1983 …2019
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Research Output 1983 2019

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Conference contribution
2019

A deep learning approach for volterra kernel extraction for time domain simulation of weakly nonlinear circuits

Nguyen, T., Wang, X., Chen, X. & Schutt-Aine, J. E., May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1889-1896 8 p. 8811319. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Feedforward neural networks
Networks (circuits)
Buffers
Topology
Neural networks

Deep Learning Method for Prediction of Planar Radiating Sources from Near-Field Intensity Data

Ma, H., Li, E. P., Schutt-Aine, J. & Cangellaris, A. C., Jul 2019, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019. Institute of Electrical and Electronics Engineers Inc., p. 610-615 6 p. 8825271. (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Neural networks
Deep learning

LIM Algorithms for Diodes and Branch Capacitors

Schutt-Aine, J. E. & Goh, P., Apr 2 2019, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018. Institute of Electrical and Electronics Engineers Inc., 8680874. (IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Diodes
Capacitors
Topology
Networks (circuits)

LIM Algorithms for MOSFET Models

Schutt-Aine, J. E. & Goh, P., Mar 14 2019, 2019 IEEE 10th Latin American Symposium on Circuits and Systems, LASCAS 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 33-36 4 p. 8667600. (2019 IEEE 10th Latin American Symposium on Circuits and Systems, LASCAS 2019 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for Transient Solution of Electromagnetic and Circuit Problems with Uncertainties

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., May 10 2019, 2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019. Institute of Electrical and Electronics Engineers Inc., 8712858. (2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Transient Solution
electromagnetism
Uncertainty
Networks (circuits)
Augmented System
2018

Adaptive wavelet stochastic collocation for resonant transmission line circuits

Yang, A. S., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Apr 2 2018, 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric lines
Resonant circuits
Networks (circuits)
Statistics
Polynomials

A pseudo-supervised machine learning approach to broadband LTI macro-modeling

Nguyen, T. & Schutt-Aine, J. E., Jun 22 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1018-1021 4 p. (2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

machine learning
Macros
Learning systems
Poles
broadband

Circuit synthesis of blackbox macromodels from S-parameter representation

Schutt-Aine, J. E., Jun 29 2018, 2018 IEEE 22nd Workshop on Signal and Power Integrity, SPI 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2018 IEEE 22nd Workshop on Signal and Power Integrity, SPI 2018 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Scattering parameters
Networks (circuits)
Electric lines

FFT-based macromodeling of power delivery network with uncertainties using Latency Insertion Method and stochastic collocation

Kummerer, R. F., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 20 2018, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

collocation
fast Fourier transformations
Fast Fourier transforms
insertion
delivery

Rapid electro-thermal modeling for 3D integration using circuit simulation techniques

Shiue, G. & Schutt-Aine, J. E., Jun 22 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers Inc., 1 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Circuit simulation
Thermoanalysis
simulators
Computational complexity
thermal analysis

Stochastic LIM for uncertainty characterization of fiber-weave effect on coupled transmission lines

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 20 2018, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., Vol. 2018-January. p. 1-3 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

transmission lines
Electric lines
Glass fibers
fibers
Fibers
2017

Comparison of techniques for model order reduction of frequency-dependent networks

Nguyen, T. & Schutt-Aine, J. E., Apr 5 2017, 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. Institute of Electrical and Electronics Engineers Inc., p. 87-89 3 p. 7893133. (2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Model Order Reduction
Dependent
Skin effect
HIgh speed networks
Electric network analysis

FFT-based macromodeling of power delivery network with uncertainties using latency insertion method

Kummerer, R. F., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jun 7 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7944035. (2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fast Fourier transforms
Materials properties
Geometry
Uncertainty

Modulation enhancements of photonic crystal vcsels

Dave, H., Fryslie, S. T. M., Schutt-Aine, J. E. & Choquette, K. D., Jan 1 2017, Vertical-Cavity Surface-Emitting Lasers XXI. Choquette, K. D. & Lei, C. (eds.). SPIE, 1012207. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 10122).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vertical-cavity Surface-emitting Laser (VCSEL)
Photonic crystals
Photonic Crystal
Modulation
Enhancement

Monte Carlo estimation of sparse grid interpolation residual for stochastic collocation of high-order systems with uncertainties

Chen, X., Ma, X., Rong, A., Schutt-Aine, J. E. & Cangellaris, A. C., Jun 7 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7944004. (2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Interpolation
Sampling
Uncertainty

Stochastic electromagnetic-circuit simulation for system-level EMI analysis

Ma, X., Chen, X., Rong, A., Schutt-Aine, J. E. & Cangellaris, A. C., Oct 20 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 118-123 6 p. 8077852. (IEEE International Symposium on Electromagnetic Compatibility).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Circuit simulation
electromagnetism
Electromagnetic coupling
Computer aided analysis
electromagnetic coupling

Volterra kernels extraction from frequency-domain data for weakly non-linear circuit time-domain simulation

Nguyen, T., Schutt-Aine, J. E. & Chen, Y., Dec 29 2017, 2017 IEEE Radio and Antenna Days of the Indian Ocean, RADIO 2017. Institute of Electrical and Electronics Engineers Inc., Vol. 2017-January. p. 1-2 2 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Convolution
convolution integrals
Networks (circuits)
transistor circuits
simulation
2016

Finite difference schemes for transient simulation of transmission lines exhibiting uncertainties

Chen, X., Schutt-Ainé, J. E. & Cangellaris, A. C., Jun 20 2016, 2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7496311. (2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric lines
Galerkin methods
Probability distributions
Networks (circuits)
Uncertainty

SPICE circuit synthesis from complex pole-residue S-parameter representation

Schutt-Aine, J. E., Jul 26 2016, 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 1050-1052 3 p. 7522942. (2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electric network topology
Rational functions
Scattering parameters
SPICE
Poles

Stochastic LIM for Transient Simulations of Printed Circuit Board Transmission Lines with Uncertainties

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Aug 16 2016, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., Vol. 2016-August. p. 2297-2304 8 p. 7545744

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Printed circuit boards
Electric lines
Networks (circuits)
Equivalent circuits
Electronics packaging
2015

MOS models for LIM transient simulations

Hajimiri, M. & Schutt-Aine, J. E., Dec 3 2015, 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015. Institute of Electrical and Electronics Engineers Inc., p. 189-192 4 p. 7347159

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Digital circuits
Analog circuits
MOSFET devices
SPICE
Transistors

Stochastic LIM for transient simulation of circuits with uncertainties

Chen, X., Qiu, M., Schutt-Ainé, J. E. & Cangellaris, A. C., May 7 2015, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., p. 29-32 4 p. 7103585. (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Networks (circuits)
Transient analysis
Chaos theory
Resistors
Computational complexity
2014

Blackbox macro-modeling of the nonlinearity based on Volterra series representation of X-parameters

Xiong, X. Y. Z., Jiang, L. J., Schutt-Ainé, J. E. & Chew, W. C., Jan 1 2014, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., p. 85-88 4 p. 7103601. (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Macros
Mathematical models

Optimal relaxation of I/O electrical requirements under packaging uncertainty by stochastic methods

Chen, X., Ochoa, J. S., Schutt-Aine, J. E. & Cangellaris, A. C., Sep 11 2014, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 717-722 6 p. 6897363. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Packaging
Crosstalk
Random variables
Cost functions
Electric potential

Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards

Zhang, T., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 1 2014, 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings. IEEE Computer Society, 6844540. (2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Printed circuit boards
Statistical methods
Fibers
Substrates
Microstrip lines
2013

A strategy to optimize Modal Signaling over microstrip lines with spacing variability

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Aug 20 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558338. (2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microstrip lines
Crosstalk
Printed circuit boards
Electric lines

Comparing fast convolution and model order reduction methods for S-parameter simulation

Schutt-Ainé, J. E. & Goh, P., Dec 1 2013, EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. p. 134-137 4 p. 6724407. (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Scattering parameters
Convolution

Fast and accurate multiscale electromagnetic modeling framework: An overview

Chew, W. C., Cangellaris, A. C., Schutt-Aine, J. E., Braunisch, H., Qian, Z. G., Aydiner, A. A., Aygun, K., Jiang, L. J., Ma, Z. H., Meng, L. L. & Naeem, M., Aug 20 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558315. (2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electronics packaging
System-on-chip
System-in-package

Miniaturized on-chip passive devices based on self-rolled-up SiN x nanomembrane inductive tube

Huang, W., Yu, X., Comberiate, T., Qiu, C. W., Schutt-Aine, J. E. & Li, X., Dec 16 2013, 71st Device Research Conference, DRC 2013 - Conference Digest. p. 227-228 2 p. 6633876. (Device Research Conference - Conference Digest, DRC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver

Wu, J. W., Schutt-Aine, J. E., Qian, Z. G. & Chew, W. C., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 203-206 4 p. 6703499. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Equivalent circuits
Electromagnetic waves
Poles
SPICE
Integral equations

Modeling I/O buffers using X-parameters

Comberiate, T. M. & Schutt-Aine, J. E., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 25-28 4 p. 6703459. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Phase-locked loop simulations using the latency insertion method

Schutt-Aine, J. E. & Goh, P. K., 2013, 2013 IEEE 4th Latin American Symposium on Circuits and Systems, LASCAS 2013 - Conference Proceedings. 6519090

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Phase locked loops
Transient analysis
Dynamic response
Transistors
Electric potential

Some internal crosstalk reduction schemes

Broyde, F., Clavelier, E. & Schutt-Aine, J. E., 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 227-230 4 p. 6703505

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Crosstalk

Using X-parameters to generate IBIS models

Comberiate, T. M. & Schutt-Aine, J. E., 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558350

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Specifications

X-parameter techniques for signal integrity in high-speed links

Schutt-Aine, J. & Comberiate, T., Dec 1 2013, Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013. p. 235-239 5 p. 6745719. (Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2012

IBIS modeling using latency insertion method (LIM)

Schutt-Aine, J. E., Tan, J., Liu, P., Al-Hawari, F. & Varma, A., Jul 27 2012, 2012 IEEE 16th Workshop on Signal and Power Integrity, SPI 2012 - Proceedings. p. 97-100 4 p. 6222920. (2012 IEEE 16th Workshop on Signal and Power Integrity, SPI 2012 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Newton-Raphson method
Computer simulation

Using the latency insertion method (LIM) to generate X parameters

Comberiate, T. M. & Schutt-Aine, J. E., 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. p. 280-283 4 p. 6457896

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wave power
2011

A comparison of two latency insertion methods in dependent sources applications

Liu, P., Tan, J., Zhou, Z., Schutt-Aine, J. E. & Goh, P., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 295-298 4 p. 6100250. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Amplification
Networks (circuits)
Experiments

Application of the amplification matrix latency insertion method to circuits with dependent sources

Liu, P., Tan, J., Zhou, Z., Schutt-Aine, J. E. & Goh, P., Dec 1 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 6213771. (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Amplification
Networks (circuits)

Application of the latency insertion method to electro-thermal circuit analysis

Klokotov, D., Schutt-Aine, J. E., Beyene, W., Mullen, D., Li, M., Schmitt, R. & Yang, L., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 263-266 4 p. 6100242. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

VLSI circuits
Circuit simulation
Electric network analysis
Thermoanalysis
Networks (circuits)

Design of a 12Gb/s transceiver for high-density links with discontinuities using modal signaling

Milosevic, P. & Schutt-Ainé, J. E., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 215-218 4 p. 6100230. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Crosstalk
Transceivers
Decomposition
Telecommunication links
Data storage equipment

Latency Insertion Method (LIM) for CMOS circuit simulations with multi-rate considerations

Goh, P. & Schutt-Aine, J. E., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 125-128 4 p. 6100205. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Circuit simulation
Networks (circuits)
SPICE

Modeling I/O links with X parameters

Schutt-Aine, J. E., Milosevic, P. & Beyene, W. T., 2011, DesignCon 2011. Vol. 2. p. 928-948 21 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Circuit simulation

Partitioned latency insertion method (PLIM) with stability considerations

Goh, P., Schutt-Aine, J. E., Klokotov, D., Tan, J., Liu, P., Dai, W. & Al-Hawari, F., Aug 3 2011, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings. p. 107-110 4 p. 5898851. (2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stability criteria
Networks (circuits)

System-level characterization of modal signaling for high-density off-chip interconnects

Milosevic, P. & Schutt-Aine, J. E., Dec 1 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 6213748. (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Crosstalk
Decomposition
Transceivers
Telecommunication links
Networks (circuits)
2010

Application of the latency insertion method (LIM) to the modeling of CDM ESD events

Klokotov, D., Shukla, V., Schutt-Ainé, J. & Rosenbaum, E., Aug 9 2010, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. p. 652-656 5 p. 5490800. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Electrostatic discharge
Circuit simulation
Integrated circuits
Simulators

Crosstalk mitigation of high-speed interconnects with discontinuities using modal signaling

Milosevic, P., Schutt-Aine, J. E. & Beyene, W. T., Jan 1 2010, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society, p. 21-24 4 p. 5642534. (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Crosstalk
Decomposition
Telecommunication links
Electric lines
Data storage equipment

Modeling and simulation of high speed I/O links using X parameters

Schutt-Aine, J. E., Milosevic, P. & Beyene, W. T., Jan 1 2010, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society, p. 29-32 4 p. 5642536. (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2009

Application of the latency insertion method to circuits with blackbox macromodel representation

Schutt-Aine, J. E., Klokotov, D., Goh, P., Tan, J., Al-Hawari, F., Liu, P. & Dai, W., Dec 1 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 92-95 4 p. 5416569. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Skin effect
Scattering parameters
insertion
Networks (circuits)
Substrates

DSP-based multimode signaling for FEXT reduction in multi-Gbps links

Milosevic, P., Schutt-Aine, J. E. & Shanbhag, N. R., Dec 1 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09. p. 45-48 4 p. 5338480. (2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Jitter
Transceivers
Microstrip lines
Crosstalk