Network

Placid Mathew Ferreira

Person: Academic

Elif Ertekin

Person: Academic

Nuri Oh

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Hanyang University
  • Division of Materials Science and Engineering
  • Division of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Philippe Guyot-Sionnest

  • The University of Chicago
  • Department of Physics, University of Chicago
  • Department of Chemistry
  • The James Franck Institute
  • Departments of Physics and Chemistry
  • Department of Chemistry, University of Chicago
  • James Franck Institute
  • The University of Chicago

External person

Anshu Gaur

  • Department of Materials Science and Engineering
  • Beckman Institute
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Taner Ozel

  • National Institutes of Health
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • Laboratory of Chemical Physics
  • Seitz Materials Research Laboratory
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • National Institutes of Health
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yiran Jiang

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

You Zhai

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ju Hee Back

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Logan P. Keating

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Joseph C. Flanagan

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Congjun Wang

  • The University of Chicago
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • The James Franck Institute
  • Parsons Corporation
  • National Energy Technology Laboratory
  • University of Illinois at Urbana-Champaign
  • The University of Chicago
  • University of Illinois at Urbana-Champaign

External person

Sunkook Kim

  • Purdue University
  • School of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering

External person

Coskun Kocabas

  • Harvard University
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • Department of Chemistry and Chemical Biology
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Harvard University
  • University of Illinois at Urbana-Champaign

External person

Daner Abdula

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Beckman Inst. and Dept. of Elec.
  • Department of Physics
  • Department of Materials Science and Engineering
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hunter McDaniel

  • Los Alamos National Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Chemistry Division
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • 134 Eastgate Drive

External person

Steven P. Rogers

  • RWTH Aachen University
  • Institute of Materials in Electrical Engineering and Information Technology II
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Saeed Mohammadi

  • Purdue University
  • School of Electrical and Computer Engineering
  • Birck Nanotechnology Center

External person

Conan Huang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Cheng Lin Tsai

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gryphon A. Drake

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Peter Trefonas

  • Dow Electronic Materials Company
  • Dow Electronic Materials
  • Dow Electronic Materials
  • DuPont Electronics and Imaging
  • DuPont

External person

Hongjie Dai

  • Stanford University
  • Department of Chemistry
  • Department of Chemistry, Stanford University
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • Stanford University

External person

Kwan Wook Kwon

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Khoi T. Nguyen

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Seong Yong Cho

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Myongji University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hohyun Keum

  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Korea Institute of Industrial Technology

External person

Lane W. Martin

  • Department of Materials Science and Engineering
  • Department of Materials Science
  • University of California, Berkeley
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • Lawrence Berkeley National Laboratory
  • Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • International Institute for Carbon Neutral Research
  • University of California Office of the President
  • Department of Materials Science and Engineering, University of California
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Materials Research Laboratory
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Mat. Sci. and Engineering Department
  • Kyushu University
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign

External person

Seung Hyun Hur

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Center for Advanced Functional Polymers
  • Korea Advanced Institute of Science and Technology
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Matthew A. Meitl

  • Semprius, Inc.
  • University of Illinois Urbana-Champaign
  • X-Celeprint Ireland
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ajit Vikram

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

Sooji Nam

  • University of Illinois Urbana-Champaign
  • Electronics and Telecommunications Research Institute
  • Dept. of Mat. Sci. and Engineering
  • Information Control Device Research Section
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kishori Deshpande

  • Dow Chemical
  • The Dow Chemical Company 230 Abner Jackson Pkwy/H.H.Dow/2A185 Lake Jackson

External person

Kwangu Kang

  • Yonsei University
  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • School of Mechanical Engineering
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • School of Mechanical Engineering
  • Department of Physics
  • Dept. of Mat. Sci. and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jun Kyu Park

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bong Hoon Kim

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Korea Advanced Institute of Science and Technology
  • Department of Materials Science and Engineering, KAIST
  • Department of Chemical and Biomolecular Engineering
  • Northwestern University
  • Center for Bio-Integrated Electronics
  • Simpson Querrey Institute
  • Seitz Materials Research Laboratory
  • Department of Organic Materials and Fiber Engineering
  • Soongsil University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Daegu Gyeongbuk Institute of Science and Technology

External person

Christoph Baeumer

  • University of Illinois Urbana-Champaign
  • Jülich Research Centre
  • Peter Gruenberg Institute 9
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Giles P. Siddons

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Serdar Onses

  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering, Erciyes University
  • Erciyes University
  • Erciyes University
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Bilkent University
  • University of Illinois at Urbana-Champaign

External person

K. Peter C Vollhardt

  • Chemical Sciences Division
  • Lawrence Berkeley Natl. Laboratory
  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • Department of Chemistry
  • Chemical Sciences Division
  • Department of Chemistry
  • University of California at Berkeley

External person

Sangheon Lee

  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University

External person

Adam J. Matzger

  • Chemical Sciences Division
  • Lawrence Berkeley Natl. Laboratory
  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • Department of Chemistry
  • Chemical Sciences Division
  • Department of Chemistry
  • University of California at Berkeley

External person

Yugang Sun

  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign
  • Argonne National L...oratory
  • University of Illinois at Urbana-Champaign

External person

Ilker Torun

  • Erciyes University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mustafa Kalay

  • Erciyes University
  • Kayseri University

External person

Sooji Nam

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David B. Janes

  • School of Electrical and Computer Engineering
  • Purdue University
  • School of Electrical and Computer Engineering

External person

Yi Xuan

  • Purdue University
  • Birck Nanotechnology Center
  • School of Electrical and Computer Engineering

External person

Seong Jun Kang

  • Korea Research Institute of Standards and Science
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Division of Advanced Technology
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ruijuan Xu

  • University of Illinois Urbana-Champaign
  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering, University of California
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign

External person

Ming Gang Xia

  • Xian Jiaotong University
  • Xi'an Jiaotong University
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jungyup Lee

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical and Biomolecular Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Sibel Inc.
  • NeuroLux Corporation
  • University of Illinois at Urbana-Champaign

External person

Ali Javey

  • Stanford University
  • University of California, Berkeley
  • Harvard University
  • Department of Chemistry and Chemical Biology
  • Harvard University Society of Fellows
  • Dept. of Elec. Eng. and Comp. Sci.
  • Department of Chemistry
  • Department of Chemistry
  • Stanford University
  • Harvard University
  • University of California at Berkeley
  • Lawrence Berkeley National Laboratory

External person

Arwa Zahid

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Eric Pop

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Department of Electrical and Computer Engineering
  • Electrical Engineering, Stanford University
  • Intel
  • Bldg 500
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Department of Mechanical Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Precourt Institute for Energy
  • Dept. of Electrical
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Peide D. Ye

  • Purdue University
  • Birck Nanotechnology Center
  • School of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering

External person

Yiming Li

  • Stanford University
  • Department of Chemistry, Stanford University
  • Department of Chemistry
  • Stanford University
  • Tsinghua University

External person

Byungwoo Park

  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University

External person

Jake Joo

  • Dow Electronic Materials Company
  • Dow Electronic Materials
  • Dow Electronic Materials

External person

Bo Hyun Lee

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Youn Kyoung Cho

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Christoph Schmitz

  • Jülich Research Centre

External person

Nadine Wong Shi Kam

  • Stanford University
  • Department of Chemistry, Stanford University
  • Department of Chemistry
  • Stanford University

External person

Woong Kim

  • Stanford University
  • Department of Chemistry
  • Department of Chemistry, Stanford University
  • Stanford University
  • Korea University

External person

Saket S. Bhargava

  • Kyushu University
  • University of Illinois Urbana-Champaign
  • International Institute for Carbon Neutral Energy Research
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ankur Khare

  • DuPont Electronics and Imaging
  • DuPont

External person

Jieqian Zhang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Slavomir Nemsak

  • Jülich Research Centre
  • Peter Gruenberg Institute 9
  • United States Department of Energy

External person

Jae Kyeong Jeong

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ki Jun Yu

  • Dept. of Mat. Sci. and Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Yonsei University
  • School of Electrical and Electronic Engineering, Yonsei University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

N. Burak Kiremitler

  • Erciyes University

External person

Yunpei Duan

  • University of Illinois at Urbana-Champaign

External person

Jieqian Zhang

  • Dow Electronic Materials

External person

Rainer Waser

  • RWTH Aachen University
  • Jülich Research Centre
  • Institute of Materials in Electrical Engineering and Information Technology II
  • Peter Gruenberg Institute 9
  • Institute for Electronic Materials

External person

Sarunya Bangsaruntip

  • Stanford University
  • Department of Chemistry, Stanford University
  • Department of Chemistry
  • Stanford University

External person

Anne Shim

  • Dow Chemical
  • Cabot Corporation

External person

Nicolas Raab

  • Jülich Research Centre
  • Peter Gruenberg Institute 9

External person

Yongjoon Yu

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical and Biomolecular Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Northwestern University
  • Inc
  • Neurolux Inc
  • NeuroLux Corporation
  • University of Illinois at Urbana-Champaign

External person

Slava V. Rotkin

  • Lehigh University
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Center for Advanced Materials and Nanotechnology
  • Department of Physics
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

Congjun Wang

  • The University of Chicago
  • The University of Chicago

External person

Jaewook Kim

  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University

External person

Jong Bin Lim

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Laleh Rabieirad

  • Purdue University
  • School of Electrical and Computer Engineering

External person

Sanghyun Ju

  • Kyonggi University
  • Purdue University
  • Department of Physics

External person

Frank Scherhag

  • Chemical Sciences Division
  • Lawrence Berkeley Natl. Laboratory
  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • Department of Chemistry
  • Chemical Sciences Division
  • Department of Chemistry
  • University of California at Berkeley

External person

Robert J. Chen

  • Department of Chemistry, Stanford University
  • Stanford University
  • Department of Chemistry
  • Stanford University

External person

Claus Michael Schneider

  • Jülich Research Centre
  • Peter Gruenberg Institute 9

External person

David Merchin

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Vivek Kumar

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

Ninad Pimparkar

  • Purdue University
  • School of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering

External person

Byungho Lee

  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University

External person

Hyunho Lee

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Christian Eickmeier

  • Lawrence Berkeley National Laboratory
  • Department of Chemistry
  • Chemical Sciences Division
  • University of California, Berkeley
  • Department of Chemistry
  • University of California at Berkeley

External person

Shishir Pandya

  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • Department of Materials Science and Engineering, University of California
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • University of California at Berkeley

External person

Richard Valenta

  • Jülich Research Centre
  • Peter Gruenberg Institute 9

External person

Stephan Menzel

  • Jülich Research Centre
  • Peter Gruenberg Institute 9

External person

Feng Xiong

  • University of Illinois Urbana-Champaign
  • Stanford University
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign

External person

Andre Sutrisno

  • School of Chemical Sciences
  • University of Illinois Urbana-Champaign
  • NMR/EPR Laboratory
  • NMR/EPR Laboratory
  • NMR/EPR Laboratory
  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences

External person

Regina Dittmann

  • Jülich Research Centre
  • Peter Gruenberg Institute 9

External person

Jae Hwan Kim

  • University of Illinois Urbana-Champaign
  • Northwestern University
  • University of Illinois at Urbana-Champaign
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Bong Hoon Kim

  • Dept. of Mat. Sci. and Engineering
  • Korea Advanced Institute of Science and Technology (KAIST)
  • Korea Advanced Institute of Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Chemical and Biomolecular Engineering

External person

Zheng Tao Zhu

  • South Dakota School of Mines and Technology
  • South Dakota School of Mines & Technology
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. A. Alam

  • Purdue University
  • University of Illinois at Urbana-Champaign
  • Bangladesh Rice Research Institute
  • Bangladesh Agricultural University

External person

Maxime G. Lemaitre

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chi Hwan Lee

  • Purdue University
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • School of Mechanical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Mechanical Engineering, Stanford University
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign

External person

Heiko Junga

  • Chemical Sciences Division
  • Lawrence Berkeley Natl. Laboratory
  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • Department of Chemistry
  • Chemical Sciences Division
  • Department of Chemistry
  • University of California at Berkeley

External person

Hee Cheul Choi

  • Stanford University
  • Department of Chemistry, Stanford University
  • Stanford University

External person

T. J. Marks

  • Northwestern University
  • Tsinghua University
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • Center for Quantum Devices
  • Department of Chemistry
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Chemistry
  • University of Tübingen
  • Institute of Organic Chemistry
  • Department of Chemistry, Department of Electrical Engineering and Computer Science, Materials Research Center
  • Department of Chemistry
  • National Institute of Standards and Technology
  • Argonne-Northwestern Solar Energy Research Center

External person

Juejun Hu

  • Massachusetts Institute of Technology

External person

Andrea Locatelli

  • Sincrotrone Trieste

External person

J. C. Koepke

  • University of Illinois Urbana-Champaign
  • Sandia National Laboratories
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sergei Shenogin

  • Rensselaer Polytechnic Institute
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Nadine Wong Shi Kam

  • Stanford University

External person

Sangmin Shim

  • Yonsei University Mirae Campus

External person

Naheed Ferdous

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Joel K.W. Yang

  • Singapore University of Technology and Design
  • Agency for Science, Technology and Research, Singapore

External person

Yusuf Kelestemur

  • Middle East Technical University

External person

Irina V. Martynenko

  • Skolkovo Insitute of Science and Technology
  • Ludwig Maximilian University of Munich

External person

Jaeho Shin

  • Northwestern University
  • University of Illinois at Urbana-Champaign

External person

Tae Young Choi

  • Real-Time Computing Laboratory
  • University of Michigan, Ann Arbor

External person

Hee Nam Lee

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Henry Hinnefeld

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics and the Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alan Jiwan Yun

  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University

External person

Nikolay S. Makarov

  • 134 Eastgate Drive

External person

Yuya Murata

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Youngsun Jeon

  • Pohang University of Science and Technology

External person

Tevfik Onur Menteş

  • Sincrotrone Trieste

External person

Michael S. Strano

  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Chemical Engineering, Massachusetts Institute of Technology
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemical Engineering
  • Seitz Materials Research Laboratory
  • Department of Chemical Engineering
  • University of Illinois at Urbana-Champaign

External person

Peer Fischer

  • Korea Basic Science Institute
  • Max Planck Institute for Medical Research
  • Heidelberg University 
  • Yonsei University

External person

Tae Sik Yoon

  • Department of Materials Science and Engineering
  • Myongji University

External person

Eric Hwang

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Lolita Rotkina

  • Lehigh University
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • Center for Advanced Materials and Nanotechnology
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Katerina A. Drouvalakis

  • Stanford University
  • School of Medicine
  • Stanford University

External person

Yi Lun Hong

  • CAS - Institute of Metal Research
  • University of Science and Technology of China
  • School of Materials Science and Engineering
  • University of Science and Technology of China

External person

Kristopher D. Matthews

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shiliang Tian

  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Department of Chemistry, University of Illinois at Urbana-Champaign
  • Department of Chemistry, University of Illinois at Urbana-Champaign
  • Department of Chemistry, University of Illinois at Urbana-Champaign
  • Departments of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Urbana

External person

Alessandro Sala

  • Sincrotrone Trieste
  • University of Milan
  • National Institute for Nuclear Physics

External person

Changhee Lee

  • Seoul National University

External person

Jiwon Yoon

  • Korea Advanced Institute of Science and Technology

External person

Daniel Holmes

  • University of California at Berkeley

External person

Ji Hwan Kwon

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Korea Research Institute of Standards and Science
  • Division of Industrial Metrology
  • Center for Correlated Electron Systems
  • Institute for Basic Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yeon Sik Jung

  • Korea Advanced Institute of Science and Technology

External person

Zuhuang Chen

  • University of California, Berkeley
  • University of California Office of the President
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering, University of California
  • University of California at Berkeley

External person

Ken Brudnak

  • University of Illinois at Urbana-Champaign

External person

Hilmi Volkan Demir

  • Nanyang Technological University
  • Bilkent University

External person

Pablo Cencillo-Abad

  • University of Central Florida

External person

A. B. Shah

  • Engineering University of Illinois
  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Depts. of Mat. Sci. and Eng.
  • Center for Microanalysis of Materials
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Center for Microanalysis of Materials
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tobias A F König

  • Leibniz Institute of Polymer Research Dresden
  • Technische Universität Dresden

External person

Astrid Marchewka

  • RWTH Aachen University
  • Institute of Materials in Electrical Engineering and Information Technology II

External person

Abidin Esidir

  • Erciyes University

External person

Hyunjung Kang

  • Pohang University of Science and Technology

External person

Hui Ming Cheng

  • CAS - Institute of Metal Research

External person

Jae Ho Shin

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

External person

Ki Ju Kim

  • Seoul National University

External person

Mahsa Haddadi Moghaddam

  • Ulsan National Institute of Science and Technology

External person

Kin Hung Fung

  • University of Illinois Urbana-Champaign
  • Massachusetts Institute of Technology
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • University of Illinois at Urbana-Champaign

External person

Rahmi Ozisik

  • Rensselaer Polytechnic Institute
  • Department of Materials Science and Engineering

External person

Tim Liedl

  • Ludwig Maximilian University of Munich

External person

Muttanagoud N. Kalasad

  • University of Illinois at Urbana-Champaign

External person

Yuqiang Ma

  • University of Southern California
  • Department of Physics and Astronomy
  • University of Southern California

External person

Xiaoyu Qi

  • CSIC - Institute of Materials Science of Barcelona

External person

N. Jin

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • IEEE

External person

Pawel Keblinski

  • Rensselaer Polytechnic Institute
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Monica L. Usrey

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Dong Kyo Oh

  • Pohang University of Science and Technology

External person

Ahmet Faruk Yazici

  • Abdullah Gul University

External person

Hwang Sik Yun

  • Department of Materials Science and Engineering
  • Myongji University

External person

Jong Hyeok Jeon

  • Purdue University

External person

Hossein Alijani

  • University of Technology Sydney

External person

Wenyong Liu

  • The University of Chicago
  • Department of Chemistry, University of Chicago
  • Department of Chemistry
  • The University of Chicago

External person

John Mark P Martirez

  • University of Pennsylvania
  • Department of Chemistry

External person

Shuqi Lai

  • University of Illinois at Urbana-Champaign

External person

Mark E. Thompson

  • University of Oxford
  • University of Illinois Urbana-Champaign
  • University of Southern California
  • Department of Chemistry
  • School of Chemical Sciences, University of Illinois at Urbana Champaign
  • Department of Chemistry
  • Inorganic Chemistry Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Southern California

External person

E. Breckenfeld

  • Materials Science and Technology Division, Code 6364, Naval Research Laboratory
  • Naval Research Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. V K Mangalam

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ryeong Myeong Kim

  • Seoul National University

External person

Hyeon Ho Jeong

  • Gwangju Institute of Science and Technology

External person

Andrew M. Rappe

  • University of Pennsylvania
  • Department of Chemistry

External person

Jung Woo Lee

  • Hanyang University
  • WCU Department of Energy Engineering, Hanyang University
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering, Hanyang University
  • Department of Energy Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • Pusan National University
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • School of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kyeongchan Noh

  • Department of Materials Science and Engineering
  • Myongji University

External person

Stefan A. Maier

  • Ludwig Maximilian University of Munich
  • Imperial College London
  • Monash University

External person

Utkarsh Ramesh

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

David J. Norris

  • NEC Research Institute
  • NEC Laboratories America, Inc.

External person

Junhwa Seong

  • Pohang University of Science and Technology

External person

Albert Liao

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Paul W. Barone

  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

Joonhyeon Kang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Margaret Hines

  • Revlon Research Center
  • The University of Chicago
  • The James Franck Institute
  • The University of Chicago

External person

Trevor Ewers

  • Lawrence Berkeley National Laboratory
  • University of California, Berkeley
  • Dow Chemical
  • Department of Chemistry
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • University of California at Berkeley

External person

Byung Hwa Seo

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dunwei Wang

  • Stanford University
  • Department of Chemistry, Stanford University
  • Stanford University

External person

Dohyun Kang

  • Pohang University of Science and Technology

External person

Christian Rossner

  • Leibniz Institute of Polymer Research Dresden
  • Technische Universität Dresden
  • University of Chemistry and Technology, Prague

External person

Kyung Jin Seo

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tae Hyeon Lim

  • Department of Materials Science and Engineering
  • Myongji University

External person

Minsu Kim

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University

External person

Shin Hyun Kim

  • Yonsei University Mirae Campus

External person

Jwa Min Nam

  • Northwestern University
  • Department of Chemistry and Institute for Nanotechnology
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • Seoul National University

External person

Qingzhou Liu

  • University of Southern California
  • Department of Chemical Engineering and Materials Science
  • University of Southern California

External person

Young Gwang Kim

  • Department of Materials Science and Engineering
  • Myongji University

External person

Yihang Liu

  • University of Southern California
  • Department of Electrical Engineering, University of Southern California
  • University of Southern California

External person

Liping Xue

  • Rensselaer Polytechnic Institute
  • Department of Materials Science and Engineering

External person

Karthik Balakrishnan

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

Harald Giessen

  • University of Stuttgart
  • 4th Physics Institute and Research Center SCOPE, University of Stuttgart
  • 4. Physikalisches Institut
  • Physics Institute
  • 4. Physics Institute and Research Center SCoPE

External person

Hyukjin Jang

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Diomedes Saldana-Greco

  • University of Pennsylvania
  • Department of Chemistry

External person

Chad A. Mirkin

  • Northwestern University

External person

Eunji Lee

  • Pohang University of Science and Technology

External person

Ki Tae Nam

  • Seoul National University

External person

Hanhwi Jang

  • Korea Advanced Institute of Science and Technology

External person

Héctor A. Fustér

  • University of Illinois at Urbana-Champaign

External person

Mario Hentschel

  • University of Stuttgart
  • 4th Physics Institute and Research Center SCOPE, University of Stuttgart

External person

Jaeyoung Jang

  • The University of Chicago
  • Department of Chemistry, University of Chicago
  • Department of Chemistry
  • The University of Chicago

External person

Haoran Ren

  • Monash University

External person

Jinhyun Kim

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hao Chen

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Junsuk Rho

  • Research Institute of Industrial Science & Technology, Pohang
  • Pohang University of Science and Technology

External person

Anyi Zhang

  • University of Southern California
  • Department of Chemical Engineering and Materials Science
  • University of Southern California

External person

A. Germeau

  • Utrecht University

External person

Inki Kim

  • Sungkyunkwan University

External person

Rebecca D. McAuliffe

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Na Rae Kim

  • Korea Advanced Institute of Science and Technology
  • Inha University
  • Department of Polymer Science and Engineering
  • Department of Materials Science and Engineering, KAIST

External person

Andreas Fery

  • Leibniz Institute of Polymer Research Dresden
  • Technische Universität Dresden

External person

W. J. Huang

  • University of Illinois Urbana-Champaign
  • Carl Zeiss SMT AG
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yeongho Choi

  • Department of Chemical Engineering and Department of Energy System Research
  • Ajou University

External person

Seung Kyun Kang

  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Korea Advanced Institute of Science and Technology
  • Seitz Materials Research Laboratory
  • Department of Chemical and Biomolecular Engineering
  • Department of Bio and Brain Engineering, Korea Advanced Institute of Science and Technology
  • Seoul National University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hoon Sik Kim

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Philip Edward Heil

  • Materials Science and Engineering Department
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Nam Heon Kim

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhaogang Dong

  • Agency for Science, Technology and Research, Singapore
  • Singapore University of Technology and Design
  • National University of Singapore

External person

Hyounghan Kwon

  • University of Science and Technology UST
  • Korea Institute of Science and Technology

External person

Agustín Mihi

  • University of Illinois Urbana-Champaign
  • Institute of Photonic Sciences
  • University of Illinois at Urbana-Champaign
  • ICFO - Institute of Photonic Sciences
  • University of Illinois at Urbana-Champaign
  • CSIC - Institute of Materials Science of Barcelona

External person

Jaekyung Kim

  • Pohang University of Science and Technology

External person

Keonwon Beom

  • Department of Materials Science and Engineering
  • Myongji University

External person

Wooik Jung

  • Hanbat National University

External person

Qian Wang

  • Stanford University
  • Stanford University

External person

D. Vanmaekelbergh

  • Utrecht University

External person

Cesar E. Chialvo

  • University of Illinois Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chongwu Zhou

  • University of Southern California
  • Department of Electrical Engineering, University of Southern California
  • Department of Chemical Engineering and Materials Science
  • University of Southern California

External person

Thomas W. Tombler

  • Stanford University
  • Department of Chemistry
  • Stanford University

External person

S. Lee

  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign

External person

Gyeongtae Kim

  • Pohang University of Science and Technology

External person

Richard T. Haasch

  • Frederick Seitz Mat. Research Lab.
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Center for Microanalysis of Materials
  • Department of Mechanical Science and Engineering, University of Illinois
  • Materials Research Laboratory
  • Center for Microanalysis of Materials
  • Department of Chemistry
  • Department of Mechanical Science and Engineering
  • Center for Microanalysis of Materials
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yangxin Zhou

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Johanna Hackl

  • Jülich Research Centre
  • Peter Gruenberg Institute 9

External person

Koray Aydin

  • Northwestern University

External person

Nara Jeon

  • Pohang University of Science and Technology

External person

Evren Mutlugun

  • Abdullah Gul University
  • Bilkent University

External person

Zhelong Jiang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. S. Kim

  • Seoul National University
  • University of Colorado Boulder
  • School of Physics
  • Department of Physics
  • National Institute of Standards and Technology
  • University of Colorado
  • Ulsan National Institute of Science and Technology

External person

Saeed Mohammad

  • Purdue University
  • School of Electrical and Computer Engineering

External person

Sergej V. Shilov

  • Syracuse University

External person

Yuna Kwak

  • Seoul National University

External person

M. Imtiaz Khan

  • RWTH Aachen University

External person

Yujin Park

  • Pohang University of Science and Technology

External person

Nicholas Fang

  • Massachusetts Institute of Technology
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Mechanical Engineering Department
  • Hatsopoulos Microfluids Laboratory
  • Department of Mechanical Scienceand Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Tian Gu

  • Massachusetts Institute of Technology

External person

Feng Hua

  • IEEE
  • Clarkson University

External person

Liang Chen

  • University of Southern California
  • Department of Electrical Engineering, University of Southern California
  • University of Southern California

External person

Ki Bum Kim

  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University
  • Department of Materials Science and Engineering
  • Stanford University
  • School of Materials Science and Engineering
  • Materials Science and Engineering Department
  • Sch. of Mat. Science and Engineering
  • Department of Materials Science and Engineering
  • Stanford University

External person

E. A. Meulenkamp

  • Philips Research
  • Koninklijke Philips N.V.

External person

Bin Jiang

  • The University of Hong Kong
  • University of Illinois Urbana-Champaign
  • Virtual Laboratory of Urban Environments and Human Health
  • Division of Landscape Architecture
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Arizona State University

External person

Taehyun Hwang

  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University

External person

Jarrett A. Moyer

  • Department of Physics
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Younghwan Yang

  • Pohang University of Science and Technology

External person

Tae Il Kim

  • University of Illinois Urbana-Champaign
  • Sungkyunkwan University
  • Institute for Basic Science
  • Dept. of Mat. Sci. and Engineering
  • School of Chemical Engineering, Sungkyunkwan University (SKKU)
  • Department of Materials Science and Engineering
  • IBS Center for Neuroscience Imaging Research (CNIR), Institute for Basic Science (IBS)
  • Center for Neuroscience Imaging Research (CNIR), Institute of Basic Science (IBS), Sungkyunkwan University (SKKU)
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David N. Mueller

  • Jülich Research Centre
  • Peter Gruenberg Institute 9

External person

C. Delerue

  • Département ISEN
  • ISEN Institut Superieur d'Electronique et du Numerique
  • Institut supérieur de l'électronique et du numérique

External person

Sang Hyun Lee

  • Myongji University

External person

Scott Huxtable

  • Virginia Tech
  • University of Illinois Urbana-Champaign
  • Dept. Mat. Sci. Eng. Frederick S.
  • Department of Mechanical Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Virginia Polytechnic Institute and State University
  • University of Illinois at Urbana-Champaign

External person

Dasol Lee

  • Yonsei University Mirae Campus

External person

Dmitri V. Talapin

  • Argonne National Laboratory
  • The University of Chicago
  • Department of Chemistry, University of Chicago
  • Center for Nanoscale Materials, Argonne National Laboratory, Bldg 440
  • Department of Chemistry
  • The University of Chicago
  • Argonne National Laboratory

External person

M. Pelton

  • Center for Nanoscale Materials, Argonne National Laboratory, Bldg 440
  • Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Sakulsuk Unarunotai

  • Chulalongkorn University
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Chemistry
  • Seitz Materials Research Laboratory
  • Department of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Johannes Bürger

  • Ludwig Maximilian University of Munich

External person

Hye Eun Lee

  • Seoul National University

External person

Michael Word

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Debashis Chanda

  • College of Optics and Photonics (CREOL), University of Central Florida
  • University of Central Florida
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • CREOL
  • Nanoscience Technology Center
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sang Min Won

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Northwestern University
  • Center for Bio-Integrated Electronics
  • University of Illinois at Urbana-Champaign
  • Sungkyunkwan University
  • University of Illinois at Urbana-Champaign

External person

Zhiwei Li

  • Northwestern University
  • University of Maryland, College Park

External person

Hojun Kim

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Center for Biomaterials
  • Korea Institute of Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Prashun Gorai

  • University of Illinois Urbana-Champaign
  • Colorado School of Mines
  • National Renewable Energy Laboratory
  • Dept. of Chemical and Biomolecular Engineering
  • Chem. and Biomol. Eng. Department
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineerin
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Hyun Ho Lee

  • Myongji University
  • Department of Chemical Engineering
  • University of Washington

External person

O. Ok Park

  • Korea Advanced Institute of Science and Technology
  • Korea Advanced Institute of Science and Technology
  • Center for Advanced Functional Polymers
  • Department of Chemical and Biomedical Engineering
  • Department of Chemical and Biomolecular Engineering

External person

Hojoong Jung

  • Korea Institute of Science and Technology

External person

Jaehoon Lim

  • Ajou University

External person

Feng Hua

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Clarkson University
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • IEEE
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mansoo Choi

  • Seoul National University

External person

Hyuck Mo Lee

  • Korea Advanced Institute of Science and Technology
  • Department of Materials Science and Engineering, KAIST

External person

Gwangmin Bae

  • Korea University

External person

Keng Hsu

  • University of Illinois Urbana-Champaign
  • Arizona State University
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Polytechnic School
  • Department of Mechanical Scienceand Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Polytechnic School
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chi Xu

  • University of Southern California
  • Department of Physics and Astronomy
  • University of Southern California

External person

Sen Cong

  • University of Southern California
  • Department of Electrical Engineering, University of Southern California
  • University of Southern California

External person

Zhiyun Xu

  • Massachusetts Institute of Technology

External person

Jongmin Youn

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kaushik Roy

  • Purdue University
  • Purdue University

External person

Xuan Cao

  • University of Southern California
  • Department of Chemical Engineering and Materials Science
  • University of Southern California
  • East China University of Science and Technology
  • CAS - Dalian Institute of Chemical Physics

External person

Seokwoo Jeon

  • Columbia University
  • Korea Advanced Institute of Science and Technology (KAIST)
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Korea Advanced Institute of Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Korea Advanced Institute of Science and Technology
  • Seoul National University
  • Department of Materials Science and Engineering
  • Nanoscale Science and Engineering Center
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Sch. of Mat. Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Korea University

External person

Bumjin Gil

  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University

External person

Jihae Lee

  • Pohang University of Science and Technology

External person

Xinxin Jing

  • Max Planck Institute for Solid State Research
  • University of Stuttgart

External person

A. R. Damodaran

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • University of California, Berkeley
  • University of California Office of the President
  • Department of Materials Science and Engineering, University of California
  • Materials Research Laboratory
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign

External person

Mark S. Braiman

  • Syracuse University
  • Department of Chemistry

External person

J. J. Kelly

  • Utrecht University
  • Loyola University Chicago

External person

Rui Hua Jeff Xu

  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. L. Roest

  • Utrecht University

External person

I. Petrov

  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Technique and Applications
  • International Union for Vacuum Science
  • Dept. of Mat. Sci. and Engineering
  • Linköping University
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Frank Du

  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Michael L. Odlyzko

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Luis A. Pérez

  • CSIC - Institute of Materials Science of Barcelona

External person

G. Allan

  • Département ISEN
  • ISEN Institut Superieur d'Electronique et du Numerique
  • Institut supérieur de l'électronique et du numérique

External person

Seongmin Kim

  • Purdue University

External person

Myung Han Yoon

  • Northwestern University
  • Department of Chemistry
  • Gwangju Institute of Science and Technology

External person

Inyu Jung

  • Korea Advanced Institute of Science and Technology
  • Department of Materials Science and Engineering, KAIST

External person

Joohoon Kim

  • Pohang University of Science and Technology

External person

T. Kim

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dang Du Nguyen

  • Sungkyunkwan University

External person

Scott Fong

  • University of Illinois at Urbana-Champaign

External person

Teri W. Odom

  • Nano Letters
  • Nano Letters
  • Organic Process Research and Development
  • Northwestern University

External person

Hyung Jun Song

  • Seoul National University of Science and Technology (SNUST)

External person

Haomin Chen

  • Korea University

External person

Nam Heon Kim

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

External person

Furkan Sahin

  • Erciyes University
  • Beykent University

External person

Nai Yun Shih

  • University of Southern California
  • Department of Chemical Engineering and Materials Science
  • University of Southern California

External person

Paul J. Utz

  • Stanford University
  • School of Medicine
  • Stanford University

External person

Wencai Ren

  • CAS - Institute of Metal Research

External person

Tyler Fleetham

  • University of Southern California
  • Department of Chemistry
  • University of Southern California

External person

Takuo Tanaka

  • Tokushima University
  • RIKEN

External person

Chansun Shin

  • Myongji University
  • Department of Materials Science and Engineering

External person

Nathan R. Franklin

  • Stanford University
  • Department of Chemistry
  • Stanford University

External person

Jingfeng Wang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Pilwoo Lee

  • Department of Chemical Engineering
  • Myongji University

External person

Kihyun Shin

  • Korea Advanced Institute of Science and Technology
  • Department of Materials Science and Engineering, KAIST

External person

Sang Min Park

  • Northwestern University

External person

Lise Bilhaut

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chris Matranga

  • The University of Chicago
  • The James Franck Institute
  • The University of Chicago
  • National Energy Technology Laboratory

External person

Jae Hwan Kim

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Igor Aharonovich

  • University of Technology Sydney

External person

Minju Kim

  • Myongji University
  • Department of Materials Science and Engineering

External person

Fanqi Wu

  • University of Southern California
  • Department of Chemical Engineering and Materials Science
  • University of Southern California

External person

Hyunah Kwon

  • Max Planck Institute for Medical Research
  • Heidelberg University 

External person

Gyum Hur

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

Antonio Facchetti

  • Northwestern University
  • Department of Chemistry
  • Flexterra, Inc.

External person

Dmitriy S. Dolzhnikov

  • The University of Chicago
  • Department of Chemistry, University of Chicago
  • Department of Chemistry
  • The University of Chicago

External person

Phil Geil

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Deparment of Materials Science/Eng.
  • Department of a Materials Science and Engineering, University of Illinois at Urbana- Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Na Liu

  • Rice University
  • Zhejiang University
  • Qingdao Agricultural University
  • Max Planck Institute for Solid State Research
  • University of Stuttgart

External person

Jaydeep P. Kulkarni

  • Purdue University

External person