Network

Jonathan W Coppess

Person: Academic

Waclaw Swiech

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. P. Flynn

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Materials Research Laboratory
  • Department of Physics and the Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mahesh Rajappan

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

V. Cháb

  • Czech Academy of Sciences

External person

H. Conrad

  • Fritz Haber Institute of the Max Planck Society

External person

A. M. Bradshaw

  • Fritz Haber Institute of the Max Planck Society

External person

Z. Chvoj

  • Czech Academy of Sciences

External person

P. Bajcsy

  • University of Illinois Urbana-Champaign
  • Cognex Corp.
  • Beckmml Institute
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Acumen Product Group
  • Beckman Institute for Advanced Science and Technology
  • Natl. Ctr. Supercomputing Applic.
  • Natl. Ctr. for Supercomp. Applic.
  • National Center for Super computing Applications
  • Cognex Corp.
  • Cognex Corporation
  • National Center for Supercomputing Applications (NCSA)
  • National Center for Supercomputing Application
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

R. S. Appleton

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

W. Stenzel

  • Fritz Haber Institute of the Max Planck Society

External person

M. Šnábl

  • Fritz Haber Institute of the Max Planck Society
  • Czech Academy of Sciences

External person

C. S. Durfee

  • University of Illinois at Urbana-Champaign

External person

I. Petrov

  • Linköping University
  • Dept. of Mat. Sci. and Engineering
  • Engineering University of Illinois at Urbana-Champaign
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • University of Illinois Urbana-Champaign
  • 3M Materials Laboratory
  • Department of Materials Science
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Dept. Mat. Sci. Frederick Seitz M.
  • Dept. of Mat. Sci./Engineering
  • Technique and Applications
  • International Union for Vacuum Science
  • Dept. Mat. Sci. Frederick Seitz M.
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Shannon Bradley

  • University of Illinois Urbana-Champaign
  • NCSA/UIUC
  • University of Illinois at Urbana-Champaign

External person

G. Yang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Slezák

  • Czech Academy of Sciences

External person

V. Petrova

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

William McFadden

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

W. Engel

  • Fritz Haber Institute of the Max Planck Society

External person

S. M. Bonham

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

O. Borusík

  • Fritz Haber Institute of the Max Planck Society

External person

Rishabh Gupta

  • University of Illinois Urbana-Champaign
  • Department of Agricultural and Biological Engineering
  • University of Illinois at Urbana-Champaign
  • University of Florida

External person

Jens H. Petersen

  • Nøruplundvej 2
  • Aarhus University

External person

M. Polcik

  • Fritz Haber Institute of the Max Planck Society
  • Czech Academy of Sciences

External person

P. Duczynski

  • Czech Academy of Sciences

External person

P. Jelínek

  • Czech Academy of Sciences
  • Universidad Autónoma de Madrid

External person

M. Fredricksen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. L. Zhou

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. Morkes

  • Czech Academy of Sciences

External person

Hanseok Jeong

  • University of Illinois Urbana-Champaign
  • Department of Agricultural and Biological Engineering
  • Seoul National University of Science and Technology (SNUST)
  • University of Illinois at Urbana-Champaign

External person

Diego Calderon

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alex Yahja

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. Peter Flynn

  • University of Illinois at Urbana-Champaign

External person

J. A. Eades

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chen Wang

  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Haase

  • Fritz Haber Institute of the Max Planck Society

External person

Steve Burdin

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jory Hecht

  • Tufts University
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. Jiříček

  • Czech Academy of Sciences

External person

M. Mundschau

  • University of Illinois at Urbana-Champaign

External person

I. Ulrych

  • Czech Academy of Sciences

External person

Yan Zhao

  • University of Illinois Urbana-Champaign
  • NCSA/UIUC
  • University of Illinois at Urbana-Champaign

External person

I. Lukeš

  • Czech Academy of Sciences

External person

Jason Kastner

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ernie Sammann

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person