Network

Gregory S Girolami

Person: Academic

Jeffrey S Moore

Person: Academic

William Paul King

Person: Academic

Kiruba Sivasubramaniam Haran

Person: Academic

Thomas B Rauchfuss

  • Chemistry - Larry R. Faulkner Professor Emeritus, Research Professor

Person: Academic

Karl Hess

  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Coordinated Science Laboratory
  • University of Illinois Urbana-Champaign
  • University of Kentucky
  • Samsung
  • Alcatel-Lucent
  • IEEE
  • Nokia
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Beckman Institute and Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Physics
  • Everitt Laboratoy
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Jinju Lee

  • University of Kentucky
  • Samsung
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Dept. Elec. Comp. Eng. Beckman I.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Microanalysis of Materials
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Tucker

  • University of Illinois Urbana-Champaign
  • Texas Instruments
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Central Research Laboratories
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Kangguo Cheng

  • Samsung
  • University of Illinois at Urbana-Champaign
  • IEEE
  • IBM Research
  • IBM
  • University of Illinois at Urbana-Champaign

External person

Eric Pop

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Department of Electrical and Computer Engineering
  • Electrical Engineering, Stanford University
  • Intel
  • Bldg 500
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Department of Mechanical Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Precourt Institute for Energy
  • Dept. of Electrical
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

T. J. Marks

  • Northwestern University
  • Tsinghua University
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • Center for Quantum Devices
  • Department of Chemistry
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Chemistry
  • University of Tübingen
  • Institute of Organic Chemistry
  • Department of Chemistry, Department of Electrical Engineering and Computer Science, Materials Research Center
  • Department of Chemistry
  • National Institute of Standards and Technology
  • Argonne-Northwestern Solar Energy Research Center

External person

Josh D. Wood

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Northwestern University
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. C. Abeln

  • Lucent Technologies
  • Alcatel-Lucent
  • University of Illinois Urbana-Champaign
  • Nokia
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

C. R. Kannewurf

  • Northwestern University
  • Sci. Technol. Ctr. Super.Conduct.
  • Sci. Technol. Ctr. Super. C.
  • University of Illinois Urbana-Champaign
  • Dept. of Elec. Eng. and Comp. Sci.
  • Department of Electrical Engineering
  • Materials Research Center
  • Center for Quantum Devices
  • Center for Quantum Devices
  • Center for Photonic Communication and Computing
  • Department of Chemistry
  • University of Tübingen
  • Institute of Organic Chemistry
  • Department of Chemistry, Department of Electrical Engineering and Computer Science, Materials Research Center

External person

P. M. Albrecht

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Zhi Chen

  • University of Kentucky
  • University of Illinois Urbana-Champaign
  • Samsung
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tamotsu Inabe

  • Northwestern University
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Chemistry
  • Center for Quantum Devices
  • Department of Chemistry
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry, Department of Electrical Engineering and Computer Science, Materials Research Center
  • Department of Chemistry

External person

I. C. Kizilyalli

  • Alcatel-Lucent
  • University of Kentucky
  • University of Illinois Urbana-Champaign
  • Lucent
  • Nokia
  • Lucent Technologies
  • Department of Electrical and Computer Engineering
  • Beckman Institute and Department of Electrical and Computer Engineering
  • Bell Labs
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. L. Skala

  • University of Illinois Urbana-Champaign
  • Texas Instruments
  • Center for Compound Semiconductor Microelectronics
  • 3M Materials Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Central Research Laboratories
  • Department of Electrical and Computer Engineering
  • Department of Chemistry and Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. Chem. Eng. and Mat. Res. Lab.
  • Department of Physics and the Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

J. S. Hubacek

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • 3M Materials Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Chemistry and Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. Chem. Eng. and Mat. Res. Lab.
  • Department of Physics and the Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Duc Nguyen

  • University of Illinois Urbana-Champaign
  • Vietnam National University, Hanoi
  • Northwestern University
  • Departments of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Faculty of Chemistry
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign

External person

R. T. Brockenbrough

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • 3M Materials Laboratory
  • University of Minnesota Twin Cities
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Chemistry and Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Department of Electrical Engineering
  • Dept. Chem. Eng. and Mat. Res. Lab.
  • Department of Physics and the Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

T. C. Shen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Gordon Gammie

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • 3M Materials Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Chemistry and Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. Chem. Eng. and Mat. Res. Lab.
  • Department of Physics and the Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

J. C. Koepke

  • University of Illinois Urbana-Champaign
  • Sandia National Laboratories
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. W. Schmucker

  • University of Illinois Urbana-Champaign
  • Naval Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. E. Thorne

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

W. G. Lyons

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Laura B. Ruppalt

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Richard T. Haasch

  • Frederick Seitz Mat. Research Lab.
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Center for Microanalysis of Materials
  • Department of Mechanical Science and Engineering, University of Illinois
  • Materials Research Laboratory
  • Center for Microanalysis of Materials
  • Department of Chemistry
  • Department of Mechanical Science and Engineering
  • Center for Microanalysis of Materials
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mark C. Hersam

  • Northwestern University
  • University of Illinois Urbana-Champaign
  • Department of Medicine
  • Dept. Elec. Comp. Eng. Beckman I.
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Materials Science and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. Estrada

  • Boise State University
  • Materials Science and Engineering, Boise State University
  • University of Illinois Urbana-Champaign
  • Department of Material Science and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Micron School of Materials Science and Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. B. Ballard

  • Zyvex Labs
  • National Oceanic and Atmospheric Administration
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

W. McMahon

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Lea Nienhaus

  • Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Chemistry
  • Massachusetts Institute of Technology
  • Micro and Nanotechnology Lab
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • Departments of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Lequn Liu

  • Materials Research Society (MRS
  • University of Illinois Urbana-Champaign
  • IEEE
  • American Physical Society
  • American Vacuum Society (AVS
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • American Physical Society
  • University of Illinois at Urbana-Champaign

External person

Young Kwang Kim

  • Samsung
  • CPU Tech1 Team
  • CPU TD Group
  • Technology Development Division

External person

Jixin Yu

  • University of Illinois Urbana-Champaign
  • University of South Carolina
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of South Carolina
  • University of Illinois at Urbana-Champaign

External person

K. T. He

  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alexander Sinitskii

  • University of Nebraska-Lincoln
  • National University of Science and Technology "MISiS"
  • Nebraska Center for Materials and Nanoscience
  • Department of Chemistry
  • University of Nebraska-Lincoln
  • University of Illinois at Urbana-Champaign

External person

Phaedon Avouris

  • IBM
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gregory Scott

  • University of Illinois Urbana-Champaign
  • California Polytechnic State University, San Luis Obispo
  • Departments of Chemistry
  • Department of Chemistry and Biochemistry
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Sundar Chetlur

  • Alcatel-Lucent
  • University of Kentucky
  • Lucent Laboratories
  • Nokia
  • Lucent Technologies

External person

Salvador Barraza-Lopez

  • Instituto Politécnico Nacional
  • Virginia Tech
  • Georgia Institute of Technology
  • University of Illinois Urbana-Champaign
  • University of Arkansas System
  • Los Alamos National Laboratory
  • Department of Physics
  • Department of Physics
  • Escuela Superior de Física y Matemáticas
  • Physics Division
  • Department of Physics
  • Department of Physics
  • Center for Relativistic Astrophysics
  • Department of Physics
  • Inst. for Particle Phys./Astrophys.
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Virginia Polytechnic Institute and State University
  • University of Illinois

External person

N. P. Guisinger

  • University of Illinois Urbana-Champaign
  • Dept. Elec. Comp. Eng. Beckman I.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gregory P. Doidge

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Ashtekar

  • University of Illinois Urbana-Champaign
  • Departments of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Kuang Yu Cheng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • National Tsing Hua University
  • University of Illinois at Urbana-Champaign

External person

A. Haggag

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Joseph F. Lomax

  • Northwestern University
  • Department of Chemistry
  • Center for Quantum Devices
  • Department of Chemistry, Department of Electrical Engineering and Computer Science, Materials Research Center

External person

J. H. Miller

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Physics and Astronomy
  • University of North Carolina at Chapel Hill
  • Australian National University
  • Massachusetts Institute of Technology
  • Pusan National University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of North Carolina Institute of Marine Sciences

External person

Young Wug Kim

  • Samsung
  • CPU Tech1 Team
  • CPU TD Group
  • Technology Development Division

External person

Erin S. Carmichael

  • University of Illinois Urbana-Champaign
  • Departments of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Sarah Wieghold

  • Technical University of Munich
  • Department of Chemistry
  • Department of Physical Chemistry
  • Department of Physical Chemistry

External person

Wei Ye

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Noel N. Chang

  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • Departments of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. N. Randall

  • Zyvex Labs

External person

D. S. Thompson

  • University of Illinois Urbana-Champaign
  • Department of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • School of Chemical Sciences, University of Illinois
  • Department of Electrical and Computer Engineering
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Kwang Pyuk Suh

  • Samsung
  • CPU TD Group
  • CPU Tech1 Team
  • Technology Development Division

External person

E. T. Foley

  • Natl. Inst. for Adv. Interdisc. Res.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute and Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • National Institute of Advanced Industrial Science and Technology
  • University of Illinois at Urbana-Champaign

External person

K. F. Schoch

  • Northwestern University
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science

External person

Ashkan Behnam

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Larry J. Markoski

  • INI Power Systems
  • University of Michigan, Ann Arbor
  • Beckman Institute for Advanced Science and Technology
  • INI Powers Systems
  • University of Illinois Urbana-Champaign
  • INI Power Systems
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Chemistry
  • Department of Chemistry
  • Departments of Chemistry
  • Department of Chemical Engineering
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Michigan, Ann Arbor
  • University of Illinois

External person

Navneet Kumar

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Leonard F. Register

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • Department of Electrical, and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Microelectronics Research Center
  • Microelectronics Research Center
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

William J. McCarthy

  • Northwestern University
  • Center for Quantum Devices
  • Materials Research Center

External person

Enrique A. Carrion

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bruce N. Diel

  • Northwestern University
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry
  • Department of Electrical Engineering and Computer Science
  • Department of Chemistry

External person

Pamela A. Peña Martin

  • Kyushu University
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

John Bardeen

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

Jae Won Do

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. T. Ratajack

  • Northwestern University
  • Center for Quantum Devices
  • Department of Chemistry
  • Center for Quantum Devices

External person

K. Y. Cheng

  • University of Illinois Urbana-Champaign
  • National Tsing Hua University
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Pamela Peña Martin

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Huy A. Nguyen

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology

External person

Chinlee Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

W. Wu

  • University of Illinois Urbana-Champaign
  • Texas Instruments
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Central Research Laboratories
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alison Wallum

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Chicago

External person

Tao Sun

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Austin S. Lyons

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mamun Sarker

  • University of Nebraska-Lincoln
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. R. Rossi

  • IBM
  • National Institute for Nuclear Physics
  • University of Perugia
  • University of Bologna

External person

Zhun Yong Ong

  • University of Texas at Dallas
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Physics
  • Department of Materials Science and Engineering
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Texas at Dallas

External person

Marie A. Mayer

  • University of California, Berkeley
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering

External person

H. Xu

  • Zyvex Asia Pte Ltd

External person

B. R. Tuttle

  • Behrend College
  • Pennsylvania State University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

Y. Ding

  • Zyvex Asia Pte Ltd

External person

Jayan Hewaparakrama

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gang Li

  • University of Nebraska-Lincoln
  • The University of Chicago

External person

Michael K. Moguel

  • Northwestern University
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry

External person

Parsian Katal Mohseni

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Rochester Institute of Technology
  • Micro and Nanotechnology Lab
  • Microsystems Engineering
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Electrical Engineering Department
  • University of Illinois at Urbana-Champaign

External person

Gang Wang

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Feifei Lian

  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

Isha Datye

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Huy A. Nguyen

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology

External person

Joshua J. Goings

  • University of Washington
  • Department of Chemistry, University of Washington

External person

S. H. Carr

  • Tsinghua University
  • Northwestern University

External person

S. T. Chou

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dongxia Shi

  • CAS - Institute of Physics
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Chinese Academy of Sciences
  • University of Illinois at Urbana-Champaign

External person

Ximeng Liu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. H. Tessmer

  • Michigan State University
  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Physics
  • Physics and Astronomy Department
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • Michigan State University
  • University of Illinois at Urbana-Champaign

External person

J. R. Shapley

  • Center of Advanced Materials for the Purification of Water with Systems
  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry and Materials Research Laboratory
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • School of Chemical Sciences, University of Illinois
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • School of Chemical Sciences, University of Illinois at Urbana Champaign
  • Departments of Chemistry
  • Center of Advanced Materials for the Purification of Water with Systems
  • Department of Chemistry
  • Center of Advanced Materials for the Purification of Water with Systems
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Physics and the Seitz Materials Research Laboratory
  • Dept. Chem. Eng. and Mat. Res. Lab.
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Mikhail Shekhirev

  • University of Nebraska-Lincoln
  • Department of Chemistry
  • University of Nebraska-Lincoln
  • Drexel University
  • Drexel University College of Engineering

External person

Scott R. Daly

  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • University of Iowa
  • Los Alamos National Laboratory
  • School of Chemical Sciences, University of Illinois at Urbana-Champaign, Noyes Laboratory
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Departments of Chemistry
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Iowa
  • University of Iowa
  • University of Iowa

External person

Yaofeng Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Timothy H. Vo

  • Department of Chemistry
  • University of Nebraska-Lincoln
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • University of Nebraska-Lincoln

External person

A. F. Kam

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute and Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. A. Shah

  • Dow Chemical
  • University of Illinois Urbana-Champaign
  • Dept. of Chem./Biomolec. Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. Saini

  • Zyvex Labs

External person

Xu Xie

  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • Lam Research Corporation
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Adrian Radocea

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

B. Kotzias

  • Alcatel-Lucent
  • Nokia
  • Lucent Technologies

External person

Carl W. Dirk

  • Northwestern University

External person

Mohammad Mehdi Pour

  • University of Nebraska-Lincoln
  • Department of Chemistry
  • University of Nebraska-Lincoln

External person

J. R. Von Ehr

  • Zyvex Labs

External person

Robert L. Burton

  • Northwestern University
  • Center for Quantum Devices
  • Materials Research Center

External person

P. Fay

  • University of Notre Dame
  • IEEE
  • University of Illinois Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • University of Ollinois
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Department of Electr. Engrg.
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Notre Dame
  • University of Notre Dame
  • University of Illinois at Urbana-Champaign

External person

G. Weber

  • Lucent
  • Nokia

External person

Aniruddh Rangarajan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Justin Mallek

  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Departments of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

J. Lee

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Uiduk University
  • Division of Information and Communication Eng.
  • Division of Information Eng.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Case Western Reserve University
  • Case Western Reserve University

External person

Gregory L. Damhorst

  • Department of Bioengineering
  • Micro and Nanotechnology Lab
  • University of Illinois Urbana-Champaign
  • Carle Foundation Hospital
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • University of Illinois at Chicago
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • College of Medicine at Urbana-Champaign, University of Illinois
  • Biomedical Research Center, Carle Foundation Hospital
  • College of Medicine
  • Department of Bioengineering
  • Department of Microbiology and College of Medicine
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Carle Clinic Association
  • Department of Bioengineering
  • Emory University
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Chicago
  • Prenosis Inc.
  • University of Illinois at Urbana-Champaign

External person

Kyle A. Ritter

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Siddhanth Munukutla

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bong Seok Kim

  • Samsung
  • CPU TD Group

External person

Alexey Lipatov

  • University of Nebraska-Lincoln
  • Department of Chemistry
  • University of Nebraska-Lincoln

External person

H. Choi

  • Micro and Nanotechnology Lab
  • Korea Institute of Science and Technology
  • Micro and Nanotechnology Laboratory and Department of Electrical and Computer Engineering, University of Illinois
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Zetai Liu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Alexander

  • Zyvex Labs

External person

Christopher M. Caroff

  • University of Illinois at Urbana-Champaign
  • University of Nebraska-Lincoln

External person

Shinyoung Choi

  • The University of Chicago

External person

K. C. Hsieh

  • Dept. of Elec. and Comp. Engineering
  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Electrical Engineering Research Laboratory
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Ctr. Compd. Semiconduct. M.
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. Nordlander

  • Rice University
  • Departments of Physics and Astronomy
  • Department of Electrical and Computer Engineering and Material Science and Nanoengineering
  • Department of Physics
  • Rice University

External person

Martin Wagner

  • University of California at San Diego
  • Department of Physics

External person

Shuhei Nakamura

  • Northwestern University

External person

Hefei Dong

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Joshua A. Kaitz

  • Department of Chemistry and Beckman, Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • Department of Physics and Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Davida W. Kalina

  • Northwestern University
  • Department of Chemistry

External person

Fritz Keilmann

  • Ludwig Maximilian University of Munich

External person

Yuya Murata

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Yanqin Zhai

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • National Institute of Standards and Technology
  • University of Illinois at Urbana-Champaign

External person

Weihua Wang

  • Chinese Academy of Sciences
  • CAS - Institute of Physics
  • Songshan Lake Materials Laboratory

External person

E. E. Reuter

  • University of Illinois Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zoe Budrikis

  • Institute for Scientific Interchange Foundation

External person

Maryann C. Tung

  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • Stanford University
  • University of Illinois at Urbana-Champaign

External person

M. R. Bischof

  • University of North Texas
  • Department of Materials Science and Engineering

External person

S. I. Jackson

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaosong Li

  • University of Washington
  • Department of Chemistry, University of Washington

External person

Yutaka Ohno

  • Nagoya University
  • Department of Quantum Engineering

External person

Pin Chiao Huang

  • University of Nebraska-Lincoln
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Sen

  • Alcatel-Lucent
  • Nokia
  • Lucent Technologies

External person

Cory D. Cress

  • Naval Research Laboratory
  • Electronics Science and Technology Division

External person

A. Seabaugh

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alexander S. McLeod

  • University of California at San Diego
  • Department of Physics
  • Columbia University
  • Department of Physics

External person

Dong ming Sun

  • Department of Quantum Engineering
  • Nagoya University

External person

Rui Zhao

  • Chinese Academy of Sciences
  • Beijing Normal University
  • Jilin University

External person

F. Esch

  • Technical University of Munich
  • Department of Physical Chemistry

External person

S. T. Hwang

  • University of Illinois Urbana-Champaign

External person

John Huber

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Xiao Zhou

  • Tsinghua University
  • Hong Kong University of Science and Technology

External person

Marina Y. Timmermans

  • Aalto University
  • NanoMaterials Group

External person

J. L. Malin

  • University of Illinois at Urbana-Champaign

External person

Andrew N. Cloud

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhi Guang Zhu

  • CAS - Changchun Institute of Optics Fine Mechanics and Physics
  • CAS - Institute of Physics
  • Chinese Academy of Sciences

External person

A. B. Shah

  • Engineering University of Illinois
  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Depts. of Mat. Sci. and Eng.
  • Center for Microanalysis of Materials
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Center for Microanalysis of Materials
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. Higashi

  • Nokia
  • Lucent Technologies

External person

Gyula Eres

  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Oak Ridge National Laboratory
  • Materials Science and Technology Division, Oak Ridge National Laboratory

External person

Suh Kwang-Pyuk

  • Samsung
  • CPU Tech 1 Team

External person

Shian Aur

  • Texas Instruments

External person

H. C. Akpati

  • Rice University
  • Department of Physics

External person

Changxian Wang

  • Nanyang Technological University

External person

Ivan Vlassiouk

  • Oak Ridge National Laboratory
  • Energy and Transportation Science Division, Oak Ridge National Laboratory
  • Energy and Transportation Science Division

External person

Weidong He

  • Swiss Federal Laboratories for Materials Science and Technology (Empa)

External person

Damon N. Hebert

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Robert Eklund

  • Texas Instruments

External person

Ki Jun Yu

  • Dept. of Mat. Sci. and Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Yonsei University
  • School of Electrical and Electronic Engineering, Yonsei University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Neil O L Viernes

  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign

External person

B. Fischer

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Albert G. Nasibulin

  • Aalto University
  • NanoMaterials Group

External person

U. Heiz

  • Technical University of Munich
  • Department of Physical Chemistry

External person

Michael Loes

  • University of Nebraska-Lincoln

External person

Ximeng Liu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology

External person

Laiquan Shen

  • Chinese Academy of Sciences

External person

F. H. Herbstein

  • Technion-Israel Institute of Technology
  • Department of Chemistry

External person

Rafal A. Korlacki

  • University of Nebraska-Lincoln
  • Department of Electrical and Computer Engineering
  • University of Nebraska-Lincoln

External person

Camilo Jaramillo

  • Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Nuclear
  • Pennsylvania State University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. M. Farrell

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaosong Li

  • University of Washington
  • Department of Chemistry, University of Washington

External person

Clinton S. Potter

  • Scripps Research Institute
  • University of Illinois Urbana-Champaign
  • Natl. Ctr. Supercomputing Applic
  • Department of Integrative Structural and Computational Biology
  • Department of Molecular and Experimental Medicine
  • Beckman Institute for Advanced Science and Technology
  • Beckman Institute of Advanced Science and Technology, University of Illinois
  • Beckman Institute
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Florida

External person

Lou Ann Miller

  • University of Illinois Urbana-Champaign
  • Biological Electron Microscopy
  • Department of Pathobiology
  • Seitz Materials Research Laboratory
  • Department of Veterinary Biosciences
  • Department of Veterinary Biosciences
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Biological Electron Microscopy
  • Center for Microscopy and Imaging
  • University of Illinois at Urbana-Champaign

External person

Shun Lien Chuang

  • Dept. of Elec. and Comp. Engineering
  • University of Illinois Urbana-Champaign
  • Princeton Optronics
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Ctr. Compd. Semiconduct. M.
  • Dept. of Etearical and Computer Eng.
  • Engineering and Computer Science Department
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sravan Pappu

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Fan Zhang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Adam L. Friedman

  • Naval Research Laboratory
  • Materials Science and Technology Division, Code 6364, Naval Research Laboratory

External person

Carl D. Gregory

  • University of Illinois Urbana-Champaign
  • Biomed. Magnetic Reson. Laboratory
  • Beckman Institute of Advanced Science and Technology, University of Illinois
  • Biomed. Magnetic Reson. Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Medical Information Science
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

J. D. Plummer

  • Stanford University
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Stanford University

External person

K. Matsuda

  • Naruto University of Education
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

E. A. Beam

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Agarwala

  • University of Illinois Urbana-Champaign
  • National Instruments
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Basil Aruin

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rushabh Mehta

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tsung Chuan Whang

  • Northwestern University
  • Center for Quantum Devices

External person

HeeSung Choi

  • University of Texas at Dallas
  • Physics Department
  • University of Texas at Dallas

External person

Shanyu Zhao

  • Swiss Federal Laboratories for Materials Science and Technology (Empa)

External person

Hanfei Wang

  • University of Illinois at Urbana-Champaign

External person

Michael D. Goldflam

  • University of California at San Diego
  • Department of Physics

External person

Progna Banerjee

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Texas at Austin
  • University of Illinois at Urbana-Champaign

External person

Richard E. Marsh

  • California Institute of Technology
  • University of Illinois Marvel Undergraduate Research Awardee
  • California Institute of Technology

External person

Mark H. Thiemens

  • University of California at San Diego
  • Dept. of Chemistry and Biochemistry, University of California, San Diego

External person

Jayme L. Jeffries

  • University of Illinois Urbana-Champaign
  • Department of Pathobiology, College of Veterinary Medicine, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. Zhao

  • CAS - Institute of Physics
  • Chinese Academy of Sciences

External person

L. Jurczyszyn

  • University of Wrocław
  • Institute of Experimental Physics

External person

Lyle H. Schwartz

  • Northwestern University
  • Department of Materials Science and Engineering
  • University of Tübingen
  • Institute of Organic Chemistry

External person

Jessica Crystal Spear

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jae Won Do

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Scott R. Wilson

  • University of Illinois Urbana-Champaign
  • 601 S. Goodwin, Urbana, IL 61801, U.
  • Universität Karlsruhe
  • Box 55-5
  • Urbana-Champaign
  • Karlsruhe Institute of Technology
  • School of Chemical Sciences
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry
  • School of Chemical Sciences and Materials Research Laboratory
  • Beckman Institute for Advanced Science and Technology
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry
  • School of Chemical Sciences, University of Illinois at Urbana Champaign
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Roger Adams Laboratory
  • Materials Research Laboratory
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Departments of Chemistry
  • School of Chemical Sciences, University of Illinois at Urbana-Champaign, Noyes Laboratory
  • Department of Chemistry
  • Lehrstuhl für Anorganische Chemie
  • Department of Electrical and Computer Engineering
  • School of Chemical Sciences
  • University of Delaware
  • Department of Chemistry, University of Delaware
  • School of Chemical Sciences and Fredrick Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • CSIR - Central Drug Research Institute
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Cedric M. Horvath

  • University of Arkansas System
  • Department of Physics

External person

G. E. Stillman

  • University of Illinois Urbana-Champaign
  • Urbana, IL, USA
  • Dept. of Elec. and Comp. Engineering
  • California Institute of Technology
  • HRL Laboratories
  • EpiWorks
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Materials Research Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Electrical Engineering Research Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Department of Chemistry
  • Ctr. Compd. Semiconduct. M.
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Jiangliang Yin

  • The University of Chicago

External person

Wei Hua Wang

  • CAS - Changchun Institute of Optics Fine Mechanics and Physics
  • CAS - Institute of Physics
  • Chinese Academy of Sciences

External person

Bridget Carragher

  • Scripps Research Institute
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Columbia University
  • New York Structural Biology Center
  • University of Illinois at Urbana-Champaign
  • University of Florida
  • Beckman Institute
  • UIUC

External person

R. F. Reidy

  • University of North Texas
  • Department of Materials Science and Engineering

External person

Nhan T. Nguyen

  • Faculty of Chemistry
  • Hanoi University of Sciences
  • VNU University of Science
  • Faculty of Chemistry
  • Vietnam National University, Hanoi

External person

M. Heiranian

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Antonio C. Berti

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Stefano Zapperi

  • University of Milan
  • Institute for Scientific Interchange Foundation
  • National Research Council of Italy
  • Aalto University
  • Dipartimento di Fisica
  • Department of Applied Physics
  • Department of Physics and Center for Complexity and Biosystems

External person

Deepak K. Sengupta

  • Urbana, IL, USA
  • Jet Propulsion Laboratory, California Institute of Technology
  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Ctr. Space Microelectronics Technol.
  • Ctr. Space Microlectron. Technol.
  • Ctr. Compd. Semiconduct. M.
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Kenneth J. Wynne

  • Office of Naval Research
  • Chemistry Program

External person

T. Olewicz

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Abdou Hassanien

  • National Institute of Advanced Industrial Science and Technology
  • National Institute of Chemistry Ljubljana
  • Electronics and Photonics Research Institute

External person

Kyle L. Grosse

  • Department of Mechanical Science and Engineering
  • Mechanical Science and Engineering, Univ. Illinois Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kim Young-Kwang

  • Samsung
  • CPU Tech 1 Team

External person

Nick Kisseberth

  • Beckman Institute
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Beckman Institute of Advanced Science and Technology, University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Na Wu

  • Swiss Federal Institute of Technology Zurich

External person

M. Tao

  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • University of South Carolina
  • Center for Compound Semiconductor Microelectronics
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Elec. and Comp. Engineering
  • University of Illinois at Urbana-Champaign
  • University of South Carolina
  • University of Illinois at Urbana-Champaign

External person

Henry O. Marcy

  • Northwestern University
  • Department of Electrical Engineering

External person

B. P. Gorman

  • Colorado School of Mines
  • Department of Materials Science and Engineering

External person

Zhizhou Kuang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ted K. Higman

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Guangbin Dong

  • The University of Chicago

External person

Vincent E. Dorgan

  • Electrical and Computer Engineering, Univ. Illinois Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. Antczak

  • University of Wrocław
  • Institute of Experimental Physics

External person

J. Jonas

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. Mark Bolinger

  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, University of Illinois
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiangyun J. Duan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Otto Schneider

  • University of Tübingen
  • Institute of Organic Chemistry
  • Northwestern University
  • Department of Chemistry

External person

Cesar E. Chialvo

  • University of Illinois Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mohammad Mehdi Pour

  • University of Nebraska-Lincoln
  • Department of Chemistry
  • University of Nebraska-Lincoln

External person

F. L. Knoller

  • Technical University of Munich

External person

James C. Culbertson

  • Naval Research Laboratory
  • Electronics Science and Technology Division

External person

W. H. Goodman

  • Northwestern University
  • Department of Chemistry

External person

Yang Xu

  • Zhejiang University
  • University of Illinois Urbana-Champaign
  • Department of Information Science and Electronic Engineering
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Mech. and Indust. Eng.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Esko I. Kauppinen

  • Aalto University
  • NanoMaterials Group

External person

M. Schofieled

  • Alcatel-Lucent
  • Nokia
  • Lucent Technologies

External person

Andrey Lashkov

  • Saratov State Technical University
  • Department of Physics

External person

Omar Khatib

  • University of Colorado Boulder
  • University of California at San Diego
  • Department of Physics
  • Department of Physics

External person

Stephen M. Goodnick

  • Arizona State University
  • Oregon State University
  • Department of Electrical Engineering
  • Oregon State University
  • Arizona State University

External person

Shengying Yue

  • Shandong University

External person

Ashkan Behman

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Brian Pringle

  • University of Illinois Urbana-Champaign
  • Departments of Chemistry
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Zhi Chen

  • University of Kentucky
  • University of Illinois Urbana-Champaign
  • Samsung
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Jeremy T. Robinson

  • Naval Research Laboratory
  • Electronics Science and Technology Division
  • Rice University

External person

Steven D. Gammon

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

W. H. Wang

  • CAS - Institute of Physics
  • Chinese Academy of Sciences
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering

External person

Yefim Epstein

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Cheng Lin Tsai

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Brent E. Walling

  • University of Illinois Urbana-Champaign
  • Department of Pathobiology, College of Veterinary Medicine, University of Illinois at Urbana-Champaign
  • Department of Pathobiology
  • University of Illinois at Urbana-Champaign

External person

S. Y. Lee

  • University of Illinois Urbana-Champaign
  • University of Michigan, Ann Arbor
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

F. Y. Liu

  • Stanford University
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Stanford University

External person

Peter J. Sempsrott

  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jiurong Liu

  • Shandong University

External person

Ning C. Wang

  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

V. Nazareth

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. W M Salemink

  • University of Illinois Urbana-Champaign
  • IBM Zurich Research Laboratory
  • IBM

External person

Brendan F. Wolan

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kyeongjae Cho

  • University of Texas at Dallas
  • Physics Department
  • University of Texas at Dallas

External person

James A. Ibers

  • Northwestern University
  • Department of Chemistry

External person

Min Huang

  • Physics Department
  • University of Texas at Dallas
  • University of Texas at Dallas

External person

Sakulsuk Unarunotai

  • Chulalongkorn University
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Chemistry
  • Seitz Materials Research Laboratory
  • Department of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. G. Bishop

  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Microeectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

J. L. Latten

  • University of Illinois at Urbana-Champaign

External person

Malcolm S. Mcclure

  • Northwestern University
  • Center for Quantum Devices

External person

J. F. Dorsten

  • Shell Oil
  • University of Illinois Urbana-Champaign
  • Royal Dutch Shell PLC
  • Shell Oil
  • Department of Chemistry
  • Department of Chemistry and the Materials Research Laboratory
  • Department of Chemistry
  • Departments of Chemistry
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Christopher D. English

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Physics and the Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jason Lindquist

  • University of Illinois Urbana-Champaign
  • Beckman Institute of Advanced Science and Technology, University of Illinois
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Hyeongyun Cha

  • Kyushu University
  • University of Illinois at Urbana-Champaign
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Can Liao

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Ozgur Aktas

  • Bilkent University
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Electrical and Electronics Engineering
  • Dept. of Electrical and Electronics Engineering
  • University of Illinois at Urbana-Champaign

External person

Sung Kon Kim

  • University of Illinois Urbana-Champaign
  • Jeonbuk National University
  • Dept. of Mat. Sci. and Engineering
  • School of Chemical Engineering
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Seoul National University
  • University of Illinois at Urbana-Champaign

External person

M. Garg

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hao Chung Kuo

  • National Yang Ming Chiao Tung University
  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Photonics
  • Dept. of Mat. Sci. and Engineering
  • Department of Photonics
  • Departmet of Photonics and Institute of Electro-Optical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Photonic
  • Department of Photonics and Institute of Electro-Optical Engineering
  • National Chiao Tuna University
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • Hon Hai Precision Industry
  • University of Illinois at Urbana-Champaign

External person

Joshua D. Wood

  • University of Illinois Urbana-Champaign
  • Northwestern University
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology

External person

Xuan Yi

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • School of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Scripps College
  • University of Illinois at Urbana-Champaign

External person

D. Jovanovic

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Materials Research Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Pratibha Dev

  • Naval Research Laboratory
  • Howard University
  • Department of Physics and Astronomy

External person

Michael Hanack

  • University of Tübingen
  • Institute of Organic Chemistry
  • Institute of Organic Chemistry

External person

J. J. Shepherd

  • University of Iowa
  • Chemistry Building
  • University of Iowa
  • University of Iowa
  • Carleton College
  • University of Barcelona
  • Mayo Clinic Rochester, MN

External person

Kyoungmin Min

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

F. F. Schweinberger

  • Technical University of Munich

External person

H. C. Liu

  • National Research Council
  • California Institute of Technology
  • National Research Council of Canada
  • University of Illinois Urbana-Champaign
  • Inst. for Microstructural Sciences
  • Inst. of Microstructural Sciences
  • Inst. for Microstructural Sciences
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology

External person

W. Fang

  • University of Illinois at Urbana-Champaign

External person

Michael N. Kozicki

  • Arizona State University
  • Department of Electrical Engineering
  • Arizona State University

External person

Lee Seung

  • Samsung
  • CPU Tech 1 Team

External person

Feng Xiong

  • University of Illinois Urbana-Champaign
  • Stanford University
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

D. L. Jaeger

  • University of North Texas
  • Department of Materials Science and Engineering

External person

B. E. Janicek

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Physics
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Faraz Arastu

  • University of Illinois Urbana-Champaign
  • Hinetics, LLC
  • University of Illinois at Urbana-Champaign

External person

I. Petrov

  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Technique and Applications
  • International Union for Vacuum Science
  • Dept. of Mat. Sci. and Engineering
  • Linköping University
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. M. Barbara

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Z. Guo

  • Zhejiang University
  • Department of Information Science and Electronic Engineering

External person

Frank Du

  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Victor Sysoev

  • Saratov State Technical University
  • National University of Science and Technology "MISiS"
  • Department of Physics

External person

G. Ehrlich

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Michael Cai Wang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of South Florida
  • Department of Mechanical Engineering
  • University of Illinois at Urbana-Champaign
  • Sewanee: The University of the South
  • University of South Florida
  • University of Illinois at Urbana-Champaign

External person

Jinman Yang

  • Arizona State University
  • Department of Electrical Engineering
  • Arizona State University

External person

M. P. Keyes

  • University of Illinois Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Anshul Saxena

  • University of Texas at Austin

External person

D. N. Basov

  • University of California at San Diego
  • Department of Physics
  • Department of Physics
  • Columbia University
  • Department of Physics

External person

S. Q. Gu

  • University of Illinois Urbana-Champaign
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. M. Reisner

  • Technion-Israel Institute of Technology
  • Department of Chemistry

External person

James Darkwa

  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, University of Illinois
  • Department of Electrical and Computer Engineering
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wen Bin Liang

  • Northwestern University
  • Department of Chemistry

External person

Xiang Zhao

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bin Li

  • Shandong University

External person

S. T. Hwang

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Trevor J. Thornton

  • Arizona State University
  • Department of Electrical Engineering
  • Arizona State University

External person

Lang Sheng Lin

  • Northwestern University
  • Department of Chemistry

External person

Yonghua Hao

  • University of Illinois Urbana-Champaign
  • Department of Pathobiology, College of Veterinary Medicine, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Paul W. Bohn

  • University of Notre Dame
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry and Biochemistry and Department of Chemical and Biomolecular Engineering, University of Notre Dame
  • Department of Chemical and Biomolecular Engineering, University of Notre Dame
  • Department of Chemistry and Biochemistry, University of Notre Dame
  • University of Illinois Urbana-Champaign
  • National Instruments
  • Yale University
  • United States Army Engineer Research and Development Center
  • Department of Chemistry
  • Micro and Nanotechnology Lab
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Environmental Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Mech. and Indust. Eng.
  • Department of Chemistry and the Materials Research Laboratory
  • Center for Microanalysis of Materials
  • Department of Chemistry
  • University of Missouri at St. Louis
  • Department of Chemistry
  • Department of Chemistry and Biochemistry
  • Dept. of Chemical and Biomolecular Engineering
  • Seitz Materials Research Laboratory
  • Department of Chemistry and Biochemistry
  • Departments of Chemistry
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemistry and Biochemistry
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign
  • University of Notre Dame
  • University of Illinois
  • University of Notre Dame
  • University of Illinois at Urbana-Champaign

External person

Hongye Sun

  • University of Nebraska-Lincoln
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Patrick Moran

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Rachael Brady

  • Natl. Ctr. Supercomputing Applic
  • University of Illinois Urbana-Champaign
  • Beckman Institute of Advanced Science and Technology, University of Illinois
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Tianshu Zhai

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

P. B. Griffin

  • Stanford University
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Stanford University

External person

Narendra K. Jaggi

  • Northwestern University

External person

Cynthia A. Rowe

  • Urbana, IL, USA
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

John G. Gaudiello

  • Northwestern University
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry

External person

Zhihui Zeng

  • Shandong University

External person

Peng Luo

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • National Institute of Standards and Technology
  • University of Illinois at Urbana-Champaign

External person

Robert Huang

  • Alcatel-Lucent
  • Nokia

External person

Kim Young-Wug

  • Samsung
  • CPU Tech 1 Team

External person

Joshua D. Wood

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Northwestern University
  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign

External person