Network

Satinder Singh

  • University of Michigan, Ann Arbor
  • Computer Science and Engineering
  • University of Michigan, Ann Arbor

External person

Tengyang Xie

  • University of Illinois at Urbana-Champaign
  • UIUC
  • UIUC
  • UIUC
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • Microsoft USA
  • UIUC
  • University of Illinois Urbana-Champaign

External person

Alekh Agarwal

  • Microsoft USA
  • Alphabet Inc.

External person

Jinglin Chen

  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Alex Kulesza

  • University of Michigan, Ann Arbor
  • Computer Science and Engineering
  • Alphabet Inc.
  • University of Michigan, Ann Arbor

External person

Jiawei Huang

  • University of Illinois at Urbana-Champaign
  • Microsoft USA
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Akshay Krishnamurthy

  • University of Massachusetts
  • Microsoft USA

External person

John Langford

  • Microsoft USA
  • Toyota Technological Institute at Chicago
  • Toyota Technological Institute at Chicago
  • Yahoo Research Labs

External person

Audrey Huang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Philip Amortila

  • University of Illinois at Urbana-Champaign
  • UIUC

External person

Richard Lewis

  • Department Psychology
  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Ambuj Tewari

  • Department of Statistics
  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Dylan J. Foster

  • Cornell University
  • Massachusetts Institute of Technology
  • Microsoft USA

External person

Aditya Modi

  • University of Michigan, Ann Arbor
  • Microsoft Research Asia

External person

Masatoshi Uehara

  • Harvard University
  • Cornell University
  • Genentech Incorporated

External person

Ching An Cheng

  • Microsoft USA

External person

Csaba Szepesvári

  • University of Alberta
  • Alphabet Inc.

External person

Chengchun Shi

  • The London School of Economics and Political Science
  • LSE

External person

Paul Mineiro

  • Microsoft USA

External person

Tie Yan Liu

  • Microsoft USA

External person

Yisong Yue

  • Carnegie Mellon University
  • California Institute of Technology
  • Department of Computer Science
  • iLab.
  • California Institute of Technology
  • Carnegie Mellon University

External person

Miroslav Dudík

  • Microsoft USA

External person

Wen Sun

  • Carnegie Mellon University
  • Cornell University

External person

Yu Bai

  • Salesforce.com, Inc.
  • Stanford University
  • Salesforce AI Research

External person

Tao Qin

  • Microsoft USA
  • Huazhong Agricultural University
  • Shandong University of Technology

External person

Robert Schapire

  • Princeton University
  • Microsoft USA
  • AT&T

External person

Li Zhao

  • Microsoft USA

External person

Wenhao Zhan

  • Princeton University

External person

Aryan Mokhtari

  • University of Texas at Austin

External person

Jim Kurose

  • University of Massachusetts
  • University of Massachusetts Boston
  • University of Massachusetts Amherst

External person

Cameron Voloshin

  • California Institute of Technology

External person

Victor Chernozhukov

  • Massachusetts Institute of Technology

External person

Tommaso Melodia

  • Department of Electrical and Computer Engineering
  • Northeastern University
  • Northeastern University China
  • College of Engineering

External person

Baihe Huang

  • Peking University

External person

Mingyan Liu

  • University of Michigan, Ann Arbor
  • IEEE
  • Department of Electrical Engineering and Computer Science
  • QuadMetrics, Inc
  • Real-Time Computing Laboratory
  • University of Michigan Healthcare System
  • University of Michigan, Ann Arbor
  • University of Michigan
  • University of Michigan

External person

Yu Bai

  • Salesforce AI Research

External person

Shi Jian Chen

  • CAS - Academy of Mathematics and System Sciences

External person

Ayush Sekhari

  • Massachusetts Institute of Technology

External person

Simon S. Du

  • Carnegie Mellon University
  • Carnegie Mellon University
  • North Carolina State University

External person

Anish Arora

  • Ohio State University

External person

Caiming Xiong

  • Salesforce.com, Inc.
  • Salesforce Research

External person

Hoang M. Le

  • California Institute of Technology
  • California Institute of Technology

External person

Chenkai Sun

  • University of Illinois at Urbana-Champaign
  • Alibaba Group Holding Ltd.
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Nathan Kallus

  • Cornell University

External person

Chenlu Ye

  • Hong Kong University of Science and Technology

External person

Jayakumar Subramanian

  • Adobe Systems Incorporated

External person

Siyuan Zhang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

R. D. Nowak

  • University of Wisconsin-Madison
  • Department of Electrical and Computer Engineering
  • University of Nevada, Reno
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Jinzhe Yang

  • Tsinghua University

External person

Srini Parthasarathy

  • Ohio State University

External person

Aylin Yener

  • Pennsylvania State University
  • Dept. of Electrical Engineering
  • Ohio State University

External person

Georgios Theocharous

  • Adobe Systems Incorporated

External person

Ness B. Shroff

  • Purdue University
  • Ohio State University
  • IEEE
  • Center for Wireless Systems and Applications (CWSA)
  • Department of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Ohio State University

External person

Constantine Caramanis

  • University of Texas at Austin

External person

Chirag Agarwal

  • Adobe Systems Incorporated

External person

Pulkit Katdare

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Lekan Molu

  • Microsoft USA

External person

Sen Lin

  • Ohio State University

External person

Wei Chen

  • Microsoft USA

External person

Kaushik Chowdhury

  • Northeastern University China

External person

Andrew Bennett

  • Morgan Stanley

External person

Yu Xiang Wang

  • University of California at Santa Barbara
  • UC Santa Barbara College of Engineering

External person

Jia Liu

  • Ohio State University

External person

Hulya Seferoglu

  • University of Illinois at Chicago

External person

Chunyi Peng

  • Purdue University

External person

Zhiqiang Lin

  • Ohio State University

External person

Stratis Ioannidis

  • Northeastern University China
  • College of Engineering

External person

Sanjay Shakkottai

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • IEEE
  • Stanford University
  • Texas A&M University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical, and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering, Texas AandM University
  • Center for Compound Semiconductor Microelectronics
  • UT Austin
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Lei Ying

  • Arizona State University
  • Iowa State University
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • School of Electrical
  • School of ECEE
  • School of Electrical
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Goldenwater Center (GWC)
  • School of Computing
  • Goldwater Center (GWC) 436
  • University of Michigan, Ann Arbor
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • Iowa State University
  • University of Michigan, Ann Arbor
  • University of Michigan
  • University of Michigan
  • Iowa State University
  • University of Illinois at Urbana-Champaign
  • Arizona State University

External person

Ziqi Wang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Balaji Krishnamurthy

  • Adobe Systems Incorporated

External person

Lihong Li

  • Microsoft USA
  • Alphabet Inc.
  • Rutgers - The State University of New Jersey, New Brunswick

External person

Haruka Kiyohara

  • Cornell University

External person

Barnabás Janzer

  • University of Cambridge
  • University of Oxford

External person

Raef Bassily

  • Ohio State University

External person

Kannan Srinivasan

  • Ohio State University

External person

Gellért Weisz

  • University College London
  • Alphabet Inc.

External person

Mohak Bhardwaj

  • University of Washington

External person

Dhruv Madeka

  • Amazon.com, Inc.

External person

Hal Daumé

  • Microsoft USA
  • University of Maryland, College Park

External person

Christoph Dann

  • Carnegie Mellon University
  • Carnegie Mellon University
  • Alphabet Inc.

External person

Yuheng Zhang

  • University of Illinois at Urbana-Champaign

External person

Priyank Agrawal

  • University of Illinois at Urbana-Champaign

External person

Jason D. Lee

  • Stanford University
  • Institute for Computational and Mathematical Engineering
  • University of Southern California
  • Princeton University
  • Stanford University
  • University of Southern California

External person

Eylem Ekici

  • Ohio State University

External person

Dean P. Foster

  • Amazon.com, Inc.

External person

Arpan Dasgupta

  • International Institute of Information Technology Hyderabad

External person

Shripad Deshmukh

  • Adobe Systems Incorporated

External person

Ming Shi

  • Ohio State University

External person

Hanze Dong

  • Hong Kong University of Science and Technology
  • Salesforce AI Research
  • Salesforce AI Research

External person

Manling Li

  • University of Illinois at Urbana-Champaign
  • UIUC
  • Department of Computer Science
  • UIUC
  • Rensselaer Polytechnic Institute
  • UIUC
  • Northwestern University
  • University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • University of Illinois Urbana-Champaign

External person

Gauri Joshi

  • Carnegie Mellon University

External person

Yi Ren Fung

  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Huan Wang

  • Salesforce.com, Inc.

External person

Sham M. Kakade

  • Rutgers - The State University of New Jersey, New Brunswick
  • Microsoft USA
  • University of Washington
  • University of Washington
  • University of Pennsylvania
  • Toyota Technological Institute
  • Toyota Technological Institute at Chicago
  • Harvard University

External person

Ameet Talwalkar

  • Carnegie Mellon University

External person

Atilla Eryilmaz

  • IEEE
  • Laboratory for Information and Decision Systems
  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Lab. for Info. and Decision Systems
  • Ohio State University
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • Ohio State University
  • University of Illinois at Urbana-Champaign

External person

Yu Bai

  • Stanford University
  • Stanford University

External person

Yingbin Liang

  • Princeton University
  • University of Illinois Urbana-Champaign
  • Syracuse University
  • Ohio State University
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Ohio State University
  • Department of Civil Engineering, Syracuse University
  • University of Illinois at Urbana-Champaign

External person

Han Zhong

  • Peking University
  • Hong Kong University of Science and Technology

External person

Tengyang Xie

  • University of Illinois Urbana-Champaign

External person

Jialiang Xu

  • University of Illinois at Urbana-Champaign

External person

Kareem Amin

  • Alphabet Inc.

External person

Ida Momennejad

  • Microsoft USA

External person

Wei Xiong

  • University of Illinois at Urbana-Champaign
  • Hong Kong University of Science and Technology

External person

Byron Boots

  • Georgia Institute of Technology
  • University of Washington

External person

Chi Han

  • ByteDance Ltd.
  • University of Illinois at Urbana-Champaign

External person

Xiaomeng Huang

  • Tsinghua University

External person

Akanksha Saran

  • Microsoft USA

External person

Elisa Bertino

  • Purdue University
  • Purdue University

External person