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Network

Un Ku Moon

  • Oregon State University
  • IEEE
  • School of Electrial Engineering and Computer Science
  • Department of Electrical Engineering
  • School of Electrical Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • School of EECS
  • Sch. of Elec. Eng./Computer Science
  • School of Electrical Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering

External person

Amr Elshazly

  • Oregon State University
  • Intel
  • University of Illinois at Urbana-Champaign
  • Intel Corporation
  • Intel Corporation
  • Intel Corporation
  • School of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • School of EECS
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Oracle Labs
  • VLSI Research
  • Oracle Corporation

External person

Ahmed Elkholy

  • Department of Electrical and Computer Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Broadcom Corporation

External person

Mrunmay Talegaonkar

  • Oregon State University
  • Department of Electrical and Computer Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, University of Illinois
  • Infi Corporation
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, University of Illinois
  • Inphi Corporation
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Electrical Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • School of EECS
  • Department of Electrical and Computer Engineering

External person

Woo Seok Choi

  • University of Illinois at Urbana-Champaign
  • Gwangju Institute of Science and Technology
  • Korean Agency for Defense Development
  • Oregon State University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • School of EECS
  • Harvard University
  • School of Engineering and Applied Sciences, Wyss Institute for Biologically Inspired Engineering, Harvard University
  • Seoul National University

External person

Kartikeya Mayaram

  • Oregon State University
  • School of EECS
  • School of Electrical Engineering and Computer Science
  • School of Electrial Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering
  • IEEE
  • School of Electrical Engineering and Computer Science

External person

Brian Young

  • Oregon State University
  • Marvell
  • Marvell Semiconductor
  • Marvell
  • Marvell
  • ON Semiconductor Corporation
  • School of Electrical Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • School of EECS

External person

Saurabh Saxena

  • Oregon State University
  • Department of Electrical and Computer Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, University of Illinois
  • Indian Institute of Technology, Madras
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical Engineering
  • School of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • School of EECS

External person

Tejasvi Anand

  • Department of Electrical and Computer Engineering, University of Illinois
  • Oregon State University
  • U. Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Electrical Engineering and Computer Science Department
  • Department of Electrical Engineering and Computer Science
  • School of EECS
  • School of Electrical Engineering and Computer Science

External person

R. K. Nandwana

  • Oregon State University
  • Department of Electrical and Computer Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, University of Illinois
  • Cisco Systems
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of EECS
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering
  • University of Illinois

External person

Guanghua Shu

  • Oregon State University
  • University of Illinois at Urbana-Champaign
  • Oracle Labs
  • VLSI Research
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • School of EECS
  • Indian Institute of Technology, Madras
  • Department of Electrical Engineering
  • Oracle Corporation

External person

Rajesh Inti

  • Oregon State University
  • Intel
  • School of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • School of EECS
  • School of Electrical Engineering and Computer Science

External person

Sachin Rao

  • Oregon State University
  • Qualcomm Technologies Inc.
  • Qualcomm Incorporated
  • Qualcomm Research
  • School of Electrical Engineering and Computer Science
  • School of EECS
  • School of Electrical Engineering and Computer Science

External person

Seong Joong Kim

  • Department of Electrical and Computer Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering
  • University of Illinois

External person

Gu Yeon Wei

  • Harvard University
  • Oregon State University
  • IEEE
  • Department of Electrical Engineering
  • School of EECS
  • Division of Engineering and Applied Sciences
  • Electrical Engineering and Computer Science
  • School of Engineering and Applied Sciences, Wyss Institute for Biologically Inspired Engineering, Harvard University

External person

Mostafa Gamal Ahmed

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Ahmed Elmallah

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Wenjing Yin

  • Oregon State University
  • Qualcomm Incorporated
  • School of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • School of EECS

External person

Qadeer Khan

  • Oregon State University
  • Qualcomm Incorporated
  • University of Illinois at Urbana-Champaign
  • Indian Institute of Technology, Madras
  • School of EECS
  • School of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering
  • University of Illinois

External person

Karthikeyan Reddy

  • Oregon State University
  • Linear Technology
  • Linear Technology
  • School of Electrical Engineering and Computer Science
  • School of EECS
  • Linear Technology Corp

External person

Gabor C. Temes

  • Oregon State University
  • IEEE
  • School of Electrical Engineering and Computer Science
  • School of Electrial Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • School of EECS

External person

Min Gyu Kim

  • Oregon State University
  • Broadcom Corporation
  • IEEE
  • Broadcom Corporation
  • School of Electrical Engineering and Computer Science
  • School of EECS

External person

Arun Rao

  • National Semiconductor Corporation
  • Texas Instruments
  • University of Illinois at Urbana-Champaign
  • Grass Valley Design Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Igor Vytyaz

  • Oregon State University
  • Berkeley Design Automation
  • IEEE
  • School of Electrical Engineering and Computer Science
  • School of EECS
  • School of Electrical Engineering and Computer Science

External person

Naga Sasidhar

  • Oregon State University
  • Mobius Semiconductor
  • Intel
  • Department of Electrical Engineering and Computer Science
  • School of EECS
  • School of Electrical Engineering and Computer Science

External person

Seiji Takeuchi

  • Asahi Kasei EMD Corporation
  • Asahi Kasei Microsystems
  • Asahi Kasei Microdevices Corporation

External person

William McIntyre

  • National Semiconductor Corporation
  • Texas Instruments
  • University of Illinois at Urbana-Champaign
  • Grass Valley Design Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Koichi Hamashita

  • Asahi Kasei EMD Corporation
  • Asahi Kasei Microsystems
  • Asahi Kasei Microdevices Corporation

External person

Junheng Zhu

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Karim M. Megawer

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Da Wei

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Volodymyr Kratyuk

  • Portland Design Center
  • Oregon State University
  • Silicon Laboratories
  • IEEE
  • School of Electrial Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • School of EECS
  • Silicon Laboratories

External person

Gil Cho Ahn

  • Oregon State University
  • Sogang University
  • IEEE
  • Department of Electronic Engineering
  • School of Electrical Engineering and Computer Science
  • School of EECS

External person

Merrick Brownlee

  • Oregon State University
  • Mindspeed Technologies
  • IEEE
  • School of Electrial Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • School of EECS

External person

David Gubbins

  • Linear Technology
  • Oregon State University
  • School of EECS

External person

Srikanth Gondi

  • Kawasaki Microelectronics America, Inc.
  • GigFire Microsystems, Inc
  • R and D Division

External person

Amr Khashaba

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Greg Winter

  • Texas Instruments
  • University of Illinois at Urbana-Champaign
  • Grass Valley Design Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Ting Wu

  • Oregon State University
  • Rambus Inc.
  • School of Electrical Engineering and Computer Science
  • School of EECS
  • School of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering
  • Rambus Inc.

External person

Abhijith Arakali

  • Oregon State University
  • Silicon Laboratories, Inc.
  • School of Electrical Engineering and Computer Science
  • Broadcast Division
  • School of EECS

External person

Damian Swank

  • National Semiconductor Corporation

External person

Peter Kurahashi

  • Oregon State University
  • School of Electrial Engineering and Computer Science
  • School of Electrical Engineering and Computer Science
  • School of EECS

External person

David C. Lee

  • Berkeley Design Automation
  • IEEE

External person

Sunwoo Kwon

  • Dongbu HiTek
  • Oregon State University
  • School of EECS

External person

Nathanael Griesert

  • Texas Instruments
  • University of Illinois at Urbana-Champaign
  • Grass Valley Design Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Sarvesh Bang

  • National Semiconductor Corporation
  • Oregon State University
  • School of EECS
  • School of Electrical Engineering and Computer Science

External person

Ankur Agrawal

  • Harvard University
  • IBM Research
  • School of Engineering and Applied Sciences, Wyss Institute for Biologically Inspired Engineering, Harvard University
  • IBM
  • IBM Research
  • T.J. Watson Research Center

External person

Praveen Prabha

  • Broadcom
  • Broadcom Corporation
  • Oregon State University
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom Corporation
  • School of EECS
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom
  • Broadcom

External person

Tao Tong

  • Oregon State University
  • School of Electrical Engineering and Computer Science

External person

Terri S. Fiez

  • Oregon State University
  • School of Electrical Engineering and Computer Science
  • School of EECS

External person

Kaoru Takasuka

  • Asahi Kasei EMD Corporation
  • Asahi Kasei Microsystems

External person

Daniel Coombs

  • University of Illinois at Urbana-Champaign
  • Ocient Inc.

External person

Brian Drost

  • Silicon Laboratories
  • Oregon State University
  • Silicon Laboratories
  • School of EECS

External person

Danielle Griffith

  • Texas Instruments

External person

Volodymyr Kratyuk

  • Oregon State University
  • School of EECS

External person

M. Aniya

  • Asahi Kasei Microdevices Corporation

External person

Bumha Lee

  • National Semiconductor Corporation

External person

Sang Ho Kim

  • Samsung

External person

Youn Jae Kook

  • Oregon State University
  • Analog Devices, Inc.
  • School of Electrial Engineering and Computer Science
  • School of EECS
  • School of Electrical Engineering and Computer Science

External person

Yubo Liu

  • University of Illinois at Urbana-Champaign
  • Qualcomm Incorporated

External person

Sang Hyeon Lee

  • Samsung
  • IEEE
  • Oregon State University
  • School of Electrical Engineering and Computer Science

External person

S. Lee

  • Oregon State University
  • Sungkyunkwan University
  • Stony Brook University
  • Seoul National University
  • Department of Physics and Astronomy
  • School of EECS
  • Department of Agricultural Biotechnology, Center for Food and Bioconvergence, Seoul National University
  • Seoul National University

External person

Dongwook Kim

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Benjamin Hershberg

  • Oregon State University
  • School of EECS

External person

Luca Benini

  • University of Bologna
  • Swiss Federal Institute of Technology Zurich

External person

Wenhuan Yu

  • Oregon State University
  • School of Electrical Engineering and Computer Science

External person

Nilanjan Pal

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Randy Mooney

  • Intel
  • Circuit Res. Lab.

External person

Josh Carnes

  • Oregon State University
  • School of EECS
  • School of Electrical Engineering and Computer Science

External person

Alexander V. Rylyakov

  • IBM
  • Elenion Technologies
  • T.J. Watson Research Center

External person

Bibhudatta Sahoo

  • University of Illinois at Urbana-Champaign

External person

Skyler Weaver

  • Oregon State University
  • School of EECS

External person

J. Chae

  • Maxlinear
  • Maxlinear
  • Oregon State University
  • School of EECS

External person

G. Ternes

  • Oregon State University
  • School of EECS

External person

Jack Kenney

  • Department of High Speed Converters
  • Analog Devices, Inc.

External person

Kofi A A Makinwa

  • Delft University of Technology
  • Department of Micro-electronics and Computer Engineering
  • Delft University of Technology

External person

Gowtham Vemulapalli

  • Oregon State University
  • Texas Instruments
  • School of Electrical Engineering and Computer Science

External person

Ramesh Harjani

  • University of Minnesota Twin Cities
  • Carnegie Mellon University
  • Department of Electrical and Computer Engineering
  • Dept. of Elec. and Comp. Engineering
  • University of Minnesota Twin Cities

External person

Bryan Casper

  • Intel
  • Circuit Res. Lab.

External person

Gregory W. Wornell

  • Massachusetts Institute of Technology
  • Lockheed Martin
  • Department of Electrical Engineering
  • Research Laboratory of Electronics, Massachusetts Institute of Technology
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology

External person

Salz, Braedon

  • University of Illinois at Urbana-Champaign

External person

Yong Wang

  • Elenion Technologies

External person

Yu K. Moon

  • Oregon State University
  • School of Electrial Engineering and Computer Science

External person

Matthew Tomei

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Univ of Illinois

External person

Ho Jin Park

  • Samsung

External person

Xun Jian

  • University of Illiinois
  • University of Illinois at Urbana-Champaign

External person

Ken Chang

  • Xilinx Inc.

External person

Samira Zali Asl

  • Oregon State University
  • School of EECS

External person

Nema Talebbeydokhti

  • Oregon State University
  • School of Electrical Engineering and Computer Science

External person

Makrand Mahalley

  • Analog Devices, Inc.

External person

Musah, T.

  • Oregon State University
  • School of EECS

External person

Kerem Ok

  • Oregon State University
  • School of EECS

External person

Mohamed Elzeftawi

  • Xilinx Inc.

External person

Marcel Kossel

  • IBM Zurich Research Laboratory
  • IBM

External person

Rajaee, O.

  • Oregon State University
  • School of EECS

External person

Tianyu Wang

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering

External person

Carlo Samori

  • Polytechnic University of Milan

External person

Jose Rodrigo Sanchez Vicarte

  • University of Illinois at Urbana-Champaign

External person

Siladitya Dey

  • Oregon State University
  • School of EECS

External person

Timir Nandi

  • University of Illinois at Urbana-Champaign

External person

Sung No Lee

  • Samsung

External person

Yutian Lei

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Lucien J. Breems

  • NXP Semiconductors

External person

Christopher Williams

  • Elenion Technologies

External person

Zanbaghi, Ramin

  • Cirrus Logic

External person

Gizem Tabak

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Pourya Assem

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Anthony Chan Carusone

  • University of Toronto
  • Dept. of Elec. and Comp. Engineering

External person

T. Sugimoto

  • Asahi Kasei Microsystems

External person

Yan Wang

  • Texas Instruments

External person

Noyan C. Sev√ľktekin

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Sven Mattisson

  • Ericsson AB

External person

Andrew Liu

  • The MathWorks, Inc.
  • The MathWorks, Inc.

External person

Wen Chuen Liu

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Alvin Leng Sun Loke

  • Advanced Micro Devices

External person

Bangda Yang

  • Oregon State University
  • School of EECS

External person

Thomas Toifl

  • IBM Zurich Research Laboratory
  • IBM

External person

Mostafa Gamal Ahmed

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Alessandro Piovaccari

  • Silicon Laboratories

External person

Samira Zaliasl

  • Oregon State University
  • School of Electrical Engineering and Computer Science

External person

Tam N. Huynh

  • Elenion Technologies

External person

Makoto Nagata

  • Kobe University

External person

Or Ordentlich

  • School of Computer Science and Engineering
  • Hebrew University of Jerusalem

External person