Engineering & Materials Science
Irradiation
100%
Ion bombardment
83%
Atoms
74%
Ions
66%
Ion beams
60%
Temperature
49%
Vacancies
46%
Defects
43%
Computer simulation
36%
Metals
36%
Point defects
36%
Precipitates
36%
Radiation
26%
Nanoparticles
24%
Hot Temperature
23%
Plastic deformation
22%
Grain boundaries
20%
Ultrahigh vacuum
20%
Transmission electron microscopy
19%
Electrons
18%
Substrates
16%
Solid solutions
16%
Thin films
16%
Impurities
15%
Copper
15%
Sputtering
14%
Superlattices
13%
Electron microscopes
13%
X rays
12%
Grain growth
12%
Phonons
11%
Radiation damage
11%
Epitaxial growth
11%
Coarsening
11%
Solubility
10%
Scattering
10%
Hardness
10%
Powders
9%
Ballistics
9%
Crystals
9%
Melting
9%
Torsional stress
9%
Physics & Astronomy
irradiation
61%
molecular dynamics
54%
cascades
47%
ion beams
46%
ion irradiation
46%
ions
43%
damage
38%
defects
38%
atoms
33%
simulation
31%
metals
29%
spikes
25%
point defects
25%
interstitials
25%
computerized simulation
25%
nanoparticles
23%
bombardment
22%
temperature
21%
sintering
20%
radiation
20%
copper
17%
viscous flow
16%
markers
16%
precipitates
16%
ultrahigh vacuum
16%
grain boundaries
16%
grain size
15%
energy
15%
tracers
14%
collisions
14%
dosage
14%
transmission electron microscopy
13%
annealing
13%
impurities
12%
thin films
12%
rare gases
12%
silver
11%
condensation
11%
kinetics
11%
melting
11%
temperature dependence
11%
plastic deformation
10%
solutes
10%
x ray scattering
10%
electron microscopes
9%
epitaxy
9%
backscattering
9%
smoothing
9%
sputtering
9%
enthalpy
9%
Chemical Compounds
Alloy
79%
Simulation
57%
Crystal Point Defect
41%
Molecular Dynamics
38%
Ion
26%
Grain Size
23%
Displacement
22%
Metal
22%
Interstitial
21%
Annealing
20%
Amorphous Material
20%
Solute
17%
Sintering
17%
Strain
16%
Creep Rate
15%
Solid Solution
14%
Grain Growth
14%
Surface
14%
Dose
10%
Shear
10%
Electron Particle
10%
Noble Gas Atom
10%
Torsion
10%
Transmission Electron Microscopy
10%
Surface Damage
9%
Ambient Reaction Temperature
9%
Vacuum
9%
Purity
9%
Ion Bombardment
9%
Enthalpy of Mixing
9%
Sputtering
9%
Condensation
8%
Microstructure
8%
Phase Separation
8%