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Network

Kannan, Sreeram

  • University of Washington
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering and Computer Science
  • Dept. of Elec. Eng. and Comp. Sci.
  • Department of Electrical Engineering
  • Department of EECS, University of California at Berkeley
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Networked Control Systems Lab
  • Department of Electrical and Computer Engineering
  • Samsung AI Centre

External person

Tse, David

  • University of California at Berkeley
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Univ. IL
  • IEEE
  • University of California Office of the President
  • Department of EECS, University of California at Berkeley
  • Department of Electrical Engineering and Computer Sciences
  • Dept. of Elec. Eng. and Comp. Sci.
  • Electrical Engineering and Computer Science Department
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Systems Engineering
  • Electrical Engineering and Computer Sciences Department
  • Electrical Engineering and Computer Sciences Department
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences, University of California, Berkeley
  • University of Hong Kong
  • Department of Marketing
  • Department of Electrical Engineering and Computer Sciences
  • Electrical Engineering and Computer Sciences Department
  • Department of Electrical Engineering and Computer Sciences
  • University of California

External person

Raja, Adnan

  • Fastback Networks, Inc.
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks
  • Fastback Networks

External person

Fanti, Giulia

  • University of California Office of the President
  • University of Illinois at Urbana-Champaign
  • Giulia Fanti
  • University of California at Berkeley
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Elec. and Comp. Engineering
  • Carnegie Mellon University

External person

Kairouz, Peter

  • University of Illinois at Urbana-Champaign
  • Stanford University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Prabhakaran, Vinod M.

  • Tata Institute of Fundamental Research
  • TIFR
  • Swiss Federal Institute of Technology Lausanne
  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • School of Technology and Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Kulkarni, Sanjeev R.

  • Princeton University
  • IEEE
  • Department of Electrical Engineering
  • Department of Electric Engineering
  • EE Dept.
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

Anantharam, V.

  • University of California at Berkeley
  • IEEE
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering and Computer Science Department
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of EECS, University of California at Berkeley
  • Department of Electrical Engineering and Computer Science
  • University of California

External person

Gao, Weihao

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. ECE and CSL
  • CSL and Dept. of ECE
  • University of Illi-nois

External person

Wagner, Aaron B.

  • Cornell University
  • Ministry of Science and Technology
  • University of Illinois at Urbana-Champaign
  • School of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering
  • School of ECE

External person

Venkatakrishnan, Shaileshh Bojja

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • EECS Department
  • Massachusetts Institute of Technology
  • Department of Electrical and Computer Engineering

External person

Jovicic, Aleksandar

  • Qualcomm Incorporated
  • University of Illinois at Urbana-Champaign
  • IEEE
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering

External person

Tavildar, Saurabha

  • Qualcomm Incorporated
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • UIUC

External person

Oh, Sewoong

  • University of Illinois at Urbana-Champaign
  • Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of ECE and ISE
  • University of Illi-nois
  • CSL and Dept. of IESE
  • Massachusetts Institute of Technology
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Paul G. Allen School of Computer Science and Engineering
  • University of Washington
  • EECS Department
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Departments of EE and Statistics
  • Department of Electrical Engineering and Department of Statistics
  • Department of Electrical Engineering

External person

Wang, Hua

  • Qualcomm Incorporated
  • University of Illinois at Urbana-Champaign
  • Grocery Manufacturers Assn.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Food Science and Human Nutrition
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Liu, Tie

  • Texas A and M University
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Texas AandM University
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics

External person

Kim, Hyeji

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • University of Washington
  • Samsung AI Centre

External person

Geng, Quan

  • Tower Research Capital, LLC
  • University of Illinois at Urbana-Champaign
  • Tower Research Capital, LLC
  • Tower Research Capital, LLC
  • Alphabet Inc.
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital, LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC
  • Tower Research Capital, LLC
  • Tower Research Capital, LLC
  • Tower Research Capital, LLC
  • Tower Research Capital, LLC
  • Tower Research Capital LLC

External person

Tyagi, Himanshu

  • Indian Institute of Science Bangalore
  • Department of Electrical Communication Engineering

External person

Watanabe, Shun

  • Tokyo University of Agriculture and Technology
  • Department of Computer and Information Sciences

External person

Kamath, Sudeep

  • University of California at Berkeley
  • University of California at San Diego
  • Princeton University
  • Department of Electrical and Computer Engineering
  • Department of EECS, University of California at Berkeley
  • Electrical and Computer Engineering Department

External person

Ramchandran, Kannan

  • University of California at Berkeley
  • Qualcomm Incorporated
  • University of Pittsburgh
  • University of Illinois at Urbana-Champaign
  • Beckman Institute
  • Compaq Computer Corp
  • City University of New York
  • Columbia University
  • Lucent
  • Elec. and Comp. Eng. Department
  • IEEE
  • Hewlett-Packard
  • Dept. of Elec. Eng. and Comp. Sci.
  • Center for Compound Semiconductor Microelectronics
  • Cambridge Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Mathematics
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of EECS, University of California at Berkeley
  • Department of Electrical Engineering and Computer Sciences
  • Ctr. for Telecommunications Research
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering
  • Beckman Institute and Department of Electrical and Computer Engineering
  • Department of Electrical Engineering and Computer Sciences
  • University of California

External person

Jiang, Yihan

  • University of Washington
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering

External person

Alizadeh, Mohammad

  • Massachusetts Institute of Technology
  • Stanford University

External person

Rajesh, Ramachandran

  • Defence Research and Development Organisation India
  • Center for Airborne Systems

External person

Asnani, Himanshu

  • Stanford University
  • Department of Electrical Engineering, Stanford University
  • Ericsson Research and Development Sillicon Valley
  • Department of Electrical and Computer Engineering
  • University of Washington
  • Ericsson AB

External person

Mu, Jiaqi

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Ahmad, Sahand Haji Ali

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Laroia, Rajiv

  • Qualcomm Incorporated
  • University of Illinois at Urbana-Champaign
  • IEEE

External person

Zheng, Lizhong

  • Massachusetts Institute of Technology
  • Dept. of Elec. Eng. and Comp. Sci.
  • EECS Department

External person

Wang, Yi

  • Huawei Technologies Co., Ltd.

External person

Sundaresan, Rajesh

  • Indian Institute of Science Bangalore
  • University of Illinois at Urbana-Champaign
  • Electrical and Computer Engineering Department
  • Department of Electrical Communication Engineering

External person

Khude, Nilesh

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Wu, Rui

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Tularak, Thitidej

  • Cornell University
  • Ministry of Science and Technology

External person

Swamy, Vasuki Narasimha

  • Indian Institute of Technology, Madras
  • University of California at Berkeley
  • Department of Electrical Engineering
  • Electrical Engineering and Computer Sciences Department

External person

Weingarten, Hanan

  • Technion-Israel Institute of Technology
  • Department of Electrical Engineering

External person

Rana, Ranvir

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Gong, Hongyu

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Cidon, Asaf

  • Stanford University

External person

Sharma, V.

  • University of Delhi
  • University of California at San Diego
  • CERN
  • University of California at Riverside
  • Indian Institute of Science Bangalore
  • University of Illinois at Chicago
  • University of California Office of the President
  • Electrical and Computer Engineering Department
  • Florida State University
  • University of Wisconsin-Madison

External person

Kelly, Benjamin G.

  • Cornell University
  • Birchbox, Inc

External person

Nagaraj, Kanthi

  • Stanford University

External person

Steinberg, Yossef

  • Technion-Israel Institute of Technology
  • Department of Electrical Engineering

External person

Lozano, Aurelie C.

  • Lausanne (EPFL)
  • Swiss Federal Institute of Technology
  • Princeton University
  • Swiss Federal Institute of Technology Lausanne
  • IEEE
  • Department of Electrical Engineering
  • EE Dept.

External person

Katti, Sachin

  • Stanford University

External person

Shamai, Shlomo

  • Technion-Israel Institute of Technology
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

Wang, I. Hsiang

  • Swiss Federal Institute of Technology Lausanne

External person

Avestimehr, Salman

  • University of Southern California

External person

Thathachar, M. A L

  • Indian Institute of Science Bangalore

External person

Li, Yuchen

  • University of Illinois at Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Bagaria, Vivek

  • Stanford University

External person

Denby, Bradley

  • Dept. of Elec. and Comp. Engineering
  • Carnegie Mellon University

External person

Diggavi, Suhas

  • University of California at Los Angeles

External person

Bhashyam, Srikrishna

  • Indian Institute of Technology, Madras
  • Department of Electrical Engineering
  • Department of Electrical Engineering

External person

Kogan, Leonid

  • Massachusetts Institute of Technology

External person

Yu, Mingchao

  • University of Southern California

External person

Bakshi, Surya

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • UIUC

External person

Rajamani, Sriram

  • Microsoft USA
  • University of California at Berkeley

External person

Sakakini, Tarek

  • University of Illinois at Urbana-Champaign

External person

Bi, Xiaoyan

  • Huawei Technologies Co., Ltd.

External person

Bojja Venkatakrishnan, Shaileshh

  • University of Illinois at Urbana-Champaign

External person

Ruan, Kathleen

  • Carnegie Mellon University

External person

Sivaraman, Vibhaalakshmi

  • Massachusetts Institute of Technology

External person

Zhang, Jiayin

  • Huawei Technologies Co., Ltd.

External person

Wang, Mua

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Suh, Changho

  • Korea Advanced Institute of Science and Technology
  • School of Electrical Engineering

External person

Li, Songze

  • University of Southern California

External person

Jovičć, Aleksandar

  • Qualcomm Incorporated

External person

Jiao, Jiantao

  • University of California at Berkeley

External person

Wang, Gerui

  • University of Illinois at Urbana-Champaign

External person

Sharma, Vinod

  • Electrical and Computer Engineering Department
  • Indian Institute of Science Bangalore

External person

Makkuva, Ashok Vardhan

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Bhargava, Shruti

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • UIUC

External person

Sahraei, Saeid

  • University of Southern California

External person

Rahimzamani, Arman

  • Department of Electrical and Computer Engineering
  • University of Washington

External person