M Tamer Başar

Network

Subhonmesh Bose

Person: Academic

David Malcolm Nicol

Person: Academic

Ji Liu

  • University of Illinois Urbana-Champaign
  • Stony Brook University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Applied Mathematics and Statistics
  • University of Illinois at Urbana-Champaign
  • Stony Brook University
  • University of Rochester
  • Tencent
  • Kwai Inc
  • Kwai Inc.
  • The Stony Brook University Cancer Center
  • University of Illinois at Urbana-Champaign

External person

Quanyan Zhu

  • Princeton University
  • Isfahan University of Technology
  • New York University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Coordinated Science Laboratory
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Tansu Alpcan

  • Technical University of Berlin
  • Deutsche Telekom
  • University of Melbourne
  • University of Illinois Urbana-Champaign
  • Coordinated Science Laboratory
  • Humboldt University of Berlin
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Electronic Engineering
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois at Urbana-Champaign

External person

Kaiqing Zhang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Dept. of ECE
  • University of Minnesota Twin Cities
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign
  • University of Maryland, College Park

External person

Serdar Yuksel

  • Queen's University Kingston
  • Yale University
  • University of Illinois Urbana-Champaign
  • Dunham Lab.
  • Mathematics and Engineering Program
  • Mathematics and Engineering Program
  • Department of Electrical Engineering
  • Mathematics and Engineering Program
  • Department of Mathematics and Statistics
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Eitan Altman

  • Institut national de recherche en informatique et en automatique
  • Project Maestro
  • Universidad de los Andes Mérida
  • Inst Natl de Recherche en
  • Sophia-Antipolis
  • 1NRIA
  • New York University
  • CREATE-NET
  • University of Illinois Urbana-Champaign
  • Centro de Simulacion y Modelos
  • IEEE
  • INRIA Sophia Antipolis
  • Center for Research and Telecommunication Experimentation for Networked Communities
  • University of Illinois at Urbana-Champaign

External person

Xudong Chen

  • University of Illinois Urbana-Champaign
  • University of Colorado Boulder
  • Chinese University of Hong Kong
  • Department of ECEE
  • Department of Electrical
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Computer Engineering
  • Department of Electrical
  • University of Illinois at Urbana-Champaign
  • Washington University St. Louis
  • University of Colorado Boulder
  • University of Illinois at Urbana-Champaign

External person

Walid Saad

  • University of Miami
  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign
  • Wireless at VT
  • Bradley Department of Electrical and Computer Engineering
  • Dept. of Electrical and Computer Engineering
  • Virginia Tech
  • Bradley Dept. of Electrical and Computer Engineering
  • Princeton University
  • University of Oslo
  • University Graduate Center
  • University of Illinois at Urbana-Champaign
  • Virginia Polytechnic Institute and State University
  • Virginia Tech College of Engineering
  • University of Miami College of Engineering

External person

Zhu Han

  • University of Houston
  • Kyung Hee University
  • Department of Electrical and Computer Engineering
  • Department of Electronics and Radio Engineering, Kyung Hee University Gyeonggi-do

External person

Emrah Akyol

  • University of California at Santa Barbara
  • University of Illinois Urbana-Champaign
  • State University of New York Binghamton University
  • Electrical and Computer Engineering Department
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • UC Santa Barbara College of Engineering
  • University of Illinois at Urbana-Champaign

External person

Sourabh Bhattacharya

  • Iowa State University
  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Mechanical Engineering
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • Iowa State University
  • University of Illinois at Urbana-Champaign
  • Iowa State University

External person

Zigang Pan

  • Polytechnic University - Brooklyn
  • University of California at Santa Barbara
  • University of Illinois Urbana-Champaign
  • New York University
  • IEEE
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • UC Santa Barbara College of Engineering

External person

Jun Moon

  • University of Illinois Urbana-Champaign
  • Ulsan National Institute of Science and Technology
  • Ulsan National Institute of Science Technology
  • School of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • School of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering
  • University of Seoul
  • University of Illinois at Urbana-Champaign
  • Hanyang University
  • University of Illinois at Urbana-Champaign

External person

Muhammed O. Sayin

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Toyota InfoTechnology Center
  • USA, Inc.
  • Toyota InfoTechnology Center
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Bilkent University
  • University of Illinois at Urbana-Champaign

External person

Are Hjørungnes

  • University of Oslo
  • Rikshospitalet-Radiumhospitalet HF
  • University Graduate Center

External person

Abhishek Gupta

  • University of Illinois Urbana-Champaign
  • Department of Aerospace Engineering, University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Ohio State University
  • Department of Electrical and Computer Engineering
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Aerospace Engineering
  • University of Illinois at Urbana-Champaign
  • UIUC
  • Ohio State University
  • University of Illinois at Urbana-Champaign
  • Ohio State University

External person

Orhan Ç Imer

  • General Electric
  • University of Illinois Urbana-Champaign
  • Coordinated Science Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Decision Sciences Laboratory
  • Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

A. Khanafer

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. Vincent Poor

  • Princeton University
  • Michael Henry Strater University
  • Worcester Polytechnic Institute
  • National Academy of Sciences
  • University of Illinois Urbana-Champaign
  • IEEE
  • School of Engineering and Applied Science
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • National Academy of Sciences
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • Michael Henry Strater University

External person

Hamidou Tembine

  • Telecommunication Department
  • Supélec
  • INRIA
  • King Abdullah University of Science and Technology
  • Avignon Université
  • CentraleSupélec
  • CNRS
  • École Supérieure d' Électricité (SUPÉLEC)
  • CNRS Centre National de la Recherche Scientifique
  • Telecommunications Department
  • Telecommunication Department
  • Université Paris-Saclay
  • MAESTRO Group
  • KAUST
  • Telecommunication Department
  • University of Illinois Urbana-Champaign
  • Université Paris-Sud
  • University of Illinois at Urbana-Champaign
  • INRIA Sophia Antipolis
  • University of Illinois at Urbana-Champaign

External person

Miroslav Krstic

  • University of California at San Diego
  • Department of Mechanical and Aerospace Engineering
  • Dept. of Mechanical and Aerospace Eng.
  • Dept. of Mechanical and Aerospace Eng.
  • Department of MAE
  • University of California Office of the President
  • Department of Mechanical and Aerospace Engineering
  • University of Colorado Boulder
  • Universidade do Estado do Rio de Janeiro
  • University of Colorado Boulder

External person

Erik Miehling

  • University of Illinois Urbana-Champaign
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign

External person

Philip E. Paré

  • University of Illinois Urbana-Champaign
  • Universidad Nacional de Colombia
  • Industrial and Systems Engnieering Department
  • KTH Royal Institute of Technology
  • Purdue University
  • University of Illinois at Urbana-Champaign
  • Purdue University
  • University of Illinois at Urbana-Champaign
  • College of Engineering

External person

Xiaobin Gao

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rajiv Maheswaran

  • University of Southern California
  • University of Illinois Urbana-Champaign
  • Dartmouth College
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Southern California
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Mérouane Debbah

  • CentraleSupélec
  • Alcatel-Lucent
  • Nokia
  • Plateau de Moulon
  • Université Paris-Saclay
  • Alcatel-Lucent
  • Department of Flexible Radio

External person

Weichao Mao

  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • UIUC
  • University of Illinois at Urbana-Champaign

External person

William R. Perkins

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Aeronautical and Astronautical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Zhuoran Yang

  • Princeton University
  • Department of Operations Research and Financial Engineering
  • Yale University

External person

Xuanyu Cao

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Hong Kong University of Science and Technology
  • University of Illinois at Urbana-Champaign

External person

J. W. Melody

  • Coordinated Science Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Dept. of Elec. and Comp. Eng.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. Bansal

  • University of Illinois Urbana-Champaign
  • Alcatel-Lucent
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Lucent
  • Nokia
  • University of Illinois at Urbana-Champaign

External person

Muhammad Aneeq Uz Zaman

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dario Bauso

  • University of Palermo
  • Dipartimento di Matematica
  • Universitàdi Palermo
  • University of Sheffield
  • Department of Automatic Control and Systems Engineering
  • Dipartimento di Ingegneria Chimica
  • Dipartimento di Ingegneria Chimica, Gestionale Informatica, e Meccanica
  • Dipartimento di Ingegneria Chimica, Gestionale, Informatica e Meccanica
  • University of Sheffield

External person

Bahman Gharesifard

  • Queen's University Kingston
  • University of Illinois Urbana-Champaign
  • Queen's University
  • Department of Mathematics and Statistics
  • Department of Mathematics and Statistic
  • University of Illinois at Urbana-Champaign
  • University of California at Los Angeles
  • University of Illinois at Urbana-Champaign

External person

Hui Sun

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hideaki Ishii

  • The University of Tokyo
  • Tokyo Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Information Physics and Computing
  • Department of Computational Intelligence and Systems Science
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Keyou You

  • Tsinghua University
  • Department of Automation
  • Tsinghua National Laboratory for Information Science and Technology

External person

Akshay Kashyap

  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Paul Frihauf

  • University of California at San Diego
  • Department of Mechanical and Aerospace Engineering
  • Dept. of Mechanical and Aerospace Eng.
  • Dept. of Mechanical and Aerospace Eng.
  • University of California Office of the President
  • Department of Mechanical and Aerospace Engineering

External person

Gürdal Arslan

  • University of California, Los Angeles
  • Voyan Technology
  • University of Hawai'i at Mānoa
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Department of Mechanical and Aerospace Engineering
  • Department of Elec. Engg.
  • Department of Mechanical and Aerospace Engineering
  • University of California at San Diego
  • University of Hawaii
  • University of Illinois at Urbana-Champaign
  • University of California at Los Angeles
  • University of Illinois
  • University of Hawaii at Manoa
  • University of California Los Angeles
  • University of Illinois at Urbana-Champaign

External person

Tangul U. Basar

  • Illinois Institute of Technology
  • University of Illinois Urbana-Champaign
  • University of Twente
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Medical Imaging Research Center, Electrical and Computer Engineering Department, Illinois Institute of Technology
  • Illinois Inst of Technol, Electr
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Garry Didinsky

  • Boeing
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zuguang Gao

  • University of Illinois Urbana-Champaign
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • The University of Chicago
  • University of Illinois at Urbana-Champaign

External person

Sadegh Bolouki

  • University of Illinois Urbana-Champaign
  • Arizona State University
  • School of Electrical
  • University of Illinois at Urbana-Champaign
  • Tarbiat Modarres University
  • Ecole Polytechnique de Montreal
  • University of Illinois at Urbana-Champaign
  • Arizona State University

External person

Kien C. Nguyen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jianwei Huang

  • Chinese University of Hong Kong
  • Department of Information Engineering
  • Department of Information Engineering
  • The Chinese University of Hong Kong, Shenzhen
  • Shenzhen Institute of Artificial Intelligence and Robotics for Society
  • Shenzhen Institute of Artificial Intelligence and Robotics for Society

External person

Weiguo Xia

  • KTH Royal Institute of Technology
  • Dalian University of Technology
  • ACCESS Linnaeus Centre
  • Signal Processing Group
  • School of Control Science and Engineering

External person

Roberto Tempo

  • Polytechnic University of Turin

External person

MingQing Xiao

  • University of California at Davis
  • Southern Illinois University
  • University of Illinois Urbana-Champaign
  • Institute of Theoretical Dynamics
  • Department of Mathematics
  • University of Illinois at Urbana-Champaign
  • Southern Illinois University

External person

Alec Koppel

  • DEVCOM Army Research Laboratory
  • United States Army Research Laboratory
  • J. P. Morgan

External person

Shubham Aggarwal

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wei Chen

  • KTH Royal Institute of Technology
  • University of California, Berkeley
  • Hong Kong University of Science and Technology
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electronic and Computer Engineering
  • ACCESS Linnaeus Center
  • Signal Processing Group
  • Department of Electrical Engineering and Computer Science
  • Peking University
  • University of California at Berkeley

External person

Radha Poovendran

  • University of Washington
  • Department of Electrical Engineering
  • University of Washington

External person

Ashutosh Nayyar

  • University of Southern California
  • University of California, Berkeley
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering, University of Southern California
  • Department of Electrical Engineering and Computer Sciences, University of California, Berkeley
  • University of Illinois at Urbana-Champaign
  • University of Southern California
  • University of California at Berkeley
  • Department of Electrical Engineering, University of Southern California
  • University of Illinois at Urbana-Champaign

External person

Derya H. Cansever

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dan Wang

  • Hong Kong University of Science and Technology
  • Department of Electronic and Computer Engineering

External person

Francesco De Pellegrini

  • CREATE-NET
  • University of Illinois Urbana-Champaign
  • INRIA Sophia Antipolis
  • Institut national de recherche en informatique et en automatique
  • Fondazione Bruno Kessler
  • Avignon Université
  • Center for Research and Telecommunication Experimentation for Networked Communities
  • University of Illinois at Urbana-Champaign

External person

Hongxia Shen

  • Lawrence Berkeley National Laboratory
  • University of Illinois Urbana-Champaign
  • Environmental Energy Technologies Division
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Northwestern University
  • University of Illinois at Urbana-Champaign

External person

Melih Bastopcu

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jose B. Cruz

  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shu Li

  • University of Illinois Urbana-Champaign
  • Harvard University
  • University of Illinois at Urbana-Champaign
  • Harvard University
  • University of Illinois at Urbana-Champaign

External person

Karl H. Johansson

  • KTH Royal Institute of Technology
  • ACCESS Linnaeus Center
  • ACCESS Linnaeus Centre
  • Signal Processing Group
  • ACCESS Linneaus Center

External person

Naci Saldi

  • University of Illinois Urbana-Champaign
  • Department of Natural and Mathematical Sciences
  • Ozyegin University
  • University of Illinois at Urbana-Champaign
  • Bilkent University

External person

Behrouz Touri

  • Georgia Institute of Technology
  • University of Colorado Boulder
  • University of Illinois Urbana-Champaign
  • Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign
  • Decision and Control Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical
  • School of Electrical Engineering and Computer Sciences
  • Electrical and Computer Engineering
  • Department of IESE
  • School of Electrical and Computer Engineering, Georgia Tech University
  • University of California at San Diego
  • University of Illinois at Urbana-Champaign
  • Georgia Tech University
  • University of Illinois at Urbana-Champaign
  • University of Colorado Boulder

External person

Khaled Alshehri

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • King Fahd University of Petroleum and Minerals
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jiaqi Zhang

  • Tsinghua National Laboratory for Information Science and Technology

External person

Michael Bloem

  • NASA Ames Research Center
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Vikram R. Saksena

  • Alcatel-Lucent
  • University of Illinois Urbana-Champaign
  • Lucent
  • University of Illinois at Urbana-Champaign
  • Nokia

External person

Li Qiu

  • Hong Kong University of Science and Technology
  • Department of Electronic and Computer Engineering
  • Stony Brook University
  • Department of Electrical and Computer Engineering
  • Stony Brook University
  • The Stony Brook University Cancer Center

External person

Carol Fung

  • University of Waterloo
  • Cheriton School of Computer Science

External person

Mahmoud El Chamie

  • INRIA Sophia Antipolis
  • University of Texas at Austin
  • University of Washington
  • Department of Aerospace Engineering and Engineering Mechanics
  • PSI Center
  • Institut national de recherche en informatique et en automatique

External person

Raouf Boutaba

  • University of Waterloo
  • Pohang University of Science and Technology
  • ITCE Division
  • Cheriton School of Computer Science
  • Division of IT Convergence Engineering

External person

Xiangyuan Zhang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Max Mintz

  • Yale University
  • University of Illinois Urbana-Champaign
  • School of Engineering and Applied Science
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Suhas Diggavi

  • University of California, Los Angeles
  • University of California at Los Angeles
  • University of California Los Angeles

External person

Sujay Bhatt

  • University of Illinois at Urbana-Champaign
  • J. P. Morgan
  • University of Illinois at Urbana-Champaign

External person

Shao Liu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. Franke

  • IBM
  • University of Illinois Urbana-Champaign
  • IBM Research
  • UIUC
  • University of Illinois at Urbana-Champaign

External person

Ju Bin Song

  • Kyung Hee University
  • Department of Electronics and Radio Engineering, Kyung Hee University Gyeonggi-do
  • College of Electronics and Information
  • College of Electronics and Information
  • Kyung Hee Univiversity

External person

Haoran Qiu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • UIUC
  • Department of Computer Science
  • University of Illinois
  • Department of Computer Science

External person

Yang Liu

  • University of California at Santa Cruz
  • Harvard University
  • University of California at Santa Cruz
  • Harvard University
  • University of Michigan, Ann Arbor
  • University of California

External person

G. J. Toussaint

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Francesco Bullo

  • Coordinated Science Laboratory
  • University of California at Santa Barbara
  • University of Illinois Urbana-Champaign
  • Department of Mechanical and Environmental Engineering
  • Center for Compound Semiconductor Microelectronics
  • Center for Control, Dynamical Systems, and Computation
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • UC Santa Barbara College of Engineering

External person

Cheng Tang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

B. Anderson

  • Memorial Sloan Kettering Cancer Ctr.
  • Australian National University
  • Memorial Sloan-Kettering Cancer Center
  • Hangzhou Dianzi University
  • Data61-CSIRO
  • CSIRO
  • National ICT Australia
  • College of Engineering and Computer Science
  • Department of Systems Engineering and Cooperative
  • Research School of Engineering
  • National ICT Australia (NICTA)

External person

Kenneth Rose

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering
  • Centers for Disease Control and Prevention
  • UC Santa Barbara College of Engineering

External person

W. Saad

  • University of Miami
  • University of Oslo
  • Princeton University
  • University of Illinois Urbana-Champaign
  • Rikshospitalet-Radiumhospitalet HF
  • Wireless at VT
  • Virginia Tech
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering Department
  • Electrical and Computer Engineering Department
  • Bradley Department of Electrical and Computer Engineering
  • Bradley Dept. of Electrical and Computer Engineering
  • Electrical and Computer Engineering Department
  • Electrical and Computer Engineering Department
  • University Graduate Center

External person

A. Stephen Morse

  • Yale University
  • University of Illinois Urbana-Champaign
  • IEEE
  • Departrnent of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Political Science and the Department of Electrical Engineering

External person

Yongqiang Wang

  • Clemson University
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Zhi Xu

  • University of Illinois Urbana-Champaign
  • Massachusetts Institute of Technology
  • Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Tiago Roux Oliveira

  • Universidade do Estado do Rio de Janeiro

External person

Y. W. Wu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Georges Zaccour

  • Department of Decision Sciences
  • HEC Montreal

External person

Kurt Rohloff

  • BBN Technologies
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Andrew Clark

  • Department of Electrical Engineering
  • University of Washington
  • London School of Hygiene and Tropical Medicine
  • University of Washington

External person

Qian Ma

  • Chinese University of Hong Kong
  • Department of Information Engineering
  • Sun Yat-Sen University

External person

Mengbin Ye

  • Australian National University
  • Research School of Engineering
  • Westlake University
  • Institute of Advanced Technology
  • Research School of Engineering at Australian National
  • University of Groningen
  • Institute of Advanced Technology

External person

Victor Hugo Pereira Rodrigues

  • Universidade Federal do Rio de Janeiro
  • Universidade do Estado do Rio de Janeiro

External person

Huanshui Zhang

  • Shandong University
  • Shandong University of Science and Technology

External person

Xingzhe Fan

  • Rensselaer Polytechnic Institute
  • University of Miami
  • Electrical, Computer, and Systems Engineering Department

External person

Changbin Yu

  • Australian National University
  • Hangzhou Dianzi University
  • Research School of Engineering
  • Westlake University
  • Institute of Advanced Technology
  • Institute of Advanced Technology

External person

Tania Jiménez

  • Universidad de los Andes Mérida
  • INRIA Sophia Antipolis
  • Inst Natl de Recherche en
  • Institut national de recherche en informatique et en automatique

External person

Michael B. Bragg

  • University of Illinois Urbana-Champaign
  • AIAA
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Washington

External person

Xudong Zhao

  • Dalian University of Technology

External person

Chung Wei Lin

  • Toyota Info Technology Center
  • USA, Inc.
  • Toyota InfoTechnology Center
  • Toyota InfoTechnology Center
  • National Taiwan University

External person

S. Shankar Sastry

  • University of California, Berkeley
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences, University of California, Berkeley
  • Department of Electrical Engineering and Computer Sciences
  • Electrical Engineering and Computer Sciences Department
  • Electrical Engineering and Computer Sciences
  • Department of Computer Sciences
  • University of Texas at Austin
  • University of Texas at Dallas
  • University of California at Berkeley
  • Department of Electrical Engineering and Computer Sciences
  • University of Texas at Dallas

External person

Sina Sanjari

  • Queen's University Kingston
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nahum Shimkin

  • Technion-Israel Institute of Technology
  • INRIA Sophia Antipolis
  • Inst Natl de Recherche en
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • Technion

External person

Hasan Selbuz

  • Scientific and Technological Research Council of Turkey
  • Marmara Scientific and Industrial Research Institute
  • Applied Mathematics Division
  • Applied Mathematics Division

External person

Kyung Joon Park

  • Seoul National University
  • Daegu Gyeongbuk Institute of Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Computer Science, University of Illinois
  • School of Electrical Eng./Comp. Sci.
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Information and Communication Engineering
  • Department of Information and Communication Engineering
  • School of Electrical Engineering and Computer Science
  • Dept. of ICE
  • School of Electrical Eng. & Computer Science
  • Department of Information and Communication Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Anibal Sanjab

  • Virginia Tech
  • Bradley Dept. of Electrical and Computer Engineering
  • Flemish Institute for Technological Research
  • Virginia Polytechnic Institute and State University
  • Virginia Tech College of Engineering

External person

Arunabha Bagchi

  • University of Twente
  • Department of Applied Mathematics
  • Department of Applied Mathematics

External person

Songwu Lu

  • University of California, Los Angeles
  • University of Illinois Urbana-Champaign
  • IEEE
  • Computer Science Dept.
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of California at Los Angeles
  • University of Illinois at Urbana-Champaign

External person

Juanjuan Xu

  • Shandong University

External person

Murat Arcak

  • Rensselaer Polytechnic Institute
  • Electrical, Computer, and Systems Engineering Department
  • University of California, Berkeley
  • University of California at Berkeley

External person

Jorge I. Poveda

  • University of Colorado Boulder
  • University of California at San Diego
  • University of Colorado Boulder

External person

Han Liu

  • Northwestern University
  • Center for Quantum Devices
  • Tencent
  • Tencent Artificial Intelligence Lab
  • Princeton University

External person

S. Yagiz Olmez

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Behcet Acikmese

  • PSI Center
  • University of Washington

External person

Raj K. Velicheti

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Geert Jan Olsder

  • University of Twente
  • Department of Applied Mathematics

External person

Petar V. Kokotović

  • University of California at Santa Barbara
  • Toyon Research Corporation
  • University of Illinois Urbana-Champaign
  • Ctr. for Contr. Eng. and Computation
  • Department of Electrical and Computer Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Toyon Research Corporation
  • UC Santa Barbara College of Engineering
  • University of Illinois at Urbana-Champaign

External person

Shinichi Shiraishi

  • Toyota Info Technology Center
  • Toyota InfoTechnology Center USA
  • TOYOTA Info Technology Centre Co., Ltd.
  • Toyota Info. Technology Center
  • Toyota InfoTechnology Center
  • Toyota Research Institute - Advanced Development

External person

Alain Haurie

  • University of Montreal
  • GERAD
  • University of Geneva
  • HEC Montreal

External person

Omar Ait-Hellal

  • INRIA Sophia Antipolis
  • Institut national de recherche en informatique et en automatique

External person

Sei Zhen Khong

  • University of Minnesota Twin Cities
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bahare Kiumarsi

  • University of Illinois Urbana-Champaign
  • Michigan State University
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Michigan State University

External person

N. Malouch

  • Sorbonne Université
  • Universite Pierre et Marie Curie

External person

Yonina C. Eldar

  • Weizmann Institute of Science
  • Technion-Israel Institute of Technology

External person

Cagri Imer

  • Dartmouth College
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kenan Ezal

  • Toyon Research Corporation
  • Toyon Research Corporation

External person

Mohammad Noureddine

  • University of Illinois Urbana-Champaign
  • Information Trust Institute
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • Department of Computer Science
  • Department of Computer Science
  • University of Illinois at Urbana-Champaign
  • Rose Hulman Institute Technology
  • University of Illinois at Urbana-Champaign

External person

Leilei Cui

  • New York University

External person

Mingyan Liu

  • University of Michigan, Ann Arbor
  • IEEE
  • Department of Electrical Engineering and Computer Science
  • QuadMetrics, Inc
  • Real-Time Computing Laboratory
  • University of Michigan Healthcare System
  • University of Michigan, Ann Arbor
  • University of Michigan
  • University of Michigan
  • University of Michigan Ann Arbor MI

External person

Don Towsley

  • IEEE
  • College of William and Mary
  • University of Massachusetts
  • Computer Science Department
  • Department of Computer Science
  • Department of Computer and Information Science
  • College of Information and Computer Science
  • University of Massachusetts Amherst

External person

Qianchuan Zhao

  • Tsinghua University
  • Department of Automation
  • University of Illinois at Urbana-Champaign

External person

Stephen Russell

  • United States Army Research Laboratory
  • University of California, Berkeley
  • DEVCOM Army Research Laboratory
  • University of California at Berkeley
  • Jackson Health System

External person

Nora Ayanian

  • University of Southern California
  • University of Southern
  • University of Southern California

External person

Linda Bushnell

  • University of Washington
  • Networked Control Systems Lab
  • Department of Electrical Engineering
  • University of Washington

External person

Archit Patke

  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois

External person

Ramesh Govindan

  • University of Southern
  • University of Southern California
  • ArtisTech, Inc.
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Southern California
  • Department of Electrical Engineering, University of Southern California

External person

Mehdi Bennis

  • University of Oulu
  • Department of Electrical Engineering

External person

Suleyman S. Kozat

  • Koc University
  • IBM
  • Bilkent University
  • IBM Research
  • University of Illinois Urbana-Champaign
  • IBM
  • Department of ECE
  • Electrical and Electronics Department
  • Department of Electrical and Electronics Engineering
  • Department of Computer Engineering
  • EEE Department
  • Electrical and Electronics Engineering Department
  • Electrical Engineeirng and Electronics Department
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Electrial and Electronics Engineering Department
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Susmit Jha

  • SRI International

External person

Daniela Rus

  • Dartmouth College
  • Massachusetts Institute of Technology
  • Department of Computer Science
  • Massachusetts Institute of Technology

External person

Fei Sha

  • United States Army Research Laboratory
  • University of Southern California
  • University of Southern California

External person

Tancrede Lepoint

  • SRI International
  • University of Illinois Urbana-Champaign
  • Alphabet Inc.
  • University of Illinois at Urbana-Champaign

External person

Junshan Zhang

  • University of California at Davis

External person

Yan Zhang

  • Simula Research Laboratory
  • University of Oslo
  • Department of Informatics
  • Department of Informatics

External person

Geoff Downton

  • Schlumberger
  • Schlumberger

External person

Jonathan Bredin

  • Dartmouth College
  • Department of Computer Science
  • Department of Computer Science

External person

Gaurav Sukhatme

  • University of Southern California
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Southern California
  • Amazon.com, Inc.

External person

Zhong Ping Jiang

  • New York University
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering

External person

Craig Rieger

  • Idaho National Laboratory
  • Instrumentation Control and Intelligent Systems

External person

Venkata Sriram Siddhardh Nadendla

  • University of Illinois Urbana-Champaign
  • Missouri University of Science and Technology
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Missouri University of Science and Technology (SandT)
  • University of Illinois at Urbana-Champaign

External person

Choon Yik Tang

  • University of Oklahoma
  • Department of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering

External person

Randall A. Berry

  • Northwestern University
  • Electrical Engineering and Computer Science Department

External person

Sabita Maharjan

  • Rikshospitalet-Radiumhospitalet HF
  • Simula Research Laboratory
  • University of Oslo
  • Department of Informatics

External person

Yongxin Chen

  • University of Minnesota Twin Cities
  • University of Minnesota
  • Georgia Institute of Technology
  • Georgia Institute of Technology

External person

R. Rajkumar

  • Carnegie Mellon University
  • IBM
  • Dept. of Elec. and Comp. Engineering
  • Department of Statistics
  • Department of Computational
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Carnegie Mellon University

External person

Jatinder Pal Singh

  • Technical University of Berlin
  • Deutsche Telekom

External person

Chong Ho Choi

  • Seoul National University
  • School of Electrical Eng./Comp. Sci.
  • Sch. of Computer Science and Eng.
  • School of Electrical Eng. & Computer Science

External person

Prashant Shenoy

  • University of Massachusetts
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sanjit A. Seshia

  • University of California, Berkeley
  • Department of EECS, University of California at Berkeley
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering and Computer Sciences, University of California, Berkeley
  • Department of Electrical Engineering and Computer Sciences
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • Department of Electrical Engineering and Computer Sciences

External person

Nadine B. Sarter

  • Ohio State University
  • Department of Industrial and Systems Engineering
  • Ohio State University

External person

Luca Sanguinetti

  • University of Pisa
  • ComUE Paris-Saclay
  • Dipartimento di Ingegneria dell'Informazione, Elettronica, Informatica, Telecomunicazioni
  • Université Paris-Saclay

External person

Ciyuan Zhang

  • Purdue University
  • Purdue University

External person

Zhiyuan Li

  • Dept. of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • IntelinAir Inc. San Jose
  • Dept. of Mechanical Science and Engineering
  • IntelinAir Inc.
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ming Cao

  • University of Groningen
  • Faculty of Mathematics and Natural Sciences
  • Faculty of Science and Engineering

External person

Khaled B. Letaief

  • Hong Kong University of Science and Technology

External person

Ahmed Fawaz

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Information Trust Institute
  • Information Trust Institute
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mani B. Srivastava

  • University of California, Los Angeles
  • Electrical Engineering Department
  • University of California at Los Angeles
  • University of California at San Diego

External person

Feiran Zhao

  • Tsinghua University
  • Tsinghua National Laboratory for Information Science and Technology

External person

Zhaoran Wang

  • Northwestern University
  • Northwest University China
  • Princeton University

External person

Subhrakanti Dey

  • University of Melbourne
  • IEEE
  • Department of of Electrical and Electronic Engineering
  • Department of Electrical and Electronic Engineering
  • Dept. of of Electrical Engineering
  • Department of Electrical and Electronic Engineering
  • Electrical Engineering Dept.

External person

Andrew R. Teel

  • University of California at Santa Barbara
  • Toyon Research Corporation
  • University of California Office of the President
  • Ctr. for Contr. Eng. and Computation
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Toyon Research Corporation
  • UC Santa Barbara College of Engineering

External person

J. B R Do Val

  • Universidade Estadual de Campinas
  • UNICAMP

External person

Zhou Yuan

  • University of Houston
  • Department of Electrical and Computer Engineering

External person

Deepak Ganesan

  • University of Massachusetts
  • University of California, Los Angeles
  • University of California at Los Angeles
  • University of Massachusetts Amherst

External person

Jin W. Kim

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Potsdam

External person

Lin F. Yang

  • University of California at Los Angeles
  • Chinese University of Hong Kong
  • University of Science and Technology of China
  • University of California at Berkeley
  • Princeton University
  • University of California Los Angeles

External person

Mehran Mesbahi

  • PSI Center
  • University of Washington

External person

Amar Prakash Azad

  • INRIA Sophia Antipolis
  • Institut national de recherche en informatique et en automatique

External person

Biying Shou

  • City University of Hong Kong
  • Department of Management Science

External person

Thomas Vallée

  • Nantes Université
  • LEN-C3E

External person

Wei Shi

  • University of Illinois Urbana-Champaign
  • Arizona State University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

M. Bragg

  • Department of Aerospace Engineering
  • AIAA
  • University of Illinois Urbana-Champaign
  • University of Washington
  • AIAA
  • Department of Aerospace Engineering
  • College of Engineering
  • Department of Aeronauticai and Astronauticai Engineering
  • Department of Aerospace Engineering
  • Department of Aerospace Engineering
  • Interim Dean of College of Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Department of Aerospace Engineering, University of Illinois Urbana-Champaign
  • Department of Aeronautical and Astronautical Engineering
  • Boeing
  • AIAA
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Washington

External person

Ying Ping Zheng

  • CAS - Institute of Automation
  • National Laboratory of Pattern Recognition

External person

Paulo Tabuada

  • University of California, Los Angeles
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of California at Los Angeles
  • University of California Los Angeles

External person

R. Chellappa

  • Purdue University
  • University of Maryland, College Park
  • School of Electrical Engineering
  • Computer Science Center
  • Institute for Systems Research
  • College of Engineering

External person

Pierre Bernhard

  • INRIA Sophia Antipolis
  • Université Côte d'Azur
  • University of Illinois Urbana-Champaign
  • Institut national de recherche en informatique et en automatique
  • Universite Cote d'Azur
  • University of Illinois at Urbana-Champaign

External person

Stephan Schmidt

  • Technical University of Berlin
  • DAI-Labor

External person

Mohammad Hossein Manshaei

  • Isfahan University of Technology
  • Department of Electrical and Computer Engineering

External person

Ben Marlin

  • University of Massachusetts
  • University of Massachusetts Amherst

External person

Dongsheng Ding

  • University of Southern California
  • University of Southern California
  • Department of Electrical Engineering, University of Southern California

External person

Tianyi Chen

  • Rensselaer Polytechnic Institute

External person

Paul Wang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical and Science Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Praveen Bommannavar

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dusit Niyato

  • Nanyang Technological University
  • School of Computer Engineering
  • Nanyang Technological University

External person

Kai Zheng

  • University of Illinois Urbana-Champaign
  • Dept. of Mech. and Indust. Eng.
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical and Industrial Engineering
  • Department of Mechanical Science and Engineering
  • Mittal Steel Company
  • Arcelor Mittal Steel Company USA R and D
  • Mechanical Science and Engineering
  • ArcelorMittal
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wei Xing

  • Dalian University of Technology

External person

Ananthram Swami

  • United States Army Research Laboratory
  • SRI International
  • DEVCOM Army Research Laboratory

External person

Demosthenis Teneketzis

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor

External person

Stein Gjessing

  • Rikshospitalet-Radiumhospitalet HF
  • Simula Research Laboratory
  • University of Oslo
  • Department of Informatics
  • Department of Informatics

External person

Mihailo R. Jovanovic

  • University of Southern California
  • University of Southern California
  • Department of Electrical Engineering, University of Southern California

External person

John T. Wen

  • Rensselaer Polytechnic Institute
  • Electrical, Computer, and Systems Engineering Department

External person

Maurizio Falcone

  • Dipartimento di Matematica
  • University of Rome La Sapienza

External person

Galina Schwartz

  • University of California, Berkeley
  • Department of Electrical Engineering and Computer Science
  • University of California at Berkeley

External person

Sebin Gracy

  • KTH Royal Institute of Technology
  • Rice University
  • Rice University

External person

David Kotz

  • Dartmouth College
  • Department of Computer Science
  • Department of Computer Science

External person

Garrett Warnell

  • University of Maryland, College Park
  • United States Army Research Laboratory
  • Institute for Systems Research

External person

Kamil Nar

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mariola Ndrio

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dritan Kaleshi

  • University of Bristol
  • Centre for Communications Research

External person

Mathias Hudoba De Badyn

  • Swiss Federal Institute of Technology Zurich

External person

Tianfu Ma

  • Shandong University

External person

Utsav Sadana

  • HEC Montreal

External person

Saswati Sarkar

  • University of Pennsylvania
  • IEEE
  • Dept. of Electrical and Systems Eng.

External person

Jane Wei Huang

  • University of British Columbia
  • Department of Electrical and Computer Engineering

External person

Xiaoqi Bi

  • University of Illinois at Urbana-Champaign
  • Industrial and Enterprise Systems Engineering
  • University of Illinois at Urbana-Champaign

External person

Jean Pierre Hubaux

  • École Polytechnique Fédérale de Lausanne
  • Swiss Federal Institute of Technology Lausanne
  • Ecole Polytechnique Federale de Lausanne

External person

Maryam Fazel

  • University of Washington
  • University of Washington
  • University of Washington

External person

Achim Mueller

  • Technical University of Berlin

External person

Antonio Massaro

  • Fondazione Bruno Kessler

External person

Yunpeng Wang

  • University of Miami
  • Department of Electrical and Computer Engineering

External person

A. Stephen Morse

  • Yale University
  • University of Illinois at Urbana-Champaign

External person

Won J. Jeon

  • Samsung Advanced Institute of Technology
  • University of Illinois Urbana-Champaign
  • Computer Science Laboratory
  • Computer Science, University of Illinois at Urbana-Champaign
  • Samsung
  • University of Illinois at Urbana-Champaign
  • Motorola
  • University of Illinois at Urbana-Champaign

External person

Yuke Li

  • Yale University
  • Department of Political Science and the Department of Electrical Engineering

External person

Xiangyun Zhou

  • Australian National University
  • Research School of Engineering

External person

Chunyu Wu

  • Dalian University of Technology

External person

Vijay Gupta

  • University of Notre Dame
  • California Institute of Technology
  • Div. of Engrg. and Appl. Sci.
  • Department of Electrical Engineering
  • Department of Electrica Engineering
  • Department of Electrical Engineering
  • University of Maryland, College Park
  • University of Notre Dame
  • California Institute of Technology
  • University of Notre Dame

External person

Arslan Gürdal

  • University of California, Los Angeles
  • Department of Mechanical and Aerospace Engineering
  • University of California at San Diego
  • University of California at Los Angeles

External person

Daniel Owusu Adu

  • Queen's University Kingston

External person

Amanda Hsu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Egemen E. Tezcan

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Vasco D'orey

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

James Krieger

  • University of California at San Diego
  • Department of Mechanical and Aerospace Engineering

External person

Narayan B. Mandayam

  • University of Medicine and Dentistry of New Jersey
  • Rutgers - The State University of New Jersey, New Brunswick
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Rutgers University

External person

Emma Hart

  • Edinburgh Napier University

External person

Sadjaad Ozgoli

  • Tarbiat Modarres University

External person

Sebastian F. Ruf

  • Center for Complex Network Research
  • Northeastern University
  • Georgia Institute of Technology

External person

Stephen J. Turnovsky

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Marco Conti

  • IFIP WGs 6.2, 63 and 6.8
  • IFIP WGs 6.2, 63 and 6.8
  • National Research Council of Italy
  • ACM
  • IEEE

External person

John Lygeros

  • Swiss Federal Institute of Technology Zurich

External person

Qinyi Wang

  • Beihang University
  • State Key Laboratory of Software Development Environment

External person

Xu Zhang

  • Huazhong University of Science and Technology

External person

Yanli Liu

  • University of California at Los Angeles

External person

Alper Oner

  • Istanbul Technical University
  • Mechatronics Education and Research Center

External person

Yong Xiao

  • Pengcheng National Laboratory (Guangzhou)
  • Huazhong University of Science and Technology

External person

Ming Qing Xiao

  • University of Illinois at Urbana-Champaign

External person

Aris L. Moustakas

  • National and Kapodistrian University of Athens

External person

Muhammad Aneeq uz Zaman

  • Coordinated Science Laboratory

External person

Romeil Sandhu

  • Center for Compound Semiconductor Microelectronics
  • University of Illinois Urbana-Champaign
  • Stony Brook University
  • University of Illinois at Urbana-Champaign

External person

Ch Deissenberg

  • Aix-Marseille Université

External person

Hyun Min Do

  • Seoul National University

External person

Paul H. McDowell

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Qianqian Ma

  • Boston University

External person

B. Ross Barmish

  • University of Illinois Urbana-Champaign
  • University of Wisconsin-Madison
  • Department of Electrical and Computer Engineering
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin

External person

Ross Blauwkamp

  • University of Illinois Urbana-Champaign
  • Dept. of Mech. and Indust. Eng.
  • Dept. of Mech. and Indust. Eng.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xingyu Sha

  • Tsinghua University
  • Tsinghua National Laboratory for Information Science and Technology

External person

Georgios B. Giannakis

  • University of Minnesota Twin Cities
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Dept. of ECE

External person

Qiaomin Xie

  • University of Illinois at Urbana-Champaign
  • Cornell University
  • University of Illinois at Urbana-Champaign

External person

Tyrone E. Duncan

  • University of Kansas
  • Department of Mathematics

External person

Hyuk Lim

  • Gwangju Institute of Science and Technology
  • Seoul National University
  • School of Electrical Eng./Comp. Sci.
  • Department of Nanobio Materials and Electronics
  • Department of Information and Communications

External person

Daniele Miorandi

  • CREATE-NET
  • Center for Research and Telecommunication Experimentation for Networked Communities

External person

Aidin Ferdowsi

  • Bradley Dept. of Electrical and Computer Engineering
  • Virginia Tech
  • Virginia Polytechnic Institute and State University
  • Virginia Tech College of Engineering

External person

Tijani Chahed

  • Télécom Paris
  • ComUE Paris-Saclay
  • Telecom SudParis, Institut Mines-Telecom, UMR CNRS 5157
  • Telecom SudParis, Institut Mines-Telecom, UMR CNRS 5157
  • Télécom SudParis
  • Institut Mines-Télécom

External person

T. J. Wen

  • Rensselaer Polytechnic Institute

External person

Chen Hou

  • Tsinghua National Laboratory for Information Science and Technology

External person

Stavros Toumpis

  • Athens University of Economics and Business

External person

Corinne Touati

  • ENSIMAG
  • Institut polytechnique de Grenoble
  • Mescal/LIG Project

External person

Mohamed El Kamili

  • Facultè des Sciences
  • Facultè des Sciences

External person

M. Kivanç Mihçak

  • Microsoft USA
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Stephen B. Wicker

  • Cornell University
  • School of Electrical and Computer Engineering

External person

Na Li

  • Harvard University
  • School of Engineering and Applied Sciences, Wyss Institute for Biologically Inspired Engineering, Harvard University
  • California Institute of Technology
  • California Institute of Technology
  • Harvard University

External person

Devesh Pokhariyal

  • University of Illinois Urbana-Champaign
  • Department of Aeronautical and Astronautical Engineering
  • Department of Aeronautical and Astronautical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Sonia Compans

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Anthony Ephremides

  • University of Maryland, College Park
  • IEEE
  • Department of Electrical Engineering

External person

Ying Ping Zhengh

  • CAS - Institute of Automation
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dan Wang

  • Hong Kong Polytechnic University

External person

Guanze Peng

  • New York University

External person

Baicen Xiao

  • Department of Electrical Engineering
  • University of Washington
  • University of Washington

External person

Serdar Yukse

  • Yale University
  • Dunham Lab.

External person

Vikram Krishnamurthy

  • University of British Columbia
  • Department of Electrical and Computer Engineering

External person

John R. Birge

  • The University of Chicago

External person

P. R. Kumar

  • Department of Electrical and Computer Engineering
  • Texas A&M University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Texas AandM University
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Dept. of Mech. and Indust. Eng.
  • Department of Mechanical Science and Engineering
  • Stanford University
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Corning Incorporated
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Texas A&m University

External person

Jin Young Choi

  • Seoul National University
  • Sch. of Computer Science and Eng.

External person

Wotao Yin

  • Rice University
  • Columbia University
  • IEOR Department
  • Department of Computational and Applied Mathematics
  • University of California at Los Angeles
  • Rice University

External person

Xi Ming Sun

  • Dalian University of Technology
  • School of Control Science and Engineering

External person

Zhu Han

  • Kyung Hee University
  • University of Houston

External person

Fuchun Sun

  • Tsinghua University
  • Tsinghua National Laboratory for Information Science and Technology (TNList)

External person

Dimitri P. Bertsekas

  • Massachusetts Institute of Technology
  • Dept. of Elec. Eng. and Comp. Sci.
  • Department of Electrical Engineering and Computer Science
  • Massachusetts Institute of Technology

External person

Julio Cesar Louzada Pinto

  • Télécom Paris
  • ComUE Paris-Saclay
  • Telecom SudParis, Institut Mines-Telecom, UMR CNRS 5157
  • Telecom SudParis, Institut Mines-Telecom, UMR CNRS 5157
  • Télécom SudParis
  • Institut Mines-Télécom

External person

Tao Sun

  • Amazon.com, Inc.

External person

Carsten W. Scherer

  • Mechanical Engineering Systems and Control Group
  • Delft University of Technology

External person

Mingyi Hong

  • University of Minnesota Twin Cities
  • Iowa State University
  • Department of Electrical and Computer Engineering
  • Department of Industrial and Manufacturing Systems Engineering
  • Digital Technology Center
  • University of Illinois Urbana-Champaign
  • University of Minnesota
  • University of Illinois at Urbana-Champaign
  • Iowa State University
  • Iowa State University
  • University of Illinois at Urbana-Champaign

External person

Jiajun Shen

  • Zhejiang University
  • Department of Control Science and Engineering

External person

Juntao Chen

  • Fordham University
  • New York University

External person

Thomas Hillbrand

  • Technische Universität Darmstadt
  • Laboratory of Control Systems and Process Automation

External person

Shu Jun Liu

  • Sichuan University
  • College of Mathematics

External person

Suresh P. Sethi

  • University of Texas at Dallas
  • School of Management

External person

N. Denizcan Vanli

  • Massachusetts Institute of Technology
  • Lab. for Info. and Decision Systems

External person

Hwangnam Kim

  • Korea University
  • School of Electrical Engineering

External person

Edward A. Whalen

  • Department of Aerospace Engineering
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yixuan Lin

  • Stony Brook University
  • Department of Applied Mathematics and Statistics
  • Stony Brook University
  • The Stony Brook University Cancer Center

External person

Simon Armour

  • University of Bristol
  • Centre for Communications Research

External person

Tae Han Kim

  • Seoul National University
  • School of Electrical Eng. & Computer Science

External person

Daniel Fullmer

  • Yale University

External person

Holly M. Gurbacki

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yuan Yuan

  • Tsinghua University
  • Tsinghua National Laboratory for Information Science and Technology (TNList)

External person

Jean Walrand

  • University of California, Berkeley
  • Belgian American Education Foundation
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical Engineering and Computer Sciences
  • Department of EECS, University of California at Berkeley
  • University of California at Berkeley

External person

Zhijin Cheng

  • Tellhow Intelligent Engineering Ltd.
  • Tsinghua University
  • Department of Automation
  • Tellhow Sci-Tech Co., Ltd.

External person

Asuman Ozdaglar

  • Massachusetts Institute of Technology
  • IEEE
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • Laboratory for Information and Decision Systems
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
  • Synthetic Biology Group, Research Laboratory of Electronics, Department of Biological Engineering and Electrical Engineering and Computer Science, Massachusetts Institute of Technology
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering
  • Dept. of EECS
  • Dept. of Electrical Engineering and Computer Science
  • Dept. of EECS
  • Dept. of Electrical Engineering and Computer Science
  • Dept. of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • Dept. of Elec. Eng. and Comp. Sci.
  • Massachusetts Institute of Technology

External person

Sadegh Arefizadeh

  • Tarbiat Modarres University
  • University of Alberta

External person

In Joong Ha

  • Seoul National University
  • School of Electrical Eng. & Computer Science

External person

Tanmay Khirwadkar

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign

External person

Rong Zheng

  • IEEE
  • University of Houston
  • Dept. of Computer Science
  • Department of Computer Science
  • Department Computer Science
  • University of Illinois Urbana-Champaign
  • Department of Compute Science
  • Department of Compute Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Univ. of Houston

External person

Navjot Singh

  • University of California at Los Angeles
  • University of California Los Angeles

External person

Nadine B. Sorter

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alain Bensoussan

  • University of Texas at Dallas
  • School of Management

External person

Siva Subramani

  • University of Bristol
  • Centre for Communications Research

External person

Donya G. Dobakhshari

  • University of Notre Dame
  • Department of Electrical Engineering
  • Department of Electrica Engineering
  • Department of Electrical Engineering
  • University of Notre Dame
  • University of Notre Dame

External person

Jameson Mori

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • College of Veterinary Medicine at Uiuc

External person

Veeraruna Kavitha

  • Avignon Université
  • INRIA Sophia Antipolis

External person

Sahika Genc

  • Amazon.com, Inc.

External person

Alireza Aram

  • University of Pennsylvania
  • Finance Department

External person

Roy Smith

  • University of California at Santa Barbara
  • University of Waterloo
  • California Institute of Technology
  • Rockwell Semiconductor Systems
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Conexant
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • Swiss Federal Institute of Technology Zurich
  • UC Santa Barbara College of Engineering

External person

Weibo Gong

  • University of Massachusetts
  • Computer Science Department
  • Department of Chemical Engineering, University of Massachusetts Amherst

External person

Puduru Viswanadha Reddy

  • Indian Institute of Technology Madras

External person

Vida Ravanmehr

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ruihao Zhu

  • Massachusetts Institute of Technology

External person

David Simchi-Levi

  • Massachusetts Institute of Technology
  • Department of Civil and Environmental Engineering, Massachusetts Institute of Technology
  • Operations Research Center
  • Massachusetts Institute of Technology

External person

Yifei Zhu

  • Shanghai Jiao Tong University

External person

Rongping Zhu

  • Tsinghua University
  • Tsinghua National Laboratory for Information Science and Technology

External person

Tao Li

  • New York University

External person

Umesh Vaidya

  • Iowa State University
  • Department of ElectricalandComputer Engineering
  • Iowa State University
  • Clemson University
  • Clemson University College of Engineering, Computing and Applied Sciences
  • Iowa State University

External person

Cody Guldner

  • Department of Computer Science

External person

E. A. Schuchard

  • Randolf AFB
  • United States Navy

External person

Yuhan Kang

  • University of Houston

External person

Ali Houjeij

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mohammed Abbad

  • Facultè des Sciences
  • Facultè des Sciences

External person

Scott A. Mccray

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. C. Ho

  • Harvard University
  • Division of Engineering and Applied Physics
  • Division of Applied Sciences
  • Harvard University

External person

Jiangmeng Zhang

  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pulkit Grover

  • University of California, Berkeley
  • Stanford University
  • Department of Electrical Engineering
  • Stanford University
  • University of California at Berkeley
  • Stanford University

External person

Rachid El Azouzi

  • Avignon Université

External person

Miroslav Krstica

  • University of California at San Diego

External person

Sham M. Kakade

  • Rutgers - The State University of New Jersey, New Brunswick
  • Microsoft USA
  • University of Washington
  • University of Washington
  • University of Pennsylvania
  • Toyota Technological Institute
  • Toyota Technological Institute at Chicago

External person

Gianni Ricci

  • University of Modena and Reggio Emilia

External person

Gulay Oke Gunel

  • Istanbul Technical University

External person

Yingyu Li

  • Huazhong University of Science and Technology

External person

Eunsuk Kang

  • Carnegie Mellon University
  • Carnegie Mellon University
  • Carnegie Mellon University

External person

Xiao Mingqing

  • University of California at Davis
  • Department of Mathematics

External person

Jennifer C. Hou

  • ACM
  • University of Illinois Urbana-Champaign
  • IEEE
  • University of IIlinois
  • ACM
  • Computer Science, University of Illinois at Urbana-Champaign
  • Dept. of Computer Science
  • Department of Computer Science, University of Illinois
  • Department of Computer Science
  • Department of Computer Science
  • Department of Compute Science
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois at Urbana-Champaign

External person

Zhong Fan

  • Toshiba Corporation

External person

Hans P. Geer1Ng

  • Swiss Federal Institute of Technology Zurich
  • Department of Mechanical Engineering and the Measurement and Control. Laboratory.

External person

Guangming Shi

  • Pengcheng National Laboratory (Guangzhou)
  • Xidian University

External person

Mingqing Xiaq

  • University of California at Davis

External person

Wesley Suttle

  • Stony Brook University
  • The Stony Brook University Cancer Center

External person

Hossein Hosseini

  • University of Washington
  • University of Washington

External person

Behrouz Maham

  • University of Tehran
  • School of Electrical and Computer Engineering

External person

Hans P. Geering

  • Swiss Federal Institute of Technology Zurich
  • ETH, Dep of Mechanical Engineering,

External person

Emiliano Dall'Anese

  • University of Minnesota Twin Cities
  • National Renewable Energy Laboratory
  • Department of Electrical and Computer Engineering
  • Department of ECEE
  • University of Colorado Boulder
  • National Renewable Energy Laboratory
  • University of Colorado Boulder

External person

Dylan Janak

  • University of Washington

External person

Pramod P. Khargonekar

  • University of Florida
  • College of Engr.
  • University of Florida

External person

Jiongmin Yong

  • University of Central Florida

External person

Dinuka Sahabandu

  • University of Washington
  • University of Washington

External person

David S. Leslie

  • Lancaster University

External person

Şahin Albayrak

  • Technical University of Berlin
  • DAI-Labor

External person

Aranya Chakrabortty

  • Department of Electrical and Computer Engineering
  • North Carolina State University

External person

I. Egemen Tezcan

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Husheng Li

  • University of Tennessee, Knoxville
  • Department of Electrical Engineering and Computer Science
  • Univ. of Tennessee

External person

Sameer Vijay

  • Department of Computer Science

External person

Sunil Mallya

  • Amazon.com, Inc.

External person

Daniel P. Palomar

  • Hong Kong University of Science and Technology
  • Department of Electronic and Computer Engineering

External person

Yunzhe Tao

  • Amazon.com, Inc.

External person

Ishai Menache

  • Massachusetts Institute of Technology
  • Microsoft Research Asia
  • Lab. for Info. and Decision Systems
  • Microsoft USA

External person

Mark Salmon

  • European University Institute, San Domenico di Fiesole

External person