Network

J. Ballato

  • Clemson University
  • University of Illinois Urbana-Champaign
  • The American Ceramic Society
  • Center for Optical Materials Science and Engineering Technologies
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Holcombe Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Chemistry
  • University of Illinois at Urbana-Champaign
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

T. Hawkins

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

M. Cavillon

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Université Paris-Sud
  • Université Paris-Saclay
  • ComUE Paris-Saclay
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

C. J. Kucera

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

N. Yu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Michel Digonnet

  • Stanford University
  • Stanford University

External person

M. Tuggle

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Magnus Engholm

  • Mid Sweden University

External person

Alexander R. Pietros

  • Fiber Optics Research and Glass Engineering (FORGE) Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Fiber Optics Research and Glass Engineering (FORGE) Laboratory

External person

B. Meehan

  • Clemson University
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

P. R. Foy

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Center for Optical Materials Science and Engineering Technologies
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

R. Stolen

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Department of Materials Science and Engineering
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Martin Bernier

  • Université Laval
  • University of Montreal

External person

S. Morris

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Kacper Rebeszko

  • Fiber Optics Research and Glass Engineering (FORGE) Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Fiber Optics Research and Glass Engineering (FORGE) Laboratory

External person

G. C. Papen

  • University of Illinois Urbana-Champaign
  • University of California at San Diego
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. P. Stone

  • Clemson University
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

M. Jones

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Department of Materials Science and Engineering
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

P. C. Law

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jenny M. Knall

  • Stanford University
  • Stanford University
  • Stanford University

External person

A. E. Mironov

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Laboratory for Optical Physics and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Laboratory for Optical Physics and Engineering
  • Cygnus Photonics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Mary Ann Cahoon

  • Clemson University
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Pierre Baptiste Vigneron

  • Stanford University
  • Stanford University

External person

A. Croteau

  • INO.
  • National Optics Institute

External person

Ray Secondo

  • Virginia Commonwealth University

External person

Ksenia Dolgaleva

  • University of Ottawa

External person

P. Boucaud

  • Hebrew University of Jerusalem
  • Université Paris-Sud
  • ComUE Paris-Saclay
  • CNRS
  • Universite Paris-Sud XI
  • Universite Paris XI
  • Université Paris-Saclay
  • CNRS Centre National de la Recherche Scientifique
  • Universite Cote d'Azur

External person

Kresten Yvind

  • Technical University of Denmark

External person

Cecília L.A.V. Campos

  • Universidade Federal de Pernambuco

External person

C. Ryan

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Dmitry Turchinovich

  • Technical University of Denmark
  • DTU Fotonik, Department of Photonics Engineering, Technical University of Denmark
  • Max Planck Institute for Polymer Research
  • Technical University of Denmark
  • University of Duisburg-Essen
  • Faculty of Physics, Center for Nanointegration Duisburg-Essen (CENIDE), University of Duisburg-Essen
  • DTU Fotonik - Department of Photonics Engineering, Technical University of Denmark
  • Bielefeld University

External person

Eiji Tokunaga

  • Tokyo University of Science

External person

A. Ballato

  • Clemson University
  • Holcombe Electrical and Computer Engineering
  • The American Ceramic Society
  • Department of Electrical and Computer Engineering
  • ERADCOM
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Mikko J. Huttunen

  • Tampere University

External person

Yuh Shiuan Liu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nathalie Vermeulen

  • Vrije Universiteit Brussel

External person

T. Boilard

  • Université Laval

External person

Georges Boudebs

  • Université d'Angers

External person

Jingshi Yan

  • Australian National University

External person

Daniel Espinosa

  • University of Ottawa

External person

C. G. Carlson

  • United States Air Force Academy
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Laser and Optics Research Center
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dragomir Neshev

  • Australian National University

External person

Jacob R. Rosenbaum

  • Fiber Optics Research and Glass Engineering (FORGE) Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Fiber Optics Research and Glass Engineering (FORGE) Laboratory

External person

Alex Evert

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Department of Materials Science and Engineering
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

M. Pu

  • Technical University of Denmark

External person

L. Dong

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Holcombe Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

R. Rice

  • Dreamcatchers Consulting

External person

Eric W. Van Stryland

  • University of Central Florida

External person

Anderson S.L. Gomes

  • Universidade Federal de Pernambuco

External person

Adam Ball

  • Virginia Commonwealth University

External person

Nathaniel Kinsey

  • Virginia Commonwealth University

External person

Lázaro A. Padilha

  • Universidade Estadual de Campinas

External person

Rich Mildren

  • Macquarie University

External person

A. F.J. Runge

  • University of Southampton
  • Optoelectronics Research Centre
  • Optoelectronics Research Centre

External person

G. Pan

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Joshua Furtick

  • Clemson University
  • Department of Materials Science and Engineering
  • Center for Optical Materials Science and Engineering Technologies
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

A. C. Peacock

  • University of Southampton
  • Optoelectronics Research Centre
  • Optoelectronics Research Centre

External person

J. J. Coleman

  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Materials Research Laboratory
  • Engineering Research Center for Compound Semiconductor Microelectronics
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • NASA Goddard Space Flight Center
  • University of Texas at Dallas
  • Ctr. Compd. Semiconduct. M.
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Department of Materials Science
  • Microeectronics Laboratory
  • Materials Research Laboratory and Everitt Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Center for Nutrition
  • Materials Research Laboratory and Microelectronics Laboratory
  • Micro and Nanotechnology Lab
  • Department of Electrical Engineering
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Texas at Dallas

External person

Jane Gragg

  • Clemson University
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Almantas Galvanauskas

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory
  • University of Michigan, Ann Arbor

External person

D. Sligh

  • Clemson University
  • Department of Materials Science and Engineering
  • Center for Optical Materials Science and Engineering Technologies
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Stephen J. Mihailov

  • National Research Council of Canada

External person

A. James

  • Clemson University
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Dan Grobnic

  • National Research Council of Canada

External person

Konstantin G. Kornev

  • Clemson University
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Artis Brasovs

  • Clemson University
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Chi Hung Liu

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory
  • University of Michigan, Ann Arbor

External person

Gary R. Swenson

  • Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign
  • Utah State University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Remote Sensing and Space Sciences Group
  • Center for Atmospheric and Space Sciences
  • Department of Electrical and Computer Engineering
  • Lockheed Martin
  • Lockheed Research and Development
  • Lockheed Research and Development
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jennifer Campbell

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wynter Chen

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mingye Xiong

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

L. M. Little

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. D. Yablon

  • Interfiber Analysis

External person

Maxime Cavillon

  • Clemson University
  • Université Paris-Sud
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Department of Materials Science and Engineering
  • Université Paris-Saclay
  • ComUE Paris-Saclay

External person

Sehyun Park

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Rice University
  • University of Illinois at Urbana-Champaign

External person

Enkeleda Balliu

  • Mid Sweden University
  • Stanford University

External person

J. Parsons

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Columbia University
  • Ohio State University
  • University of Copenhagen
  • National Institute for Nuclear Physics
  • University of Genoa
  • Stanford Linear Accelerator Center
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Jincheng Du

  • University of North Texas
  • Department of Materials Science and Engineering

External person

Steve W. Martin

  • Iowa State University
  • The American Ceramic Society
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Iowa State University
  • Iowa State University

External person

L. Ackerman

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Benoit Faugas

  • Clemson University
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Nufern
  • Department of Materials Science and Engineering
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Kavita V. Desai

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Jagannathan

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Thomas C. Galvin

  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign
  • Lawrence Livermore National Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Laboratory for Optical Physics and Engineering
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Anthony Mangognia

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jonathon Guerrier

  • Furman University

External person

R. Kirk Price

  • University of Illinois at Urbana-Champaign
  • nLIGHT Corporation
  • University of Illinois at Urbana-Champaign

External person

K. E. Keister

  • Earlham College
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Alexis Méndez

  • MCH Engineering LLC

External person

Chun Wei Chen

  • Stanford University

External person

Xian Feng

  • Jiangsu Normal University

External person

Molly E. Fahey

  • NASA Goddard Space Flight Center

External person

Colin McMillen

  • Clemson University

External person

Qimin Quan

  • NanoMosaic Inc.

External person

H. J. Yang

  • University of Illinois Urbana-Champaign
  • Purdue University
  • Department of Electrical and Computer Engineering
  • Laboratory for Optical Physics and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jasbinder Sanghera

  • Naval Research Laboratory

External person

D. J. Ottaway

  • University of Adelaide
  • University of Rochester
  • Massachusetts Institute of Technology
  • National Science Foundation
  • LIGO, Massachusetts Institute of Technology
  • LIGO Hanford

External person

K. J. Beernink

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory and Everitt Laboratory
  • Materials Research Laboratory
  • Materials Research Laboratory and Microelectronics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

V. Iordache

  • University of Illinois Urbana-Champaign
  • Department of Geology, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tao Luo

  • AdValue Photonics

External person

Angel Flores

  • NASA Goddard Space Flight Center
  • Air Force Research Laboratory

External person

Max Diem

  • Northeastern University

External person

Misha Sumetsky

  • Aston University

External person

Junjie Zhao

  • University of North Texas
  • Zhejiang University
  • Department of Materials Science and Engineering

External person

Benedikt W. Graf

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • NinePoint Medical
  • Department of Electrical and Computer Engineering, University of at Champaign
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Biophotonics Imaging Laboratory
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kara Peters

  • North Carolina State University

External person

Yitao Wang

  • Université Paris-Saclay
  • ComUE Paris-Saclay

External person

A. W. Yu

  • NASA Goddard Space Flight Center

External person

Demetrios Poulios

  • NASA Goddard Space Flight Center

External person

Anbo Wang

  • Virginia Polytechnic Institute and State University

External person

Paul Antonick

  • Rutgers - The State University of New Jersey, New Brunswick

External person

T. Y. Fan

  • NASA Goddard Space Flight Center

External person

D. Litzkendorf

  • Leibniz Institute of Photonic Technology

External person

K. Numata

  • NASA Goddard Space Flight Center

External person

Baris Kukuoz

  • Clemson University
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Xvsheng Qiao

  • Zhejiang University

External person

E. Joseph Friebele

  • KeyW Corporation

External person

S. Wang

  • University of Illinois at Urbana-Champaign

External person

Donald M. Cornwell

  • NASA Goddard Space Flight Center

External person

Michael Gachich

  • University of Illinois at Urbana-Champaign

External person

J. Dong

  • Xiamen University

External person

John Canning

  • University of Technology Sydney

External person

Lei Zhang

  • Zhejiang University

External person

Benjamin N. Frey

  • Stanford University

External person

Zhongcong Xie

  • Harvard University

External person

M. C. Paul

  • Fiber Optics and Photonics Division
  • CSIR - Central Leather Research Institute
  • CSIR - Central Glass Ceramic Research Institute

External person

Colin C. Baker

  • Naval Research Laboratory

External person

Ashley Burdett

  • University Research Foundation

External person

M. G. Pamato

  • University of Illinois Urbana-Champaign
  • University College London
  • Department of Earth Sciences
  • Department of Geology, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jayani Kalahe

  • University of North Texas

External person

Lan Yang

  • Washington University St. Louis

External person

Michael A. Krainak

  • NASA Goddard Space Flight Center

External person

Arturo I. Hernandez-Serrano

  • University of Warwick

External person

Amber L. Vargas

  • University Research Foundation

External person

Matthieu Lancry

  • Université Paris-Saclay
  • ComUE Paris-Saclay

External person

Geoffrey A. Cranch

  • Naval Research Laboratory

External person

Shibin Jiang

  • AdValue Photonics

External person

B. Topper

  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Bennett Greenberg

  • Rutgers - The State University of New Jersey, New Brunswick
  • Princeton University

External person

Z. Dai

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sudipta Ghosh

  • Indian Institute of Technology Delhi
  • CSIR - Central Glass Ceramic Research Institute

External person

A. Vonderhaar

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. H. Ni

  • University of Illinois at Urbana-Champaign

External person

Stephen H. Garofalini

  • Department of Materials Science and Engineering
  • Rutgers - The State University of New Jersey, New Brunswick

External person

H. Cheng

  • South China University of Technology
  • Xiamen University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electronic Engineering
  • Guangdong Provincial Key Laboratory of Fiber Laser Materials and Applied Techniques
  • State Key Laboratory of Luminescent Materials and Devices
  • Guangdong Engineering Technology Research and Development Center of Special Optical Fiber Materials and Devices
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Thao Vien Bui

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gilberto Brambilla

  • University of Southampton

External person

Benjamin G. Ward

  • United States Air Force Academy
  • Department of Physics

External person

Jay Dawson

  • Lawrence Livermore National Laboratory

External person

Axel Schulzgen

  • University of Central Florida

External person

Björn M. Reinhard

  • Boston University
  • Boston University

External person

Enrique Castro-Camus

  • University of Marburg
  • Centro de Investigaciones en Optica

External person

Arushi Arora

  • Stanford University
  • Stanford University
  • Stanford University

External person

Kevin Cook

  • University of Technology Sydney

External person

John J. Zayhowski

  • NASA Goddard Space Flight Center

External person

Elodie Strupiechonski

  • Centro de Investigacion y de Estudios Avanzados del Instituto Politécnico Nacional

External person

Frank Vollmer

  • University of Exeter

External person

S. J. Park

  • University of Illinois at Urbana-Champaign

External person

Thomas W. Hawkins

  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Chirantan Mukhopadhyay

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Srikanth Pedireddy

  • University of Exeter

External person

K. Schuster

  • Leibniz Institute of Photonic Technology

External person

J. Dellith

  • Leibniz Institute of Photonic Technology

External person

Paola Saccomandi

  • Polytechnic University of Milan

External person

Lauris Talbot

  • Université Laval

External person

G. G. Carlson

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Daniel L. Rhonehouse

  • Naval Research Laboratory

External person

Michael Norlander

  • University of Illinois at Urbana-Champaign

External person

Callum Jones

  • University of Exeter

External person

Alfred Andrawis

  • NASA Goddard Space Flight Center

External person

Goretti G. Hernandez-Cardoso

  • University of Marburg

External person

Alan Z. Liu

  • Embry-Riddle Aeronautical University
  • Department of Physical Sciences, Embry-Riddle Aeronautical University
  • University of Illinois Urbana-Champaign
  • Wuhan University
  • Department of Electrical and Computer Engineering
  • Department of Physical Sciences
  • Electronic Information School
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Kirtland AFB
  • Directed Energy Directorate
  • Dept.Elec.Comp. Eng.
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Air Force Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Ori Henderson-Sapir

  • Mirage Photonics
  • University of Adelaide

External person

Mário F.S. Ferreira

  • University of Aveiro

External person

Richard E. Riman

  • Rutgers - The State University of New Jersey, New Brunswick

External person

Xiaozhen Xu

  • NASA Goddard Space Flight Center

External person

Bertrand Poumellec

  • Université Paris-Saclay
  • ComUE Paris-Saclay

External person

G. M. Smith

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person