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Network

Dale J Van Harlingen

Person: Academic

William Paul King

Person: Academic

Gee Lau

  • Pathobiology - Associate Professor, Director of Graduate Studies

Person: Academic

Prashant Jain

Person: Academic

Hess, Karl

  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Beckman Inst. for Adv. Sci./Technol.
  • Center for Compound Semiconductor Microelectronics
  • Coordinated Science Laboratory University of Illinois at Urbana
  • University of Illinois at Urbana-Champaign
  • University of Kentucky
  • Samsung
  • Alcatel-Lucent
  • IEEE
  • Nokia
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Beckman Institute and Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Physics
  • Beckman Institute for Advanced Science and Technology
  • Everitt Laboratoy

External person

Lee, Jinju

  • University of Kentucky
  • Samsung
  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Dept. Elec. Comp. Eng. Beckman I.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Tucker, J.

  • University of Illinois at Urbana-Champaign
  • Texas Instruments
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Central Research Laboratories
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering

External person

Cheng, Kangguo

  • IBM
  • Samsung
  • IBM Research
  • University of Illinois at Urbana-Champaign
  • IEEE
  • IBM
  • IBM Semiconductor Research and Development Center
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Physics

External person

Pop, Eric

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Department of Electrical and Computer Engineering
  • Electrical Engineering, Stanford University
  • Intel
  • Bldg 500
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Micro and Nanotechnology Laboratory, University of Illinois
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Mechanical Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Precourt Institute for Energy
  • Dept. of Electrical
  • Department of Electrical and Computer Engineering

External person

Marks, T. J.

  • Northwestern University
  • Tsinghua University
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Chemistry, Northwestern University
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • Center for Quantum Devices
  • Department of Chemistry
  • Department of Electrical Engineering and Computer Science
  • Northwestern Univ, Materials
  • Department of Chemistry
  • Department of Chemistry
  • University of Tübingen
  • Institute of Organic Chemistry

External person

Abeln, G. C.

  • Lucent Technologies
  • Alcatel-Lucent
  • University of Illinois at Urbana-Champaign
  • Nokia
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • The Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering

External person

Wood, Josh D.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Northwestern University
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Physics
  • Department of Materials Science and Engineering, Northwestern University
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Micro and Nanotechnology Laboratory, University of Illinois

External person

Kannewurf, C. R.

  • Northwestern University
  • Sci. Technol. Ctr. Super.Conduct.
  • Sci. Technol. Ctr. Super. C.
  • University of Illinois at Urbana-Champaign
  • Dept. of Elec. Eng. and Comp. Sci.
  • Department of Electrical Engineering
  • Materials Research Center
  • Center for Quantum Devices
  • Center for Quantum Devices
  • Center for Photonic Communication and Computing
  • Department of Chemistry
  • Northwestern Univ, Materials
  • University of Tübingen
  • Institute of Organic Chemistry

External person

Chen, Zhi

  • University of Kentucky
  • Univ. Illinois at Urbana-Champaign
  • Samsung
  • University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering
  • Frederick Seitz Materials Research Laboratory

External person

Albrecht, P. M.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology

External person

Inabe, Tamotsu

  • Northwestern University
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Chemistry
  • Center for Quantum Devices
  • Department of Chemistry
  • Department of Electrical Engineering and Computer Science
  • Northwestern Univ, Materials
  • Department of Chemistry
  • Department of Chemistry, Northwestern University
  • Department of Chemistry

External person

Kizilyalli, I. C.

  • Alcatel-Lucent
  • University of Kentucky
  • University of Illinois at Urbana-Champaign
  • Lucent
  • Nokia
  • Lucent Technologies
  • Department of Electrical and Computer Engineering
  • Beckman Institute and Department of Electrical and Computer Engineering
  • Bell Labs
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Skala, S. L.

  • University of Illinois at Urbana-Champaign
  • Texas Instruments
  • Center for Compound Semiconductor Microelectronics
  • 3M Materials Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Central Research Laboratories
  • Department of Electrical and Computer Engineering
  • Department of Chemistry and Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. Chem. Eng. and Mat. Res. Lab.

External person

Hubacek, J. S.

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • 3M Materials Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Chemistry and Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. Chem. Eng. and Mat. Res. Lab.

External person

Nguyen, Duc

  • University of Illinois at Urbana-Champaign
  • Vietnam National University, Hanoi
  • Northwestern University
  • Departments of Chemistry
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Faculty of Chemistry
  • Department of Chemistry

External person

Brockenbrough, R. T.

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • 3M Materials Laboratory
  • University of Minnesota
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Chemistry and Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Department of Electrical Engineering
  • Dept. Chem. Eng. and Mat. Res. Lab.

External person

Shen, T. C.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • The Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Gammie, Gordon

  • University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • 3M Materials Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Chemistry and Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. Chem. Eng. and Mat. Res. Lab.

External person

Koepke, J. C.

  • University of Illinois at Urbana-Champaign
  • Sandia National Laboratories NM
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology

External person

Schmucker, S. W.

  • University of Illinois at Urbana-Champaign
  • Naval Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology

External person

Thorne, R. E.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering

External person

Lyons, W. G.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering

External person

Ruppalt, Laura B.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Haasch, Richard T.

  • Frederick Seitz Mat. Research Lab.
  • Dept. of Mat. Sci. and Engineering
  • Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Frederick Seitz Materials Research Laboratory
  • Frederick Seitz Materials Research Laboratory
  • Center for Microanalysis of Materials
  • Department of Mechanical Science and Engineering, University of Illinois
  • Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Center for Microanalysis of Materials
  • Department of Chemistry

External person

Hersam, Mark C.

  • Northwestern University
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering, Northwestern University
  • Department of Chemistry, Northwestern University
  • Department of Medicine
  • Dept. Elec. Comp. Eng. Beckman I.
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Materials Science and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Estrada, D.

  • Boise State University
  • Materials Science and Engineering, Boise State University
  • University of Illinois at Urbana-Champaign
  • Department of Material Science and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Micron School of Materials Science and Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Micro and Nanotechnology Laboratory, University of Illinois

External person

Ballard, J. B.

  • Zyvex Labs LLC
  • NOAA
  • Zyvex Labs
  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology

External person

McMahon, W.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign

External person

Nienhaus, Lea

  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Department of Chemistry
  • Massachusetts Institute of Technology
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • Departments of Chemistry

External person

Liu, Lequn

  • Materials Research Society (MRS
  • University of Illinois at Urbana-Champaign
  • IEEE
  • American Physical Society
  • American Vacuum Society (AVS
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign

External person

Kim, Young Kwang

  • Samsung
  • CPU Tech1 Team
  • CPU TD Group
  • Technology Development Division

External person

Yu, Jixin

  • University of Illinois at Urbana-Champaign
  • University of South Carolina
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering

External person

He, K. T.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Avouris, Phaedon

  • IBM
  • University of Illinois at Urbana-Champaign

External person

Scott, Gregory

  • University of Illinois at Urbana-Champaign
  • California Polytechnic State University SLO
  • Departments of Chemistry
  • Department of Chemistry and Biochemistry
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology

External person

Chetlur, Sundar

  • Alcatel-Lucent
  • University of Kentucky
  • Lucent Laboratories
  • Nokia
  • Lucent Technologies

External person

Barraza-Lopez, Salvador

  • Instituto Politecnico Nacional
  • Virginia Polytechnic Institute and State University
  • Georgia Institute of Technology
  • University of Illinois at Urbana-Champaign
  • University of Arkansas
  • Los Alamos National Laboratory
  • Department of Physics
  • Department of Physics
  • Escuela Superior de Física y Matemáticas
  • Physics Division
  • Department of Physics
  • Department of Physics
  • Center for Relativistic Astrophysics
  • Department of Physics
  • Inst. for Particle Phys./Astrophys.
  • Beckman Institute for Advanced Science and Technology

External person

Guisinger, N. P.

  • University of Illinois at Urbana-Champaign
  • Dept. Elec. Comp. Eng. Beckman I.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Doidge, Gregory P.

  • University of Illinois at Urbana-Champaign
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign

External person

Ashtekar, S.

  • University of Illinois at Urbana-Champaign
  • Departments of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology

External person

Cheng, Kuang Yu

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Haggag, A.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Physics

External person

Lomax, Joseph F.

  • Northwestern University
  • Department of Chemistry
  • Center for Quantum Devices
  • Department of Chemistry, Northwestern University

External person

Miller, J. H.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Physics and Astronomy
  • University of North Carolina

External person

Kim, Young Wug

  • Samsung
  • CPU Tech1 Team
  • CPU TD Group
  • Technology Development Division

External person

Carmichael, Erin S.

  • University of Illinois at Urbana-Champaign
  • Departments of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Physics

External person

Wieghold, Sarah

  • Technical University of Munich
  • Department of Chemistry
  • Department of Physical Chemistry
  • Department of Physical Chemistry
  • Catalysis Research Center, Technische Universität München
  • Technische Universität München

External person

Chang, Noel N.

  • University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • Departments of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign

External person

Randall, J. N.

  • Zyvex Labs LLC
  • Zyvex Labs

External person

Do, Jae Won

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology

External person

Thompson, D. S.

  • University of Illinois at Urbana-Champaign
  • Department of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • School of Chemical Sciences, University of Illinois
  • Department of Electrical and Computer Engineering
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign

External person

Suh, Kwang Pyuk

  • Samsung
  • CPU TD Group
  • CPU Tech1 Team
  • Technology Development Division

External person

Foley, E. T.

  • Natl. Inst. for Adv. Interdisc. Res.
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute and Department of Electrical and Computer Engineering

External person

Schoch, K. F.

  • Northwestern University
  • Department of Electrical Engineering and Computer Science
  • Northwestern Univ, Materials

External person

Behnam, Ashkan

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign

External person

Kumar, Navneet

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Frederick Seitz Materials Research Laboratory

External person

Register, Leonard F.

  • University of Texas at Austin
  • University of Illinois at Urbana-Champaign
  • Department of Electrical, and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Microelectronics Research Center
  • Microelectronics Research Center

External person

McCarthy, William J.

  • Northwestern University
  • Center for Quantum Devices
  • Materials Research Center

External person

Carrion, Enrique A.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Diel, Bruce N.

  • Northwestern University
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry

External person

Ye, Wei

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering

External person

Peña Martin, Pamela A.

  • Kyushu University
  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University

External person

Wang, C.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Bardeen, John

  • University of Illinois at Urbana-Champaign
  • Department of Physics
  • Department of Physics

External person

Ratajack, M. T.

  • Northwestern University
  • Center for Quantum Devices
  • Department of Chemistry
  • Center for Quantum Devices

External person

Cheng, K. Y.

  • University of Illinois at Urbana-Champaign
  • National Tsing Hua University
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics

External person

Nguyen, Huy A.

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology

External person

Wang, Chinlee

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Wu, W.

  • University of Illinois at Urbana-Champaign
  • Texas Instruments
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Central Research Laboratories

External person

Sinitskii, Alexander

  • University of Nebraska
  • National University of Science and Technology "MISiS"
  • Nebraska Center for Materials and Nanoscience
  • Department of Chemistry
  • University of Nebraska–Lincoln

External person

Lyons, Austin S.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Laboratory, University of Illinois
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Rossi, A. R.

  • IBM
  • National Institute for Nuclear Physics
  • University of Perugia
  • University of Bologna

External person

Ong, Zhun Yong

  • University of Texas at Dallas
  • University of Illinois at Urbana-Champaign
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Physics
  • Department of Materials Science and Engineering
  • Department of Physics
  • Micro and Nanotechnology Laboratory, University of Illinois
  • Department of Physics

External person

Mayer, Marie A.

  • University of California at Berkeley
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering

External person

Xu, H.

  • Zyvex Asia Pte Ltd
  • Zyvex Asia Pte Ltd

External person

Rockett, Angus A.

  • University of Illinois at Urbana-Champaign
  • Kyushu University
  • Colorado School of Mines
  • Dept. of Mat. Sci. and Engineering
  • Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Department of Materials Science
  • Department of Metallurgy and Materials Science
  • Department of Metallurgy and Materials Engineering
  • Department of Materials Science and Engineering
  • Frederick Seitz Materials Research Laboratory
  • George S. Ansell Department of Metallurgical and Materials Engineering
  • Frederick Seitz Materials Research Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Metallurgy
  • Department of Physics (IFM), Linköping University
  • Linköping University
  • International Institute for Carbon Neutral Research
  • Department of Materials Science and Engineering
  • University of Liverpool
  • Department of Materials Science and Engineering
  • University of Oregon
  • Center for Microanalysis of Materials
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • University of Illinois
  • United States Department of Energy

External person

Tuttle, B. R.

  • Behrend College
  • Pennsylvania State University
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Physics
  • Behrend College

External person

Ding, Y.

  • Zyvex Asia Pte Ltd
  • Zyvex Asia Pte Ltd

External person

Hewaparakrama, Jayan

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Moguel, Michael K.

  • Northwestern University
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry

External person

Mohseni, Parsian Katal

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Materials Research Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Rochester Institute of Technology
  • Micro and Nanotechnology Laboratory
  • Microsystems Engineering
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering

External person

Lian, Feifei

  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Datye, Isha

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Goings, Joshua J.

  • University of Washington
  • Department of Chemistry, University of Washington

External person

Carr, S. H.

  • Tsinghua University
  • Northwestern University
  • Department of Materials Science and Engineering, the Materials Research Center, Northwestern University

External person

Chou, S. T.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering

External person

Shi, Dongxia

  • CAS - Institute of Physics
  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Chinese Academy of Sciences

External person

Tessmer, S. H.

  • Michigan State University
  • Massachusetts Inst. of Technology
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Physics
  • Physics and Astronomy Department
  • Department of Physics

External person

Shapley, J. R.

  • Center of Advanced Materials for the Purification of Water with Systems
  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry and Materials Research Laboratory
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • School of Chemical Sciences, University of Illinois
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • School of Chemical Sciences, University of Illinois at Urbana Champaign
  • Departments of Chemistry
  • Center of Advanced Materials for the Purification of Water with Systems
  • Department of Chemistry
  • Center of Advanced Materials for the Purification of Water with Systems
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Physics and the Seitz Materials Research Laboratory
  • Dept. Chem. Eng. and Mat. Res. Lab.

External person

Shekhirev, Mikhail

  • University of Nebraska
  • Department of Chemistry
  • University of Nebraska–Lincoln

External person

Daly, Scott R.

  • Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Iowa
  • Los Alamos National Laboratory
  • School of Chemical Sciences, University of Illinois at Urbana-Champaign, Noyes Laboratory
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Departments of Chemistry
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign

External person

Chen, Yaofeng

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Laboratory, University of Illinois

External person

Vo, Timothy H.

  • Department of Chemistry
  • University of Nebraska
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • University of Nebraska–Lincoln

External person

Kam, A. F.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute and Department of Electrical and Computer Engineering

External person

Shah, S. A.

  • Dow Chemical
  • University of Illinois at Urbana-Champaign
  • Dept. of Chem./Biomolec. Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology

External person

Saini, R.

  • Zyvex Labs

External person

Martin, Pamela Peña

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering

External person

Xie, Xu

  • Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Radocea, Adrian

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology

External person

Kotzias, B.

  • Alcatel-Lucent
  • Nokia
  • Lucent Technologies

External person

Dirk, Carl W.

  • Northwestern University
  • Northwestern Univ, Materials

External person

Wood, Joshua D.

  • University of Illinois at Urbana-Champaign
  • Northwestern University
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Physics
  • Department of Materials Science and Engineering, Northwestern University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology

External person

Burton, Robert L.

  • Northwestern University
  • Center for Quantum Devices
  • Materials Research Center

External person

Fay, P.

  • University of Notre Dame
  • IEEE
  • University of Illinois at Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • University of Ollinois
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Department of Electr. Engrg.
  • Department of Electrical Engineering

External person

Weber, G.

  • Alcatel-Lucent
  • Lucent
  • Lancent Technologies
  • Bell Labs

External person

Rangarajan, Aniruddh

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology

External person

Mallek, Justin

  • University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Departments of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Massachusetts Institute of Technology

External person

Lee, J.

  • University of Illinois at Urbana-Champaign
  • Department of Physics
  • Uiduk University
  • Division of Information and Communication Eng.
  • Division of Information Eng.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Damhorst, Gregory L.

  • Department of Bioengineering
  • 2000D Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • Micro and Nanotechnology Laboratory
  • Carle Foundation Hospital
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • University of Illinois at Chicago
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • College of Medicine at Urbana-Champaign, University of Illinois
  • Biomedical Research Center, Carle Foundation Hospital
  • College of Medicine
  • Department of Bioengineering
  • Department of Microbiology and College of Medicine
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Carle Clinic Association
  • Department of Bioengineering
  • Emory University

External person

Ritter, Kyle A.

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering

External person

Kim, Bong Seok

  • Samsung
  • CPU TD Group

External person

Sun, Tao

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Mechanical Science and Engineering

External person

Choi, H.

  • Micro and Nanotechnology Laboratory, University of Illinois
  • Korea Institute of Science and Technology
  • Micro and Nanotechnology Laboratory and Department of Electrical and Computer Engineering, University of Illinois
  • Univ. Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory

External person

Alexander, J.

  • Zyvex Labs LLC

External person

Rauchfuss, Thomas B.

  • University of Illinois at Urbana-Champaign
  • Kyushu University
  • Dortmund University
  • Technical University of Berlin
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry
  • Washington State University Pullman
  • Department of Chemistry
  • Department of Chemistry
  • Departments of Chemistry
  • School of Chemical Sciences and Materials Research Laboratory
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry
  • the Materials Research Laboratory, University of Illinois
  • School of Chemical Sciences, University of Illinois at Urbana Champaign
  • University of Delaware
  • Department of Chemistry, University of Delaware
  • Materials Research Laboratory, University of Illinois
  • Sch. Chem. Sci. Beckman Inst. A.
  • School of Chemical Sciences, University of Illinois at Urbana-Champaign, Noyes Laboratory
  • International Institute for Carbon Neutral Energy Research
  • Institut für Anorganische und Analytische Chemie
  • School of Chemical Sciences
  • Karlsruhe Institute of Technology
  • Lehrstuhl für Anorganische Chemie
  • Department of Electrical and Computer Engineering
  • Australian National University
  • Research School of Chemistry
  • Purdue University
  • School of Chemical Sciences
  • Univ. of IL at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Chemical Sciences and Fredrick Seitz Materials Research Laboratory
  • Sch. Chem. Sci. Beckman Inst. A.
  • Frederick Seitz Materials Research Laboratory

External person

Hsieh, K. C.

  • Dept. of Elec. and Comp. Engineering
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Electrical Engineering Research Laboratory
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • Center for Compound Semiconductor Microelectronics
  • Micro and Nanotechnology Laboratory, University of Illinois

External person

Nordlander, P.

  • Rice University
  • Departments of Physics and Astronomy
  • Department of Electrical and Computer Engineering and Material Science and Nanoengineering
  • Department of Physics

External person

Wagner, Martin

  • University of California at San Diego
  • Department of Physics

External person

Dong, Hefei

  • University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology

External person

Kaitz, Joshua A.

  • Department of Chemistry and Beckman, Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Chemistry
  • Department of Physics and Beckman Institute for Advanced Science and Technology

External person

Kalina, Davida W.

  • Northwestern University
  • Department of Chemistry

External person

Keilmann, Fritz

  • Ludwig Maximilian University of Munich

External person

Murata, Yuya

  • University of Illinois at Urbana-Champaign
  • Frederick Seitz Materials Research Laboratory

External person

Reuter, E. E.

  • University of Illinois at Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory

External person

Tung, Maryann C.

  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Bischof, M. R.

  • University of North Texas
  • Department of Materials Science and Engineering

External person

Jackson, S. I.

  • University of Illinois at Urbana-Champaign

External person

Li, Xiaosong

  • University of Washington
  • Department of Chemistry, University of Washington

External person

Ohno, Yutaka

  • Nagoya University
  • Department of Quantum Engineering

External person

Sen, S.

  • Alcatel-Lucent
  • Nokia
  • Lucent Technologies

External person

Cress, Cory D.

  • Naval Research Laboratory
  • Electronics Science and Technology Division

External person

Seabaugh, A.

  • Texas Instruments
  • University of Illinois at Urbana-Champaign

External person

Fang, Weich

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Ctr. Compd. Semiconduct. M.

External person

McLeod, Alexander S.

  • University of California at San Diego
  • Department of Physics
  • Columbia University
  • Department of Physics

External person

Sun, Dong ming

  • Department of Quantum Engineering
  • Nagoya University

External person

Esch, F.

  • Technical University of Munich
  • Department of Physical Chemistry

External person

Hwang, S. T.

  • University of Illinois at Urbana-Champaign

External person

Huber, John

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology

External person

Timmermans, Marina Y.

  • Aalto University
  • NanoMaterials Group

External person

Cloud, Andrew N.

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

External person

Zhu, Zhi Guang

  • CAS - Changchun Institute of Optics Fine Mechanics and Physics
  • CAS - Institute of Physics
  • Chinese Academy of Sciences

External person

Shah, A. B.

  • Engineering University of Illinois
  • University of Illinois at Urbana-Champaign
  • Intel
  • Department of Materials Science and Engineering
  • Frederick Seitz Materials Research Laboratory
  • Depts. of Mat. Sci. and Eng.
  • Center for Microanalysis of Materials
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Center for Microanalysis of Materials
  • Department of Materials Science
  • Department of Materials Science and Engineering

External person

Higashi, G.

  • Nokia
  • Lucent Technologies

External person

Eres, Gyula

  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Oak Ridge National Laboratory
  • Materials Science and Technology Division, Oak Ridge National Laboratory

External person

Kwang-Pyuk, Suh

  • Samsung
  • CPU Tech 1 Team

External person

Aur, Shian

  • Texas Instruments

External person

Akpati, H. C.

  • Rice University
  • Department of Physics

External person

Vlassiouk, Ivan

  • Oak Ridge National Laboratory
  • Energy and Transportation Science Division, Oak Ridge National Laboratory
  • Energy and Transportation Science Division

External person

Cha, Hyeongyun

  • University of Illinois at Urbana-Champaign
  • Kyushu University
  • Department of Mechanical Science and Engineering, University of Illinois
  • International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University
  • Department of Mechanical Science and Engineering
  • Frederick Seitz Materials Research Laboratory

External person

Hebert, Damon N.

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering

External person

Eklund, Robert

  • Texas Instruments

External person

Yu, Ki Jun

  • Dept. of Mat. Sci. and Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Yonsei University
  • School of Electrical and Electronic Engineering, Yonsei University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Frederick Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering

External person

Viernes, Neil O L

  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Department of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry

External person

Fischer, B.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Nasibulin, Albert G.

  • Aalto University
  • NanoMaterials Group

External person

Heiz, U.

  • Technical University of Munich
  • Department of Physical Chemistry

External person

Liu, Ximeng

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign

External person

Pea Martin, Pamela

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

External person

Herbstein, F. H.

  • Technion-Israel Institute of Technology
  • Department of Chemistry

External person

Korlacki, Rafal A.

  • University of Nebraska
  • Department of Electrical and Computer Engineering
  • University of Nebraska–Lincoln

External person

Farrell, R. M.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Li, Xiaosong

  • University of Washington
  • Department of Chemistry, University of Washington

External person

Potter, Clinton S.

  • Scripps Research Institute
  • University of Illinois at Urbana-Champaign
  • Natl. Ctr. Supercomputing Applic
  • Department of Integrative Structural and Computational Biology
  • Department of Molecular and Experimental Medicine
  • Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Beckman Institute of Advanced Science and Technology, University of Illinois
  • Beckman Institute
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Petrov, I.

  • Linköping University
  • Dept. of Mat. Sci. and Engineering
  • Engineering University of Illinois at Urbana-Champaign
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • Linköping University
  • University of Illinois at Urbana-Champaign
  • 3M Materials Laboratory
  • 3M Materials Laboratory
  • Department of Materials Science
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Frederick Seitz Materials Research Laboratory
  • Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Dept. Mat. Sci. Frederick Seitz M.
  • Dept. of Mat. Sci./Engineering
  • Technique and Applications
  • International Union for Vacuum Science
  • Dept. Mat. Sci. Frederick Seitz M.
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory

External person

Miller, Lou Ann

  • University of Illinois at Urbana-Champaign
  • Biological Electron Microscopy
  • Department of Pathobiology
  • Frederick Seitz Materials Research Laboratory
  • Department of Veterinary Biosciences
  • Department of Veterinary Biosciences
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Biological Electron Microscopy
  • Frederick Seitz Materials Research Laboratory
  • Center for Microscopy and Imaging

External person

Chuang, Shun Lien

  • Dept. of Elec. and Comp. Engineering
  • University of Illinois at Urbana-Champaign
  • Princeton Optronics
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • Dept. of Etearical and Computer Eng.

External person

Harris, E. B.

  • Alcatel-Lucent
  • University of Illinois at Urbana-Champaign
  • Nokia
  • Lucent Technologies
  • Department of Physics

External person

Pappu, Sravan

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology

External person

Jinju, Lee

  • University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign

External person

Friedman, Adam L.

  • Naval Research Laboratory
  • Materials Science and Technology Division, Code 6364, Naval Research Laboratory

External person

Gregory, Carl D.

  • Univ. Illinois at Urbana-Champaign
  • Biomed. Magnetic Reson. Laboratory
  • University of Illinois at Urbana-Champaign
  • Beckman Institute of Advanced Science and Technology, University of Illinois
  • Biomed. Magnetic Reson. Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Medical Information Science
  • Beckman Institute for Advanced Science and Technology

External person

Plummer, J. D.

  • Stanford University
  • Department of Electrical Engineering

External person

Matsuda, K.

  • Naruto University of Education
  • University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign

External person

Beam, E. A.

  • Texas Instruments
  • University of Illinois at Urbana-Champaign

External person

Agarwala, S.

  • University of Illinois at Urbana-Champaign
  • National Instruments
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering

External person

Aruin, Basil

  • University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Keyes, M. P.

  • University of Illinois at Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory

External person

Mehta, Rushabh

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign

External person

Whang, Tsung Chuan

  • Northwestern University
  • Center for Quantum Devices

External person

Choi, HeeSung

  • University of Texas at Dallas
  • Physics Department

External person

Goldflam, Michael D.

  • University of California at San Diego
  • Department of Physics

External person

Banerjee, Progna

  • University of Illinois at Urbana-Champaign
  • Department of Physics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Marsh, Richard E.

  • California Institute of Technology
  • University of Illinois Marvel Undergraduate Research Awardee

External person

Thiemens, Mark H.

  • University of California at San Diego
  • Dept. of Chemistry and Biochemistry, University of California, San Diego

External person

Jeffries, Jayme L.

  • University of Illinois at Urbana-Champaign
  • Department of Pathobiology, College of Veterinary Medicine, University of Illinois at Urbana-Champaign

External person

Nakamura, Shuhei

  • Northwestern University
  • Department of Materials Science and Engineering, the Materials Research Center, Northwestern University
  • Department of Chemistry

External person

Nguyen, Huy A.

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology

External person

Zhao, K.

  • CAS - Institute of Physics
  • Chinese Academy of Sciences

External person

Lee, Yong Hee

  • Samsung
  • CPU Tech1 Team

External person

Jurczyszyn, L.

  • University of Wroclaw
  • Institute of Experimental Physics

External person

Schwartz, Lyle H.

  • Northwestern University
  • Department of Materials Science and Engineering
  • University of Tübingen
  • Institute of Organic Chemistry

External person

Budrikis, Zoe

  • Institute for Scientific Interchange Foundation

External person

Wilson, Scott R.

  • University of Illinios
  • 601 S. Goodwin, Urbana, IL 61801, U.
  • Universität Karlsruhe
  • Box 55-5
  • Urbana-Champaign, Urbana, IL, USA
  • Karlsruhe Institute of Technology
  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry
  • School of Chemical Sciences and Materials Research Laboratory
  • Beckman Institute for Advanced Science and Technology
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry
  • School of Chemical Sciences, University of Illinois at Urbana Champaign
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Roger Adams Laboratory
  • Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Departments of Chemistry
  • School of Chemical Sciences, University of Illinois at Urbana-Champaign, Noyes Laboratory
  • Department of Chemistry
  • Lehrstuhl für Anorganische Chemie
  • Department of Electrical and Computer Engineering
  • School of Chemical Sciences
  • Univ. of IL at Urbana-Champaign
  • University of Delaware
  • Department of Chemistry, University of Delaware
  • School of Chemical Sciences and Fredrick Seitz Materials Research Laboratory
  • Materials Research Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Horvath, Cedric M.

  • University of Arkansas
  • Department of Physics

External person

Stillman, G. E.

  • Univ of Illinois, Urbana, IL, USA
  • Urbana, IL, USA
  • Dept. of Elec. and Comp. Engineering
  • California Institute of Technology
  • HRL Laboratories
  • EpiWorks
  • University of Illinois at Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Beckman Inst. for Adv. Sci./Technol.
  • Electrical Engineering Research Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Department of Chemistry
  • Ctr. Compd. Semiconduct. M.

External person

Wang, Wei Hua

  • CAS - Changchun Institute of Optics Fine Mechanics and Physics
  • CAS - Institute of Physics
  • Chinese Academy of Sciences

External person

Carragher, Bridget

  • Scripps Research Institute
  • University of Illinois at Urbana-Champaign
  • Beckman Institute
  • Department of Integrative Structural and Computational Biology
  • Department of Molecular and Experimental Medicine
  • Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Beckman Institute of Advanced Science and Technology, University of Illinois
  • Dept. of Cell and Structural Biology
  • Optical Visualization Facility
  • Dept. of Cell and Structural Biology
  • UIUC

External person

Reidy, R. F.

  • University of North Texas
  • Department of Materials Science and Engineering

External person

Nguyen, Nhan T.

  • Faculty of Chemistry
  • Hanoi University of Sciences

External person

Heiranian, M.

  • University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Beckman Institute for Advanced Science and Technology

External person

Berti, Antonio C.

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology

External person

Malin, J. I.

  • Texas Instruments
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Ctr. Compd. Semiconduct. M.
  • GaAs Operations

External person

Huang, Min

  • Physics Department
  • University of Texas at Dallas

External person

Zapperi, Stefano

  • University of Milan
  • Institute for Scientific Interchange Foundation
  • CNR
  • Aalto University
  • Dipartimento di Fisica
  • Department of Applied Physics
  • Department of Physics and Center for Complexity and Biosystems

External person

Sengupta, Deepak K.

  • Urbana, IL, USA
  • Jet Propulsion Laboratory, California Institute of Technology
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Ctr. Space Microelectronics Technol.
  • Ctr. Space Microlectron. Technol.
  • Ctr. Compd. Semiconduct. M.

External person

Wynne, Kenneth J.

  • Office of Naval Research
  • Chemistry Program

External person

Liu, Ximeng

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology

External person

Olewicz, T.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Hassanien, Abdou

  • National Institute of Advanced Industrial Science and Technology
  • National Institute of Chemistry Ljubljana
  • Electronics and Photonics Research Institute

External person

Grosse, Kyle L.

  • Department of Mechanical Science and Engineering
  • Mechanical Science and Engineering, Univ. Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign

External person

Young-Kwang, Kim

  • Samsung
  • CPU Tech 1 Team

External person

Kisseberth, Nick

  • Beckman Institute
  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Beckman Institute of Advanced Science and Technology, University of Illinois

External person

Tao, M.

  • Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of South Carolina
  • Center for Compound Semiconductor Microelectronics
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Elec. and Comp. Engineering

External person

Marcy, Henry O.

  • Northwestern University
  • Department of Electrical Engineering

External person

Gorman, B. P.

  • Colorado School of Mines
  • Department of Materials Science and Engineering

External person

Higman, Ted K.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Kuang, Zhizhou

  • University of Illinois at Urbana-Champaign
  • Department of Pathobiology, College of Veterinary Medicine, University of Illinois at Urbana-Champaign

External person

Dorgan, Vincent E.

  • Electrical and Computer Engineering, Univ. Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign

External person

Antczak, G.

  • University of Wroclaw
  • Institute of Experimental Physics

External person

Jonas, J.

  • University of Illinois at Urbana-Champaign
  • the Materials Research Laboratory, University of Illinois
  • Department of Chemistry

External person

Bolinger, C. Mark

  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences, University of Illinois
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign

External person

Duan, Xiangyun J.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Schneider, Otto

  • University of Tübingen
  • Institute of Organic Chemistry
  • Northwestern University
  • Department of Chemistry

External person

Chialvo, Cesar E.

  • University of Illinois at Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Physics
  • Frederick Seitz Materials Research Laboratory
  • Department of Physics
  • Department of Physics

External person

Pour, Mohammad Mehdi

  • University of Nebraska
  • Department of Chemistry
  • University of Nebraska–Lincoln

External person

Knoller, F. L.

  • Technical University of Munich
  • Catalysis Research Center, Technische Universität München

External person

Ye, W.

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

External person

Culbertson, James C.

  • Naval Research Laboratory
  • Electronics Science and Technology Division

External person

Goodman, W. H.

  • Northwestern University
  • Department of Chemistry

External person

Xu, Yang

  • Zhejiang University
  • University of Illinois at Urbana-Champaign
  • Department of Information Science and Electronic Engineering
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Mech. and Indust. Eng.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Kauppinen, Esko I.

  • Aalto University
  • NanoMaterials Group

External person

Schofieled, M.

  • Alcatel-Lucent
  • Nokia
  • Lucent Technologies

External person

Lashkov, Andrey

  • Saratov State Technical University
  • Department of Physics

External person

Khatib, Omar

  • University of Colorado Boulder
  • University of California at San Diego
  • Department of Physics
  • Department of Physics

External person

Goodnick, Stephen M.

  • Arizona State University
  • Oregon State University
  • Department of Electrical Engineering

External person

Behman, Ashkan

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Pringle, Brian

  • University of Illinois at Urbana-Champaign
  • Departments of Chemistry
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology

External person

Robinson, Jeremy T.

  • Naval Research Laboratory
  • Electronics Science and Technology Division

External person

Wang, W. H.

  • CAS - Institute of Physics
  • Chinese Academy of Sciences
  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

External person

Epstein, Yefim

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology

External person

Tsai, Cheng Lin

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Frederick Seitz Materials Research Laboratory

External person

Walling, Brent E.

  • University of Illinois at Urbana-Champaign
  • Department of Pathobiology, College of Veterinary Medicine, University of Illinois at Urbana-Champaign
  • Department of Pathobiology

External person

Lee, S. Y.

  • University of Illinois at Urbana-Champaign
  • University of Michigan, Ann Arbor
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Liu, F. Y.

  • Stanford University
  • Department of Electrical Engineering

External person

Wang, Ning C.

  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign

External person

Nazareth, V.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Zhou, Xiao

  • Tsinghua University

External person

Salemink, H. W M

  • University of Illinois at Urbana-Champaign
  • IBM Zurich Research Laboratory

External person

Cho, Kyeongjae

  • University of Texas at Dallas
  • Physics Department

External person

Ibers, James A.

  • Northwestern University
  • Department of Chemistry, Northwestern University
  • Department of Chemistry

External person

Unarunotai, Sakulsuk

  • Chulalongkorn University
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Department of Chemistry
  • Frederick Seitz Materials Research Laboratory
  • Department of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering

External person

Bishop, S. G.

  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Microeectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Dept. of Mat. Sci. and Engineering

External person

Mehdi Pour, Mohammad

  • University of Nebraska
  • Department of Chemistry
  • University of Nebraska–Lincoln

External person

Mcclure, Malcolm S.

  • Northwestern University
  • Center for Quantum Devices

External person

Dorsten, J. F.

  • Shell Oil
  • Urbana, IL, USA
  • University of Illinois at Urbana-Champaign
  • Shell
  • Shell Oil
  • Department of Chemistry
  • Department of Chemistry and the Materials Research Laboratory
  • Department of Chemistry
  • Departments of Chemistry
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology

External person

English, Christopher D.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Physics and the Seitz Materials Research Laboratory

External person

Lindquist, Jason

  • University of Illinois at Urbana-Champaign
  • Beckman Institute of Advanced Science and Technology, University of Illinois
  • Beckman Institute for Advanced Science and Technology

External person

Aktas, Ozgur

  • Bilkent University
  • University of Illinois at Urbana-Champaign
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Electrical and Electronics Engineering
  • Dept. of Electrical and Electronics Engineering

External person

Lee, S. H.

  • Seoul National University
  • Samsung
  • University of Georgia
  • Purdue University
  • Department of Agricultural Biotechnology, Center for Food and Bioconvergence, Seoul National University
  • Department of Crop and Soil Sciences
  • School of Plant Science
  • Ctr. Urban and Indust. Pest Mgmt.
  • School of Agricultural Biotechnology

External person

Roy, P. K.

  • Alcatel-Lucent
  • Nokia
  • Lucent Technologies

External person

Kuo, Hao Chung

  • National Chiao Tung University
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Photonics
  • Dept. of Mat. Sci. and Engineering
  • Department of Photonics
  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Photonic
  • Department of Photonics and Institute of Electro-Optical Engineering
  • National Chiao Tuna University

External person

Yi, Xuan

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Jovanovic, D.

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Inst. for Adv. Sci./Technol.
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Beckman Institute for Advanced Science and Technology
  • Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois

External person

Dev, Pratibha

  • Naval Research Laboratory
  • Howard University
  • Department of Physics and Astronomy

External person

Hanack, Michael

  • University of Tübingen
  • Institute of Organic Chemistry
  • Institute of Organic Chemistry

External person

Shepherd, J. J.

  • University of Iowa
  • Chemistry Building

External person

Schweinberger, F. F.

  • Technical University of Munich
  • Catalysis Research Center, Technische Universität München

External person

Liu, H. C.

  • National Research Council
  • California Institute of Technology
  • National Research Council of Canada
  • University of Illinois at Urbana-Champaign
  • Inst. for Microstructural Sciences
  • Inst. of Microstructural Sciences
  • Inst. for Microstructural Sciences

External person

Kozicki, Michael N.

  • Arizona State University
  • Department of Electrical Engineering

External person

Seung, Lee

  • Samsung
  • CPU Tech 1 Team

External person

Zhang, Fan

  • Argonne National Laboratory
  • Iowa State University
  • University of Illinois at Urbana-Champaign
  • Department of Biochemistry
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Argonne National Laboratory

External person

Xiong, Feng

  • University of Illinois at Urbana-Champaign
  • Stanford University
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Laboratory, University of Illinois

External person

Jaeger, D. L.

  • University of North Texas
  • Department of Materials Science and Engineering

External person

Garg, Mayank

  • University of Illinois at Urbana-Champaign

External person

Janicek, B. E.

  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Physics
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics

External person

Kang, H. S.

  • Samsung
  • University of Perugia
  • Yale University
  • Rutherford Appleton Laboratory
  • Brunel University
  • Vanderbilt University
  • Adelphi University
  • Sogang University
  • University of California at Berkeley
  • University of Cincinnati
  • University of Colorado Boulder
  • University of California at Santa Cruz
  • University of California at Santa Barbara
  • University of Massachusetts
  • University of Illinois at Urbana-Champaign
  • University of Genoa
  • University of Ferrara
  • University of Pisa
  • University of Padova
  • University of Mississippi
  • National Institute for Nuclear Physics
  • University of Oregon
  • University of Wisconsin-Madison
  • University of Washington
  • University of Tennessee, Knoxville
  • Stanford University
  • Rutgers - The State University of New Jersey, New Brunswick
  • Indiana University Bloomington
  • Boston University
  • California Institute of Technology
  • Columbia University
  • Colorado State University
  • Massachusetts Institute of Technology
  • Tohoku University
  • TRIUMF
  • University of British Columbia
  • High Energy Accelerator Research Organization, Tsukuba
  • University of Victoria BC
  • Nagoya University
  • Lawrence Berkeley National Laboratory
  • Università di Pisa
  • Istituto Nazionale de Fisica Nucleare Sezione di Ferrara
  • INFN
  • INFNSezione di Padova
  • Sezione di Padova-Trento
  • INFN Sezione di Pisa
  • Sezione INFN di Ferrara
  • INFN Sezione di Perugia
  • Istituto Nazionale di Fisica Nucleare Sezione di Bologna
  • Rutgers University–New Brunswick

External person

Arastu, Faraz

  • University of Illinois at Urbana-Champaign

External person

Barbara, T. M.

  • University of Illinois at Urbana-Champaign
  • the Materials Research Laboratory, University of Illinois

External person

Guo, Z.

  • Zhejiang University
  • Department of Information Science and Electronic Engineering

External person

Du, Frank

  • Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Sysoev, Victor

  • Saratov State Technical University
  • National University of Science and Technology "MISiS"
  • Department of Physics

External person

Ehrlich, G.

  • University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

External person

Yang, Jinman

  • Arizona State University
  • Department of Electrical Engineering

External person

Latten, J. L.

  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. Chem. Eng. and Mat. Res. Lab.

External person

Basov, D. N.

  • University of California at San Diego
  • Department of Physics
  • Department of Physics
  • Columbia University
  • Department of Physics

External person

Jaggi, Narendra K.

  • Northwestern University
  • Department of Materials Science and Engineering
  • Department of Chemistry

External person

Wallum, Alison

  • University of Illinois at Urbana-Champaign

External person

Gu, S. Q.

  • University of Illinois at Urbana-Champaign
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Reisner, G. M.

  • Technion-Israel Institute of Technology
  • Department of Chemistry

External person

Darkwa, James

  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences, University of Illinois
  • Department of Electrical and Computer Engineering
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Liang, Wen Bin

  • Northwestern University
  • Department of Chemistry

External person

Zhao, Xiang

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and Materials Science and Engineering

External person

Hwang, S. T.

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering

External person

Thornton, Trevor J.

  • Arizona State University
  • Department of Electrical Engineering

External person

Lin, Lang Sheng

  • Northwestern University
  • Department of Chemistry

External person

Hao, Yonghua

  • University of Illinois at Urbana-Champaign
  • Department of Pathobiology, College of Veterinary Medicine, University of Illinois at Urbana-Champaign

External person

Bohn, Paul W.

  • University of Notre Dame
  • Beckman Inst. Adv. Sci. and Technol.
  • Department of Chemistry and Biochemistry and Department of Chemical and Biomolecular Engineering, University of Notre Dame
  • University of IL at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemical and Biomolecular Engineering, University of Notre Dame
  • Urbana, IL, USA
  • Department of Chemistry and Biochemistry, University of Notre Dame
  • Univ. of Illinois - Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • National Instruments
  • Univ. Illinois at Urbana-Champaign
  • Yale University
  • United States Army Engineer Research and Development Center
  • Department of Chemistry
  • Micro and Nano Technology Laboratory, University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Beckman Institute for Advanced Science and Technology
  • The Beckman Institute, University of Illinois at Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Environmental Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Mech. and Indust. Eng.
  • Department of Chemistry and the Materials Research Laboratory
  • Center for Microanalysis of Materials
  • Department of Chemistry
  • University of Missouri at St. Louis
  • Department of Chemistry
  • Department of Chemistry and Biochemistry
  • Dept. of Chemical and Biomolecular Engineering
  • Frederick Seitz Materials Research Laboratory
  • Department of Chemistry and Biochemistry
  • Departments of Chemistry

External person

Moran, Patrick

  • University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology

External person

Munukutla, Siddhanth

  • University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Brady, Rachael

  • Natl. Ctr. Supercomputing Applic
  • University of Illinois at Urbana-Champaign
  • Beckman Institute of Advanced Science and Technology, University of Illinois
  • Beckman Institute for Advanced Science and Technology

External person

Griffin, P. B.

  • Stanford University
  • Department of Electrical Engineering

External person

Rowe, Cynthia A.

  • Urbana, IL, USA
  • University of Illinois at Urbana-Champaign

External person

Gaudiello, John G.

  • Northwestern University
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry

External person

Min, Kyoungmin

  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering, Beckman Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology

External person

Huang, Robert

  • Alcatel-Lucent
  • Nokia

External person

Young-Wug, Kim

  • Samsung
  • CPU Tech 1 Team

External person

Wood, Joshua D.

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Materials Science and Engineering, Northwestern University
  • Department of Electrical and Computer Engineering
  • Northwestern University
  • University of Illinois at Urbana-Champaign

External person

Lipatov, Alexey

  • University of Nebraska
  • Department of Chemistry
  • University of Nebraska–Lincoln

External person