Network
Andrew Carl Singer
- Electrical and Computer Engineering - Fox Family Professor Emeritus, Research Professor
Person: Academic
Lav R Varshney
- Electrical and Computer Engineering - Associate Professor
- Siebel School of Computing and Data Science - Associate Professor
- Industrial and Enterprise Systems Engineering - Associate Professor
- Coordinated Science Lab - Associate Professor
- Neuroscience Program - Associate Professor
- National Center for Supercomputing Applications (NCSA) - Associate Professor, Center for Digital Agriculture
- Beckman Institute for Advanced Science and Technology - Associate Professor
- Carl R. Woese Institute for Genomic Biology - Affiliate
Person: Academic
Philip T Krein
- Electrical and Computer Engineering - Grainger Endowed Chair Emeritus, Professor Emeritus
- Grainger College of Engineering - Director, Joint Research Center, Zhejiang University-UIUC Institute, Special Advisor to the Dean
- Coordinated Science Lab - Research Professor
Person: Academic
Elyse Rosenbaum
- Electrical and Computer Engineering - Melvin and Anne Hassebrock Professor, Professor
- Coordinated Science Lab - Professor
Person: Academic
Nam Sung Kim
- Electrical and Computer Engineering - W. J. "Jerry" Sanders III-Advanced Micro Devices Inc. Endowed Chair, Professor
- Siebel School of Computing and Data Science - Professor
- Coordinated Science Lab - Professor
- National Center for Supercomputing Applications (NCSA) - Professor
Person: Academic
Vikram Sadanand Adve
- Siebel School of Computing and Data Science - Donald B. Gillies Professor, Professor
- Information Trust Institute - Professor
- Coordinated Science Lab - Professor
- National Center for Supercomputing Applications (NCSA) - Professor
Person: Academic
Jose E Schutt-Aine
- Electrical and Computer Engineering - W.J. "Jerry" Sanders III - Advanced Micro Devices Inc. Scholar, Professor
- Coordinated Science Lab - Professor
Person: Academic
Narendra Ahuja
- Electrical and Computer Engineering - Donald Biggar Willett Professor Emeritus
- Siebel School of Computing and Data Science - Research Professor
- Coordinated Science Lab - Professor Emeritus
- National Center for Supercomputing Applications (NCSA) - Professor Emeritus, Center for Digital Agriculture
Person: Academic
R H Campbell
- Siebel School of Computing and Data Science - Sohaib and Sara Abbasi Professor Emeritus
- Information Trust Institute - Professor Emeritus
- National Center for Supercomputing Applications (NCSA) - Professor Emeritus
Person: Academic
Milton Feng
- Electrical and Computer Engineering - Nick Holonyak Jr. Chair Emeritus, Professor Emeritus
Person: Academic
Sarita V Adve
- Siebel School of Computing and Data Science - Richard T. Cheng Professor, Professor
- Electrical and Computer Engineering - Professor
- Information Trust Institute - Professor
- Coordinated Science Lab - Professor
- National Center for Supercomputing Applications (NCSA) - Professor
Person: Academic
Pavan Kumar Hanumolu
- Electrical and Computer Engineering - Seendripu Family Professor, Professor
- Coordinated Science Lab - Professor
Person: Academic
Rakesh Kumar
- Electrical and Computer Engineering - John Bardeen Faculty Scholar, Professor
- Siebel School of Computing and Data Science - Professor
- Information Trust Institute - Professor
- Coordinated Science Lab - Professor
Person: Academic
Sujan K. Gonugondla
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Amazon.com, Inc.
- University of Illinois at Urbana-Champaign
- NVIDIA
- Amazon
- University of Illinois at Urbana-Champaign
External person
Mingu Kang
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- IBM
- University of California at San Diego
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Manish Goel
- Texas Instruments
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- Coordinated Science Laboratory
- Center for Compound Semiconductor Microelectronics
- Communication Systems Laboratory
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois
- University of Illinois at Urbana-Champaign
External person
Ibrahim N. Hajj
- University of Illinois Urbana-Champaign
- IEEE
- Center for Compound Semiconductor Microelectronics
- Department of Electrical and Computer Engineering
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Rami A. Abdallah
- Intel
- University of Illinois Urbana-Champaign
- Broadcom Corporation
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Visual and Parallel Computing Group
- Center for Compound Semiconductor Microelectronics
- Wireless Connectivity Group
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Charbel Sakr
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- IBM Research
- IBM
- University of Illinois at Urbana-Champaign
- NVIDIA
- University of Illinois at Urbana-Champaign
External person
Eric P. Kim
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Sumant Ramprasad
- University of Illinois Urbana-Champaign
- Center for Compound Semiconductor Microelectronics
- ClariPhy Communications, Inc.
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
G. Balamurugan
- Intel
- University of Illinois Urbana-Champaign
- IEEE
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Circuit Res. Lab.
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Microprocessor Research
- University of Illinois at Urbana-Champaign
- University of Illinois
- University of Illinois at Urbana-Champaign
External person
Rajamohana Hegde
- Intersymbol Communications
- University of Illinois Urbana-Champaign
- IEEE
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Coordinated Science Laboratory
- ECE DepartmenUCoordinated Science Laboratory
- ECE DepartmenUCoordinated Science Laboratory
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Mohammad M. Mansour
- American University of Beirut
- University of Illinois Urbana-Champaign
- IEEE
- Dept. of Elec. and Comp. Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- iCIMS Research Center
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering
- iCIMS Research Center
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
S. R. Sridhara
- Texas Instruments
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- DSP Solutions R and D Center
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Keshab K. Parhi
- Alcatel-Lucent
- University of Minnesota Twin Cities
- Department of Electrical Engineering
- University of Minnesota
External person
Ameya Patil
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- Amazon.com, Inc.
- University of Illinois at Urbana-Champaign
External person
Girish V. Varatkar
- Qualcomm Incorporated
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- Center for Compound Semiconductor Microelectronics
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Yongjune Kim
- University of Illinois at Urbana-Champaign
- Daegu Gyeongbuk Institute of Science and Technology
- Western Digital
- Pohang University of Science and Technology
- University of Illinois at Urbana-Champaign
External person
Sriram Narayanan
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- Texas Instruments
- University of Illinois at Urbana-Champaign
External person
Sai Zhang
- University of Illinois Urbana-Champaign
- Apple
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Hassan Dbouk
- University of Illinois Urbana-Champaign
- Texas Instruments
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Hyeon Min Bae
- Finisar Corporation
- Intersymbol Communications
- Korea Advanced Institute of Science and Technology
- University of Illinois Urbana-Champaign
- Finisar Corporation
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Finisar Corporation
- University of Illinois at Urbana-Champaign
- II-VI Incorporated
- University of Illinois at Urbana-Champaign
External person
L. Wang
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- Hewlett-Packard
External person
S. C. Lee
- Academia Sinica Taiwan
- Sungkyunkwan University
- University of Sydney
- Korea Institute of Science and Technology
- CERN
- Texas Tech University
- Aristotle University of Thessaloniki
- Technion-Israel Institute of Technology
- Centro de Investigacion y de Estudios Avanzados del Instituto Politécnico Nacional
- Insitute of Physics, Academia Sinica
- Texas Instruments
- University of Illinois Urbana-Champaign
- Academia Sinica - Institute of Physics
- University of Sheffield
- University of Victoria BC
- University of Bonn
- Kyungpook National University
- Dipartimento di Fisica
- Kyungpook National University
- NOVA University Lisbon
- Transilvania University of Brasov
- West University of Timisoara
- University Politehnica of Bucharest
- Korea University
- Seoul National University
- Vilnius University
- IEEE
- University of Adelaide
- Yale University
- Institute for High Energy Physics
- Department of Physics
- Institute of Physics, Academia Sinica
- Department of Physics and Astronomy
- Institute of Physics
- Institute of Physics
- Department of Physics
- School of Physics
- Communication Systems Laboratory
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Nano-Photonics Center
- Fachhochschule Wiener Neustadt
- Department of Physics
- Stony Brook University
- Iowa State University
- Department of Physics and Astronomy
- University of Applied Sciences Wiener Neustadt
- Department of Physics
- University of Illinois at Urbana-Champaign
- University of Sheffield
- Stony Brook University
- Iowa State University
- University of Illinois at Urbana-Champaign
External person
Arshad Ahmed
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Center for Compound Semiconductor Microelectronics
- Texas Instruments
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Byonghyo Shim
- Korea University
- Qualcomm Incorporated
- University of Illinois Urbana-Champaign
- Seoul National University
- IEEE
- School of Electrical Engineering
- School of Information and Communication
- Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University
- Department of Electrical and Computer Engineering
- Coordinated Science Laboratory
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Rajan Narasimha
- Texas Instruments
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- DSP Solutions R and D Center
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Ralf Koetter
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Institute for Communications Engineering
- Technical University of Munich
- Department of Electrical and Computer Engineering
- IEEE
- University of Wisconsin-Milwaukee
- Dept. of Electr. Eng. and Comput. Sci.
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Global Foundries, Inc.
- International Business Machines
- Center for Compound Semiconductor Microelectronics
- Beckman Institute for Advanced Science and Technology
- Coordinated Science Laboratory
- IBM
- University of Illinois at Urbana-Champaign
- Linköping University
- University of Illinois at Urbana-Champaign
- University of Wisconsin
External person
Jungwook Choi
- University of Illinois Urbana-Champaign
- IBM
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- Hanyang University
External person
Ming Zhang
- Intel
- IEEE
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Seok Jun Lee
- Texas Instruments
- University of Illinois Urbana-Champaign
- Communication Systems Laboratory
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
Yingyan Lin
- Huazhong University of Science and Technology
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electronic Science and Technology
- Rice University
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
K. Soumyanath
- Intel
- University of Illinois Urbana-Champaign
- IEEE
- Microprocessor Research
- University of Illinois at Urbana-Champaign
External person
Gi Hong Im
- Alcatel-Lucent
- Pohang University of Science and Technology
- University of Illinois Urbana-Champaign
- Lucent
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- Nokia
- University of Illinois at Urbana-Champaign
External person
Min Sun Keel
- University of Illinois Urbana-Champaign
- Samsung
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Jonathan Ashbrook
- Intersymbol Communications
- Finisar Corporation
- International Business Machines
- Global Foundries, Inc.
- International Business Machines
- IBM
- II-VI Incorporated
External person
Saion K. Roy
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Aolin Xu
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
L. R. Pujara
- University of Dayton
- Wright State University
- Dept of Electr Eng, Wright State
- Department of Electrical Engineering
- Wright State University
External person
Raymond E. Siferd
- Indian Institute of Technology Delhi
- University of Dayton
- Wright State University
- Department of Electrical Engineering
- Dept of Electr Eng, Wright State
- Wright State University
External person
Sungmin Lim
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Swaroop Appadwedula
- Massachusetts Institute of Technology
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- Advanced Sensor Techniques Group
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Subhasish Mitra
- Stanford University
- Intel
- IEEE
- Department of Electrical Engineering, Stanford University
- Department of Electrical Engineering
- Department of CS
- Department of EE
- Department of Electrical Engineering and Computer Science
- Stanford University
- Stanford University
External person
R. Krishnamurthy
- Intel
- University of Illinois Urbana-Champaign
- IEEE
- Microprocessor Research
- University of Illinois at Urbana-Champaign
External person
Ihab Nahlus
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
S. Martin
- Bell Laboratories
- Lucent Technologies
- Alcatel-Lucent
- University of Illinois Urbana-Champaign
- Lucent
- University of Illinois at Urbana-Champaign
- Nokia
External person
Makram M. Mansour
- University of Illinois Urbana-Champaign
- Center for Compound Semiconductor Microelectronics
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
Hyungyo Kim
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- Samsung
External person
Lei Wang
- Hewlett-Packard
- Microprocessor Design Labs
- Microprocessor Technol. Laboratories
External person
Naveen Verma
- Princeton University
- Department of Electrical Engineering
- University of Illinois at Urbana-Champaign
External person
Han Mo Ou
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
S. Bobba
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Aseem Wadhwa
- University of California at Santa Barbara
- Apple
- Department of Electrical and Computer Engineering
- UC Santa Barbara College of Engineering
External person
Prakalp Srivastava
- University of Illinois Urbana-Champaign
- Computer Science, University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois Urbana-Champaign
External person
Jaijeet Roychowdhury
- University of Minnesota Twin Cities
- University of California, Berkeley
- Department of Electrical and Computer Engineering
- Department of Electrical Engineering and Computer Sciences
- Department of Electrical and Computer Engineering
- University of California at Berkeley
External person
Eric Pop
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Stanford University
- Stanford University
- Department of Electrical and Computer Engineering
- Electrical Engineering, Stanford University
- Intel
- Bldg 500
- University of Illinois Urbana-Champaign
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Department of Electrical Engineering
- Beckman Institute for Advanced Science and Technology
- Micro and Nanotechnology Lab
- Department of Mechanical Engineering
- Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
- Department of Electrical Engineering
- Department of Electrical Engineering and Precourt Institute for Energy
- Dept. of Electrical
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- Stanford University
- University of Illinois
- University of Illinois at Urbana-Champaign
- Stanford University
- Precourt Institute for Energy
External person
Upamanyu Madhow
- University of California at Santa Barbara
- Department of Electrical and Computer Engineering
- UC Santa Barbara College of Engineering
External person
Daniel J. Baker
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Dilip V. Sarwate
- University of Illinois Urbana-Champaign
- IEEE
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Minwei Lu
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Adam C. Faust
- University of Illinois Urbana-Champaign
- Intel
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Jan Rabaey
- University of California, Berkeley
- Department of EECS, University of California at Berkeley
- University of California at Berkeley
External person
Kannan Ramchandran
- University of California at Berkeley
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- Hewlett-Packard
- University of Pittsburgh
- IEEE
- Qualcomm Incorporated
- Nokia
- Columbia University
- Elec. and Comp. Eng. Department
- City University of New York
External person
Ki Wook Kim
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Sung Mo Kang
- IEEE
- University of Illinois Urbana-Champaign
- Silicon Perspective Corporation
- University of California at Santa Cruz
- University of California, Berkeley
- Lucent
- Rutgers - The State University of New Jersey, New Brunswick
- Marshall University
- Swiss Federal Institute of Technology Lausanne
- Department of Electrical and Computer Engineering and Department of Computer Science
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Center for Compound Semiconductor Microelectronics
- Department of Electrical and Computer Engineering
- Baskin School of Engineering
- Ctr. for Prev. R. and D.
- Center for Advanced Study
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of California at Berkeley
- University of California at Santa Cruz
- Nokia
- University of Illinois at Urbana-Champaign
- University of California
External person
Jong Yoon Lee
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Seitz Materials Research Laboratory
- Northwestern University
- Center for Bio-Integrated Electronics
- University of Illinois at Urbana-Champaign
- Sibel Inc.
- University of Illinois at Urbana-Champaign
External person
Yechan Lee
- University of Illinois at Urbana-Champaign
- Korea Advanced Institute of Science and Technology
- University of Illinois at Urbana-Champaign
External person
Yu Hung Lee
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Pavle Milosevic
- University of Illinois Urbana-Champaign
- Intel
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Chi Hwan Lee
- Purdue University
- University of Illinois at Urbana-Champaign
- Stanford University
External person
Keshab K. Parhi
External person
Ji Yoon Jeong
- University of Illinois Urbana-Champaign
- Seitz Materials Research Laboratory
- University of Illinois at Urbana-Champaign
- NeuroLux Corporation
- University of Illinois at Urbana-Champaign
External person
Jaeseok Jeong
- University of Illinois Urbana-Champaign
- Seitz Materials Research Laboratory
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Mingu Kong
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
David Blaauw
- University of Michigan, Ann Arbor
- Intel
- ARM Ltd.
- Department of Electrical Engineering
- Department of Electrical Eng.
- Circuit Res. Lab.
- Radiation Laboratory
- Department of Electrical Engineering and Computer Science
- Department of EECS
- Real-Time Computing Laboratory
- University of Michigan Healthcare System
- University of Michigan, Ann Arbor
External person
Arin Ryu
- University of Illinois Urbana-Champaign
- Seitz Materials Research Laboratory
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Dipankar Nagchoudhuri
- Indian Institute of Technology Delhi
- Department of Electrical Engineering
External person
Shuai Xu
- Simpson Querrey Institute
- Department of Dermatology
- Northwestern University
- Center for Bio-Integrated Electronics
External person
H. S Philip Wong
- Stanford University
- Department of Electrical Engineering, Stanford University
- Dept. of Electrical and Engineering
- Department of Electrical Engineering
- Stanford University
- Stanford University
External person
Karan Bhatia
- University of Illinois Urbana-Champaign
- Texas Instruments
- IEEE
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Peter Kairouz
- University of Illinois Urbana-Champaign
- Stanford University
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Alphabet Inc.
- University of Illinois at Urbana-Champaign
- Stanford University
- University of Illinois at Urbana-Champaign
- Stanford University
External person
Amy S. Paller
- Northwestern University
- Division of Neonatology
- Center for Bio-Integrated Electronics
- Department of Dermatology
- Children's Memorial Hospital
- Department of Dermatology
External person
Xue Feng
- Tsinghua University
- University of Illinois Urbana-Champaign
- Swiss Federal Institute of Technology Zurich
- Center for Mechanics and Materials, Tsinghua University
- Department of Engineering Mechanics, Tsinghua University
- Electronics Laboratory
- Dept. of Mech. and Indust. Eng.
- Department of Engineering Mechanics
- Dept. of Mat. Sci. and Engineering
- Department of Engineering Mechanics
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Kun Hyuck Lee
- Simpson Querrey Institute
- Northwestern University
- University of Illinois at Urbana-Champaign
External person
Yonggang Huang
- Northwestern University
- University of Illinois at Urbana-Champaign
- University of Connecticut
- Tsinghua University
- Department of Chemistry
- Center for Engineering and Health and Skin Disease Research Center
- CAS - Institute of Semiconductors
- University of Pennsylvania
- Center for Engineering and Health
- University of Illinois at Urbana-Champaign
- Zhejiang University
External person
Aditya Gupta
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Ameya D. Patii
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Yihui Zhang
- Tsinghua University
- Northwestern University
- Zhejiang University
- Center for Engineering and Health
- Center for Engineering and Health and Skin Disease Research Center
- Center for Mechanics and Materials, Tsinghua University
- Department of Engineering Mechanics
- Department of Engineering Mechanics, Tsinghua University
- Center for Flexible Electronics Technology
- Mechanical Engineering
- Department of Civil and Environmental Engineering
- Dept. of Civ. Eng. and Mech. Eng.
- Department of Civil and Environmental Engineering
- Department of Civil and Environmental Engineering
- University of Illinois Urbana-Champaign
- Seitz Materials Research Laboratory
- Department of Mechanical Science and Engineering
- Department of Mechanical Science and Engineering, University of Illinois
- Center for Flexible Electronics Technology and Center for Mechanics and Materials
External person
Zhaoqian Xie
- Dalian University of Technology
- Northwestern University
- City University of Hong Kong
- Tsinghua University
External person
Manoj Aggarwal
- University of Illinois Urbana-Champaign
- Sarnoff Corporation
- Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Young Sik Kim
- Chosun University
- Department of Information and Communication Engineering
External person
Fadi Kurdahi
- University of California at Irvine
- Morpho Technologies
- University of California at Irvine
External person
Siva Kumar Sastry Hari
- NVIDIA
- University of Illinois Urbana-Champaign
- NVIDIA
- Computer Science, University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois Urbana-Champaign
External person
Haocheng Hua
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Jungyup Lee
- University of Illinois Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
- Department of Chemical and Biomolecular Engineering
- Seitz Materials Research Laboratory
- University of Illinois at Urbana-Champaign
- Sibel Inc.
- NeuroLux Corporation
- University of Illinois at Urbana-Champaign
External person
Do Hoon Kim
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
C. L. Liu
- University of Texas at Austin
- University of Illinois Urbana-Champaign
- Alcatel-Lucent
- National Tsing Hua University
- Lucent
- Department of Computer Science, University of Illinois
- Computer Science, University of Illinois at Urbana-Champaign
- Department of Computer Science
- University of Illinois at Urbana-Champaign
- Nokia
- University of Illinois at Urbana-Champaign
External person
Christopher Ogle
- Simpson Querrey Institute
- Northwestern University
- Center for Bio-Integrated Electronics
External person
Anthony Banks
- University of Illinois Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
- Department of Chemical and Biomolecular Engineering
- Department of Physics
- Northwestern University
- University of Illinois at Urbana-Champaign
- Neurolux Inc
- Wearifi Inc.
- University of Illinois at Urbana-Champaign
External person
Bong Hoon Kim
- University of Illinois Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
- Department of Materials Science and Engineering
- Korea Advanced Institute of Science and Technology
- Department of Materials Science and Engineering, KAIST
- Department of Chemical and Biomolecular Engineering
- Northwestern University
- Center for Bio-Integrated Electronics
- Simpson Querrey Institute
- Seitz Materials Research Laboratory
- Department of Organic Materials and Fiber Engineering
- Soongsil University
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- Daegu Gyeongbuk Institute of Science and Technology
External person
Yongjoon Yu
- University of Illinois Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
- Department of Chemical and Biomolecular Engineering
- Seitz Materials Research Laboratory
- University of Illinois at Urbana-Champaign
- Northwestern University
- Inc
- Neurolux Inc
- NeuroLux Corporation
- University of Illinois at Urbana-Champaign
External person
Bowen Ji
- Shanghai Jiao Tong University
- Northwestern University
- Department of Micro/Nano Electronics
- Northwestern Polytechnical University Xian
External person
Mostafa Gamal Ahmed
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- Ain Shams University
- University of Illinois at Urbana-Champaign
External person
Tao Long
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Pradeep S. Shenoy
- Texas Instruments
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Kevin You
- University of Illinois Urbana-Champaign
- Seitz Materials Research Laboratory
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Myeong Namkoong
- University of Illinois Urbana-Champaign
- Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
- Northwestern University
- Department of Biomedical Engineering
- Simpson Querrey Institute
- University of Illinois at Urbana-Champaign
- Texas A&M University
- University of Illinois at Urbana-Champaign
External person
Georg Zeitler
- Technical University of Munich
- University of Illinois Urbana-Champaign
- Institute for Communications Engineering
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois
- University of Illinois at Urbana-Champaign
External person
Ha Uk Chung
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
- University of Illinois Urbana-Champaign
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Seitz Materials Research Laboratory
- Northwestern University
- Department of Materials Science and Engineering
- Center for Quantum Devices
- Simpson Querrey Institute
- Center for Photonic Communication and Computing
- University of Illinois at Urbana-Champaign
- Sibel Inc.
- University of Illinois at Urbana-Champaign
External person
Ankit Srivastava
- Qualcomm Incorporated
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Chhay Kong
- IBM
- University of Illinois Urbana-Champaign
- IBM
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Casey M. Rand
- Division of Neonatology
- Stanley Manne Children's Research Institute
- Children's Memorial Hospital
External person
Dongwon Seo
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Hokyung Jang
- University of Illinois Urbana-Champaign
- Seitz Materials Research Laboratory
- Northwestern University
- Center for Bio-Integrated Electronics
- University of Illinois at Urbana-Champaign
- University of Wisconsin-Madison
- University of Wisconsin
- University of Illinois at Urbana-Champaign
External person
Lawrence T. Pileggi
- Carnegie Mellon University
- IBM
- University of Texas at Austin
- IBM Microelectronics
- Global Foundries, Inc.
- Dept. of Elec. and Comp. Engineering
- Carnegie Mellon University
External person
Ravi Kiran Raman
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Analog Devices, Inc.
- Department of Electrical
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Chenjie Gu
- University of California, Berkeley
- Department of Electrical Engineering and Computer Sciences
- University of California at Berkeley
External person
Kwang Hyun Baek
- University of Illinois Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Roozbeh Ghaffari
- MC10 Inc.
- Massachusetts Institute of Technology
- MC10, Inc.
- MC10, Inc.
- MC10 Inc.
- Northwestern University
- Center for Bio-Integrated Electronics
- Department of Biomedical Engineering
- Simpson Querrey Institute
- Epicore Biosystems, Inc.
External person
Ning C. Wang
- Stanford University
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Stanford University
- Micro and Nanotechnology Lab
- University of Illinois at Urbana-Champaign
- Stanford University
- University of Illinois at Urbana-Champaign
- Stanford University
External person
Pourya Assem
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of California, Berkeley
- University of Illinois at Urbana-Champaign
- University of California at Berkeley
- University of Illinois at Urbana-Champaign
External person
Karthik V. Aadithya
- University of California, Berkeley
- Department of Electrical Engineering and Computer Sciences
- University of California at Berkeley
External person
Z. J. Liu
- Agency for Science, Technology and Research, Singapore
- Institute of High Performance Computing A Star
- Institute of High Performance Computing, Astar
- Institute for High Performance Computing
- University of Illinois Urbana-Champaign
- Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
Chris Kim
External person
Yujun Deng
- Shanghai Jiao Tong University
- Northwestern University
- State Key Laboratory of Mechanical System and Vibration
- Center for Bio-Integrated Electronics
External person
Dennis Ryu
- Simpson Querrey Institute
- Northwestern University
- Center for Bio-Integrated Electronics
External person
Gerhard Kramer
- Technical University of Munich
- Texas Instruments
- Institute for Communications Engineering
External person
Kannan Ramchandran
- University of California, Berkeley
- Qualcomm Incorporated
- University of Pittsburgh
- University of Illinois Urbana-Champaign
- Beckman Institute
- Compaq Computer Corp
- City University of New York
- Columbia University
- Lucent
- Elec. and Comp. Eng. Department
- IEEE
- Hewlett-Packard
- Dept. of Elec. Eng. and Comp. Sci.
- Center for Compound Semiconductor Microelectronics
- Cambridge Research Laboratory
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Mathematics
- Department of Electrical and Computer Engineering
- Department of Electrical Engineering and Computer Sciences
- Department of Electrical Engineering and Computer Sciences
- Department of EECS, University of California at Berkeley
- Department of Electrical Engineering and Computer Sciences
- Ctr. for Telecommunications Research
- Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering and Computer Science
- Department of Electrical and Computer Engineering
- Beckman Institute and Department of Electrical and Computer Engineering
- Department of Electrical Engineering and Computer Sciences
- Beckman Institute
- Coordinated Science Laboratory
- University of Illinois at Urbana-Champaign
- University of California at Berkeley
- University of Illinois
- Nokia
- University of Illinois at Urbana-Champaign
External person
Timothy K. Tsai
- Alcatel-Lucent
- University of Illinois Urbana-Champaign
- IEEE
- Lucent
- Brigham Young University
- Nokia
- NVIDIA
External person
Kyung In Jang
- Dept. of Mat. Sci. and Engineering
- Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
- University of Illinois Urbana-Champaign
- Daegu Gyeongbuk Institute of Science and Technology
- Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
- Seitz Materials Research Laboratory
- Department of Robotics Engineering
- Department of Materials Science and Engineering
- Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Nicholas J. Wang
- University of Illinois Urbana-Champaign
- IEEE
- Center for Compound Semiconductor Microelectronics
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Jongwon Kim
- Northwestern University
- Kyung Hee University
- Department of Mechanical Engineering, Kyung Hee University
- Sibel Inc.
External person
Jeonghyun Kim
- Hanyang University
- University of Illinois Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
- Department of Energy Engineering
- Department of Materials Science and Engineering, Hanyang University
- Seitz Materials Research Laboratory
- Department of Electronics Convergence Engineering
- Kwangwoon University
- Department of Materials Science and Engineering
- University of Illinois at Urbana-Champaign
- University of North Texas
- University of Illinois at Urbana-Champaign
External person
Jun Bin Park
- University of Illinois Urbana-Champaign
- Seitz Materials Research Laboratory
- Department of Statistics
- University of Illinois at Urbana-Champaign
- Sibel Inc.
- University of Illinois at Urbana-Champaign
External person
Dominic Grande
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Seitz Materials Research Laboratory
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Ankur Agrawal
- Harvard University
- IBM Research
- School of Engineering and Applied Sciences, Wyss Institute for Biologically Inspired Engineering, Harvard University
- IBM
- Harvard University
External person
Richard E. Blahut
- International Business Machines
- University of Illinois Urbana-Champaign
- Global Foundries, Inc.
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- International Business Machines
- IBM
- University of Illinois at Urbana-Champaign
External person
Aaron Hamvas
- Stanley Manne Children's Research Institute
- Division of Neonatology
- Children's Memorial Hospital
- Northwestern University
External person
Abdulrahman Mahmoud
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- Harvard University
- University of Illinois at Urbana-Champaign
- University of Illinois Urbana-Champaign
External person
Debra E. Weese-Mayer
- Division of Neonatology
- Stanley Manne Children's Research Institute
- Children's Memorial Hospital
- Northwestern University
External person
Jean Won Kwak
- University of Illinois Urbana-Champaign
- Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
- Dept. of Mat. Sci. and Engineering
- Department of Materials Science and Engineering
- Northwestern University
- Simpson Querrey Institute
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Gangaikond S. Visweswaran
- Indian Institute of Technology Delhi
- Department of Electrical Engineering
External person
Erin M. Ibler
- Department of Dermatology
- Division of Neonatology
- Northwestern University
- Children's Memorial Hospital
External person