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Network

Deepak Somaya

Person: Academic

Vivek K. Goyal

  • Massachusetts Institute of Technology
  • Research Laboratory of Electronics
  • Boston University
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering
  • Dept. of Electrical Engineering and Computer Science
  • Research Laboratory of Electronics, Massachusetts Institute of Technology
  • Department of Electrical Engineering and Computer Science
  • Signal Transformation and Information Representation Group
  • Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology

External person

Kush R. Varshney

  • IBM
  • Massachusetts Institute of Technology
  • Lab. for Info. and Decision Systems
  • Mathematical Sciences and Analytics
  • Mathematical Sciences Department
  • T.J. Watson Research Center

External person

Avhishek Chatterjee

  • University of Illinois at Urbana-Champaign
  • University of Texas at Austin
  • Indian Institute of Technology, Madras
  • Department of Electrical Engineering
  • IIT

External person

Anshoo Tandon

  • National University of Singapore
  • Department of Electrical and Computer Engineering

External person

Mehul Motani

  • National University of Singapore
  • Cornell University
  • Worcester Polytechnic Institute
  • IEEE
  • Department of Electrical and Computer Engineering

External person

Aditya Vempaty

  • Syracuse University
  • IBM
  • Department of Electrical Engineering and Computer Science
  • Department of EECS
  • T.J. Watson Research Center

External person

Pramod K. Varshney

  • Syracuse University
  • EECS Department
  • Department of Electrical Engineering and Computer Science
  • Department of EECS

External person

Daniel V. Oppenheim

  • IBM
  • T.J. Watson Research Center

External person

Daewon Seo

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Yi Min Chee

  • IBM
  • Industry Solutions Research department
  • T.J. Watson Research Center

External person

Ravi Kiran Raman

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Ting Yi Wu

  • University of Illinois at Urbana-Champaign
  • Sun Yat-Sen University
  • Sun Yat-sen University

External person

J. Kusuma

  • Massachusetts Institute of Technology
  • Schlumberger
  • Research Laboratory of Electronics, Massachusetts Institute of Technology
  • Stanford University
  • Department of Computer Science

External person

Joong Bum Rhim

  • Massachusetts Institute of Technology
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
  • Research Laboratory of Electronics, Massachusetts Institute of Technology

External person

Yongjune Kim

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Western Digital

External person

Sriram Vishwanath

  • University of Texas at Austin
  • Wireless Networking and Communication Group
  • Department of Electrical, and Computer Engineering

External person

Ha Q. Nguyen

  • Massachusetts Institute of Technology
  • Dept. of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • Research Laboratory of Electronics, Massachusetts Institute of Technology

External person

Vinith Misra

  • Massachusetts Institute of Technology
  • Stanford University
  • Department of Electrical Engineering
  • Signal Transformation and Information Representation Group

External person

Dmitri B. Chklovskii

  • Cold Spring Harbor Laboratory
  • Howard Hughes Medical Institute

External person

Sourya Basu

  • University of Illinois at Urbana-Champaign
  • Indian Institute of Technology, Kanpur
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Vincent Y.F. Tan

  • Department of Electrical and Computer Engineering
  • National University of Singapore
  • Department of Mathematics

External person

Sanjoy K. Mitter

  • Massachusetts Institute of Technology
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • Lab. for Info. and Decision Systems

External person

Haizi Yu

  • University of Illinois at Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign

External person

Florian Pinel

  • IBM
  • IBM Research
  • T.J. Watson Research Center
  • IBM Research

External person

Michael Borokhovich

  • University of Texas at Austin
  • Wireless Networking and Communication Group

External person

Krishna Jagannathan

  • Indian Institute of Technology, Madras
  • Department of Electrical Engineering

External person

Amir Hesam Salavati

  • Swiss Federal Institute of Technology Lausanne

External person

Angela Schörgendorfer

  • IBM
  • T.J. Watson Research Center

External person

Rebecca Chen

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Gregory J. Koop

  • Eastern Mennonite University
  • Department of Psychology
  • Eastern Mennonite University

External person

Linjia Chang

  • University of Illinois at Urbana-Champaign

External person

Wee Peng Tay

  • Nanyang Technological University
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Amy H. Criss

  • Syracuse University
  • Department of Psychology

External person

Preethi Jyothi

  • University of Illinois at Urbana-Champaign
  • Indian Institute of Technology, Bombay
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology

External person

Ameya Patil

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Amin Shokrollahi

  • Swiss Federal Institute of Technology Lausanne

External person

Xiou Ge

  • University of Illinois at Urbana-Champaign

External person

Amin Karbasi

  • Swiss Federal Institute of Technology Lausanne
  • Swiss Federal Institute of Technology Zurich
  • LCAV
  • Yale University
  • Department of Computer Science
  • Computer and Communication Sciences

External person

Theodoros Mamalis

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

D. Bhattacharjya

  • IBM
  • T.J. Watson Research Center

External person

Lakshminarayan Srinivasan

  • Stanford University
  • Department of Radiology

External person

Feng Ji

  • Nanyang Technological University
  • School of Electrical and Electronic Engineering
  • School of Electrical and Electronic Engineering

External person

Mingu Kang

  • University of Illinois at Urbana-Champaign
  • IBM
  • T.J. Watson Research Center

External person

Roman Vaculín

  • IBM
  • IBM Research
  • Mobile
  • T.J. Watson Research Center
  • IBM Research

External person

John Z. Sun

  • Massachusetts Institute of Technology
  • Research Laboratory of Electronics, Massachusetts Institute of Technology

External person

Gireeja Ranade

  • University of California at Berkeley
  • Electrical Engineering and Computer Sciences
  • Microsoft USA

External person

Sasikanth Manipatruni

  • Intel
  • Intel Corp.

External person

Rakesh Pimplikar

  • IBM Research
  • IBM Research

External person

Nagendra Bala Murali Athreya

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology

External person

Tianxi Li

  • University of Michigan, Ann Arbor

External person

Thomas E. Kunetz

  • Monitoring and Research Department

External person

Anas Chaaban

  • King Abdullah University of Science and Technology
  • CEMSE Division

External person

Evan Sadler

  • Harvard University

External person

Vijay Gupta

  • Notre Dame University
  • California Institute of Technology
  • Div. of Engrg. and Appl. Sci.
  • Department of Electrical Engineering
  • Department of Electrica Engineering
  • University of Notre Dame
  • Department of Electrical Engineering

External person

Mohamed Slim Alouini

  • King Abdullah University of Science and Technology
  • CEMSE Division

External person

Devavrat Shah

  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign
  • EECS Department
  • Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Computer Science

External person

Lior Limonad

  • IBM Research
  • IBM
  • IBM Research

External person

Jinjun Xiong

  • IBM
  • Cognitive Computing Systems Research
  • IBM Research
  • University of Illinois at Urbana-Champaign
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • IBM Research
  • T.J. Watson Research Center

External person

Sundeep Rangan

  • University of California at Berkeley
  • New York University
  • Electrical Engineering Department, 147 Cory Hall, University of California
  • Polytechnic Institute

External person

Palakorn Achananuparp

  • Singapore Management University

External person

Alexander Jones Gross

  • University of Maine

External person

Alyson K. Fletcher

  • University of California at Berkeley

External person

Grace I. Wang

  • Massachusetts Institute of Technology
  • Harvard University
  • Research Laboratory of Electronics, Massachusetts Institute of Technology
  • Eaton-Peabody Laboratories

External person

Jing Y. Shyr

  • IBM
  • T.J. Watson Research Center

External person

Dmitri Nikonov

  • Intel
  • Intel Corp.

External person

Minami Sugimoto

  • Department of Public Health
  • Cancer Scan

External person

Mayank Amencherla

  • University of Illinois at Urbana-Champaign

External person

Keisuke Matsushima

  • Keisuke Matsushima

External person

H. S Philip Wong

  • Stanford University
  • Department of Electrical Engineering, Stanford University
  • Dept. of Electrical and Engineering
  • Department of Electrical Engineering

External person

Mehmet A. Donmez

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Abhinav B. Das

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Dominic A. Brose

  • Monitoring and Research Department

External person

Naveen Verma

  • Princeton University
  • Department of Electrical Engineering

External person

Ankur Mani

  • Massachusetts Institute of Technology
  • Arizona State University
  • Arts Media and Engineering Program
  • Media Lab.

External person

Karzand, Mina

  • Massachusetts Institute of Technology

External person

Derek Botti

  • IBM
  • T.J. Watson Research Center

External person

Yair Wand

  • University of British Columbia
  • MIS division
  • MIS division

External person

Masahiro Kazama

  • Habitech Inc.

External person

Young Sik Kim

  • Chosun University
  • Department of Information and Communication Engineering

External person

Krishna Ratakonda

  • IBM
  • University of Illinois at Urbana-Champaign
  • Beckman Inst
  • IBM Research
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Multimedia Department
  • T.J. Watson Research Center
  • IBM Research

External person

Sheila U. Appel

  • IBM
  • T.J. Watson Research Center

External person

Helena Lee

  • Singapore Management University

External person

Dharmashankar Subramanian

  • T.J. Watson Research Center

External person

Yunghsiang S. Han

  • National Taiwan University of Science and Technology
  • Department of EE

External person

Hao Chen

  • Boise State University
  • Department of Electrical and Computer Engineering

External person

Ilan Lobel

  • New York University

External person

Alex Wein

  • Stanford University
  • Department of Computer Science

External person

Chizuru Hosokawa

  • Department of Public Health
  • Cancer Scan

External person

Chien Sheng Yang

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Qunwei Li

  • Syracuse University
  • Department of Electrical Engineering and Computer Science

External person

Moran Gavish

  • IBM Research
  • IBM
  • IBM Research

External person

Yoshiki Ishikawa

  • Habitech Inc.

External person

Anant Sahai

  • University of California at Berkeley

External person

Vei Wang Isaac Phua

  • Chinese University of Hong Kong

External person

Aniruddha Bhargava

  • University of Wisconsin-Madison

External person

Alex Pentland

  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Media Lab.
  • Univ of Illinois

External person

Aseem Sharma

  • Indian Institute of Technology, Madras
  • Department of Electrical Engineering

External person

Amit Singh

  • IBM Research

External person

Eric Paniagua

  • California Institute of Technology

External person

Eric Pop

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Department of Electrical and Computer Engineering
  • Electrical Engineering, Stanford University
  • Intel
  • Bldg 500
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Micro and Nanotechnology Laboratory, University of Illinois
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Mechanical Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Precourt Institute for Energy
  • Dept. of Electrical
  • Department of Electrical and Computer Engineering

External person

Sharma, Aseem

  • Department of Electrical Engineering, IIT Madras
  • Indian Institute of Technology, Madras
  • Department of Electrical Engineering

External person

Per Jesper Sjöström

  • University College London
  • Wolfson Institute for Biomedical Research

External person

Pnina Soffer

  • University of Haifa
  • Information Systems Department

External person

Sameep Mehta

  • IBM Research
  • IBM Research

External person

Bryan D. He

  • Stanford University
  • Department of Computer Science

External person

Lawrence T. Pileggi

  • Carnegie Mellon University
  • IBM
  • University of Texas at Austin
  • IBM Microelectronics
  • Global Foundries, Inc.
  • Dept. of Elec. and Comp. Engineering

External person

Song Jianhan

  • Chinese University of Hong Kong

External person

Thomas, Daniel

  • Syracuse Research Corporation
  • SRC, Inc.

External person

Ateret Anaby-Tavor

  • IBM Research
  • IBM
  • IBM Research

External person

Elad Fein

  • IBM Research
  • IBM
  • IBM Research

External person

Jun Wang

  • Alibaba Group
  • Alibaba Group, USA
  • Alibaba Group Holding Ltd.

External person

Subhasish Mitra

  • Stanford University
  • Intel
  • IEEE
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical Engineering
  • Department of CS
  • Department of EE
  • Department of Electrical Engineering and Computer Science

External person

Leslie Plant

  • IBM
  • T.J. Watson Research Center

External person

Donya G. Dobakhshari

  • Notre Dame University
  • Department of Electrical Engineering
  • Department of Electrica Engineering
  • University of Notre Dame
  • Department of Electrical Engineering

External person

Dhiraj Murthy

  • University of Texas at Austin

External person

Karthik Visweswariah

  • IBM Research
  • IBM Research

External person

Mohil Shah

  • Complex and Sustainable Urban Networks (CSUN) Laboratory
  • Department of Civil and Materials Engineering
  • University of Illinois at Chicago

External person

Noyan C. Sevüktekin

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

David H. Hall

  • Yeshiva University

External person

Ian Young

  • Intel
  • Intel Corp.

External person

Yue Liu

  • Singapore Management University

External person

Andrew G. Richardson

  • University of Pennsylvania
  • Center for Neuroengineering and Therapeutics
  • Department of Neurosurgery
  • Stanford University
  • Department of Radiology

External person

Daewon Seo

  • University of Wisconsin-Madison

External person

Beth L. Chen

  • Cold Spring Harbor Laboratory

External person

Huozhi Zhou

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Pulkit Grover

  • University of California at Berkeley
  • Stanford University
  • Department of Electrical Engineering

External person

Kuldip Kumar

  • Monitoring and Research Department

External person

Elsa Dupraz

  • Ecole Nationale d'Ingenieurs de Sfax
  • CNRS

External person

Ashish Jagmohan

  • IBM
  • University of Illinois at Urbana-Champaign
  • Illinois Univ.
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • University of Illi-nois
  • University of Illinois
  • T.J. Watson Research Center
  • University of Illinois at Chicago

External person

Aditya Sarathy

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology

External person

Jeffrey Weldon

  • Carnegie Mellon University

External person

Jan Rabaey

  • University of California at Berkeley
  • Department of EECS, University of California at Berkeley

External person

John Mulrow

  • Complex and Sustainable Urban Networks (CSUN) Laboratory
  • Department of Civil and Materials Engineering
  • University of Illinois at Chicago

External person

Newell, Brooke S.

  • University of Illinois at Urbana-Champaign

External person

Darshan Jain

  • Complex and Sustainable Urban Networks (CSUN) Laboratory
  • Department of Civil and Materials Engineering
  • University of Illinois at Chicago

External person

James Jamison

  • IBM
  • T.J. Watson Research Center

External person

Ee Peng Lim

  • Singapore Management University
  • School of Information Systems

External person