-Champaign
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Tarus

  • University of Helsinki
  • Accelerator Laboratory

External person

J. W. Bullard

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Andrea E. Sand

  • University of Helsinki
  • Department of Physics

External person

D. Lesueur

  • École polytechnique
  • ComUE Paris-Saclay
  • Commissariat à l’énergie atomique et aux énergies alternatives

External person

J. Bass

  • Michigan State University
  • Eidgenössische Technische Hochschule
  • Swiss Federal Institute of Technology Zurich
  • Physics Dept.
  • Laboratorium für Festkörperphysik
  • Michigan State University

External person

L. M. Miller

  • Engineering Research Center for Compound Semiconductor Microelectronics
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Logas Logas

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. C. Kim

  • University of Illinois Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory
  • Division of Chemistry
  • Naval Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Schäfer

  • Technische Universität Darmstadt
  • Fachgebiet Materialmodellierung
  • Institute of Materials Science

External person

Florian Banhart

  • Université de Strasbourg

External person

M. E. Givens

  • Engineering Research Center for Compound Semiconductor Microelectronics
  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Francois Willaime

  • Université Paris-Saclay
  • ComUE Paris-Saclay

External person

D. Setman

  • University of Vienna
  • Physics of Nanostructured Materials
  • Department of Physics

External person

D. Simeone

  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Université Paris-Saclay
  • Lab. d'Etud. des Mat. Absorbants
  • ComUE Paris-Saclay

External person

Sourav Das

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

E. H. Ekiz

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Roger Stoller

  • Oak Ridge National Laboratory
  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Materials Science & Technology Division

External person

R. Spohr

  • École polytechnique
  • ComUE Paris-Saclay
  • GSI Helmholtz Centre for Heavy Ion Research

External person

Jia Ye

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Lawrence Berkeley National Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Julia Ivanisenko

  • Karlsruhe Institute for Technology (KIT)
  • Institute for Nanotechnology
  • Karlsruhe Institute of Technology
  • Institute for Nanotechnology

External person

T. Diaz De La Rubia

  • Lawrence Livermore National Laboratory
  • Department of Physics, SUNY at Albany
  • Argonne National Laboratory
  • SUNY Albany
  • University of Illinois Urbana-Champaign
  • Chemistry and Materials Science Directorate
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Materials Science Division
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory

External person

R. A. Enrique

  • Department of Materials Science and Engineering
  • University of Michigan, Ann Arbor
  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Michigan, Ann Arbor
  • University of Illinois at Urbana-Champaign

External person

Fredric Granberg

  • University of Helsinki
  • Department of Physics

External person

Qun Li

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

M. Nastasi

  • Los Alamos National Laboratory

External person

T. M. Cockerill

  • Engineering Research Center for Compound Semiconductor Microelectronics
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Texas Advanced Computing Center
  • University of Texas at Austin
  • University of Illinois at Urbana-Champaign

External person

Alexei Lagoutchev

  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, University of Illinois at Urbana-Champaign, Noyes Laboratory
  • University of Illinois at Urbana-Champaign

External person

Lorenzo Malerba

  • Belgian Nuclear Research Center
  • SCK-CEN

External person

M. Tang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. Gaber

  • Assiut University
  • Jülich Research Centre
  • Phys. Dept.

External person

Fu Rong Ding

  • Materials Science Division, Argonne National Laboratory
  • Argonne National Laboratory
  • Material Science Division
  • The University of Chicago
  • Argonne National Laboratory

External person

A. Dunlop

  • École polytechnique
  • ComUE Paris-Saclay
  • Commissariat à l’énergie atomique et aux énergies alternatives

External person

S. J. Zinkle

  • Oak Ridge National Laboratory
  • University of Tennessee, Knoxville
  • Department of Nuclear Engineering
  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Materials Science & Technology Division
  • Univ. of Tennessee

External person

Horst Hahn

  • University of Illinois Urbana-Champaign
  • Argonne National Laboratory
  • Technische Universität Darmstadt
  • Rutgers - The State University of New Jersey, New Brunswick
  • Department of Materials Science and Engineering
  • Institute of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Institute of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Material Science Division
  • Department of Materials Science and Engineering
  • Materials Science and Technology Division, Argonne National Laboratory
  • Department of Mechanics
  • Karlsruhe Institute of Technology
  • Institute of Nanotechnology
  • Department of Materials Science
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory

External person

K. Zhao

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sergei L. Dudarev

  • United Kingdom Atomic Energy Authority
  • Culham Centre for Fusion Energy

External person

William J. Weber

  • Oak Ridge National Laboratory
  • University of Tennessee, Knoxville
  • Department of Materials Science and Engineering, University of Tennessee
  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Materials Science & Technology Division
  • Univ. of Tennessee

External person

Tomoaki Suzudo

  • Japan Atomic Energy Agency
  • Center for Computational Science and e-Systems

External person

N. A. Mara

  • United States Department of Energy
  • Institute for Materials Science and the Center for Integrated Nanotechnologies
  • Los Alamos National Laboratory

External person

H. Shyu

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Christopher M. Barr

  • Sandia National Laboratories
  • Sun Yat-Sen University

External person

J. Vetter

  • École polytechnique
  • ComUE Paris-Saclay
  • GSI Helmholtz Centre for Heavy Ion Research

External person

Margolita Pollack

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Jaeyel Lee

  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Huang

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Thomas Schuler

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Université de Lyon
  • Universite Jean Monnet Saint-Etienne
  • University of Illinois at Urbana-Champaign

External person

H. Zillgen

  • Forschungszentrum Julich GmbH
  • Jülich Research Centre

External person

Maria A. Okuniewski

  • Idaho National Laboratory
  • University of Illinois Urbana-Champaign
  • Purdue University
  • Department of Nuclear Engineering
  • Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign
  • Department of Nuclear Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. N. Baillargeon

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Electrical Engineering Research Laboratory
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign

External person

T. Boll

  • Karlsruhe Institute of Technology
  • Institute for Applied Materials
  • Karlsruhe Nano Micro Facility

External person

R. Madhavan

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Eric Lang

  • Micro and Nanotechnology Lab
  • University of Illinois Urbana-Champaign
  • Department of Nuclear
  • Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign
  • University of Illinois at Urbana-Champaign

External person

G. B. Alers

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

D. V. Forbes

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

S. Jay Chey

  • Dept. of Mat. Sci. and Engineering
  • Materials Research Laboratory
  • University of Minnesota Twin Cities
  • University of Illinois Urbana-Champaign
  • Dept. of Chem. Eng. and Mat. Science
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Center for Compound Semiconductor Microelectronics
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • IBM
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

A. Setzer

  • Leipzig University
  • Division of Superconductivity and Magnetism

External person

K. C. Hsieh

  • Dept. of Elec. and Comp. Engineering
  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Electrical Engineering Research Laboratory
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Ctr. Compd. Semiconduct. M.
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sanjit Ghose

  • Brookhaven National Laboratory
  • Energy Sciences Directorate/Photon Science Division
  • University of Illinois at Urbana-Champaign

External person

M. Victoria

  • Paul Scherrer Institute

External person

C. Hill

  • Jet Propulsion Laboratory, California Institute of Technology

External person

T. X. Bui

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Anthony M. Monterrosa

  • Sandia National Laboratories

External person

Hongwei Gu

  • Hong Kong University of Science and Technology
  • Department of Physics

External person

H. Kim

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. Daykin

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mohamed Guermazi

  • Case Western Reserve University
  • Department of Materials Science and Engineering
  • Case Western Reserve University

External person

Ludovic Thuinet

  • Université de Lille

External person

K. J. Beernink

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory and Everitt Laboratory
  • Materials Research Laboratory
  • Materials Research Laboratory and Microelectronics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jian Wang

  • Los Alamos National Laboratory
  • University of Illinois Urbana-Champaign

External person

W. E. King

  • Argonne National Laboratory
  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Department of Physics, SUNY at Albany
  • Materials Science Division
  • SUNY Albany
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory

External person

W. A. Goddard

  • Purdue University
  • California Institute of Technology
  • Arthur Amos Noyes Laboratory of Chemical Physics
  • Division of Chemistry and Chemical Engineering
  • California Institute of Technology
  • Division of Chemistry and Chemical Engineering

External person

G. E. Hoefler

  • University of Illinois at Urbana-Champaign

External person

J. Sprinkle

  • Materials Science Division, Argonne National Laboratory
  • Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

R. Lokesh

  • University of Illinois at Urbana-Champaign

External person

Patrick M. Price

  • Sandia National Laboratories

External person

Prajina Bhattacharya

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

A. Kaldor

  • Purdue University
  • ExxonMobil
  • Resource Chemistry Laboratory

External person

P. Esquinazi

  • Leipzig University
  • Division of Superconductivity and Magnetism

External person

S. K. Ghose

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. Hoshino

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Richard W. Siegel

  • Rensselaer Polytechnic Institute
  • Purdue University
  • Argonne National Laboratory
  • Department of Materials Science and Engineering
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Guy Ayrault

  • Cornell University
  • Department of Materials Science and Engineering, Cornell University

External person

F. Spaepen

  • Purdue University
  • Harvard University
  • Division of Applied Sciences
  • Harvard University

External person

G. Rummel

  • University of Münster

External person

Weiwei Zhu

  • Southern University of Science and Technology
  • Department of Materials Science and Engineering

External person

Yu Ivanisenko

  • Karlsruhe Institute of Technology
  • Institute of Nanotechnology

External person

J. Moyle

  • Material Science Division
  • Argonne National Laboratory
  • Argonne National Laboratory

External person

M. Kleinschmit

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Schalit

  • Argonne National Laboratory
  • Material Science Division
  • The University of Chicago
  • Argonne National Laboratory

External person

H. Zhu

  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. Mat. Sci. Eng. Mat. Res. Lab.
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

H. Gleiter

  • Universität des Saarlandes
  • Saarland University
  • Fachbereich Werkstoffwissenschaften und Fertigungstechnik

External person

Michael D. Uchic

  • AFRL/MLLM
  • Wright-Patterson AFB
  • University of Illinois Urbana-Champaign
  • Materials and Manufacturing Directorate
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • Air Force Research Laboratory

External person

K. Benedek

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Rui Hao

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • International Centre for Advanced Materials (ICAM; UIUC Spoke)
  • University of Illinois at Urbana-Champaign

External person

M. Ghaly

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Agency for Science, Technology and Research, Singapore
  • Department of Nuclear Engineering
  • Materials Research Laboratory
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Dept. Mat. Sci. Eng. Mat. Res. Lab.
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

B. M. Paine

  • California Institute of Technology
  • California Institute of Technology

External person

Y. Lee

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

J. A. Cowen

  • Michigan State University
  • Physics Dept.
  • Michigan State University

External person

S. J. Riley

  • Purdue University
  • Argonne National Laboratory
  • Chemistry Division, Center for Nanoscale Materials, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

V. C. Elarde

  • QPC Lasers, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

G. F. Bouobda Moladje

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

I. J. Beyerlein

  • Los Alamos National Laboratory
  • University of California at Santa Barbara
  • UC Santa Barbara College of Engineering

External person

J. J. Alwan

  • Micron Technology Incorporated
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micron Display Technology, Inc.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

R. K. Zheng

  • Hong Kong University of Science and Technology
  • University of Sydney
  • Department of Physics
  • School of Physics

External person

K. Robinson

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

L. S. Hung

  • Department of Materials Science and Engineering, Cornell University
  • Cornell University

External person

Evan Ma

  • Dept. of Mat. Sci. and Engineering
  • Johns Hopkins University
  • California Institute of Technology
  • Applied Physics and Electrical Engineering, 116-81
  • California Institute of Technology

External person

M. B. Weissman

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

S. Mantl

  • Materials Science and Technology Division, Argonne National Laboratory
  • Argonne National Laboratory
  • Jülich Research Centre
  • The University of Chicago
  • Argonne National Laboratory

External person

C. Bailat

  • University of Illinois at Urbana-Champaign

External person

Peter Kurath

  • Department of Mechanical Engineering University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Dept. of Mech. and Indust. Eng.
  • Mechanical Science and Engineering Department
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

H. M. Wu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Campion

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

F. Tsui

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Aleksander A. Tedstone

  • University of Manchester
  • International Centre for Advanced Materials (ICAM
  • International Centre for Advanced Materials (ICAM; Manchester Hub)

External person

Soumyajit Jana

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gibson J. Murray

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

L. Marques

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. J. Caturla

  • Lawrence Livermore Natl. Laboratory
  • Lawrence Livermore National Laboratory
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sander Gaemers

  • BP plc
  • Castrol InnoVentures

External person

P. Baldo

  • Pasadena, CA, USA
  • Argonne National Laboratory
  • California Institute of Technology
  • Materials Science Division, Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Materials Science and Technology Division, Argonne National Laboratory
  • Argonne National Laboratory

External person

G. Chen

  • Jet Propulsion Laboratory, California Institute of Technology

External person

K. Hoshino

  • Central Research Laboratory

External person

Wenpei Gao

  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • University of California at Irvine
  • Department of Chemical Engineering and Materials Science
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of California at Irvine
  • University of Illinois at Urbana-Champaign

External person

S. J. Kim

  • Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

J. Nord

  • Accelerator Laboratory
  • University of Helsinki

External person

W. L. Brown

  • Purdue University
  • Alcatel-Lucent
  • Lucent
  • Nokia

External person

M. Moscovits

  • Purdue University
  • University of Toronto
  • Materials Chemistry Research Group

External person

H. Zhu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Stephen J. Hales

  • NASA Langley Research Center

External person

Xuan Zheng

  • Seagate Technology
  • Seagate Corporation
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

W. J. Flick

  • Department of Materials Science
  • Engineering University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alexander Y. Terekhov

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

J. Patel

  • Jet Propulsion Laboratory, California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Center for Reliable and High Performance Computing

External person

Christopher P. Warrens

  • BP Technology Centre
  • BP plc

External person

T. H. Blewitt

  • Materials Science Division, Argonne National Laboratory
  • Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

John S. Vetrano

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. Mehrer

  • University of Münster

External person

Hsieh Horngming

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Pete R. Jemian

  • Argonne National Laboratory
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • United States Department of Energy

External person

B. Stritzker

  • Institut fur Festkorperförschung Kernforshungsanlage
  • Jülich Research Centre

External person

D. Wang

  • Karlsruhe Institute of Technology
  • Institute of Nanotechnology

External person

M. E. Favaro

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jian Guo Wen

  • Argonne National Laboratory
  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Electron Microscopy Center
  • Materials Science Division, Argonne National Laboratory
  • Center for Microanalysis of Materials
  • Electron Microscopy Center
  • Materials Science Division
  • Department of Chemistry
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Electron Microscopy Center
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

Y. Li

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

A. I. Popov

  • Institute of Solid State Physics, University of Latvia

External person

Söenke Seifert

  • Argonne National Laboratory
  • Chemistry and Materials Science Division
  • The University of Chicago
  • Argonne National Laboratory

External person

G. S. Was

  • University of Michigan, Ann Arbor
  • Department of Nuclear Engineering and Radiological Sciences
  • Department of Nuclear Engineering and Radiological Sciences
  • University of Michigan, Ann Arbor

External person

M. A. Ryan

  • Jet Propulsion Laboratory, California Institute of Technology

External person

T. Scherer

  • Karlsruhe Institute of Technology
  • Institute of Nanotechnology

External person

Menahem Krief

  • Hebrew University of Jerusalem

External person

Thomas Banwell

  • California Institute of Technology

External person

K. Y. Cheng

  • University of Illinois Urbana-Champaign
  • National Tsing Hua University
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

S. G. Louie

  • Purdue University
  • Lawrence Berkeley National Laboratory
  • University of California, Berkeley
  • Department of Physics
  • Molecular Design Institute
  • Department of Physics
  • University of California at Berkeley

External person

A. v. Sambeek

  • Forschungszentrum Juelich
  • Jülich Research Centre
  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

A. Badillo

  • Laboratory for Thermal-Hydraulics, Paul Scherrer Institute
  • University of Illinois Urbana-Champaign
  • Paul Scherrer Institute
  • Dept. of Mat. Sci. and Engineering
  • Laboratory for Thermal-Hydraulics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Harrell Sellers

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

D. K. Wagner

  • Lab. of Atom./Solid State Physics
  • Cornell University

External person

Y. Grandjean

  • Électricité de France S.A.
  • SRMP
  • CE Saclay
  • Centre les Renardieres
  • Cent d'Etudes de Saclay
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • ComUE Paris-Saclay
  • EDF/DER/EMA
  • Université Paris-Saclay

External person

J. Charles Barbour

  • Sandia National Laboratories
  • Department of Materials Science and Engineering, Cornell University
  • Cornell University
  • Department of Nanostructure Physics

External person

Fumiya Watanabe

  • University of Illinois at Urbana-Champaign

External person

Y. Zhong

  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

R. A. Brand

  • Karlsruhe Institute of Technology
  • Institute of Nanotechnology

External person

Cancan Zhao

  • Southern University of Science and Technology
  • Department of Materials Science and Engineering

External person

G. J. Snyder

  • Jet Propulsion Laboratory, California Institute of Technology
  • Northwestern University

External person

Joseph E. Van Nostrand

  • Wright-Patterson Air Force Base
  • SRMP, CE Saclay, CEA
  • Wright-Patterson AFB
  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • ComUE Paris-Saclay
  • Dept. of Mat. Sci. and Engineering
  • Center for Compound Semiconductor Microelectronics
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Université Paris-Saclay
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

S. Flege

  • Technische Universität Darmstadt
  • Institute of Materials Science
  • Institute of Materials Science

External person

Kevin R. West

  • BP Technology Centre
  • BP plc

External person

G. Martin

  • CEREM-DTM-SRMP
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • CEN Saclay
  • Sect. de Rech. de Metall. Physique, CEA-Saclay
  • Cab. H.C.
  • Sect. de Rech. de Metall. Physique
  • CEREM-SRMP
  • Centre d'Etudes Nucléaires de Saclay
  • CEA-Saclay, Sect. de Rech. de Metall. Physique
  • Commsrt. a l'Energie Atomique-Saclay
  • CEA-Siège
  • CE-Saclay
  • CNRS
  • DECM, SRMP, CE Saclay
  • Centre National de la Recherche Scientifique
  • Centre D Etudes Nucléaires de Saclay
  • CEA
  • CEA-Saclay
  • CECM, CNRS
  • Serv. de Rech. de Metall. Physique
  • Centre d'Etudes de Chimie Métallurgique
  • SRMP
  • A.R.M.P.
  • CE Saclay
  • CEREM/SRMP
  • DEN-DMN-SRMP
  • CECM-CNRS
  • Section de Recherches de Métallurgy Physique
  • Commsrt. a l'Ener. Atom. Saclay
  • DTA/CEREM/DECM/SRMP
  • Cent d'Etudes de Saclay
  • CEN Saclay, D. TECH/SRMP
  • SRMP/CEREM
  • SRMP-DECM-CEREM
  • CEREM-SRMP
  • ComUE Paris-Saclay
  • Commissariat a L'Energie Atomique CEA
  • Sect. Rech. de Metall. Phys.
  • Department of Metal Physics Research (SRMP)
  • Dir. des Technol. Avancées
  • Département de Technologie
  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Section de Recherches de Métallurgy Physique
  • Université Paris-Saclay

External person

Paul OBrien

  • University of Manchester
  • International Centre for Advanced Materials (ICAM; Manchester Hub)

External person

Yee Kan Koh

  • National University of Singapore
  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Dept. of Mat. Sci. and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Centre for Advanced 2D Materials
  • University of Illinois at Urbana-Champaign

External person

A. V. Granato

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

J. P. Pleurial

  • Jet Propulsion Laboratory, California Institute of Technology

External person

Ji Cheng Zhao

  • Ohio State University
  • General Electric
  • Department of Materials Science and Engineering
  • Ohio State University
  • Ohio State University

External person

A. Arabi-Hashemi

  • Leibniz Institute of Surface Engineering

External person

R. E. Cook

  • Materials Science Division, Argonne National Laboratory
  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

R. Witte

  • Karlsruhe Institute of Technology
  • Institute of Nanotechnology

External person

Xuying Liu

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Heinrich Gades

  • University of Kaiserslautern
  • Fachbereich Physik

External person

T. Diaz De La Rubia

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

E. C. Landahl

  • Argonne National Laboratory
  • The University of Chicago
  • United States Department of Energy

External person

Philip Howard

  • BP Technology Centre
  • BP plc

External person

C. H. Stephan

  • Michigan State University
  • Physics Dept.
  • Michigan State University

External person

J. W. Mayer

  • Department of Materials Science and Engineering, Cornell University
  • Cornell University
  • Max Planck Institute for Intelligent Systems

External person

Louis E. Brus

  • Columbia University
  • Purdue University
  • Alcatel-Lucent
  • Lucent
  • Department of Chemistry
  • Nokia

External person

Sung Eun Kim

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Craig Daniels

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David J. Lewis

  • University of Manchester
  • International Centre for Advanced Materials (ICAM
  • International Centre for Advanced Materials (ICAM; Manchester Hub)

External person

T. D. Nguyen

  • Department of Materials Science and Engineering
  • Hanoi University of Science and Technology

External person

C. P. Liu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

B. E. Janicek

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Physics
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Matthew Highland

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

I. M. Robinson

  • University of Illinois at Urbana-Champaign

External person

Kangjie Chu

  • Southern University of Science and Technology
  • Department of Materials Science and Engineering

External person

P. S. Peercy

  • Purdue University
  • Sandia National Laboratories
  • Compound Semiconductor and Device Research Department

External person

M. Ghafari

  • Karlsruhe Institute of Technology
  • Institute of Nanotechnology

External person

Xuekun Shang

  • Collaborative Innovation Center of Steel Technology
  • University of Science and Technology Beijing

External person

R. P. Andres

  • Purdue University

External person

J. Xu

  • CAS - Institute of Metal Research
  • University of Illinois at Urbana-Champaign

External person

G. Mayr

  • University of Illinois Urbana-Champaign
  • I. Physikalisches Institut Göttingen
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Göttingen
  • University of Illinois at Urbana-Champaign

External person

A. Lotnyk

  • Leibniz Institute of Surface Engineering

External person

C. K. Huang

  • Jet Propulsion Laboratory, California Institute of Technology

External person

Barry Stolzman

  • Michigan State University
  • Physics Dept.
  • Michigan State University

External person

T. Diaz

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

X. X. Zhang

  • Hong Kong Univ. of Sci. and Technol.
  • Hong Kong University of Science and Technology
  • Department of Physics

External person

A. Dunlop

  • CEA/CEREM/DTM/Laboratoire des Solides Irradiés École Polytechnique
  • École polytechnique
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • ComUE Paris-Saclay

External person

Alex V. Hamza

  • Lawrence Livermore National Laboratory
  • LLNL
  • Nanoscale Synthesis and Characterization Laboratory

External person

Daniel C. Bufford

  • Sandia National Laboratories

External person

J. Peltola

  • University of Helsinki

External person

L. R. Singer

  • Argonne National Laboratory
  • Material Science Division
  • The University of Chicago
  • Argonne National Laboratory

External person

K. Kyuno

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Honig

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. Wang

  • Central Research Department
  • DuPont

External person