Network

M Tamer Başar

Person: Academic

Girish Chowdhary

Person: Academic

S. P. Meyn

  • University of Florida
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Inria International Chair
  • University of Florida
  • University of Illinois at Urbana-Champaign

External person

Amirhossein Taghvaei

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of California at Irvine
  • Coordinated Science Laboratory
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of California at Irvine
  • UCI
  • University of Washington
  • Univ. of California Irvine
  • University of Illinois at Urbana-Champaign
  • University of Washington

External person

Andrzej Banaszuk

  • University of California at Santa Barbara
  • United Technologies Corporation
  • Control and Embedded Systems Group
  • UTRC
  • Cornell University
  • Systems Department
  • Pratt and Whitney
  • Control and Embedded Systems Group

External person

Jin W. Kim

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Potsdam

External person

Tao Yang

  • University of Illinois Urbana-Champaign
  • General Electric
  • Coupang Global LLC
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Huibing Yin

  • Department of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Materials Science and the Coordinated Science Laboratory
  • Department of Mechanical and Science Engineering
  • Department of Mechanical Sciences and Engineering (Adjunct)
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kun Deng

  • Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Uday V. Shanbhag

  • Pennsylvania State University
  • Department of Industrial and Enterprise Systems Engineering
  • University of Illinois Urbana-Champaign
  • Department of Industrial and Enterprise Systems Engineering
  • Department of Industrial and Manufacturing Engineering
  • Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign
  • Industrial and Manufacturing Engineering
  • Department of Industrial and Enterprise Systems Engineering
  • IFP
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Udit Halder

  • University of Illinois at Urbana-Champaign
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign

External person

Prabir Barooah

  • University of Florida
  • University of California at Santa Barbara
  • Department of Mechanical and Aerospace Engineering
  • Department of Mechanical and Aerospace Engineering
  • Department of Mechanical and Aerospace Engineering
  • Department of Mechanical and Aerospace Engineering
  • Department of Electrical and Computer Engineering
  • Department of Mechanical and Aerospace Engineering
  • UC Santa Barbara College of Engineering
  • University of Florida

External person

Umesh Vaidya

  • Iowa State University
  • Department of ElectricalandComputer Engineering
  • Iowa State University
  • Clemson University
  • Clemson University College of Engineering, Computing and Applied Sciences
  • Iowa State University

External person

Yu Sun

  • Siemens Corporation, Corporate Technology
  • Siemens
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Chi Zhang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Experian plc
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Marios C. Soteriou

  • United Technologies Corporation
  • UTRC
  • AIAA
  • AIAA

External person

Heng Sheng Chang

  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • Coordinated Science Laboratory
  • Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Tixian Wang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign

External person

Ekaterina D. Gribkova

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Neuroscience Program
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tansu Alpcan

  • Technical University of Berlin
  • Deutsche Telekom
  • University of Melbourne
  • University of Illinois Urbana-Champaign
  • Coordinated Science Laboratory
  • Humboldt University of Berlin
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Electronic Engineering
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois at Urbana-Champaign

External person

Adam K. Tilton

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Clas A. Jacobson

  • United Technologies Corporation

External person

Chia Hsien Shih

  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Noel Naughton

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Virginia Tech College of Engineering

External person

S. Yagiz Olmez

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wei Chen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Seung Hyun Kim

  • University of Illinois at Urbana-Champaign
  • Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Yuan Zheng

  • University of Massachusetts
  • ME Department
  • ME Department

External person

Erik Miehling

  • University of Illinois Urbana-Champaign
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign

External person

Alexander I. Khibnik

  • Controls and Diagnostics Systems
  • United Technologies Corporation
  • Pratt and Whitney
  • Controls and Diagnostics Systems

External person

T. J. Healey

  • Cornell University
  • Department of Theoretical and Applied Mechanics
  • Center for Applied Mathematics

External person

Paul Wang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical and Science Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

C. V. Hollot

  • University of Massachusetts
  • ECE Department
  • IEEE
  • ECE Department

External person

Yossi Chait

  • University of Massachusetts
  • ME Department
  • ME Department

External person

Gregory Hagen

  • United Technologies Corporation

External person

Arman Tekinalp

  • University of Illinois Urbana-Champaign
  • Department of Aerospace Engineering, University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dayu Huang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

He Hao

  • University of Florida
  • Department of Mechanical and Aerospace Engineering
  • Department of Mechanical and Aerospace Engineering

External person

Jack Brouwer

  • University of California at Irvine
  • Department of Mechanical and Aerospace Engineering, University of California
  • Department of Mechanical and Aerospace Engineering
  • National Fuel Cell Research Center
  • University of California at San Diego
  • University of California at Irvine
  • Univ. of California Irvine

External person

Henk A P Blom

  • National Aerospace Laboratory NLR
  • Delft University of Technology
  • Royal Netherlands Aerospace Centre

External person

Shubham Aggarwal

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yu Sun

  • Siemens

External person

João Hespanha

  • University of Southern California
  • Yale University
  • University of California at Santa Barbara
  • University of Illinois Urbana-Champaign
  • University of California Office of the President
  • University of California, Berkeley
  • Department of Electrical and Computer Engineering
  • Center for Control, Dynamical Systems, and Computation
  • EE-Systems
  • Department of Electrical Engineering
  • Electrical Engineering Systems
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, University of Southern California
  • Department of Electrical Engineering
  • Center for Control
  • University of Southern California
  • University of California at Berkeley
  • UC Santa Barbara College of Engineering
  • Department of Electrical Engineering, University of Southern California

External person

Gergely Neu

  • University of Florida
  • Pompeu Fabra University
  • University of Florida

External person

Fan Lu

  • University of Florida
  • University of Florida

External person

Joseph S. Niedbalski

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Igor Mezic

  • University of California at Santa Barbara
  • Department of Mechanical Engineering
  • Mechanical Engineering Department
  • Department of Mechanical and Environmental Engineering
  • UC Santa Barbara College of Engineering

External person

Marcello Colombino

  • National Renewable Energy Laboratory

External person

Yue Chen

  • National Renewable Energy Laboratory

External person

Meng Chu Zhou

  • New Jersey Institute of Technology
  • King Abdulaziz University
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering

External person

Ali Shiri

  • University of Alberta
  • School of Library and Information Studies
  • School of Library and Information Studies

External person

Yan Lu

  • National Institute of Standards and Technology

External person

Yu Sun

  • University of Illinois at Urbana-Champaign

External person

William Kier

  • University of North Carolina at Chapel Hill

External person

W. P. Patrick

  • United Technologies Corporation

External person

Charles L. Cox

  • Michigan State University
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • University of Illinois at Chicago
  • Department of Pharmacology
  • The Neuroscience Program, University of Illinois
  • Department of Molecular and Integrative Physiology
  • Department of Pharmacology
  • Department of Pharmacology
  • Neuroscience Program, University of Illinois at Urbana-Champaign
  • Department of Pharmacology
  • Department of Microbiology and Molecular Genetics
  • UIUC
  • University of Illinois at Urbana-Champaign
  • Michigan State University
  • UIUC
  • University of Illinois at Chicago

External person

Robert R. Erickson

  • AIAA
  • United Technologies Corporation
  • AIAA

External person

Tejaswin Parthasarathy

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Guodong Pang

  • Pennsylvania State University
  • Harold/Inge Marcus Dept. Indust. E.

External person

A. C. Zander

  • United Technologies Corporation

External person

Youping Zhang

  • United Technologies Corporation

External person

Bernd R. Noack

  • Université de Poitiers
  • Technical University of Berlin
  • CNRS Centre National de la Recherche Scientifique
  • CNRS
  • Institut Pprime
  • Institut PPRIME
  • Institut P'
  • Institute of Fluid Dynamics and Technical Acoustics

External person

Gilead Tadmor

  • Northeastern University
  • CDSP
  • Department of Electrical and Computer Engineering
  • Communication and Digital Signal Processing Center
  • College of Engineering

External person

Mathukumalli Vidyasagar

  • University of Texas at Dallas
  • Department of Bioengineering
  • Indian Institute of Technology Hyderabad
  • Erik Jonsson School of Engineering and Computer Science
  • Department of Bioengineering
  • Erik Jonsson School of Engineering and Computer Science
  • University of Texas at Dallas

External person

Yongxin Chen

  • University of Minnesota Twin Cities
  • University of Minnesota
  • Georgia Institute of Technology
  • Georgia Institute of Technology

External person

Bryan A. Eisenhower

  • University of California at Santa Barbara
  • Department of Materials, Department of Mechanical Engineering, University of California
  • UC Santa Barbara College of Engineering

External person

Shane Ghiotto

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pilwon Hur

  • University of Wisconsin-Milwaukee
  • Texas A&M University
  • University of Illinois Urbana-Champaign
  • Department of Industrial Engineering
  • Department of Mechanical Engineering, Texas A and M University
  • Department of Mechanical Scienceand Engineering
  • Department of Mechanical Engineering and Sciences
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Sisi Li

  • New Jersey Institute of Technology
  • Department of Electrical and Computer Engineering

External person

A. Surana

  • United Technologies Corporation

External person

Y. Zhang

  • United Technologies Corporation

External person

Vivek Borkar

  • Department of Electrical Engineering
  • Indian Institute of Technology Bombay
  • Tata Institute of Fundamental Research
  • School of Technology and Computer Science

External person

Anant A. Joshi

  • University of Illinois at Urbana-Champaign
  • SEEK
  • University of Illinois at Urbana-Champaign

External person

Jana De Wiljes

  • University of Potsdam

External person

Prabhat K. Mishra

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Massachusetts Institute of Technology

External person

Ankur A. Kulkarni

  • Indian Institute of Technology Bombay
  • University of Illinois Urbana-Champaign
  • Systems and Control Engineering
  • Systems and Control Engineering Group
  • Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Siddharth Goyal

  • University of Florida
  • Department of Mechanical and Aerospace Engineering

External person

Quanyan Zhu

  • Princeton University
  • Isfahan University of Technology
  • New York University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Coordinated Science Laboratory
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Robert R. Bitmead

  • Australian National University
  • Department of Systems Engineering and Cooperative

External person

K. Alex Shorter

  • University of Michigan, Ann Arbor
  • Woods Hole Oceanographic Institution
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Mechanical Science and Engineering Department, University of Illinois
  • Department of Mechanical Scienceand Engineering
  • Department of Mechanical and Science Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Michigan Healthcare System
  • University of Illinois at Urbana-Champaign
  • University of Michigan, Ann Arbor
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Alberto Speranzon

  • United Technologies Corporation
  • Systems Department

External person

Jin Won Kim

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Andrey Bernstein

  • National Renewable Energy Laboratory

External person

Jameson Mori

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • College of Veterinary Medicine at Uiuc

External person

Jayakrishnan Unnikrishnan

  • Swiss Federal Institute of Technology Lausanne
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Audio-Visual Communications Laboratory, Swiss Federal Institute of Technology Lausanne (EPFL)
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tryphon Georgiou

  • University of Minnesota Twin Cities
  • Department of Electrical and Computer Engineering
  • University of California at Irvine
  • Univ. of California Irvine

External person

Jesper Oppelstrup

  • KTH Royal Institute of Technology

External person

Sebastian Reich

  • University of Reading
  • Department of Mathematics and Statistics
  • Institut für Mathematik
  • University of Potsdam

External person

Geng Huang

  • Department of Electrical and Computer Engineering at UIUC
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yan Lu

  • Siemens

External person

Serdar Yuksel

  • Queen's University Kingston
  • Yale University
  • University of Illinois Urbana-Champaign
  • Dunham Lab.
  • Mathematics and Engineering Program
  • Mathematics and Engineering Program
  • Department of Electrical Engineering
  • Mathematics and Engineering Program
  • Department of Mathematics and Statistics
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. A. Bouchard

  • University of Wisconsin-Madison
  • University of Illinois Urbana-Champaign
  • South Dakota State University
  • Sam Parr Biological Station
  • Department of Wildlife and Fisheries Sciences
  • University of Illinois at Urbana-Champaign

External person

Fu Li

  • Northeastern University
  • Communication and Digital Signal Processing Center

External person

C. Richard Johnson

  • Cornell University
  • IEEE
  • Department of Electrical Engineering
  • School of Electrical Engineering

External person

Naveen Kumar Uppalapati

  • University of Illinois Urbana-Champaign
  • Department of Industrial and Systems Engineering
  • Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ximena Rossello

  • Humanities Computing Program
  • University of Alberta

External person

Emiliano Dall'Anese

  • University of Minnesota Twin Cities
  • National Renewable Energy Laboratory
  • Department of Electrical and Computer Engineering
  • Department of ECEE
  • University of Colorado Boulder
  • National Renewable Energy Laboratory
  • University of Colorado Boulder

External person

Mihai Dorobantu

  • United Technologies Corporation
  • Systems Department

External person

Adam Wierman

  • California Institute of Technology
  • Computing and Mathematical Sciences Department
  • Department of Electrical Engineering
  • Dept. of CS
  • California Institute of Technology
  • California Institute of Technology Division of Engineering and Applied Science

External person