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Network

Hongbo Zhang

  • University of Illinois Urbana-Champaign
  • Synopsys Inc.
  • Meta
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Yuelin Du

  • Synopsys Inc.
  • University of Illinois Urbana-Champaign
  • ASML Netherlands BV
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Kai Yuan Chao

  • Intel
  • IEEE
  • University of Texas at Austin
  • National Tsing Hua University
  • National Yang-Ming University
  • Department of Electrical, and Computer Engineering
  • Enterprise Microprocessor Group
  • National Yang Ming Chiao Tung University

External person

H. Xiang

  • University of Texas at Austin
  • IBM
  • Cadence Design Systems
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Computer Science, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • CS Dept.
  • Department of Computer Science
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

X. Tang

  • University of Texas at Austin
  • Cadence Design Systems
  • IBM
  • IEEE
  • Department of Computer Science
  • Department of Computer Sciences

External person

Qiang Ma

  • Synopsys Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Tan Yan

  • Synopsys Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Yao Wen Chang

  • National Yang Ming Chiao Tung University
  • Triscend Corp
  • National Taiwan University
  • University of Texas at Austin
  • Waseda University
  • Synopsys Inc.
  • Graduate Institute of Electronics Engineering
  • Graduate Institute of Electro-Optical Engineering
  • Department of Computer and Information Science
  • Department of Computer and Information Science
  • Department of Computer Science
  • Graduate Institute of Electronics Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Physics Department
  • Middle East Technical University
  • Department of Physics
  • CERN
  • Vinca Institute of Nuclear Sciences
  • Cukurova University
  • University of Zurich
  • Izmir Institute of Technology
  • Chulalongkorn University
  • Boston University
  • National Central University
  • Department of Electrical Engineering
  • Waseda University

External person

Liang Deng

  • Broadcom Corporation
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign

External person

Chun Xun Lin

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • UIUC
  • University of Illinois at Urbana-Champaign
  • UIUC

External person

Evangeline F Y Young

  • Chinese University of Hong Kong
  • Department of Computer Science and Engineering
  • University of Texas at Austin

External person

Zigang Xiao

  • Synopsys Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

I. Min Liu

  • University of Texas at Austin
  • Atoptech, Inc.
  • Synopsys Inc.
  • Cadence Design Systems
  • Silicon Perspective Corporation
  • Advanced Technology Group
  • Department of Electrical, and Computer Engineering
  • Inc.

External person

Youxin Gao

  • Synopsys Inc.
  • Avant CorDoration
  • University of Texas at Austin
  • Department of Computer Sciences
  • Department of Computer Science

External person

Chris C N Chu

  • University of Texas at Austin
  • Iowa State University
  • Department of Computer Science
  • Department of Computer Sciences
  • Iowa State University

External person

Muhammet Mustafa Ozdal

  • Intel
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Design and Technology Solutions Department
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Strategic CAD Laboratories
  • University of Illinois at Urbana-Champaign

External person

R. Tian

  • University of Texas at Austin
  • Motorola
  • Freescale Semiconductor
  • Department of Computer Science
  • Department of Computer Sciences
  • Department of Computer Sciences

External person

Li Da Huang

  • National Yang Ming Chiao Tung University
  • Texas Instruments
  • University of Texas at Austin
  • Magma Corp.
  • Department of Electronic Engineering
  • Department of Computer Sciences
  • Department of Computer Science
  • Rice University

External person

Kai Zhu

  • University of Texas at Austin
  • Triscend Corp
  • Alcatel-Lucent
  • Actel Corp
  • Sun Yat-Sen University
  • University of Science and Technology of China
  • Lucent
  • Nokia

External person

Haitong Tian

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Hai Zhou

  • University of Texas at Austin
  • Synopsys Inc.
  • Advanced Technology Group
  • Department of Computer Science

External person

Guannan Guo

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • UIUC
  • University of Illinois at Urbana-Champaign
  • UIUC

External person

Wai K. Mak

  • University of Texas at Austin
  • University of South Florida
  • The University of Hong Kong
  • Department of Computer Science
  • Department of Computer Science and Engineering
  • Department of Computer Sciences

External person

Charlie Chung Ping Chen

  • University of Wisconsin-Madison
  • National Taiwan University
  • University of Texas at Austin
  • Intel
  • IEEE
  • Department of Computer Sciences
  • Department of Electrical and Computer Engineering
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

C. L. Liu

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • Alcatel-Lucent
  • National Tsing Hua University
  • Lucent
  • Department of Computer Science, University of Illinois
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • University of Illinois at Urbana-Champaign
  • Nokia

External person

Shashidhar Thakur

  • University of Texas at Austin
  • Synopsys Inc.
  • Indian Institute of Technology Bombay
  • Department of Computer Science

External person

Yang Cai

  • University of Texas at Austin
  • ArcSys Inc
  • ArcSys, Inc.
  • ArcSys
  • Department of Computer Science
  • Department of Computer Sciences
  • ArcSys, Inc.

External person

Ting Chi Wang

  • Chung Yuan Christian University
  • University of Texas at Austin
  • Department of Computer Sciences
  • Department of Information and Computer Engineering
  • Department of Computer Science
  • Department of Computer Sciences

External person

Hung Ming Chen

  • University of Texas at Austin
  • Texas Instruments
  • National Yang Ming Chiao Tung University
  • Department of Computer Science
  • Dept. of Electronics Engineering
  • Department of Computer Sciences
  • EE Department

External person

Lei Cheng

  • Synplicity, Inc.
  • University of Illinois Urbana-Champaign
  • CS Dept.
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign

External person

Hannah Honghua Yang

  • University of Texas at Austin
  • Intel
  • Department of Computer Science
  • Department of Computer Sciences

External person

Yao Ping Chen

  • University of Texas at Austin
  • Synopsys Inc.
  • Department of Computer Science

External person

Huiqun Liu

  • University of Texas at Austin
  • Intel
  • Harbin Institute of Technology
  • Tsinghua University
  • CAD
  • CAD
  • Department of Computer Science
  • VLSI Research Group
  • Portland Technol. Devmt. Automat. D.

External person

Bei Yu

  • Chinese University of Hong Kong

External person

Daifeng Guo

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

H. S Philip Wong

  • Stanford University
  • Department of Electrical Engineering, Stanford University
  • Dept. of Electrical and Engineering
  • Department of Electrical Engineering
  • Stanford University

External person

Huaizhi Wu

  • Cadence Design Systems
  • Atoptech, Inc.
  • Synopsys Inc.
  • Inc.

External person

Pei Ci Wu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Muzhou Shao

  • University of Texas at Austin
  • Synopsys Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Computer Sciences
  • Department of Computer Science
  • University of Illinois at Urbana-Champaign

External person

Minghorng Lai

  • University of Texas at Austin
  • Cadence Design Systems
  • Department of Computer Sciences
  • Department of Computer Science

External person

Hui Kong

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Rasit O. Topaloglu

  • IBM
  • Global Foundries, Inc.
  • Global Foundries Corporation
  • GLOBALFOUNDRIES
  • IBM Corporation

External person

Adnan Aziz

  • University of Texas at Austin
  • Synopsys Inc.
  • Advanced Technology Group
  • Department of Electrical, and Computer Engineering

External person

Seokjin Lee

  • University of Texas at Austin
  • Department of Electrical Engineering
  • Department of Electrical, and Computer Engineering
  • Department of Computer Sciences

External person

Lijuan Luo

  • NVIDIA
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

He Yi

  • Stanford University
  • Dept. of Electrical and Engineering
  • Department of Electrical Engineering, Stanford University
  • Technique and Applications
  • International Union for Vacuum Science
  • Universit√© Paris-Saclay
  • Stanford University

External person

T. W. Her

  • University of Texas at Austin
  • Mentor Graphics Corporation
  • Department of Computer Science
  • Department of Information and Computer Engineering
  • Chung Yuan Christian University
  • Department of Computer Sciences

External person

C. K. Wong

  • University of Texas at Austin
  • Chinese University of Hong Kong

External person

Xinshi Zang

  • Chinese University of Hong Kong

External person

Ting Yu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Shiju Lin

  • Chinese University of Hong Kong

External person

Jinwei Liu

  • Chinese University of Hong Kong

External person

Jason Cong

  • University of California, Los Angeles
  • Peking University
  • Computer Science Dept.
  • Center for Energy-Efficient Computing and Applications
  • Computer Science Department
  • School of Computer Science
  • Computer Science Department
  • Department of Computer Science
  • CS Department
  • PKU
  • University of Illinois Urbana-Champaign
  • Department of Computer Science, University of Illinois
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Sciences
  • University of Texas at Austin
  • University of Illinois at Urbana-Champaign
  • University of California at Los Angeles
  • Cornell University

External person

Yu Zhong

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Don Fussell

  • University of Texas at Austin
  • Alcatel-Lucent
  • Synopsys Inc.
  • Department of Computer Science
  • Department of Computer Sciences

External person

Li Pen Yuan

  • Synopsys Inc.

External person

Khe Sing The

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • Department of Computer Science
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Sciences
  • University of Illinois at Urbana-Champaign

External person

S. T Choden Konigsmark

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Leslie K. Hwang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Quang Dinh

  • University of Illinois at Urbana-Champaign

External person

Yongseok Cheon

  • University of Texas at Austin
  • Synopsys Inc.
  • Department of Computer Sciences
  • Department of Computer Science
  • Advanced Technology Group

External person

Yibo Lin

  • Peking University

External person

David Z. Pan

  • University of Texas at Austin
  • Department of Electrical, and Computer Engineering

External person

Gang Xu

  • University of Texas at Austin
  • CS
  • CS Department

External person

Yuzhe Ma

  • Chinese University of Hong Kong
  • Hong Kong University of Science and Technology
  • The Hong Kong University of Science and Technology (Guangzhou)

External person

Philip S. Honsinger

  • IBM
  • IBM Microelectronics
  • IBM Corporation
  • IBM Corp
  • Global Foundries, Inc.

External person

Yunfei Deng

  • Global Foundries, Inc.

External person

Honghua Yang

  • University of Texas at Austin
  • Department of Computer Science

External person

Wenqian Zhao

  • Chinese University of Hong Kong

External person

H. W. Leong

  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bentian Jiang

  • Chinese University of Hong Kong

External person

Shinichiro Haruyama

  • University of Texas at Austin
  • Alcatel-Lucent
  • Lucent
  • Department of Computer Sciences
  • Nokia

External person

Qi Sun

  • Chinese University of Hong Kong

External person

K. K. Lee

  • University of Texas at Austin
  • Department of Computer Science

External person

James Shiely

  • Synopsys Inc.

External person

Rajmohan Rajaraman

  • University of Texas at Austin
  • Department of Computer Science

External person

Maryann C. Tung

  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

Jai Ming Lin

  • National Yang Ming Chiao Tung University
  • Department of Computer and Information Science

External person

Qijing Wang

  • Chinese University of Hong Kong

External person

Tin Yin Lai

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • UIUC

External person

Xinyun Zhang

  • Chinese University of Hong Kong

External person

Mark Po Hung Lin

  • National Chung Cheng University
  • Department of Electrical Engineering
  • National Taiwan University
  • Graduate Institute of Electronics Engineering

External person

Tan Li Chou

  • Intel
  • University of Texas at Austin
  • Strategic CAD Labs.

External person

Glenn G. Lai

  • University of Texas at Austin
  • Synopsys Inc.
  • Department of Computer Science

External person

Beomjin Kwon

  • MC-244
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Beckman Institute for Advanced Science and Technology
  • School for Engineering of Matter
  • Arizona State University
  • School for Engineering of Matter, Transport and Energy (SEMTE)
  • Mechanical and Aerospace Engineering
  • University of Illinois at Urbana-Champaign

External person

Yang Bai

  • Chinese University of Hong Kong
  • Tencent Security Zhuque Lab

External person

Binwu Zhu

  • Chinese University of Hong Kong

External person

Wenbo Li

  • Chinese University of Hong Kong

External person

Wu Pei-Ci Wu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

S. Muthukrishnan

  • Synopsys Inc.
  • University of Texas at Austin

External person

Mohan Guruswamy

  • University of Texas at Austin
  • Univ of Texas, Dep of Electr &

External person

Hua Song

  • Synopsys Inc.

External person

Yu Min Lee

  • University of Wisconsin-Madison
  • Department of Electrical and Computer Engineering
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

Jingsong Chen

  • Chinese University of Hong Kong

External person

Esra Erdem

  • University of Texas at Austin
  • Department of Computer Science
  • Vienna University of Technology

External person

Yusu Wang

  • Department of Computer Science
  • Duke University
  • Department of Computer Science
  • Department of Computer Science
  • Ohio State University
  • Department of Computer Science and Engineering
  • Department of Computer Science and Engineering
  • Department of Computer Science and Engineering
  • Duke University
  • Ohio State University

External person

Sachin S. Sapatnekar

  • University of Minnesota Twin Cities
  • IEEE

External person

Scott Chilstedt

  • IBM
  • University of Illinois Urbana-Champaign
  • IBM
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

John F. Croix

  • Silicon Metrics Corporation
  • Advanced Micro Devices

External person

Robert Boone

  • Motorola
  • University of Texas at Austin
  • IEEE

External person

K. K. Lee

  • Synopsys Inc.

External person

Haisheng Zheng

  • SmartMore
  • SmartMore Corporation Limited

External person

Peiyu Liao

  • Chinese University of Hong Kong

External person

C. K. Wong

  • University of Texas at Austin
  • IBM
  • Lucent
  • Chinese University of Hong Kong
  • Department of Computer Science
  • Department of Computer Science and Engineering
  • Chung Yuan Christian University
  • National Yang Ming Chiao Tung University
  • Nokia

External person

David M. Pawlowski

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

C. K. Wong

  • Chung Yuan Christian University

External person

Fangzhon Wang

  • Chinese University of Hong Kong

External person

Thomas R. Mueller

  • Alcatel-Lucent
  • Lucent
  • Nokia

External person

Ziyang Yu

  • Chinese University of Hong Kong

External person

Sarvesh Bhardwaj

  • Mentor Graphics Corporation

External person

Sung Mo Kang

  • IEEE
  • University of Illinois Urbana-Champaign
  • Silicon Perspective Corporation
  • University of California at Santa Cruz
  • University of California, Berkeley
  • Lucent
  • Rutgers - The State University of New Jersey, New Brunswick
  • Marshall University
  • Swiss Federal Institute of Technology Lausanne
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Baskin School of Engineering
  • Ctr. for Prev. R. and D.
  • Center for Advanced Study
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of California at Santa Cruz

External person

Naveed Sherwani

  • University of Texas at Austin

External person

Pawitter Mangat

  • Global Foundries, Inc.

External person

Ismail Bustany

  • Mentor Graphics Corporation

External person

Ngai Wong

  • The University of Hong Kong
  • Department of Electrical and Electronic Engineering

External person

Wei Ren

  • University of Illinois at Urbana-Champaign

External person

M. Gunswamy

  • MCC
  • University of Texas at Austin
  • Department of Electrical, and Computer Engineering

External person

Jia Wei Fang

  • University of Illinois Urbana-Champaign
  • National Taiwan University
  • Graduate Institute of Electronics Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Lixin Lin

  • Chinese University of Hong Kong

External person

Chen Hu

  • Beijing University of Chemical Technology
  • College of Information Science and Technology

External person

Madhukar R. Korupolu

  • University of Texas at Austin
  • Department of Computer Science

External person

Will Conley

  • Freescale Semiconductor

External person

Igor L. Markov

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor

External person

Jamil Kawa

  • Synopsys Inc.

External person

L. Liebmann

  • IBM
  • IBM Semiconductor Research and Development Center
  • IBM
  • IBM Research
  • IBM System and Technology Group

External person

Jacob Avidan

  • Synopsys Inc.

External person

Debjit Sinha

  • IBM Systems
  • IBM

External person

Tan Yantt

  • University of Illinois Urbana-Champaign
  • Synopsys Inc.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Bangqi Fu

  • Chinese University of Hong Kong

External person

Sushma Yellapragada

  • University of Illinois at Urbana-Champaign

External person

William Joyner

  • Semiconductor Research Corp.
  • Semiconductor Research Corporation

External person

Yung Ming Fang

  • University of Texas at Austin

External person

Jinwei Lin

  • Chinese University of Hong Kong

External person

Ioannis Karageorgos

  • Interuniversitair Micro-Elektronica Centrum
  • KU Leuven
  • IMEC

External person

Rasit O. Topalaglu

  • Global Foundries, Inc.

External person

T. H. Freeman

  • University of Texas at Austin
  • Department of Computer Sciences

External person

Lu Zhang

  • Chinese University of Hong Kong

External person

Prasad S. Sakhamuri

  • University of Texas at Austin
  • Department of Computer Sciences

External person

Ran Chen

  • Chinese University of Hong Kong

External person

Jongwook Kye

  • Global Foundries, Inc.

External person

Kevin L. Lin

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Jiangbo Lu

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte. Ltd.
  • Advanced Digital Sciences Center (ADSC)
  • Advanced Digital Sciences Center
  • ADSC Illinois at Singapore
  • Shenzhen Cloudream Technology
  • Advanced Digital Sciences Center
  • SmartMore Corporation Limited

External person

Lixin Liu

  • Chinese University of Hong Kong

External person

Sebastian Vogel

  • Technische Universit√§t Darmstadt

External person

Gerard Luk-Pat

  • Synopsys Inc.

External person

Yung Ming Fang

  • University of Texas at Austin

External person

Mike Hutton

  • Altera Corporation

External person

Dwight Hill

  • Synopsys Inc.

External person

Ashish D. Mehta

  • University of Texas at Austin

External person

Fan Yang

  • Fudan University

External person

Haifeng Qian

  • University of Minnesota Twin Cities

External person

Edward M. Reingold

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Texas at Austin

External person

Ting Chi Wang

  • Department of Information and Computer Engineering
  • Chung Yuan Christian University

External person

Soo Han Choi

  • Samsung Advanced Institute of Technology

External person

Xiaopeng Zhang

  • Chinese University of Hong Kong

External person

Lawrence T. Pileggi

  • Carnegie Mellon University
  • IBM
  • University of Texas at Austin
  • IBM Microelectronics
  • Global Foundries, Inc.
  • Dept. of Elec. and Comp. Engineering
  • Carnegie Mellon University

External person

Yong Zhan

  • University of Minnesota Twin Cities

External person

Kerim Kalafala

  • IBM Systems
  • IBM

External person

Chen Bai

  • Chinese University of Hong Kong

External person

Dan Zheng

  • Chinese University of Hong Kong

External person

Noel Menezes

  • University of Texas at Austin

External person

Brent Goplen

  • University of Minnesota Twin Cities

External person

Jason Govig

  • Altera Corporation

External person

Fan Zhang

  • University of Illinois Urbana-Champaign
  • Beijing University of Chemical Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • College of Information Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Jinseng Cong

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jianwang Zhai

  • Tsinghua University

External person

Xufeng Yao

  • Chinese University of Hong Kong

External person

Guang Ming Wu

  • Nanhua University Taiwan
  • Department of Information Management

External person

Nianjuan Jiang

  • SmartMore Corporation Limited

External person

Tianji Liu

  • Chinese University of Hong Kong

External person

Richard Y. Sun

  • Xilinx Inc.

External person

Vladimir Lifschitz

  • University of Texas at Austin
  • Department of Computer Science

External person

Jeng Llang Tsai

  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison

External person

C. K. Wong

  • National Yang Ming Chiao Tung University

External person

Abe Elfadel

  • Synopsys Inc.

External person

Alfred Reich

  • CS
  • CS Department
  • University of Texas at Austin

External person

Zhuolun He

  • Chinese University of Hong Kong

External person

Guoqiang Chen

  • University of Minnesota Twin Cities

External person

Shui An Wen

  • Chung Yuan Christian University

External person

Guojin Chen

  • Chinese University of Hong Kong

External person

Xuan Zeng

  • Fudan University

External person

David Yeh

  • Semiconductor Research Corp.
  • Semiconductor Research Corporation

External person

Vidyamani Parkhe

  • Mentor Graphics Corporation

External person

Ronggang Yu

  • CS Department
  • University of Texas at Austin

External person

S. T. Choden Konigsmark

  • University of Illinois at Urbana-Champaign

External person

Wilsin Gosti

  • Cadence Design Systems

External person

Ivailo Nedelchev

  • Mentor Graphics Corporation

External person