Network

Alexander Gerhard Schwing

Person: Academic

T. N. Mudge

  • University of Michigan, Ann Arbor
  • Intel
  • ARM Ltd.
  • Department of Electrical Engineering
  • Department of Electrical Eng.
  • Circuit Res. Lab.
  • Department of Electrical Engineering and Computer Science
  • Radiation Laboratory
  • Department of EECS
  • Real-Time Computing Laboratory
  • Real-Time Computing Laboratory
  • Real-Time Computing Laboratory
  • University of Michigan Healthcare System
  • University of Michigan, Ann Arbor
  • University of Michigan

External person

Jung Ho Ahn

  • Seoul National University
  • Department of Computer Science and Engineering
  • Department of Transdisciplinary Studies

External person

Michael J. Schulte

  • University of Wisconsin-Madison
  • Advanced Micro Devices
  • AMD Research
  • AMD
  • Research and Advanced Development Labs
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin
  • AMD Research

External person

Mohammad Alian

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • UIUC
  • Kansas University
  • University of Kansas
  • UIUC
  • University of Illinois at Urbana-Champaign
  • University and Kansas
  • University of Kansas
  • University of Illinois
  • University of Kansas
  • University of Illinois at Urbana-Champaign

External person

Abhishek Sinkar

  • University of Illinois Urbana-Champaign
  • University of Wisconsin-Madison
  • Oracle
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Daehoon Kim

  • DGIST
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Daegu Gyeongbuk Institute of Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • DGIST
  • University of Illinois
  • Dgist

External person

Syed Gilani

  • Advanced Micro Devices
  • University of Wisconsin-Madison
  • AMD
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Yifan Yuan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • UIUC
  • University of Illinois at Urbana-Champaign
  • UIUC
  • UIUC
  • Intel Labs
  • Intel
  • University of Illinois at Urbana-Champaign
  • Intel Labs
  • Meta Platforms

External person

Vivek De

  • Intel
  • Circuits Research Labs.
  • IEEE

External person

David Blaauw

  • University of Michigan, Ann Arbor
  • Intel
  • ARM Ltd.
  • Department of Electrical Engineering
  • Department of Electrical Eng.
  • Circuit Res. Lab.
  • Radiation Laboratory
  • Department of Electrical Engineering and Computer Science
  • Department of EECS
  • Real-Time Computing Laboratory
  • University of Michigan Healthcare System
  • University of Michigan, Ann Arbor

External person

Myoungsoo Jung

  • Yonsei University
  • Computer Architecture and Memory Systems Lab
  • School of Integrated Technology
  • Korea Advanced Institute of Science and Technology
  • Computer Architecture and Memory Systems Lab

External person

Jungseob Lee

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Ren Wang

  • Intel
  • Intel Labs
  • Intel Labs
  • Intel Labs

External person

Hadi Esmaeilzadeh

  • University of California Office of the President
  • Alternative Computing Technologies (ACT) Lab
  • University of California at San Diego
  • University of Illinois Urbana-Champaign
  • University of California
  • University of Illinois at Urbana-Champaign

External person

Amir Yazdanbakhsh

  • University of Wisconsin-Madison
  • Georgia Institute of Technology
  • Alternative Computing Technologies (ACT) Lab
  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign
  • Alphabet Inc.
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin
  • University of Wisconsin
  • University of California at San Diego

External person

Sukhan Lee

  • Seoul National University
  • Department of Transdisciplinary Studies
  • Samsung

External person

Jie Zhang

  • Yonsei University
  • School of Integrated Technology
  • Computer Architecture and Memory Systems Lab
  • Korea Advanced Institute of Science and Technology
  • Computer Architecture and Memory Systems Lab

External person

Hao Wang

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Taejoon Park

  • Daegu Gyeongbuk Institute of Science and Technology
  • Hanyang University
  • Kongju National University
  • University of Wisconsin-Madison
  • Daegu Gyeoungbuk Institute of Science and Technology (DGIST)
  • Department of Robotics Engineering
  • Department of Information and Communication Engineering
  • Real-Time Cyber-Physical System Laboratory
  • Department of Information and Communication Engineering

External person

Mikko H. Lipasti

  • University of Wisconsin-Madison
  • Department of Electrical and Computer Engineering
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin
  • University of Wisconsin

External person

Jinghan Huang

  • University of Illinois at Urbana-Champaign

External person

Ulya R. Karpuzcu

  • University of Minnesota Twin Cities
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • Department of Electrical and Computer Engineering
  • Dept. of ECE
  • University of Minnesota
  • University of Illinois at Urbana-Champaign
  • University of Minnesota System
  • University of Illinois at Urbana-Champaign

External person

Ipoom Jeong

  • University of Illinois at Urbana-Champaign
  • Yonsei University

External person

Hamid Ghasemi

  • University of Wisconsin-Madison
  • AMD
  • University of Wisconsin

External person

Young Hoon Son

  • Seoul National University
  • Samsung

External person

Muhammad Khellah

  • Intel
  • Circuits Research Labs.
  • Intel Corporation
  • IEEE
  • Circuit Res. Lab.

External person

Kyomin Sohn

  • Samsung
  • Samsung Electronics Hwaseong Site
  • Samsung Advanced Institute of Technology

External person

Tanay Karnik

  • Intel
  • Circuits Research Labs.

External person

Jiaqi Lou

  • University of Illinois at Urbana-Champaign

External person

Krisztián Flautner

  • ARM Limited
  • ARM Ltd.
  • ARM's Intell. Ener. Mgmt. Technology

External person

Miryeong Kwon

  • Yonsei University
  • Computer Architecture and Memory Systems Lab
  • Korea Advanced Institute of Science and Technology
  • Computer Architecture and Memory Systems Lab

External person

Jinjun Xiong

  • IBM
  • Cognitive Computing Systems Research
  • IBM Research
  • University of Illinois Urbana-Champaign
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • University of Technology Sydney
  • California State Polytechnic University Pomona
  • IBM
  • University of Illinois at Urbana-Champaign
  • HiKonv: High Throughput Quantized
  • SUNY Buffalo
  • University at Buffalo
  • University of Illinois at Urbana-Champaign

External person

Katherine Morrow

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

David J. Palframan

  • University of Wisconsin-Madison
  • Department of Electrical and Computer Engineering
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin
  • University of Wisconsin

External person

Murali Annavaram

  • University of Southern California
  • Department of Electrical Engineering
  • Department of Electrical Engineering, University of Southern California
  • University of Southern California
  • Department of Electrical Engineering, University of Southern California

External person

Zhenhong Liu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Mahmut T. Kandemir

  • Istanbul Technical University
  • Pennsylvania State University
  • Syracuse University
  • Dept. of Comp. Sci. and Engineering
  • Yonsei University
  • PennState

External person

Michael Jaemin Kim

  • Seoul National University

External person

Shinhaeng Kang

  • Samsung
  • Samsung Electronics Hwaseong Site

External person

Ki Dong Kang

  • Daegu Gyeongbuk Institute of Science and Technology
  • DGIST
  • Electronics and Telecommunications Research Institute

External person

Soroush Ghodrati

  • Alternative Computing Technologies (ACT) Lab
  • Georgia Institute of Technology
  • University of California at San Diego
  • Alternative Computing Technologies (ACT) Lab.

External person

Dong Kai Wang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of California at San Diego

External person

Dinesh Somasekhar

  • Intel
  • Circuits Research Labs.
  • IEEE

External person

Yan Sun

  • University of Illinois at Urbana-Champaign

External person

Jim Tschanz

  • University of Illinois Urbana-Champaign
  • Intel
  • IEEE
  • VLSI Info. Processing Systems Group
  • University of Illinois at Urbana-Champaign

External person

Youjie Li

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • UIUC
  • UIUC

External person

Amin Farmahini-Farahani

  • University of Wisconsin-Madison
  • University of Illinois Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Minbok Wi

  • Seoul National University

External person

Kevin Zhang

  • Intel
  • Intel Corporation
  • IEEE
  • LTD Advanced Design Group

External person

Nitin Borkar

  • Intel
  • Circuits Research Labs.

External person

Sungjoon Koh

  • Yonsei University
  • Computer Architecture and Memory Systems Lab
  • Computer Architecture and Memory Systems Lab
  • Korea Advanced Institute of Science and Technology

External person

T. Austin

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Computer Science
  • Radiation Laboratory
  • University of Michigan Healthcare System
  • University of Michigan, Ann Arbor

External person

O. Seongil

  • Seoul National University
  • Samsung

External person

Houxiang Ji

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Chihun Song

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bingchao Li

  • Tianjin University
  • Civil Aviation University of China
  • University of Illinois Urbana-Champaign
  • School of Computer Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Computer Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ashutosh Dhar

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • IBM
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yibin Ye

  • Intel
  • Circuits Research Labs.

External person

Yuhwan Ro

  • Seoul National University
  • Department of Transdisciplinary Studies
  • Samsung

External person

Eojin Lee

  • Samsung
  • Inha University

External person

Ahmed H.M.O. Abulila

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • UIUC

External person

Jinin So

  • Samsung
  • Samsung Electronics Hwaseong Site

External person

Hadi Asghari-Moghaddam

  • University of Illinois Urbana-Champaign
  • University of Wisconsin-Madison
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

Tianchen Wang

  • University of Illinois at Urbana-Champaign

External person

Gunjan Pandya

  • Intel
  • Digital Enterprise Group
  • IEEE
  • Enterprise Microprocessor Group

External person

Hwayong Nam

  • Seoul National University

External person

Stark Draper

  • University of Wisconsin-Madison
  • University of Toronto
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Mingu Kang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • IBM
  • University of California at San Diego
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Fatih Hamzaoglu

  • Intel
  • Intel Corporation

External person

Taeho Kgil

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory
  • University of Michigan, Ann Arbor

External person

David Wang

  • Samsung
  • Samsung Advanced Institute of Technology

External person

Paula Aguilera

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Joon Ho Song

  • Samsung
  • Samsung Advanced Institute of Technology

External person

Yeongon Cho

  • Samsung
  • Samsung Advanced Institute of Technology

External person

Jaehyun Park

  • Seoul National University

External person

Sean Kinzer

  • University of California at San Diego

External person

Yongsuk Kwon

  • Samsung
  • Seoul National University

External person

Azadeh Davoodi

  • University of Wisconsin-Madison
  • Department of Electrical and Computer Engineering
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin
  • University of Wisconsin

External person

Ronald G. Dreslinski

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor
  • University of Michigan

External person

Jaehyun Park

  • Seoul National University

External person

Vijay Sathish

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Jaehyuk Huh

  • Korea Advanced Institute of Science and Technology

External person

Dimitrios Skarlatos

  • University of Illinois at Urbana-Champaign
  • Carnegie Mellon University

External person

Hyunyoon Cho

  • Samsung
  • Seoul National University

External person

Bhargava Gopireddy

  • University of Illinois Urbana-Champaign
  • Qualcomm Research
  • NVIDIA
  • University of Illinois at Urbana-Champaign

External person

Seunghak Lee

  • Daegu Gyeongbuk Institute of Science and Technology
  • DGIST
  • Human Longevity, Inc.

External person

Xinhao Kong

  • Duke University

External person

Choungki Song

  • University of Wisconsin-Madison
  • University of Wisconsin
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Ali Farhang

  • Intel
  • Digital Enterprise Group

External person

Byoungchan Oh

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Danyang Zhuo

  • Duke University

External person

Yehea Ismail

  • Northwestern University
  • Center for Quantum Devices
  • EECS Department

External person

Jongse Park

  • Georgia Institute of Technology
  • Korea Advanced Institute of Science and Technology
  • University of California at San Diego

External person

Xiaohao Wang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois at Urbana-Champaign

External person

Izzat El Hajj

  • University of Illinois Urbana-Champaign
  • Hewlett-Packard
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • American University of Beirut
  • ECE
  • University of Illinois at Urbana-Champaign
  • Georgia Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Reese Kuper

  • University of Illinois at Urbana-Champaign

External person

Shi Ting Zhou

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Gyeongseo Park

  • Daegu Gyeongbuk Institute of Science and Technology
  • DGIST

External person

Clair Webb

  • Intel
  • Intel Corporation
  • LTD Advanced Design Group

External person

Qiang Xu

  • Chinese University of Hong Kong
  • Department of Computer Science and Engineering

External person

Umur Darbaz

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hardik Sharma

  • Bigstream, Inc
  • Bigstream, Inc
  • Bigstream Inc.
  • Inc.
  • Georgia Institute of Technology

External person

Diaaeldin Khalil

  • Northwestern University
  • Center for Quantum Devices
  • EECS Department

External person

Yongseok Son

  • Chung-Ang University

External person

Charlie Tai

  • Intel
  • Intel Labs

External person

Yipeng Wang

  • Intel
  • Intel Labs

External person

Seungwon Lee

  • Samsung Advanced Institute of Technology
  • Samsung

External person

Donghyun Gouk

  • Yonsei University
  • Computer Architecture and Memory Systems Lab
  • Korea Advanced Institute of Science and Technology

External person

Dennis Sylvester

  • University of Michigan, Ann Arbor
  • Department of EECS
  • Real-Time Computing Laboratory
  • University of Michigan, Ann Arbor
  • University of Michigan

External person

Daniel W. Chang

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Jizeng Wei

  • Tianjin University
  • School of Computer Science and Technology

External person

Li Jiang

  • Shanghai Jiao Tong University
  • Shanghai Key Laboratory of Scalable Computing and Systems

External person

Wei Zuo

  • Beijing Institute of Technology
  • University of Illinois Urbana-Champaign
  • Inspirit IoT, Inc.
  • School of Information and Electronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ismail Akturk

  • Louisiana State University
  • University of Minnesota Twin Cities
  • Center for Computation and Technology
  • Dept. of ECE
  • University of Minnesota System

External person

Hyungyo Kim

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Samsung

External person

Dongkeun Oh

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

Philip Lantz

  • Intel Labs
  • Intel

External person

Srikar Vanavasam

  • University of Illinois at Urbana-Champaign

External person

Rohan Mahapatra

  • University of California at San Diego

External person

Jihyun Choi

  • Samsung Electronics Hwaseong Site
  • Samsung

External person

Yu Hen Hu

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

Derek Murray

  • Microsoft USA
  • Lacework
  • Microsoft Research Asia

External person

So Young Kim

  • Samsung
  • University of Michigan, Ann Arbor

External person

Srinivasan Narayanamoorthy

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Soojung Ryu

  • Samsung
  • Architecture Lab.
  • Samsung Advanced Institute of Technology, Samsung Electronics

External person

Nilmini Abeyratne

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor
  • Intel

External person

David Donofrio

  • Lawrence Berkeley National Laboratory

External person

Todd Mytkowicz

  • Microsoft USA

External person

Seung Won Min

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • UIUC
  • NVIDIA
  • University of Illinois at Urbana-Champaign

External person

Jungyeon Yoon

  • SK Corporation
  • Georgia Institute of Technology

External person

Charlie Chung Ping Chen

  • University of Wisconsin-Madison
  • National Taiwan University
  • University of Texas at Austin
  • Intel
  • IEEE
  • Department of Computer Sciences
  • Department of Electrical and Computer Engineering
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • Department of Computer Science
  • University of Wisconsin

External person

Jin Jung

  • Samsung

External person

Dae Hyun Kwon

  • Samsung
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kambiz Samadi

  • Alternative Computing Technologies (ACT) Lab
  • Qualcomm Incorporated
  • Qualcomm Technologies Inc.
  • Qualcomm Technologies

External person

Dan R.K. Ports

  • Microsoft USA

External person

Mingchao Yu

  • University of Southern California
  • University of Southern California
  • Department of Electrical Engineering, University of Southern California

External person

Narayan Ranganathan

  • Intel Labs
  • Intel

External person

Siddharth Agarwal

  • University of Illinois at Urbana-Champaign

External person

Kwanhee Kyung

  • Seoul National University

External person

D. Ernst

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Prakalp Srivastava

  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

V. Bertacco

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor

External person

Seungmin Baek

  • Seoul National University

External person

Amar Phanishayee

  • Microsoft USA
  • Microsoft Research Asia

External person

Sanjay Kumar

  • Intel Labs
  • Intel

External person

Jeongseob Ahn

  • Ajou University

External person

Dae Han Ahn

  • Daegu Gyeoungbuk Institute of Science and Technology (DGIST)
  • Daegu Gyeoungbuk Institute of Science and Technology
  • Daegu Gyeongbuk Institute of Science and Technology
  • Department of Information and Communication Engineering
  • Real-Time Cyber-Physical System Laboratory

External person

David Roberts

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Jongmin Shin

  • Daegu Gyeongbuk Institute of Science and Technology
  • Dgist

External person

Jacob Nelson

  • Microsoft USA

External person

Wei Bai

  • Microsoft USA
  • Microsoft Research Asia

External person

Jungwook Choi

  • University of Illinois Urbana-Champaign
  • IBM
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Hanyang University

External person

Jizhou Sun

  • Tianjin University
  • School of Computer Science and Technology

External person

S. Das

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor
  • IBM Research

External person

Hyeran Jeon

  • San Jose State University
  • University of California Merced

External person

Tianjian Li

  • Shanghai Jiao Tong University
  • Shanghai Key Laboratory of Scalable Computing and Systems

External person

Nikhil Rao

  • Intel Labs
  • Intel

External person

Gyungsu Byun

  • West Virginia University
  • Southern Methodist University
  • West Virginia University

External person

Reum Oh

  • Samsung

External person

Robert Bai

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory
  • University of Michigan, Ann Arbor

External person

A. Salman Avestimehr

  • Department of Electrical and Computer Engineering
  • Cornell University
  • University of Southern California
  • Department of Electrical Engineering, University of Southern California
  • Department of Electrical Engineering
  • School of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering
  • University of Southern California
  • Department of Electrical Engineering, University of Southern California

External person

Aditya Agrawal

  • University of Illinois Urbana-Champaign
  • NVIDIA
  • Intel
  • University of Illinois at Urbana-Champaign

External person

Mang Yu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaoyao Liang

  • Shanghai Jiao Tong University
  • Shanghai Key Laboratory of Scalable Computing and Systems

External person

T. E. Coan

  • Southern Methodist University
  • University of Pittsburgh
  • Ohio State University
  • Stanford University
  • University of Oklahoma
  • Purdue University
  • University of Rochester
  • Syracuse University
  • Vanderbilt University
  • Virginia Tech
  • California Institute of Technology
  • University of California at San Diego
  • University of California at Santa Barbara
  • University of Colorado Boulder
  • Cornell University
  • University of Florida
  • Harvard University
  • University of Illinois Urbana-Champaign
  • Carleton University
  • Natural Sciences and Engineering Research Council
  • McGill University
  • Ithaca College
  • University of Kansas
  • University of Minnesota Twin Cities
  • SUNY Albany
  • Intel
  • Wayne State University
  • West Lafayette
  • University of Texas-Pan American
  • Stanford Linear Accelerator Center
  • Natural Sciences and Engineering Research Council
  • University of Texas Rio Grande Valley
  • University of Illinois at Urbana-Champaign
  • Ohio State University
  • California Institute of Technology
  • Harvard University
  • Virginia Polytechnic Institute and State University

External person

Songze Li

  • University of Southern California
  • Trifecta Blockchain
  • University of Southern California
  • Department of Electrical Engineering, University of Southern California

External person

Cliff Young

  • Alphabet Inc.

External person

Ripudaman Singh

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

Katherine Compton

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Naifeng Jing

  • Shanghai Jiao Tong University
  • Department of Micro/Nano Electronics

External person

Sumeet Katariya

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

Daniel Wong

  • University of California at Riverside

External person

Youngsoo Shin

  • Korea Advanced Institute of Science and Technology
  • Department of Electrical Engineering

External person

Michael M. Swift

  • Department of Biological Sciences and Computer Sciences
  • Department of Computer Sciences
  • University of Wisconsin-Madison

External person

Jaewan Choi

  • Seoul National University

External person

Seoyoung Ko

  • Seoul National University

External person

Erika Gunadi

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Minwook Ahn

  • Samsung Advanced Institute of Technology
  • Samsung
  • Samsung Advanced Institute of Technology, Samsung Electronics

External person

John Kim

  • Korea Advanced Institute of Science and Technology

External person

Sanghyuk Kwon

  • Seoul National University
  • Samsung

External person

Byung Hoon Ahn

  • University of California at San Diego

External person

Parameswaran Ramanathan

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Carlos Tokunaga

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Kyoosik Shin

  • Hanyang University
  • Department of Robotics Engineering

External person

Hyerim Chung

  • Daegu Gyeoungbuk Institute of Science and Technology
  • Department of Information and Communication Engineering
  • Daegu Gyeongbuk Institute of Science and Technology

External person

Chunhua Yao

  • University of Wisconsin-Madison
  • University of Wisconsin

External person

D. H. Kim

  • Kyungpook National University
  • Korea University
  • National Institute for Nuclear Physics
  • Chonnam National University
  • Korea Institute of Science and Technology Information
  • Seoul National University
  • Jeonbuk National University
  • Sungkyunkwan University
  • Peter the Great St. Petersburg Polytechnic University
  • CERN
  • Kangwon National University
  • Ewha Womans University
  • Samsung

External person

Yibo Huang

  • University of Texas at Austin

External person

Lan Anh Nguyen

  • Chung-Ang University

External person

Pejman Lotfi-Kamran

  • Institute for Research in Fundamental Sciences (IPM)

External person

Matthew Shuman

  • Oregon State University
  • Oregon State University

External person

Xuan Zhang

  • Washington University St. Louis

External person

Behnam Khaleghi

  • University of California at San Diego

External person

Omar Alama

  • King Abdullah University of Science and Technology

External person

Vijay Janapa Reddi

  • University of Texas at Austin
  • Harvard University

External person

Newton Ni

  • University of Texas at Austin

External person

Yu Cao

  • Arizona State University
  • Department of Electrical Engineering
  • Department of Electrical, Computer, and Energy Engineering
  • Department of Electrical Engineering
  • Arizona State University

External person

Sitao Huang

  • University of Illinois Urbana-Champaign
  • ECE and Coordinated Science Lab
  • ECE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois at Urbana-Champaign
  • University of California at Irvine
  • Univ. of California Irvine

External person

Zhiting Zhu

  • Lepton AI Inc.

External person

Zhendong Bei

  • Alibaba Group Holding Ltd.

External person

Zhichao Liu

  • University of Illinois Urbana-Champaign
  • Beckman Institute
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jacob Sacks

  • Georgia Institute of Technology

External person

Hanyang Xu

  • University of California at San Diego

External person

Oliver O'Halloran

  • IBM Systems
  • IBM

External person

Matthew Tomei

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Navateja Alla

  • University of California at San Diego

External person

Renji Thomas

  • Ohio State University
  • Ohio State University

External person

Lavanya Karthikeyan

  • University of California at San Diego

External person

Indrani Paul

  • AMD
  • AMD
  • Université Paris Diderot-Paris 7

External person

Pankaj Mehra

  • SanDisk
  • Samsung

External person

Gieseo Park

  • University of Texas at Austin
  • University of Texas at Dallas

External person

Thomas Roewer

  • IBM Research
  • IBM

External person

Jingwen Leng

  • University of Texas at Austin

External person

Zhibin Yu

  • Shenzhen Institute of Advanced Technology
  • University of Chinese Academy of Sciences

External person

Taewhan Kim

  • Seoul National University
  • School of Electrical Engineering and Computer Science

External person

Zeduo Yu

  • University of Illinois at Urbana-Champaign

External person

Changlim Lee

  • Yonsei University

External person

Paritosh Pratap Ajgaonkar

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

H. Park

  • Daegu Gyeongbuk Institute of Science and Technology

External person

Hee Han Tae

  • Sungkyunkwan University

External person

Joon Kyung Kim

  • University of California at San Diego

External person

S. Pant

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Siva Narendra

  • Tyfone, Inc.

External person

Zehra Sura

  • IBM
  • University of Illinois Urbana-Champaign
  • IBM Research
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Heon Young Yeom

  • Seoul National University

External person

Brahmendra Reddy Yatham

  • University of California at San Diego

External person

Gábor Dózsa

  • IBM
  • ARM Ltd.

External person

Emmett Witchel

  • University of Texas at Austin

External person

Zhifeng Lin

  • University of Southern California

External person

Bruno Mesnet

  • IBM Systems
  • IBM

External person

Hanjoon Kim

  • Furiosa A.I.

External person

Michael Brzozowski

  • Alternative Computing Technologies (ACT) Lab
  • Georgia Institute of Technology

External person

Yoonsung Kim

  • Korea Advanced Institute of Science and Technology
  • University of California at San Diego

External person

Kai Hwang

  • University of Southern California
  • Department of Electrical Engineering, University of Southern California
  • University of Southern California
  • The Chinese University of Hong Kong, Shenzhen
  • Department of Electrical Engineering, University of Southern California

External person

Jakub Tarnawski

  • Microsoft USA

External person

Minjae Lee

  • Hanyang University

External person

Moonsub Kim

  • Seoul National University

External person

Ram Krishna

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hwanju Kim

  • University of Cambridge

External person

Jaewook Lee

  • University of Illinois Urbana-Champaign
  • School of Architecture
  • University of Illinois at Urbana-Champaign
  • Korean Institute of Civil Engineering and Building Technology
  • Samsung

External person

Jie S. Hu

  • Pennsylvania State University

External person

Zihan Xia

  • University of California at San Diego

External person

Michael J. Anderson

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Gokul Subramanian Ravi

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Michigan, Ann Arbor

External person

J. W. Yoon

  • Daegu Gyeongbuk Institute of Science and Technology
  • Department of Information and Communication Engineering

External person

Asit Mishra

  • Qualcomm Incorporated
  • Intel

External person

Qirong Xia

  • University of Illinois at Urbana-Champaign

External person

Seokjoo Cho

  • Chung-Ang University

External person

Tanay Kamik

  • Intel
  • Circuit Res. Lab.

External person

Cheng Wan

  • Rice University

External person

Mary Jane Irwin

  • Pennsylvania State University
  • Dept. of Comp. Sci. and Engineering

External person

Hyuck Han

  • Dongduk Women's University

External person

Wonil Choi

  • Computer Architecture and Memory Systems Lab
  • Pennsylvania State University
  • Yonsei University
  • Computer Architecture and Memory Systems Lab

External person

Ketan Date

  • SUNY Buffalo
  • University of Illinois Urbana-Champaign
  • Department of Industrial and Systems Engineering
  • Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign
  • Center for Multisource Information Fusion (CMIF)
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

H. S. Park

  • Hanyang University

External person

Steve Martin

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Sangjin Lee

  • Chung-Ang University

External person

Gaohan Ye

  • University of Illinois at Urbana-Champaign

External person

T. Park

  • Kongju National University

External person

Sankaralingam Panneerselvam

  • Facebook Inc
  • Meta
  • Department of Biological Sciences and Computer Sciences
  • Department of Computer Sciences

External person

Keven Feng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Ardavan Pedram

  • University of Texas at Austin
  • Department of Electrical, and Computer Engineering

External person

Danbee Park

  • Seoul National University
  • School of Electrical Engineering and Computer Science

External person

Minyong Yoon

  • Hanyang University

External person

Richard Brown

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory
  • University of Michigan, Ann Arbor

External person

C. Ziesler

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Cameron R. Wolfe

  • Rice University

External person

Tor M. Aamodt

  • University of British Columbia

External person

Seomun Jun

  • Korea Advanced Institute of Science and Technology

External person

Vivek De Vivek

  • Intel
  • Circuit Res. Lab.

External person

Jaeyoung Choi

  • Seoul National University

External person

Michael Resch

  • University of Minnesota
  • University of Minnesota Twin Cities

External person

Byeongho Kim

  • Seoul National University

External person

Jacob T. Adriaens

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Anastasios Kyrillidis

  • University of Texas at Austin
  • Department of Electrical, and Computer Engineering
  • Rice University
  • Rice University

External person

Sungmin Lim

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ahmed ElTantawy

  • University of British Columbia

External person

Srujan Penta

  • Georgia Institute of Technology

External person

Sujan K. Gonugondla

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Amazon.com, Inc.
  • University of Illinois at Urbana-Champaign
  • NVIDIA
  • Amazon
  • University of Illinois at Urbana-Champaign

External person

S. Karen Khatamifard

  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Krishna Narra

  • University of Southern California
  • University of Southern California

External person

Dimitrios Skarlatos

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Toan Pham

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Neel Patel

  • University of Kansas

External person

Lokesh Jindal

  • University of Wisconsin-Madison

External person

Jae Young Jang

  • College of Information and Communication Engineering
  • Sungkyunkwan University

External person

Jieun Lee

  • Seoul National University

External person

Sang H. Son

  • University of Virginia
  • University of Pittsburgh
  • Daegu Gyeongbuk Institute of Science and Technology
  • Department of Computer Science
  • Department of Computer Science
  • Real-Time Cyber-Physical System Laboratory

External person

Sharmila Shridhar

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

Bhushan Chitlur

  • Intel Altera

External person

Radu Teodorescu

  • Siebel Center for Computer Science
  • University of Illinois Urbana-Champaign
  • IEEE
  • Ohio State University
  • Dept. of Computer Science
  • Department of Computer Science, University of Illinois
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Ohio State University
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Simon Garcia De Gonzalo

  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • CS and Cordinated Science Lab
  • CS and Cordinated Science Lab
  • cs
  • Barcelona Supercomputing Center
  • University of Illinois at Urbana-Champaign
  • UIUC
  • CS and Coordinated Science Lab
  • University of Illinois at Urbana-Champaign
  • Sandia National Laboratories
  • University of Illinois Urbana-Champaign

External person

Narges Shahidi

  • Pennsylvania State University

External person

Pan Woo Ko

  • Kyungpook National University
  • Brain Science and Engineering Institute

External person

Myung Kuk Yoon

  • Ewha Womans University

External person

Jiawei Fei

  • King Abdullah University of Science and Technology
  • National University of Defense Technology

External person

Jun Seomun

  • Korea Advanced Institute of Science and Technology
  • Department of Electrical Engineering

External person

Robert Van De Geijn

  • University of Texas at Austin
  • Department of Computer Science
  • Department of Computer Science

External person

H. Franke

  • IBM
  • University of Illinois Urbana-Champaign
  • IBM Research
  • UIUC
  • University of Illinois at Urbana-Champaign
  • IBM

External person

Michael Mishkin

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

Doug Burger

  • Yale University
  • University of Wisconsin-Madison
  • Microsoft USA
  • Department of Microsoft
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • Microsoft Research Asia

External person

Krishna Parasuram Srinivasan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sanghyun Han

  • Korea Advanced Institute of Science and Technology

External person

Lloyd Bircher

  • Advanced Micro Devices

External person

Yanpei Liu

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

Hyungmin Kim

  • Hanyang University

External person

Carl Pearson

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Qian Zhang

  • Chinese University of Hong Kong
  • Department of Computer Science and Engineering

External person

Janghwan Lee

  • Hanyang University

External person

Ahn Choi

  • Samsung

External person

Eunbi Jeong

  • Ewha Womans University

External person

Hyoungwook Nam

  • University of Illinois at Urbana-Champaign

External person

Sunggon Kim

  • Seoul National University

External person

Edward Richter

  • University of Illinois at Urbana-Champaign

External person

Seokwoo Lee

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Pekon Gupta

  • Intel Altera

External person

Yang Zhou

  • University of Illinois at Urbana-Champaign

External person

Hyojun Son

  • Korea Advanced Institute of Science and Technology

External person

Vijaykrishnan Narayanan

  • Pennsylvania State University
  • Dept. of Comp. Sci. and Engineering

External person

Choi Ken

  • Illinois Institute of Technology

External person

Raghavendra Pradyumna Pothukuchi

  • University of Illinois Urbana-Champaign
  • Advanced Micro Devices
  • University of Illinois at Urbana-Champaign
  • Yale University
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

J. Shalf

  • Max Planck Institute for Gravitational Physics (Albert Einstein Institute)
  • Lawrence Berkeley National Laboratory
  • Albert-Einstein-Inst
  • University of Tennessee, Knoxville
  • University of Illinois Urbana-Champaign
  • The University of Chicago
  • Argonne National Laboratory
  • Washington University St. Louis
  • University of Illinois at Urbana-Champaign
  • The University of Chicago
  • Argonne National Laboratory

External person

R. Rao

  • University of Michigan, Ann Arbor

External person

Krishna Bharath

  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Jun Won Choi

  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign
  • Hanyang University
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dong Ping Zhang

  • AMD Research

External person

Marco Canini

  • King Abdullah University of Science and Technology

External person

Kiet Tuan Pham

  • Chung-Ang University

External person

Jihong Kim

  • Seoul National University

External person

Heesung Lim

  • Daegu Gyeongbuk Institute of Science and Technology

External person

Alexandros Daglis

  • Georgia Institute of Technology
  • Swiss Federal Institute of Technology Lausanne
  • Georgia Institute of Technology

External person

Hadi Asgharimoghaddam

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gunjae Koo

  • University of Southern California
  • University of Southern California

External person

Sang Jun Moon

  • Daegu Gyeongbuk Institute of Science and Technology
  • Cybernetics Laboratory

External person

Seong Jin Jang

  • Samsung
  • National Institutes of Health
  • Mayo Clinic Rochester, MN

External person

Minyi Guo

  • Shanghai Jiao Tong University
  • Shanghai Key Laboratory of Scalable Computing and Systems

External person

Myoungjun Chun

  • Seoul National University

External person

Edwin Mascarenhas

  • University of California at San Diego

External person

Zheng Qu

  • Tsinghua University
  • The University of Hong Kong

External person

Henry Duwe

  • University of Illiinois
  • University of Illinois Urbana-Champaign
  • Iowa State University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Iowa State University
  • University of Illinois at Urbana-Champaign

External person

Chi Chao Wang

  • Arizona State University
  • Arizona State University

External person

Ashita Victor

  • Georgia Institute of Technology

External person

Nuwan Jayasena

  • AMD Research

External person

S. Seongil

  • Seoul National University

External person

Eiman Ebrahimi

  • NVIDIA
  • NVIDIA Austin

External person

Jin Kim

  • Samsung

External person

Vignyan Reddy

  • University of Wisconsin-Madison

External person

Shibin Qin

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Apple
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Liu Ke

  • Washington University St. Louis
  • Meta

External person