Narendra Ahuja

Network

Angela Green-Miller

Person: Academic

Erol Tutumluer

Person: Academic

M Tamer Başar

Person: Academic

Ming Hsuan Yang

  • Honda Motor Co., Ltd.
  • University of Illinois Urbana-Champaign
  • Honda Fundamental Research Labs
  • University of California Merced
  • IEEE
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Computer Science and Beckman Institute
  • School of Engineering
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of California
  • University of Illinois at Urbana-Champaign
  • Alphabet Inc.

External person

Bernard Ghanem

  • University of Illinois Urbana-Champaign
  • Advanced Digital Sciences Center of Illinois
  • King Abdullah University of Science and Technology
  • Advanced Digital Sciences Center (ADSC)
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences
  • Advanced Digital Sciences Center of UIUC
  • KAUST
  • Advanced Digital Sciences Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center of Illinois
  • Department of Electrical and Computer Engineering
  • Geometric Modeling and Scientific Visualization Center
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

John Weng

  • Michigan State University
  • University of Illinois Urbana-Champaign
  • Canada
  • Beckman Institute for Advanced Science and Technology
  • Computer Research Institute of Montreal
  • Department of Computer Science
  • Bcckman Institute
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • Michigan State University
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Jia Bin Huang

  • University of Illinois Urbana-Champaign
  • Virginia Tech
  • Bradley Dept. of Electrical and Computer Engineering
  • Dept. of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Virginia Polytechnic Institute and State University
  • Virginia Tech College of Engineering
  • University of Maryland, College Park

External person

Hong Hua

  • University of Illinois Urbana-Champaign
  • University of Hawai'i at Mānoa
  • University of Arizona
  • Beckman Institute for Advanced Science and Technology
  • Department of Information and Computer Science
  • Department of Information Science
  • College of Optical Science
  • Optical Sciences Center
  • University of Illinois at Urbana-Champaign
  • University of Hawai'i

External person

S. Todorovic

  • Oregon State University
  • University of Illinois Urbana-Champaign
  • School of Electrical Engineering and Computer Science
  • Computer Vision and Robotics Laboratory
  • Beckman Institute for Advanced Science and Technology
  • School of EECS
  • University of Illinois at Urbana-Champaign
  • Oregon State University
  • School of Civil and Construction Engineering, Oregon State University

External person

Chunyu Gao

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ashish Jagmohan

  • IBM
  • University of Illinois Urbana-Champaign
  • Illinois Univ.
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Chicago
  • IBM Corporation
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Chicago

External person

Qingxiong Yang

  • City University of Hong Kong
  • The University of Hong Kong
  • University of Illinois Urbana-Champaign
  • Department of Computer Science
  • Department of Computer Science
  • Beckman Institute for Advanced Science and Technology
  • Muyue Technology Company Ltd.
  • University of Illinois at Urbana-Champaign

External person

Krishna Ratakonda

  • IBM
  • University of Illinois Urbana-Champaign
  • Beckman Inst
  • IBM Research
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Multimedia Department
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Anshul Sehgal

  • IBM
  • University of Illinois Urbana-Champaign
  • Illinois Univ.
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Chicago
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Chicago

External person

Ning Xu

  • University of Illinois at Urbana-Champaign
  • Samsung
  • University of Illinois at Urbana-Champaign

External person

Tianzhu Zhang

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Chinese Academy of Sciences
  • Advanced Digital Sciences Center of Illinois
  • CAS - Institute of Automation
  • Advanced Digital Sciences Center (ADSC)
  • Advanced Digital Sciences Center of UIUC
  • Advanced Digital Sciences Center
  • University of Illinois Urbana-Champaign
  • Institute of Automation
  • National Laboratory of Pattern Recognition
  • University of Illinois at Urbana-Champaign

External person

John M. Hart

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Computer Vision and Robotics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kar Han Tan

  • Hewlett-Packard
  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • CS Dept.
  • Mobile and Immersive Experience Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Computer Vision and Robotics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rakesh Dugad

  • University of Illinois Urbana-Champaign
  • Qualcomm Incorporated
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Manoj Aggarwal

  • University of Illinois Urbana-Champaign
  • Sarnoff Corporation
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hongcheng Wang

  • University of Illinois Urbana-Champaign
  • United Technologies Corporation
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Subhodev Das

  • University of Illinois Urbana-Champaign
  • PVI
  • University of California at Riverside
  • Syracuse University
  • PEB Inc
  • Beckman Institute and Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Department of Civil Engineering, Syracuse University

External person

Abhishek Singh

  • University of Illinois Urbana-Champaign
  • INTERA Inc.
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tianli Yu

  • University of Illinois Urbana-Champaign
  • Motorola
  • Like.com
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Embeded Imaging System Group
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Avinash Kumar

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • International Institute of Information Technology Hyderabad
  • Beckman Institute for Advanced Science and Technology
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaoping Hu

  • Sun Microsystems
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jagannadan Varadarajan

  • University of Illinois Urbana-Champaign
  • Advanced Digital Sciences
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Center of Illinois
  • Advanced Digital Sciences Center
  • Grab
  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign

External person

Alexia Briassouli

  • University of Illinois Urbana-Champaign
  • Department of Computer and Communication Engineering
  • IEEE
  • University of Thessaly
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Computer and Communication Engineering
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sanghoon Sull

  • University of Illinois Urbana-Champaign
  • NASA Ames Research Center
  • School of Electrical Engineering
  • Korea University
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Che Bin Liu

  • Epson R and D, Inc.
  • University of Illinois Urbana-Champaign
  • Epson R and D, Inc.
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Azriel Rosenfeld

  • University of Maryland, College Park
  • Computer Science Center
  • Computer Vision Laboratory

External person

Maneesh Singh

  • University of Illinois at Urbana-Champaign

External person

Himanshu Arora

  • University of Illinois Urbana-Champaign
  • ObjectVideo Inc
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • ObjectVideo Inc
  • University of Illinois at Urbana-Champaign

External person

David Kriegman

  • University of Illinois Urbana-Champaign
  • University of California at San Diego
  • IEEE
  • Department of Computer Science and Engineering
  • Department of CS
  • Department of Computer Science and Beckman Institute
  • Computer Science, University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xianbiao Shu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mihran Tuceryan

  • University of Illinois Urbana-Champaign
  • Michigan State University
  • Center for Compound Semiconductor Microelectronics
  • Department of Computer Science
  • University of Illinois at Urbana-Champaign
  • Michigan State University
  • University of Illinois at Urbana-Champaign

External person

Moitreya Chatterjee

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Mitsubishi Electric Research USA

External person

Jack Veenstra

  • University of Illinois Urbana-Champaign
  • AT&T
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Indriyati Atmosukarto

  • Advanced Digital
  • ADSC
  • Sciences Centre (ADSC)
  • Advanced Digital Sciences Center (ADSC)
  • Advanced Digital Sciences
  • Singapore Institute of Technology

External person

Emre Akbas

  • University of Illinois Urbana-Champaign
  • University of California at Santa Barbara
  • Dept. of Psychological and Brain Sciences, University of California
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Middle East Technical University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Changsheng Xu

  • Chinese Academy of Sciences
  • CAS - Institute of Automation
  • Institute of Automation
  • National Laboratory of Pattern Recognition
  • China-Singapore Institute of Digital Media

External person

William Hoff

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Sowmitri Swamy

  • Lockheed Martin
  • Department of Computer Science
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David Chestek

  • University of Illinois at Chicago

External person

Yong Koo Hwang

  • University of Illinois Urbana-Champaign
  • Sandia National Laboratories
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign

External person

Leonard D. Brown

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

B. J. Schachter

  • General Electric
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Si Liu

  • National University of Singapore
  • Chinese Academy of Sciences
  • Department of Electrical and Computer Engineering
  • Institute of Information Engineering
  • CAS - Institute of Information Engineering

External person

Seung Chul Yoon

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Arun Krishnan

  • University of Illinois at Urbana-Champaign
  • Siemens

External person

John B. Harvill

  • University of Illinois at Urbana-Champaign
  • Samsung
  • University of Illinois at Urbana-Champaign

External person

David Beiser

  • The University of Chicago

External person

Ruei Sung Lin

  • Motorola
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. Bajcsy

  • University of Illinois Urbana-Champaign
  • Cognex Corp.
  • Beckmml Institute
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Acumen Product Group
  • Beckman Institute for Advanced Science and Technology
  • Natl. Ctr. Supercomputing Applic.
  • Natl. Ctr. for Supercomp. Applic.
  • National Center for Super computing Applications
  • Cognex Corp.
  • Cognex Corporation
  • National Center for Supercomputing Applications (NCSA)
  • National Center for Supercomputing Application
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

A. Lynn Abbott

  • Virginia Tech
  • University of Illinois Urbana-Champaign
  • Bradley Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • Virginia Polytechnic Institute and State University
  • Virginia Tech College of Engineering

External person

Kamila Abdiyeva

  • Nanyang Technological University
  • Nazarbayev University

External person

Anoop Cherian

  • University of Minnesota Twin Cities
  • Mitsubishi Electric Research USA
  • Mitsubishi Electric Corporation

External person

Tanuja Joshi

  • University of Illinois Urbana-Champaign
  • Microsoft Research Asia
  • Microsoft USA
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Yash R. Wani

  • The University of Chicago

External person

Jean Ponce

  • École normale supérieure
  • University of Illinois Urbana-Champaign
  • Université PSL
  • LIENS
  • Ecole Normale Supérieure
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • New York University

External person

C. Nash

  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jen Hui Chuang

  • National Yang Ming Chiao Tung University
  • Department of Computer Science
  • Department of Computer and Information Science
  • University of Illinois Urbana-Champaign
  • Coordinated Science Laboratory
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Shengnan Wang

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Sing Bing Kang

  • Microsoft USA
  • Hewlett-Packard

External person

Jiebo Luo

  • Eastman Kodak
  • University of Illinois Urbana-Champaign
  • IEEE
  • University of Rochester
  • Image Science Technology Laboratory
  • Department of Computer Science
  • Department of Electrical Engineering
  • Research and Advanced Development
  • Corporate Research and Engineering
  • Kodak Research Laboratories
  • Intelligent Systems Research
  • Kodak R and D Labs
  • Research and Development Laboratories
  • University of Illinois at Urbana-Champaign
  • Meta
  • University of Rochester

External person

Esther Resendiz

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Christian Debrunner

  • Lockheed Martin
  • University of Illinois Urbana-Champaign
  • Martin Marietta Corporation
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mustafa Alam

  • The University of Chicago
  • University of Illinois at Chicago

External person

Darrell R. Hougen

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Mark Tabb

  • University of Illinois Urbana-Champaign
  • IEEE
  • Microsoft Research Asia
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microsoft USA
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Martin Lukac

  • Nazarbayev University

External person

Ramesh Raskar

  • Massachusetts Institute of Technology
  • Mitsubishi Electric Research USA
  • Mitsubishi Electric Corporation

External person

Si Liu

  • Chinese Academy of Sciences
  • National University of Singapore
  • Institute of Information Engineering
  • Institute of Automation
  • Department of Electrical and Computer Engineering

External person

Dorothea Blostein

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yihong Gong

  • NEC Laboratories America, Inc.
  • Xi'an Jiaotong University
  • NEC Corporation
  • NEC China
  • Akiira Media System
  • INEC Laboratories America, Inc.

External person

Ravi Bansal

  • Columbia University
  • Department of Psychiatry
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Psychiatry
  • University of Illinois at Urbana-Champaign

External person

Ramanathan Subramanian

  • University of Illinois Urbana-Champaign
  • International Institute of Information Technology Hyderabad
  • University of Glasgow
  • International Institute of Information Technology
  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign

External person

Narayan Srinivasa

  • University of Illinois Urbana-Champaign
  • IEEE
  • HRL Laboratories
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Wei Sheng Lai

  • University of California Merced
  • Department of Electrical Engineering and Computer Science
  • University of California

External person

Fatih Porikli

  • Australian National University
  • NICTA
  • O-Lab

External person

Huiguang Yang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Samsung Research Institute China
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Elisa Ricci

  • Fondazione Bruno Kessler
  • University of Perugia
  • Department of Engineering
  • University of Trento

External person

Kevin Bowyer

  • University of South Florida
  • Department of Computer Science and Electrical Engineering
  • Department of Computer Science and Engineering

External person

Homer H. Chen

  • College of Electrical Engineering and Computer Science
  • National Taiwan University
  • IEEE
  • University of Illinois Urbana-Champaign
  • Lucent
  • Center for Compound Semiconductor Microelectronics
  • Rockwell Collins
  • Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Springfield
  • Rockwell International Science Center
  • Nokia
  • University of Illinois at Urbana-Champaign

External person

H. Pan

  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Joseph L. Mundy

  • General Electric
  • Computer Vision Group, Inc
  • Robotics Research Group
  • University of Oxford
  • Robotics Research Group
  • GE Cent for Research and Development
  • University of California, Berkeley
  • University of Iowa
  • Computer Science Division
  • University of Iowa
  • University of California at Berkeley
  • University of Iowa

External person

Haruo Takemura

  • Osaka University
  • Advanced Telecommunications Research Institute International

External person

Ram Charan

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Samuel Rota Bulo

  • Fondazione Bruno Kessler
  • Mapillary

External person

Shaunak Ahuja

  • Advanced Digital Sciences
  • ADSC
  • Center of Illinois

External person

Sanketh Shetty

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jannick P. Rolland

  • University of Illinois Urbana-Champaign
  • University of Central Florida
  • Beckman Institute for Advanced Science and Technology
  • School of Optics
  • University of Illinois at Urbana-Champaign

External person

R. Magin

  • University of Colorado Boulder
  • University of Illinois Urbana-Champaign
  • College of Education
  • California Institute of Technology
  • University of Illinois at Chicago
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Psychology
  • College of Medicine
  • Department of Electrical and Computer Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Chicago
  • University of Illinois at Urbana-Champaign

External person

Jongwoo Lim

  • Hanyang University

External person

Srikanth Thirumalai

  • Cray Inc
  • IEEE
  • University of Illinois Urbana-Champaign
  • Cray Research
  • University of Illinois at Urbana-Champaign

External person

Ramesh Jain

  • University of California at Irvine
  • University of Michigan, Ann Arbor
  • University of California at Irvine
  • University of Michigan, Ann Arbor

External person

Ruigang Yang

  • University of Kentucky
  • Department of Computer Science
  • Department of Computer Science
  • Baidu Inc
  • Inceptio

External person

O. D. Faugeras

  • Institut national de recherche en informatique et en automatique
  • INRIA
  • University of Illinois Urbana-Champaign
  • INRIA Sophia Antipolis
  • University of Illinois at Urbana-Champaign

External person

Hao Zhang

  • University of Illinois at Urbana-Champaign

External person

Jean Marc Odobez

  • Swiss Federal Institute of Technology Lausanne
  • IDIAP Research Institute

External person

Johannes Kopf

  • Meta
  • Facebook

External person

Johannes Kopf

  • Microsoft USA
  • Meta

External person

Sooyeong Yi

  • Seoul National University of Science and Technology (SNUST)
  • Jeonbuk National University
  • Department of Electrical Engineering
  • Div. of Electronics and Information Engineering

External person

Yung Cheng Lai

  • National Taiwan University
  • University of Illinois Urbana-Champaign
  • Department of Civil Engineering
  • Dept. of Civil Engineering
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Railroad Engineering Program
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sanjay K. Srivastava

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Alok Choudhary

  • Northwestern University
  • University of Tennessee, Knoxville
  • Syracuse University
  • University of Illinois Urbana-Champaign
  • NY, USA
  • University of Massachusetts
  • Department of Electrical and Computer Engineering
  • Center for Photonic Communication and Computing
  • Center for Parallel and Distributed Computing
  • Coordinated Science Laboratory
  • Innovative Computing Lab.
  • University of Illinois at Urbana-Champaign
  • Department of Civil Engineering, Syracuse University

External person

Yijun Li

  • University of California Merced
  • University of California
  • Adobe Systems Incorporated

External person

Joseph Drapa

  • Transportation Technology Center, Inc
  • University of Illinois Urbana-Champaign
  • Railroad Engineering Program
  • Association of American Railroads
  • University of Illinois at Urbana-Champaign

External person

P. J. Narayanan

  • International Institute of Information Technology Hyderabad

External person

Yuntao Cui

  • Michigan State University
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Computer Science
  • University of Illinois at Urbana-Champaign
  • Michigan State University

External person

P. Ishwar

  • Boston University
  • University of Illinois Urbana-Champaign
  • University of California, Berkeley
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign

External person

Janak H. Patel

  • USA
  • University of Illinois Urbana-Champaign
  • Syracuse University
  • IEEE
  • Jet Propulsion Laboratory, California Institute of Technology
  • Center for Reliable and High Performance Computing
  • Center for Reliable and High-Performance Computing
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Thin Film and Charged Particle Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Department of Civil Engineering, Syracuse University
  • University of Illinois at Urbana-Champaign

External person

Jianbo Ma

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Byong An

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shubhang Bhatnagar

  • Bosch Research North America - Bosch Center for Artificial Intelligence
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Robert M. Haralick

  • University of Washington
  • University of Illinois Urbana-Champaign
  • Virginia Tech
  • Department of Electrical Engineering
  • Dept. of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • Virginia Polytechnic Institute and State University
  • Virginia Tech College of Engineering
  • University of Washington
  • City University of New York

External person

Y. Kitamura

  • Advanced Telecommunications Research Institute International

External person

Oswald Lanz

  • Fondazione Bruno Kessler

External person

Fang Li

  • University of Illinois at Urbana-Champaign

External person

Xiaodan Hu

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. V. Jawahar

  • International Institute of Information Technology Hyderabad

External person

Katsushi Ikeuchi

  • University of Illinois Urbana-Champaign
  • Carnegie Mellon University
  • University of Illinois at Urbana-Champaign
  • Carnegie Mellon University

External person

B. W. Schlake

  • Newmark Civil Engineering Laboratory
  • Norfolk Southern Corporation
  • University of Illinois Urbana-Champaign
  • Mechanical Department
  • Railroad Engineering Program
  • Railroad Engineering Program
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Norfolk Southern Corporation
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

N. Bridwell

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

F. Kishino

  • Advanced Telecommunications Research Institute International

External person

Jinjun Wang

  • Xi'an Jiaotong University
  • NEC Laboratories America, Inc.
  • ASD Epson Research and Development, Inc
  • Epson R and D, Inc.
  • Akiira Media System
  • Algorithm Group

External person

Charles R. Dyer

  • Computer Sciences UW-Madison
  • University of Wisconsin-Madison
  • Computer Science Department
  • University of Wisconsin
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Lin Shi

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shengnan Wang

  • University of Illinois Urbana-Champaign
  • Computer Vision and Robotics Laboratory
  • University of Illinois at Urbana-Champaign

External person

Yibing Song

  • City University of Hong Kong
  • Department of Computer Science

External person

Jinhui Tang

  • Nanjing University of Science and Technology
  • School of Computer Science and Engineering
  • School of Computer Science

External person

Byoungwook Choi

  • Seoul National University of Science and Technology (SNUST)
  • Department of Electrical Engineering

External person

Sarp Erturk

  • Kocaeli University
  • Electronics and Communication Engineering Department

External person

Abhimanyu Dubey

  • Massachusetts Institute of Technology

External person

Kui Jia

  • Chinese Academy of Sciences
  • Institute of Automation
  • CAS - Institute of Automation

External person

Varsha Hedau

  • Nokia
  • University of Illinois Urbana-Champaign
  • Electical and Computer Engg. Department
  • Department of Electrical and Computer Engineering
  • Center for Computational Electromagnetics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jiangong Li

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • China Agricultural University

External person

Jonathan Le Roux

  • Mitsubishi Electric Research USA
  • Mitsubishi Electric Corporation

External person

R. Yen

  • University of Illinois at Urbana-Champaign

External person

Yizhou Yu

  • The University of Hong Kong
  • University of Illinois Urbana-Champaign
  • Department of Computer Science
  • Department of Computer Science, University of Illinois
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Amit Singhal

  • Eastman Kodak
  • Research and Development Laboratories

External person

Qing Wu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Riley Edwards

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Lu Qi

  • University of California Merced

External person

Yi Ma

  • University of Illinois Urbana-Champaign
  • Microsoft USA
  • Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Visual Computing Group
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Institute of Automation
  • Chinese Academy of Sciences
  • University of Illinois at Urbana-Champaign
  • CAS - Institute of Automation
  • University of Illinois at Urbana-Champaign

External person

Yuncai Liu

  • Shanghai Jiao Tong University
  • Institute of Image Processing and Pattern Recognition
  • School of Electronics, Information and Electrical Engineering
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Myra Nam

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tong Fang

  • Siemens
  • Intelligent Vision and Reasoning Dept.

External person

Yong Hwang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Andrew Farnsworth

  • Cornell University
  • Actions@EBMF
  • Earle Brown Music Foundation Charitable Trust

External person

Ajit Singh

  • Michigan State University
  • Michigan State University

External person

Benoit Perrin

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Jianchao Yang

  • Adobe Research
  • University of Illinois Urbana-Champaign
  • Adobe Research
  • Snapchat Inc
  • Adobe Systems Incorporated
  • Adobe Corp
  • Snapchat Inc.
  • Beckman Institute
  • Snapchat Inc.
  • Snapchat Inc.
  • Snapchat Inc.
  • Snap Research
  • Snap Ine
  • Beckman Institute for Advanced Science and Technology
  • Advanced Technology Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Snap Research
  • Department of Electrical and Computer Engineering
  • Snapchat Inc.
  • Snapchat Inc.
  • Snapchat Inc.
  • Snapchat Inc.
  • Snapchat Inc.
  • Snapchat Inc.
  • Snapchat Inc.
  • ByteDance Inc
  • Snap Research
  • Snap Inc.
  • University of Illinois at Urbana-Champaign
  • ByteDance Ltd.
  • University of Illinois at Urbana-Champaign

External person

Chien Chou Lin

  • Department of Computer Science
  • National Yang Ming Chiao Tung University

External person

Qin Cai

  • Microsoft USA

External person

Chalapathy Neti

  • IBM
  • University of Illinois at Urbana-Champaign

External person

Zhengyou Zhang

  • Microsoft USA
  • University of Illinois Urbana-Champaign
  • Multimedia Collaboration Group
  • Communication and Multimedia System Group
  • Northwestern University
  • University of Illinois at Urbana-Champaign
  • Tencent

External person

R. T. Chien

  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Shuicheng Yan

  • NUS
  • National University of Singapore
  • University of Illinois Urbana-Champaign
  • IEEE
  • Nanyang Technological University
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. L. Kashyap

  • Purdue University
  • School of Electrical Engineering

External person

Le Zhang

  • Advanced Digital Sciences Center
  • Agency for Science, Technology and Research, Singapore
  • Agency for Science
  • Advanced Digital Sciences Center

External person

Qing Jie Kong

  • University of Illinois Urbana-Champaign
  • Shanghai Jiao Tong University
  • Institute of Image Processing and Pattern Recognition
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Abdullah A. Abuolaim

  • National University of Singapore
  • Advanced Digital Sciences Center
  • Department of Computer Science

External person

Zhe Hu

  • University of California Merced
  • ASRI
  • Seoul National University

External person

Chong Ho Choi

  • Seoul National University
  • School of Electrical Eng./Comp. Sci.
  • Sch. of Computer Science and Eng.
  • School of Electrical Eng. & Computer Science

External person

Andrew Senior

  • IBM
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Liang Wang

  • University of Kentucky

External person

Xiaoping Llu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shun Zhang

  • Xi'an Jiaotong University

External person

Emrah Ergul

  • Kocaeli University
  • Electronics and Communication Engineering Department

External person

Kevin Matzen

  • Meta
  • Facebook

External person

Kim Hui Yap

  • Advanced Digital Sciences Center (ADSC)

External person

Shaveta Khosla

  • University of Illinois at Chicago

External person

G. Rama Murthy

  • International Institute of Information Technology Hyderabad

External person

Bruce Culbertson

  • Hewlett-Packard
  • Mobile and Immersive Experience Laboratory

External person

Sharath Gopal

  • Bosch Research North America - Bosch Center for Artificial Intelligence

External person

Mert Dikmen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ousman Azy

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Alex Pentland

  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • Media Lab.
  • University of Illinois at Urbana-Champaign

External person

Anil Jain

  • Michigan State University
  • Department of Computer Science
  • Department of Computer Science and Engineering
  • Michigan State University

External person

Yi Sooyeong

  • Jeonbuk National University
  • Div. of Electronics and Information Engineering

External person

W. M. Osse

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shun Zhang

  • Xi'an Jiaotong University
  • Northwestern Polytechnical University Xian
  • University of Colorado Boulder

External person

John Apostolopoulos

  • Hewlett-Packard
  • Mobile and Immersive Experience Laboratory

External person

Mark Hasegawa-Johnsor

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Changsheng Xu

  • Chinese Academy of Sciences
  • Institute of Automation
  • Institute of Computing Technology
  • CAS - Institute of Automation

External person

Hsien Ting Cheng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jason Tyan

  • Intelligent Vision and Reasoning Dept.
  • Siemens

External person

Wang Gang

  • University of Illinois at Urbana-Champaign

External person

Nojun Kwak

  • Seoul National University
  • Sch. of Computer Science and Eng.

External person

Chi Hao Tsai

  • National Yang Ming Chiao Tung University
  • Department of Computer Science

External person

Yunqiang Chen

  • Siemens
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Intelligent Vision and Reasoning Dept.
  • University of Illinois at Urbana-Champaign

External person

John Weng

  • University of Illinois at Urbana-Champaign

External person

Liu Ren

  • Bosch Research North America - Bosch Center for Artificial Intelligence

External person

James Davis

  • University of California at Santa Cruz
  • Department of Computer Science
  • University of California at Santa Cruz
  • University of California

External person

Alexandre Heili

  • Swiss Federal Institute of Technology Lausanne

External person

Shengjin Wang

  • Tsinghua University

External person

Linchao Bao

  • City University of Hong Kong
  • Department of Computer Science
  • Tencent

External person

Xinhua Zhuang

  • University of Illinois Urbana-Champaign
  • University of Missouri
  • University of Washington
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Washington
  • University of Illinois at Urbana-Champaign

External person

R. Chellappa

  • Purdue University
  • University of Maryland, College Park
  • School of Electrical Engineering
  • Computer Science Center
  • Institute for Systems Research

External person

David L. Milgram

  • University of Maryland, College Park
  • Computer Science Center

External person

Tod Courtney

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Dept. of Elec. and Comp. Eng.
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Hu Xiaoping

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nicolas Loeff

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ponnuthurai Nagaratnam Suganthan

  • Nanyang Technological University

External person

Wee Kheng Leow

  • National University of Singapore
  • Department of Computer Science

External person

Tsvi Dubitzki

  • University of Maryland, College Park
  • Computer Vision Laboratory

External person

Steve Kelling

  • Cornell University

External person

Dong Li

  • Tsinghua University

External person

Larry S. Davis

  • University of Maryland, College Park
  • Computer Science Center

External person

Cheng Hui Chen

  • National Yang Ming Chiao Tung University
  • Department of Computer Science

External person

L. R. Million

  • Technical Research and Development

External person

Larry Milhon

  • BNSF Railway

External person

Nafiz Arica

  • Bahcesehir University
  • Computer Engineering Department

External person

Zicheng Liu

  • Microsoft USA
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ritchey Ruff

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign

External person

J. Ma

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Po Han Huang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. R. Mahesh Mohan

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rich Caruana

  • Microsoft USA

External person

U. K. Visesh

  • International Institute of Information Technology Hyderabad

External person

Wei Chih Hung

  • University of California Merced

External person

Mohamed Saadalla

  • King Abdullah University of Science and Technology

External person

Xing Wei

  • Xi'an Jiaotong University
  • University of Massachusetts

External person

Mark P. Stehly

  • Hazardous Materials
  • BNSF Railway
  • Burlington Northern Santa Fe Railway

External person

Gang Wang

  • Advanced Digital Sciences Center
  • Nanyang Technological University
  • University of Illinois Urbana-Champaign
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Electrical and Electronic Engineering
  • School of EEE
  • School of EEE
  • Electrical and Electronic Engineering
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Moaveni

  • Newmark Civil Engineering Laboratory
  • University of Illinois Urbana-Champaign
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Engineering and Research International, Inc.
  • Savannah State University
  • University of Illinois at Urbana-Champaign
  • Newmark Civil Engineering Laboratory
  • University of Illinois at Urbana-Champaign
  • Inc.

External person