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Network

H. Choi

  • Micro and Nanotechnology Laboratory, University of Illinois
  • Korea Institute of Science and Technology
  • Micro and Nanotechnology Laboratory and Department of Electrical and Computer Engineering, University of Illinois
  • Univ. Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory

External person

J. M. Myoung

  • Samsung Advanced Inst of Technology
  • Univ. Illinois at Urbana-Champaign
  • Samsung Advanced Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Depts. of Mat. Sci. and Eng.
  • Department of Electrical and Computer Engineering
  • Samsung

External person

Liang Pang

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Robert J. Turnbull

  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

K. H. Shim

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Depts. of Mat. Sci. and Eng.
  • Samsung Advanced Institute of Technology
  • Samsung

External person

Daniel W. Pack

  • University of Illinois at Urbana-Champaign
  • University of Kentucky
  • Department of Bioengineering
  • Dept. of Chemical and Biomolecular Engineering
  • Depts. of Bioeng.
  • Chem. and Biomol. Eng. Department
  • Department of Chemical and Materials Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineerin
  • Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering

External person

Cory Berkland

  • University of Illinois at Urbana-Champaign
  • University of Kansas
  • Department of Pharmaceutical Chemistry
  • Dept. of Chemical and Biomolecular Engineering
  • Department of Pharmaceutical Chemistry
  • Chem. and Biomol. Eng. Department
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineerin

External person

Huichan Seo

  • University of Illinois at Urbana-Champaign
  • Intel
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • Frederick Seitz Materials Research Laboratory

External person

Wenhua Gu

  • University of Illinois at Urbana-Champaign
  • Infinera Corporation
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Philip Edward Heil

  • Materials Science and Engineering Department
  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

T. L. King

  • Urbana, IL, USA
  • Univ of Houston
  • University of Houston
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Fusion Technol & Charged

External person

Chinkyo Kim

  • LG Corporate Institute of Technology
  • Opto-electronics Group
  • University of Illinois at Urbana-Champaign
  • LG Corporation
  • Department of Physics

External person

M. C. Yoo

  • Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Samsung Advanced Inst of Technology
  • Samsung Advanced Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Samsung

External person

Patrick Chapman

  • University of Texas at Arlington
  • SolarBridge Technologies
  • UIUC
  • University of Illinois at Urbana-Champaign
  • IEEE
  • Grainger Center for Electric Machinery and Electromechanics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Grainger Center for Electric Machinery and Electromechanics
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Depts. of Electrical and Computer Engineering
  • UIUC
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign

External person

Oleg Gluschenkov

  • IBM
  • University of Illinois at Urbana-Champaign
  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM Semiconduct. Res./Devmt. Ctr.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Depts. of Mat. Sci. and Eng.
  • IBM Research

External person

J. Zhang

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Houston

External person

Young Bin Choy

  • Seoul National University
  • University of Illinois at Urbana-Champaign
  • Department of Biomedical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

C. D. Hendricks

  • Lawrence Livermore Laboratory
  • Livermore, CA, USA
  • Lawrence Livermore National Laboratory
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

James P. Woosley

  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

In Yong Kim

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Biotechnology
  • Korea University
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign

External person

T. P. Bernat

  • Lawrence Livermore National Laboratory

External person

Emily J. Pollauf

  • College of Engineering and Applied Science
  • University of Illinois at Urbana-Champaign
  • Dept. of Chemical and Biomolecular Engineering
  • Chemical and Biological Engineering
  • University of Colorado Boulder
  • Department of Chemical and Biomolecular Engineering

External person

Felice Cheng

  • University of Illinois at Urbana-Champaign
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Seung Jae Hong

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering

External person

Lawrence S. Mok

  • Univ of Illinois, Urbana, IL, USA
  • IBM
  • IBM
  • University of Illinois at Urbana-Champaign
  • IBM
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Fusion Technology Laboratory
  • Fusion Studies Laboratory, Nuclear Engineering Program
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Sangho Lim

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

I. K. Robinson

  • University of Illinois at Urbana-Champaign
  • Department of Physics
  • Materials Research Laboratory, University of Illinois
  • Department of Physics
  • University College London
  • Departments of Physics Astronomy
  • Department of Physics
  • the Materials Research Laboratory, University of Illinois
  • Department of Physics
  • Frederick Seitz Materials Research Laboratory

External person

Ja Kyeong Lee

  • Inha University School of Medicine
  • Inha Research Institute for Medical Sciences, Inha University School of Medicine
  • Inha University
  • Department of Anatomy and Center for Advanced Medical Education (BK21 project)
  • Department of Anatomy
  • Medical Research Center

External person

Elizabeth Joachim

  • Medical Scholars Program, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Department of Bioengineering
  • Medical Scholars Program, Beckman Institute for Advanced Science and Technology, University of Illinois Urbana-Champaign

External person

Fawad Ismail

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Jung Hee Lee

  • Kyungpook National University
  • School of Electronic and Electrical Engineering
  • School of Electrical Engineering and Computer Science, Kyungpook National University
  • Sch. of Electron. Eng./Comp. Science

External person

S. G. Bishop

  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Microeectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Dept. of Mat. Sci. and Engineering

External person

S. Kim

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Korea University
  • Electrical Engineering Department
  • Ctr. Compd. Semiconducter M
  • Microeectronics Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

J. Honig

  • Urbana, IL, USA
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Fusion Technology Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Fusion Studies Laboratory, Nuclear Engineering Program

External person

Kam Yong Jang

  • University of Illinois at Urbana-Champaign
  • Lawrence Livermore National Laboratory
  • Fusion Technology/Charged Particle Research Laboratory
  • Fusion Technology Laboratory
  • Fusion Technology and Charged Particle Research Laboratory

External person

Il Doo Kim

  • Department of Anatomy
  • Inha University
  • Medical Research Center

External person

M. W. Tompkins

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

M. A. Anderson

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

William Manns

  • Urbana, IL, USA
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Fusion Technol & Charged

External person

Palash Sarker

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Richard Haywood

  • Urbana, IL, USA
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Fusion Technol & Charged

External person

Man Y. Sung

  • Korea University
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering and Division of Chemistry and Molecular Engineering
  • Department of Electrical Engineering

External person

Harry Rieger

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Dong Seok Kim

  • Kyungpook National University
  • School of Electrical Engineering and Computer Science, Kyungpook National University

External person

Yaguang Lian

  • University of Illinois at Urbana-Champaign
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Hyunmin Kang

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Changwook Kim

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering

External person

Choon Kun Ryu

  • University of Illinois at Urbana-Champaign

External person

S. J. Yun

  • University of Illinois at Urbana-Champaign
  • Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Electronics and Telecommunications Research Institute

External person

Sungho Park

  • LG-Phillips R and D Center
  • University of Illinois at Urbana-Champaign
  • LG Corporation
  • LG-Phillips R and D Center
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Pyung Lim Han

  • Ewha Womans University
  • Department of Chemistry and Nano Science, Ewha Womans University
  • Division of Nano Sciences and Brain Disease Research Institute
  • Department of Brain and Cognitive Sciences

External person

Frank Putnam Kelly

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Yin Chuan Jin

  • Inha University School of Medicine
  • Inha Research Institute for Medical Sciences, Inha University School of Medicine
  • Inha University
  • Department of Anatomy and Center for Advanced Medical Education (BK21 project)
  • Department of Anatomy

External person

D. A. Turnbull

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory

External person

David Chandler

  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign

External person

J. T. Verdeyen

  • CU Aerospace
  • University of Illinois at Urbana-Champaign
  • CU Aerospace
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Electrical Engineering Research Laboratory

External person

V. Varadarajan

  • University of Illinois at Urbana-Champaign
  • Fusion Studies Laboratory, Nuclear Engineering Program
  • Lawrence Livermore National Laboratory

External person

Benjamin Lew

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Ravindra S. Upadhye

  • Lawrence Livermore National Laboratory

External person

I. Petrov

  • Linköping University
  • Dept. of Mat. Sci. and Engineering
  • Engineering University of Illinois at Urbana-Champaign
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • Linköping University
  • University of Illinois at Urbana-Champaign
  • 3M Materials Laboratory
  • 3M Materials Laboratory
  • Department of Materials Science
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Frederick Seitz Materials Research Laboratory
  • Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Dept. Mat. Sci. Frederick Seitz M.
  • Dept. of Mat. Sci./Engineering
  • Technique and Applications
  • International Union for Vacuum Science
  • Dept. Mat. Sci. Frederick Seitz M.
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory

External person

Zhi Zheng

  • University of Illinois at Urbana-Champaign
  • University of Electronic Science and Technology of China
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Hye Kyung Lee

  • Department of Anatomy
  • Inha University
  • Medical Research Center

External person

Martha Briceno

  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering

External person

E. M. Simpson

  • University of Illinois at Urbana-Champaign
  • Fusion Technology Laboratory

External person

Riley Elis Vesto

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Amanda Cox

  • University of Illinois at Urbana-Champaign
  • Dept. of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering

External person

Chandrashekar Raman

  • University of Illinois at Urbana-Champaign
  • Dept. of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering

External person

W. H. Choe

  • University of Illinois at Urbana-Champaign
  • Fusion Technology Laboratory
  • Fusion Studies Laboratory, Nuclear Engineering Program

External person

S. H. Rhee

  • University of Illinois at Urbana-Champaign

External person

Mark Nelkin

  • Cornell University
  • School of Applied and Engineering Physics
  • Department of Applied Physics

External person

I. M. Robertson

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Wisconsin-Madison
  • Kyushu University
  • University of Oregon
  • Dept. of Mat. Sci. and Engineering
  • International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University
  • Department of Mechanical Science and Engineering
  • Department of Materials Science
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Materials Science Division, Argonne National Laboratory
  • Department of Materials Science
  • Department of Engineering Physics
  • Department of Materials Science and Engineering and Department of Engineering Physics
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Mechanical Science and Engineering
  • Department of Physics
  • The University of Chicago
  • Argonne National Laboratory

External person

Jeffrey O. White

  • University of Illinois at Urbana-Champaign
  • Department of Physics
  • Frederick Seitz Materials Research Laboratory
  • Frederick Seitz Materials Research Laboratory
  • the Materials Research Laboratory, University of Illinois
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign

External person

James J. Fanning

  • Univ of Illinois, Urbana, IL, USA
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Jung Hee Lee

  • School of Electronic and Electrical Engineering
  • Kyungpook National University
  • School of Electrical Engineering and Computer Science, Kyungpook National University

External person

K. S. Robinson

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

C. A. Foster

  • Oak Ridge National Laboratory
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

S. W. Wedge

  • University of Illinois at Urbana-Champaign
  • Fusion Technology Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Fusion Studies Laboratory, Nuclear Engineering Program

External person

David J. Zhang

  • Urbana, IL, USA
  • University of Illinois at Urbana-Champaign
  • Fusion Technol & Charged
  • Fusion Technology Laboratory

External person

Yi Yang

  • University of Illinois at Urbana-Champaign
  • KLA-Tencor Corporation
  • Thin Film and Charged Particle Research Laboratory
  • Department of Electrical and Computer Engineering

External person

Ki Won Kim

  • School of Electronic and Electrical Engineering
  • Kyungpook National University

External person

R. P. Gilliard

  • General Electric
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Q. Feng

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

M. C. Yoo

  • Compound Semiconductor Research Laboratory
  • Samsung Advanced Institute of Technology
  • Samsung

External person

K. C. Hsieh

  • Dept. of Elec. and Comp. Engineering
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Electrical Engineering Research Laboratory
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • Center for Compound Semiconductor Microelectronics
  • Micro and Nanotechnology Laboratory, University of Illinois

External person

Ho Chu Kang

  • University of Illinois at Urbana-Champaign
  • Thin Film and Charged Particle Research Laboratory

External person

J. Gao

  • Advanced Lighting Technology, Inc.
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Everitt Laboratoy
  • Applied Physics Laboratory
  • Department of Electrical and Computer Engineering

External person

Nilda Juan Serrano

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

External person

Rolf Timp

  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Micro and Nanotechnology Laboratory, University of Illinois
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign

External person

Ho G. Jang

  • University of Illinois at Urbana-Champaign
  • Korea University
  • Department of Electrical Engineering and Division of Chemistry and Molecular Engineering

External person

J. L. Guttman

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Seung Woo Kim

  • Inha University School of Medicine
  • Inha University
  • Department of Anatomy and Center for Advanced Medical Education (BK21 project)

External person

Y. Yang

  • Dalian University of Technology
  • University of Illinois at Urbana-Champaign
  • Department of Naval Architecture

External person

A. E. Wickenden

  • Naval Research Laboratory

External person

E. W. Cowell

  • University of Illinois at Urbana-Champaign

External person

Paul Lawrence Pusey

  • Tree Fruit Research Laboratory
  • United States Department of Agriculture
  • U.S. Department of Agriculture

External person

Roshelle Silverman

  • University of Illinois at Urbana-Champaign
  • Dept. of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering

External person

Jin Kuen Park

  • University of Illinois at Urbana-Champaign
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

M. J. Erlenborn

  • University of Illinois at Urbana-Champaign
  • Fusion Technology Laboratory
  • Fusion Studies Laboratory, Nuclear Engineering Program

External person

Mohamed Mohamed

  • University of Illinois at Urbana-Champaign
  • Massachusetts Institute of Technology
  • Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign

External person

R. Dharamshi

  • University of Houston
  • Department of Electrical and Computer Engineering

External person

Francesco Venneri

  • University of Illinois at Urbana-Champaign
  • Fusion Technol & Charged

External person

Hyungsoo Choi'

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering

External person

B. J. Smoot

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Timothy E. Day

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Hyejin Jeong

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering

External person

Amy L. Oldenburg

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Physics and Astronomy, University of North Carolina
  • University of North Carolina at Chapel Hill
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Chicago
  • Biophotonics Imaging Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics and Astronomy and the Biomedical Research Imaging Center
  • Department of Physics and Astronomy

External person

J. Zhang

  • University of Houston

External person

R. L. Henry

  • Naval Research Laboratory

External person

Hunter McDaniel

  • Los Alamos National Laboratory
  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Chemistry Division

External person

Ju Gao

  • APL Engineered Materials, Inc.

External person

T. L. Buller

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Kevan Samiee

  • University of Illinois at Urbana-Champaign
  • Frederick Seitz Materials Research Laboratory
  • Frederick Seitz Materials Research Laboratory

External person

Adel M. Marzougui

  • University of Illinois at Urbana-Champaign
  • Fusion Technology Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Fusion Studies Laboratory, Nuclear Engineering Program

External person

M. M. Islam Raja

  • University of Illinois at Urbana-Champaign
  • Fusion Technology Laboratory
  • Fusion Studies Laboratory, Nuclear Engineering Program

External person

Munima Haque

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Joe Roland

  • University of Illinois at Urbana-Champaign
  • Dept. of Cell and Structural Biology

External person

R. D. Todd

  • University of Illinois at Urbana-Champaign
  • Lawrence Livermore National Laboratory
  • Fusion Technology Laboratory

External person

Z. G. Figen

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Yoshinori Koga

  • Natl. Inst. of Mat. and Chem. Res.
  • National Institute of Advanced Industrial Science and Technology

External person

R. L. Woerner

  • Lawrence Livermore Laboratory
  • Lawrence Livermore National Laboratory

External person

G. Timp

  • 3311 Beckman Institute
  • University of Notre Dame
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • 2714 Beckman Institute
  • Micro and Nanotechnology Laboratory, University of Illinois
  • Electrical Engineering and Biological Science
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign

External person

Gu Wenhua

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Nicholas McDonnell

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Robert Y Z Bai

  • University of Illinois at Urbana-Champaign
  • Fusion Technology Laboratory
  • Fusion Studies Laboratory, Nuclear Engineering Program

External person

David A. Payne

  • American Ceramic Society
  • Univ. Illinois at Urbana-Champaign
  • The American Ceramic Society
  • University of Illinois at Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Beckman Inst. Adv. Sci. and Technol
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Eagineering
  • Department of Materials Science and Engineering
  • United States Department of Energy

External person

Se Jung Moon

  • Intel
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering

External person

Jin Young Park

  • Ewha Womans University
  • Department of Brain and Cognitive Sciences

External person

James J. Pasquesi

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Jacob I. Kleiman

  • University of Toronto
  • Institute for Aerospace Studies

External person

Radwa Barakat

  • University of Illinois at Urbana-Champaign
  • Benha University
  • Yonsei University
  • Department of Comparative Biosciences
  • Faculty of Veterinary Medicine
  • Department of Systems Biology
  • Department of Toxicology

External person

J. W. Lee

  • Samsung Advanced Inst of Technology
  • Samsung Advanced Institute of Technology
  • Samsung

External person

Sanghyun Lee

  • Hanyang University
  • Department of Bioengineering and Institute for Bioengineering and Biopharmaceutical Research

External person

Taekyung Kim

  • University of Illinois at Urbana-Champaign

External person

D. D. Koleske

  • Naval Research Laboratory
  • Sandia National Laboratories
  • Chemical Processing Science Dept.

External person

N. K. Kim

  • University of Illinois at Urbana-Champaign
  • United States Department of Energy

External person

Matt J. Kipper

  • Iowa State University
  • Department of Chemical Engineering

External person

Heon Joo Park

  • Inha University
  • Medical Research Center
  • Department of Microbiology

External person

J. Zhang

  • University of Illinois at Urbana-Champaign

External person

Martin King

  • University of Illinois at Urbana-Champaign
  • Department of Chemical Engineering

External person

Karthy M. Kasi

  • University of Illinois at Urbana-Champaign

External person

Balaji Narasimhan

  • Iowa State University
  • Department of Chemical Engineering

External person

J. S. Choi

  • Department of Materials Science and Engineering
  • Korea Advanced Institute of Science and Technology

External person

M. Cich

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering

External person

Abby W. Morgan

  • Virginia Polytechnic Institute and State University
  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical Engineering and Materials Science and Engineering
  • Department of Chemical Engineering
  • Department of Materials Science and Engineering

External person

R. J. Colchin

  • Oak Ridge National Laboratory

External person

Hochul Kang

  • Samsung Advanced Inst of Technology
  • Samsung Advanced Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Samsung

External person

K. Y. Cheng

  • University of Illinois at Urbana-Champaign
  • National Tsing Hua University
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Center for Compound Semiconductor Microelectronics

External person

Choon Kun Ryu

  • Fusion Technology/Charged Particle Research Laboratory
  • Materials Research Laboratory University of Illinois
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Fusion Technology and Charged Particle Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Hochul Rang

  • Samsung Adv. Institute of Technology
  • Samsung Advanced Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Samsung

External person

Neel Varde

  • University of Illinois at Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering

External person

S. Kim

  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Korea University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering
  • Electrical Engineering Department

External person

M. Y. Sung

  • University of Illinois at Urbana-Champaign

External person

Cheng Lin Tsai

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Frederick Seitz Materials Research Laboratory

External person

Gulsim Kulsharova

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign

External person

Q. Feng

  • University of Illinois at Urbana-Champaign

External person

Shankar Sivaramakrishnan

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

External person

Vladimir I. Gelfand

  • Northwestern University
  • University of Illinois at Urbana-Champaign
  • Dept. of Cell and Structural Biology
  • Department of Molecular and Cell Biology
  • Dept. of Cell and Structural Biology
  • Dept. of Cell and Structural Biology, Univ. Illinois at Urbana-Champaign

External person

M. Gao

  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Ohio State University
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Engineering
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Materials Science

External person

C. Ho

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Micro and Nanotechnology Laboratory, University of Illinois
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign

External person

Ravindra Singh

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Shuzo Fujiwara

  • Natl. Inst. of Mat. and Chem. Res.
  • National Institute of Advanced Industrial Science and Technology

External person

C. Park

  • University of Illinois at Urbana-Champaign

External person

D. W. Roh

  • Electronics and Telecom. Res. Inst.
  • Electronics and Telecommunications Research Institute

External person

Fumio Kokai

  • Institute of Research and Innovation
  • Laser Laboratory

External person

D. L. Krahn

  • University of Illinois at Urbana-Champaign
  • Fusion Technology/Charged Particle Research Laboratory
  • Fusion Technology and Charged Particle Research Laboratory

External person

Matthew B. Lee

  • University of Illinois at Urbana-Champaign

External person

Joo Hyun Shin

  • Inha University School of Medicine
  • Inha University
  • Department of Anatomy and Center for Advanced Medical Education (BK21 project)

External person

Jeongyong Kim

  • University of Illinois at Urbana-Champaign
  • University of Cincinnati
  • Department of Physics
  • Frederick Seitz Materials Research Laboratory

External person

S. L. Milora

  • Oak Ridge National Laboratory

External person

Russell D. Jamison

  • Virginia Commonwealth University
  • University of Illinois at Urbana-Champaign
  • College of Engineering

External person

W. K. Choo

  • Korea Adv. Inst. Sci. and Technol.
  • Korea Advanced Institute of Science and Technology
  • Department of Materials Science and Engineering

External person

Qichen Feng

  • University of Illinois at Urbana-Champaign

External person

Eun Hwa Lee

  • Ewha Womans University
  • Department of Brain and Cognitive Sciences

External person

C. Kim

  • University of Illinois at Urbana-Champaign
  • Depts. of Mat. Sci. and Eng.

External person

S. T. Hwang

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

M. B. Tanquary

  • University of Illinois at Urbana-Champaign
  • Fusion Technology Laboratory
  • Fusion Studies Laboratory, Nuclear Engineering Program

External person

Matthew Landi

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Minhyung Lee

  • Hanyang University
  • Department of Bioengineering and Institute for Bioengineering and Biopharmaceutical Research
  • Samsung
  • Samsung Advanced Institute of Technology

External person

Hyun Ick Cho

  • Kyungpook National University
  • School of Electronic and Electrical Engineering

External person

T. I. Kim

  • Compound Semiconductor Research Laboratory
  • Samsung Advanced Institute of Technology
  • Samsung

External person

D. H. Darling

  • Lawrence Livermore National Laboratory

External person

S. J. Rhee

  • University of Illinois at Urbana-Champaign
  • Frederick Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Kazuhiro Yamamoto

  • National Institute of Advanced Industrial Science and Technology

External person

Jung Eun Lee

  • Ewha Womans University
  • Division of Nano Sciences and Brain Disease Research Institute
  • Department of Electrical and Computer Engineering

External person

X. Zhang

  • University of Illinois at Urbana-Champaign

External person

J. J. Coleman

  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Materials Research Laboratory, University of Illinois
  • Engineering Research Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • NASA Goddard Space Flight Center
  • University of Texas at Dallas
  • Ctr. Compd. Semiconduct. M.
  • Microelectronics Laboratory
  • Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Department of Materials Science
  • Microeectronics Laboratory
  • Materials Research Laboratory and Everitt Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Center for Nutrition
  • the Materials Research Laboratory, University of Illinois
  • Materials Research Laboratory and Microelectronics Laboratory
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering
  • Frederick Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Dept. of Mat. Sci. and Engineering
  • Frederick Seitz Materials Research Laboratory

External person

Francesco DeCarlo

  • Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person