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Network

Philip T Krein

Person: Academic

Sujan K. Gonugondla

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Amazon.com, Inc.
  • University of Illinois at Urbana-Champaign
  • Nvidia
  • Amazon

External person

Mingu Kang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • IBM
  • University of California at San Diego
  • University of Illinois at Urbana-Champaign

External person

Manish Goel

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Coordinated Science Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Communication Systems Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Ibrahim N. Hajj

  • University of Illinois Urbana-Champaign
  • IEEE
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Rami A. Abdallah

  • Intel
  • University of Illinois Urbana-Champaign
  • Broadcom Corporation
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Visual and Parallel Computing Group
  • Center for Compound Semiconductor Microelectronics
  • Wireless Connectivity Group
  • University of Illinois at Urbana-Champaign

External person

Charbel Sakr

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • IBM Research
  • IBM
  • University of Illinois at Urbana-Champaign
  • Nvidia

External person

Eric P. Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Sumant Ramprasad

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • ClariPhy Communications, Inc.
  • University of Illinois at Urbana-Champaign

External person

G. Balamurugan

  • Intel
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Circuit Res. Lab.
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microprocessor Research
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Keshab K. Parhi

  • Alcatel-Lucent
  • University of Minnesota Twin Cities
  • Department of Electrical Engineering
  • University of Minnesota

External person

Rajamohana Hegde

  • Intersymbol Communications
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Coordinated Science Laboratory
  • ECE DepartmenUCoordinated Science Laboratory
  • ECE DepartmenUCoordinated Science Laboratory
  • University of Illinois at Urbana-Champaign

External person

Mohammad M. Mansour

  • American University of Beirut
  • University of Illinois Urbana-Champaign
  • IEEE
  • Dept. of Elec. and Comp. Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • iCIMS Research Center
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • iCIMS Research Center
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

S. R. Sridhara

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • DSP Solutions R and D Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Girish V. Varatkar

  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Ameya Patil

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Yongjune Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Western Digital
  • University of Illinois at Urbana-Champaign
  • Daegu Gyeongbuk Institute of Science and Technology

External person

Sai Zhang

  • University of Illinois Urbana-Champaign
  • Apple
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Hyeon Min Bae

  • Finisar Corporation
  • Intersymbol Communications
  • Korea Advanced Institute of Science and Technology
  • University of Illinois Urbana-Champaign
  • Finisar Corporation
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Finisar Corporation
  • University of Illinois at Urbana-Champaign

External person

S. C. Lee

  • Academia Sinica Taiwan
  • Sungkyunkwan University
  • University of Sydney
  • Korea Institute of Science and Technology
  • CERN
  • Texas Tech University
  • Aristotle University of Thessaloniki
  • Technion-Israel Institute of Technology
  • CINVESTAV-IPN
  • Insitute of Physics, Academia Sinica
  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Academia Sinica - Institute of Physics
  • University of Sheffield
  • University of Victoria BC
  • University of Bonn
  • Kyungpook National University
  • Dipartimento di Fisica
  • Kyungpook National University
  • NOVA University Lisbon
  • Transilvania University of Brasov
  • West University of Timisoara
  • University Politehnica of Bucharest
  • Korea University
  • Seoul National University
  • Vilnius University
  • IEEE
  • University of Adelaide
  • Yale University
  • Institute for High Energy Physics
  • Department of Physics
  • Institute of Physics, Academia Sinica
  • Department of Physics and Astronomy
  • Institute of Physics
  • Institute of Physics
  • Department of Physics
  • School of Physics
  • Communication Systems Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Nano-Photonics Center
  • Fachhochschule Wiener Neustadt
  • Department of Physics
  • Stony Brook University
  • Iowa State University
  • Department of Physics and Astronomy
  • University of Applied Sciences Wiener Neustadt
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Sheffield
  • Stony Brook University
  • Iowa State University

External person

Arshad Ahmed

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Texas Instruments
  • University of Illinois at Urbana-Champaign

External person

Byonghyo Shim

  • Korea University
  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign
  • Seoul National University
  • IEEE
  • School of Electrical Engineering
  • School of Information and Communication
  • Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University
  • Department of Electrical and Computer Engineering
  • Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Rajan Narasimha

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • DSP Solutions R and D Center
  • University of Illinois at Urbana-Champaign

External person

Jungwook Choi

  • University of Illinois Urbana-Champaign
  • IBM
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Hassan Dbouk

  • University of Illinois Urbana-Champaign
  • Texas Instruments
  • University of Illinois at Urbana-Champaign

External person

Ming Zhang

  • Intel
  • IEEE
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Seok Jun Lee

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Communication Systems Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Yingyan Lin

  • Huazhong University of Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electronic Science and Technology
  • Rice University
  • University of Illinois at Urbana-Champaign

External person

K. Soumyanath

  • Intel
  • University of Illinois Urbana-Champaign
  • IEEE
  • Microprocessor Research
  • University of Illinois at Urbana-Champaign

External person

Ralf Koetter

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Institute for Communications Engineering
  • Technical University of Munich
  • Department of Electrical and Computer Engineering
  • IEEE
  • University of Wisconsin-Milwaukee
  • Dept. of Electr. Eng. and Comput. Sci.
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Global Foundries, Inc.
  • International Business Machines
  • Center for Compound Semiconductor Microelectronics
  • Beckman Institute for Advanced Science and Technology
  • Coordinated Science Laboratory
  • IBM
  • University of Illinois at Urbana-Champaign
  • Link√∂ping University

External person

Gi Hong Im

  • Alcatel-Lucent
  • Pohang University of Science and Technology
  • University of Illinois Urbana-Champaign
  • Lucent
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Min Sun Keel

  • University of Illinois Urbana-Champaign
  • Samsung
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Jonathan Ashbrook

  • Intersymbol Communications
  • Finisar Corporation
  • International Business Machines
  • Global Foundries, Inc.
  • International Business Machines
  • IBM

External person

Sasikanth Manipatruni

  • Intel
  • Intel Corp.

External person

Aolin Xu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Dmitri Nikonov

  • Intel
  • Intel Corp.

External person

Sriram Narayanan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Texas Instruments

External person

L. R. Pujara

  • University of Dayton
  • Wright State University
  • Dept of Electr Eng, Wright State
  • Department of Electrical Engineering
  • Wright State University

External person

Lei Wang

  • Microproc. Technology Laboratories
  • Hewlett-Packard
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Ian Young

  • Intel
  • Intel Corp.

External person

Raymond E. Siferd

  • Indian Institute of Technology Delhi
  • University of Dayton
  • Wright State University
  • Department of Electrical Engineering
  • Dept of Electr Eng, Wright State
  • Wright State University

External person

Lei Wang

  • University of Illinois at Urbana-Champaign
  • Hewlett-Packard

External person

Aaron Martin

  • Intel
  • Circuit Res. Lab.

External person

Randy Mooney

  • Intel
  • Circuit Res. Lab.

External person

Sungmin Lim

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

James E. Jaussi

  • Intel
  • Circuit Res. Lab.

External person

Swaroop Appadwedula

  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Advanced Sensor Techniques Group
  • University of Illinois at Urbana-Champaign

External person

Subhasish Mitra

  • Stanford University
  • Intel
  • IEEE
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical Engineering
  • Department of CS
  • Department of EE
  • Department of Electrical Engineering and Computer Science
  • Stanford University

External person

Kannan Ramchandran

  • University of California, Berkeley
  • Qualcomm Incorporated
  • University of Pittsburgh
  • University of Illinois Urbana-Champaign
  • Beckman Institute
  • Compaq Computer Corp
  • City University of New York
  • Columbia University
  • Lucent
  • Elec. and Comp. Eng. Department
  • IEEE
  • Hewlett-Packard
  • Dept. of Elec. Eng. and Comp. Sci.
  • Center for Compound Semiconductor Microelectronics
  • Cambridge Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Mathematics
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of EECS, University of California at Berkeley
  • Department of Electrical Engineering and Computer Sciences
  • Ctr. for Telecommunications Research
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering
  • Beckman Institute and Department of Electrical and Computer Engineering
  • Department of Electrical Engineering and Computer Sciences
  • Beckman Institute
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois

External person

Joe T. Kennedy

  • Intel
  • Circuit Res. Lab.

External person

David R. Johnson

  • Intel
  • Circuit Res. Lab.

External person

R. Krishnamurthy

  • Intel
  • University of Illinois Urbana-Champaign
  • IEEE
  • Microprocessor Research
  • University of Illinois at Urbana-Champaign

External person

Bryan Casper

  • Intel
  • Circuit Res. Lab.

External person

Ihab Nahlus

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

S. Martin

  • Bell Laboratories
  • Lucent Technologies
  • Alcatel-Lucent
  • University of Illinois Urbana-Champaign
  • Lucent
  • University of Illinois at Urbana-Champaign

External person

Makram M. Mansour

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Lei Wang

  • Hewlett-Packard
  • Microprocessor Design Labs
  • Microprocessor Technol. Laboratories

External person

A. Alvandpour

  • Intel
  • IEEE
  • Microprocessor Research

External person

S. Bobba

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Aseem Wadhwa

  • University of California at Santa Barbara
  • Apple
  • Department of Electrical and Computer Engineering

External person

Sanjiv Chopra

  • Intersymbol Communications

External person

Prakalp Srivastava

  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jaijeet Roychowdhury

  • University of Minnesota Twin Cities
  • University of California, Berkeley
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical and Computer Engineering
  • University of California at Berkeley

External person

Eric Pop

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Department of Electrical and Computer Engineering
  • Electrical Engineering, Stanford University
  • Intel
  • Bldg 500
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Department of Mechanical Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Precourt Institute for Energy
  • Dept. of Electrical
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois

External person

Upamanyu Madhow

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering

External person

Daniel J. Baker

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

S. Borkar

  • Intel
  • IEEE
  • Microprocessor Research

External person

R. Koetter

  • University of Wisconsin-Milwaukee
  • Technical University of Munich
  • International Business Machines
  • University of Illinois Urbana-Champaign
  • IEEE
  • Global Foundries, Inc.
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Electr. Eng. and Comput. Sci.
  • Institute for Communications Engineering
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • International Business Machines
  • University of Illinois at Urbana-Champaign

External person

Dilip V. Sarwate

  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Minwei Lu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Adam C. Faust

  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Jinki Park

  • Intersymbol Communications

External person

Sean Eilert

  • Micron Technology Incorporated

External person

Jan Rabaey

  • University of California, Berkeley
  • Department of EECS, University of California at Berkeley
  • University of California at Berkeley

External person

Ki Wook Kim

  • University of Illinois at Urbana-Champaign

External person

Massimo Poncino

  • Polytechnic University of Turin

External person

Sung Mo Kang

  • IEEE
  • University of Illinois Urbana-Champaign
  • Silicon Perspective Corporation
  • University of California at Santa Cruz
  • University of California, Berkeley
  • Lucent
  • Rutgers - The State University of New Jersey, New Brunswick
  • Marshall University
  • Swiss Federal Institute of Technology Lausanne
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Baskin School of Engineering
  • Ctr. for Prev. R. and D.
  • Center for Advanced Study
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of California at Santa Cruz

External person

Gustavode de Veciana

  • University of Texas at Austin

External person

Jong Yoon Lee

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Northwestern University
  • Center for Bio-Integrated Electronics
  • University of Illinois at Urbana-Champaign
  • Sibel Inc.

External person

Yechan Lee

  • University of Illinois at Urbana-Champaign
  • Korea Advanced Institute of Science and Technology

External person

Yu Hung Lee

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pavle Milosevic

  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Ji Yoon Jeong

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Sriram Narayanan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Jaeseok Jeong

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Mingu Kong

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Yeshou Xu

  • Northwestern University
  • Southeast University, Nanjing

External person

W. Burleson

  • University of Massachusetts

External person

David Blaauw

  • University of Michigan, Ann Arbor
  • Intel
  • ARM Ltd.
  • Department of Electrical Engineering
  • Department of Electrical Eng.
  • Circuit Res. Lab.
  • Radiation Laboratory
  • Department of Electrical Engineering and Computer Science
  • Department of EECS
  • Real-Time Computing Laboratory
  • University of Michigan Healthcare System
  • University of Michigan, Ann Arbor

External person

Arin Ryu

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Dipankar Nagchoudhuri

  • Indian Institute of Technology Delhi
  • Department of Electrical Engineering

External person

Shuai Xu

  • Simpson Querrey Institute
  • Department of Dermatology
  • Northwestern University
  • Center for Bio-Integrated Electronics

External person

T. M. Mak

  • Intel
  • IEEE

External person

H. S Philip Wong

  • Stanford University
  • Department of Electrical Engineering, Stanford University
  • Dept. of Electrical and Engineering
  • Department of Electrical Engineering
  • Stanford University

External person

Karan Bhatia

  • University of Illinois Urbana-Champaign
  • Texas Instruments
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Peter Kairouz

  • University of Illinois Urbana-Champaign
  • Stanford University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Alphabet Inc.
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

Hetul Sanghvi

  • Texas Instruments

External person

Amy S. Paller

  • Northwestern University
  • Division of Neonatology
  • Center for Bio-Integrated Electronics
  • Department of Dermatology
  • Children's Memorial Hospital
  • Department of Dermatology

External person

Michael Lucas

  • Northrop Grumman

External person

Naveen Verma

  • Princeton University
  • Department of Electrical Engineering

External person

Xue Feng

  • Tsinghua University
  • University of Illinois Urbana-Champaign
  • Swiss Federal Institute of Technology Zurich
  • Center for Mechanics and Materials, Tsinghua University
  • Department of Engineering Mechanics, Tsinghua University
  • Electronics Laboratory
  • Dept. of Mech. and Indust. Eng.
  • Department of Engineering Mechanics
  • Dept. of Mat. Sci. and Engineering
  • Department of Engineering Mechanics
  • University of Illinois at Urbana-Champaign

External person

Kun Hyuck Lee

  • Simpson Querrey Institute
  • Northwestern University

External person

Junho Cho

  • Seoul National University
  • Department of Electrical Engineering

External person

Ameya D. Patii

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Yihui Zhang

  • Tsinghua University
  • Northwestern University
  • Zhejiang University
  • Center for Engineering and Health
  • Center for Engineering and Health and Skin Disease Research Center
  • Center for Mechanics and Materials, Tsinghua University
  • Department of Engineering Mechanics
  • Department of Engineering Mechanics, Tsinghua University
  • Center for Flexible Electronics Technology
  • Mechanical Engineering
  • Department of Civil and Environmental Engineering
  • Dept. of Civ. Eng. and Mech. Eng.
  • Department of Civil and Environmental Engineering
  • Department of Civil and Environmental Engineering
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois

External person

Manoj Aggarwal

  • University of Illinois Urbana-Champaign
  • Sarnoff Corporation
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Young Sik Kim

  • Chosun University
  • Department of Information and Communication Engineering

External person

Fadi Kurdahi

  • University of California at Irvine
  • Morpho Technologies
  • University of California at Irvine

External person

Siva Kumar Sastry Hari

  • Nvidia
  • University of Illinois Urbana-Champaign
  • NVIDIA
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Haocheng Hua

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Sriram Narayanan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Jungyup Lee

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical and Biomolecular Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Sibel Inc.

External person

Do Hoon Kim

  • University of Illinois at Urbana-Champaign

External person

C. L. Liu

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • Alcatel-Lucent
  • National Tsing Hua University
  • Lucent
  • Department of Computer Science, University of Illinois
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • University of Illinois at Urbana-Champaign

External person

Christopher Ogle

  • Simpson Querrey Institute
  • Northwestern University
  • Center for Bio-Integrated Electronics

External person

Sriram Narayanan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Anthony Banks

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Physics
  • Northwestern University
  • University of Illinois at Urbana-Champaign

External person

Bong Hoon Kim

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Korea Advanced Institute of Science and Technology
  • Department of Materials Science and Engineering, KAIST
  • Department of Chemical and Biomolecular Engineering
  • Northwestern University
  • Center for Bio-Integrated Electronics
  • Simpson Querrey Institute
  • Seitz Materials Research Laboratory
  • Department of Organic Materials and Fiber Engineering
  • Soongsil University
  • University of Illinois at Urbana-Champaign

External person

Mahesh Mehendale

  • Texas Instruments

External person

Yongjoon Yu

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical and Biomolecular Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Northwestern University
  • Inc

External person

Bowen Ji

  • Shanghai Jiao Tong University
  • Northwestern University
  • Department of Micro/Nano Electronics

External person

Tao Long

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kevin You

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Myeong Namkoong

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Northwestern University
  • Department of Biomedical Engineering
  • Simpson Querrey Institute
  • University of Illinois at Urbana-Champaign
  • Texas A&M University

External person

Kee Sup Kim

  • Intel
  • IEEE

External person

Georg Zeitler

  • Technical University of Munich
  • University of Illinois Urbana-Champaign
  • Institute for Communications Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Ha Uk Chung

  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Seitz Materials Research Laboratory
  • Northwestern University
  • Department of Materials Science and Engineering
  • Center for Quantum Devices
  • Simpson Querrey Institute
  • Center for Photonic Communication and Computing
  • University of Illinois at Urbana-Champaign
  • Sibel Inc.

External person

Radu Marculescu

  • Carnegie Mellon University
  • Carnegie Mellon University

External person

Jonathan Chang

  • Taiwan Semiconductor Manufacturing Company

External person

Ankit Srivastava

  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Chhay Kong

  • IBM
  • University of Illinois Urbana-Champaign
  • IBM
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Pushkal Juneja

  • Indian Institute of Technology Delhi

External person

Casey M. Rand

  • Division of Neonatology
  • Stanley Manne Children's Research Institute
  • Children's Memorial Hospital

External person

C. M. Vineyard

  • University of New Mexico
  • Sandia National Laboratories

External person

Mark Helm

  • Micron Technology Incorporated

External person

L. Wang

  • University of Illinois at Urbana-Champaign

External person

Dongwon Seo

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hokyung Jang

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Northwestern University
  • Center for Bio-Integrated Electronics
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison

External person

Lawrence T. Pileggi

  • Carnegie Mellon University
  • IBM
  • University of Texas at Austin
  • IBM Microelectronics
  • Global Foundries, Inc.
  • Dept. of Elec. and Comp. Engineering
  • Carnegie Mellon University

External person

Ravi Kiran Raman

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Analog Devices, Inc.
  • Department of Electrical
  • University of Illinois at Urbana-Champaign

External person

Chenjie Gu

  • University of California, Berkeley
  • Department of Electrical Engineering and Computer Sciences
  • University of California at Berkeley

External person

Nirmal Warke

  • Texas Instruments
  • DSP Solutions R and D Center

External person

Manish Sharma

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kwang Hyun Baek

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Shinichiro Shiratake

  • Kioxia Corporation
  • KIOXIA Corporation

External person

Roozbeh Ghaffari

  • MC10 Inc.
  • Massachusetts Institute of Technology
  • MC10, Inc.
  • MC10, Inc.
  • MC10 Inc.
  • Northwestern University
  • Center for Bio-Integrated Electronics
  • Department of Biomedical Engineering
  • Simpson Querrey Institute
  • Epicore Biosystems, Inc.

External person

Ning C. Wang

  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

Pourya Assem

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of California, Berkeley
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley

External person

Karthik V. Aadithya

  • University of California, Berkeley
  • Department of Electrical Engineering and Computer Sciences
  • University of California at Berkeley

External person

Hanfei Geng

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Z. J. Liu

  • Agency for Science, Technology and Research
  • Institute of High Performance Computing A Star
  • Institute of High Performance Computing, Astar
  • Institute for High Performance Computing
  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Aditya Gupta

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Yujun Deng

  • Shanghai Jiao Tong University
  • Northwestern University
  • State Key Laboratory of Mechanical System and Vibration
  • Center for Bio-Integrated Electronics

External person

Dennis Ryu

  • Simpson Querrey Institute
  • Northwestern University
  • Center for Bio-Integrated Electronics

External person

Qingze Huo

  • Northwestern University

External person

Michael Orshansky

  • University of Texas at Austin

External person

Seung Min Lee

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Energy Electronics Convergence
  • Kookmin University
  • Seoul National University
  • University of Illinois at Urbana-Champaign

External person

Gerhard Kramer

  • Technical University of Munich
  • Texas Instruments
  • Institute for Communications Engineering

External person

Sriram Narayanan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Timothy K. Tsai

  • Alcatel-Lucent
  • University of Illinois Urbana-Champaign
  • IEEE
  • Lucent
  • Brigham Young University
  • Nokia
  • Nvidia

External person

Kaushik Roy

  • Purdue University
  • Purdue University

External person

Kyung In Jang

  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Daegu Gyeongbuk Institute of Science and Technology
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Seitz Materials Research Laboratory
  • Department of Robotics Engineering
  • Department of Materials Science and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Y. Huang

  • Northwestern University
  • Department of Mechanical Science and Engineering
  • Tsinghua University
  • Center for Engineering and Health
  • Zhejiang University
  • University of Connecticut
  • University of Illinois Urbana-Champaign
  • Center for Engineering and Health and Skin Disease Research Center
  • CAS - Institute of Semiconductors
  • Department of Engineering Mechanics
  • Department of Mechanical Science and Engineering
  • Dept. of Mech. and Indust. Eng.
  • Dept. of Mech. and Indust. Eng.
  • Department of Civil and Environmental Engineering
  • Departments of Civil and Environmental Engineering
  • Department of Mechanical Engineering
  • Dept. of Civ. Eng. and Mech. Eng.
  • Department of Civil and Environmental Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Mechanical Engineering
  • Depts. of Civ. and Environ. Eng.
  • Department of Mechanical and Industrial Engineering
  • Institute of Public Health and Medicine
  • Skin Disease Research Center
  • Department of Mechanical Science and Engineering, University of Illinois
  • Laboratory of Nano-Optoelectronics
  • Dept. of Mat. Sci. and Engineering
  • Department of Civil and Environmental Engineering
  • Mechanical Science and Engineering Department
  • Department of Engineering Mechanics, Tsinghua University
  • Center for Bio-Integrated Electronics
  • Mechanical Engineering
  • University of Pennsylvania
  • Department of Physical Medicine and Rehabilitation
  • University of Illinois at Urbana-Champaign

External person

Nicholas J. Wang

  • University of Illinois Urbana-Champaign
  • IEEE
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Jongwon Kim

  • Northwestern University
  • Kyung Hee University
  • Department of Mechanical Engineering, Kyung Hee University
  • Sibel Inc.

External person

Jeonghyun Kim

  • Hanyang University
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Energy Engineering
  • Department of Materials Science and Engineering, Hanyang University
  • Seitz Materials Research Laboratory
  • Department of Electronics Convergence Engineering
  • Kwangwoon University
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of North Texas

External person

Thomas Burd

  • Advanced Micro Devices

External person

Jun Bin Park

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Statistics
  • University of Illinois at Urbana-Champaign

External person

Dominic Grande

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Wonyong Sung

  • Seoul National University
  • Department of Electrical Engineering

External person

Jim Tschanz

  • University of Illinois Urbana-Champaign
  • Intel
  • IEEE
  • VLSI Info. Processing Systems Group
  • University of Illinois at Urbana-Champaign

External person

Saion K. Roy

  • University of Illinois at Urbana-Champaign

External person

Pradeep S. Shenoy

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Kilby Labs.
  • Grainger Center for Electric Machinery and Electromechanics
  • University of Illinois at Urbana-Champaign

External person

Puskal Juneja

  • Indian Institute of Technology
  • IIT Council

External person

Hugh Mair

  • MediaTek

External person

Ankur Agrawal

  • Harvard University
  • IBM Research
  • School of Engineering and Applied Sciences, Wyss Institute for Biologically Inspired Engineering, Harvard University
  • IBM
  • Harvard University

External person

Richard E. Blahut

  • International Business Machines
  • University of Illinois Urbana-Champaign
  • Global Foundries, Inc.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • International Business Machines
  • IBM

External person

Aaron Hamvas

  • Stanley Manne Children's Research Institute
  • Division of Neonatology
  • Children's Memorial Hospital

External person

Abdulrahman Mahmoud

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Harvard University

External person

Molly Schau

  • Division of Neonatology
  • Children's Memorial Hospital

External person

Jeffrey Weldon

  • Carnegie Mellon University
  • Carnegie Mellon University

External person

Debra E. Weese-Mayer

  • Division of Neonatology
  • Stanley Manne Children's Research Institute
  • Children's Memorial Hospital
  • Northwestern University

External person

Chi Hwan Lee

  • Purdue University
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • School of Mechanical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Mechanical Engineering, Stanford University
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

Jean Won Kwak

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Northwestern University
  • Simpson Querrey Institute
  • University of Illinois at Urbana-Champaign

External person

Sriram Narayanan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Gangaikond S. Visweswaran

  • Indian Institute of Technology Delhi
  • Department of Electrical Engineering

External person

Zhaoqian Xie

  • Northwestern University
  • Tsinghua University
  • Northwest University China
  • Departments of Civil and Environmental Engineering
  • Department of Engineering Mechanics, Tsinghua University
  • Departments of Mechanical Engineering
  • Departments of Civil and Environmental Engineering
  • Departments of Materials Science and Engineering
  • Department of Civil and Environmental Engineering
  • Center for Bio-Integrated Electronics
  • Dalian University of Technology
  • State Key Laboratory of Structural Analysis for Industrial Equipment

External person

Ken Curewitz

  • Micron Technology Incorporated

External person

Erin M. Ibler

  • Department of Dermatology
  • Division of Neonatology
  • Northwestern University
  • Children's Memorial Hospital

External person