Research output per year
Research output per year
Fingerprint
Fingerprint is based on mining the text of the expert's scholarly documents to create an index of weighted terms, which defines the key subjects of each individual researcher.
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Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
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VISION-iT: A framework for digitalizing bubbles and droplets
Suh, Y., Chang, S., Simadiris, P., Inouye, T. B., Hoque, M. J., Khodakarami, S., Kharangate, C., Miljkovic, N. & Won, Y., Jan 2024, In: Energy and AI. 15, 100309.Research output: Contribution to journal › Article › peer-review
Open Access -
A Comprehensive Comparison for Battery Cathode Leaching Processes
Liu, Z., Sederholm, J. G., Lan, K. W., Hatzell, M. C., Perry, N. H., Miljkovic, N., Braun, P. V., Li, Y. & Wang, P., 2023, 2023 IEEE Transportation Electrification Conference and Expo, ITEC 2023. Institute of Electrical and Electronics Engineers Inc., (2023 IEEE Transportation Electrification Conference and Expo, ITEC 2023).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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An intelligent strategy for phase change heat and mass transfer: Application of machine learning
Khodakarami, S., Suh, Y., Won, Y. & Miljkovic, N., Jan 2023, Advances in Heat Transfer. Abraham, J. P., Gorman, J. M. & Minkowycz, W. J. (eds.). Academic Press, p. 113-168 56 p. (Advances in Heat Transfer; vol. 56).Research output: Chapter in Book/Report/Conference proceeding › Chapter
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Capillary-activated scalable microporous copper microchannels for two-phase thermal management of semiconductor materials
Dewanjee, S., Singhal, G. S., Li, J., Lohan, D., Joshi, S. N., Braun, P. V. & Miljkovic, N., 2023, Proceedings of the 22nd InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2023. IEEE Computer Society, (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; vol. 2023-May).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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Conventional and topologically optimized polymer manifolds for direct cooling of power electronics
Lad, A. A., Tayade, A., Hoque, M. J., Zhao, Y., Balda, J. C., King, W. P. & Miljkovic, N., Feb 2023, In: International Journal of Heat and Mass Transfer. 201, 123611.Research output: Contribution to journal › Article › peer-review
Honors & Recognition
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ASME Young Engineer Award - Electronic and Photonic Packaging Division
Miljkovic, Nenad (Recipient), 2021
Prize: Prize/Award
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Bergles-Rohsenow Young Investigator Award in Heat Transfer
Miljkovic, Nenad (Recipient), 2021
Prize: Prize/Award
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