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Research Output

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2019

A deep learning approach for volterra kernel extraction for time domain simulation of weakly nonlinear circuits

Nguyen, T., Wang, X., Chen, X. & Schutt-Aine, J., May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1889-1896 8 p. 8811319. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Deep Learning Method for Prediction of Planar Radiating Sources from Near-Field Intensity Data

Ma, H., Li, E. P., Schutt-Aine, J. & Cangellaris, A. C., Jul 2019, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019. Institute of Electrical and Electronics Engineers Inc., p. 610-615 6 p. 8825271. (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

LIM Algorithms for MOSFET Models

Schutt-Aine, J. & Goh, P., Mar 14 2019, 2019 IEEE 10th Latin American Symposium on Circuits and Systems, LASCAS 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 33-36 4 p. 8667600. (2019 IEEE 10th Latin American Symposium on Circuits and Systems, LASCAS 2019 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for Transient Solution of Electromagnetic and Circuit Problems with Uncertainties

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., May 10 2019, 2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019. Institute of Electrical and Electronics Engineers Inc., 8712858. (2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Volterra Kernel Extraction through Monomial Power Series Feed Forward Neural Network for Behavior Modeling of High Speed I/O Buffer

Wang, X., Nguyen, T. & Schutt-Aine, J., Jun 2019, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019. Institute of Electrical and Electronics Engineers Inc., p. 564-567 4 p. 8893957. (2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2018

Adaptive wavelet stochastic collocation for resonant transmission line circuits

Yang, A. S., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Apr 2 2018, 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

A pseudo-supervised machine learning approach to broadband LTI macro-modeling

Nguyen, T. & Schutt-Aine, J. E., Jun 22 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1018-1021 4 p. (2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Circuit synthesis of blackbox macromodels from S-parameter representation

Schutt-Ainé, J., Jun 29 2018, 2018 IEEE 22nd Workshop on Signal and Power Integrity, SPI 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2018 IEEE 22nd Workshop on Signal and Power Integrity, SPI 2018 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

FFT-based macromodeling of power delivery network with uncertainties using Latency Insertion Method and stochastic collocation

Kummerer, R. F., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 20 2018, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

LIM Algorithms for Diodes and Branch Capacitors

Schutt-Aine, J. & Goh, P., Jul 2 2018, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018. Institute of Electrical and Electronics Engineers Inc., 8680874. (IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rapid electro-thermal modeling for 3D integration using circuit simulation techniques

Shiue, G. & Schutt-Aine, J., Jun 22 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers Inc., 1 p. (2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for uncertainty characterization of fiber-weave effect on coupled transmission lines

Chen, X., Schutt-Ainé, J. E. & Cangellaris, A. C., Jan 20 2018, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2017

Comparison of techniques for model order reduction of frequency-dependent networks

Nguyen, T. & Schutt-Aine, J., Apr 5 2017, 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. Institute of Electrical and Electronics Engineers Inc., p. 87-89 3 p. 7893133. (2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

FFT-based macromodeling of power delivery network with uncertainties using latency insertion method

Kummerer, R. F., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jun 7 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7944035. (2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modulation enhancements of photonic crystal vcsels

Dave, H., Fryslie, S. T. M., Schutt-Aine, J. E. & Choquette, K. D., Jan 1 2017, Vertical-Cavity Surface-Emitting Lasers XXI. Choquette, K. D. & Lei, C. (eds.). SPIE, 1012207. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 10122).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Monte Carlo estimation of sparse grid interpolation residual for stochastic collocation of high-order systems with uncertainties

Chen, X., Ma, X., Rong, A., Schutt-Aine, J. E. & Cangellaris, A. C., Jun 7 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7944004. (2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic electromagnetic-circuit simulation for system-level EMI analysis

Ma, X., Chen, X., Rong, A., Schutt-Aine, J. E. & Cangellaris, A. C., Oct 20 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 118-123 6 p. 8077852. (IEEE International Symposium on Electromagnetic Compatibility).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Volterra kernels extraction from frequency-domain data for weakly non-linear circuit time-domain simulation

Nguyen, T., Schutt-Aine, J. E. & Chen, Y., Dec 29 2017, 2017 IEEE Radio and Antenna Days of the Indian Ocean, RADIO 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-2 2 p. (2017 IEEE Radio and Antenna Days of the Indian Ocean, RADIO 2017; vol. 2017-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2016

Finite difference schemes for transient simulation of transmission lines exhibiting uncertainties

Chen, X., Schutt-Ainé, J. E. & Cangellaris, A. C., Jun 20 2016, 2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7496311. (2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

SPICE circuit synthesis from complex pole-residue S-parameter representation

Schutt-Ainé, J., Jul 26 2016, 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 1050-1052 3 p. 7522942. (2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for Transient Simulations of Printed Circuit Board Transmission Lines with Uncertainties

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Aug 16 2016, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 2297-2304 8 p. 7545744. (Proceedings - Electronic Components and Technology Conference; vol. 2016-August).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2015

MOS models for LIM transient simulations

Hajimiri, M. & Schutt-Aine, J. E., Dec 3 2015, 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015. Institute of Electrical and Electronics Engineers Inc., p. 189-192 4 p. 7347159

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for transient simulation of circuits with uncertainties

Chen, X., Qiu, M., Schutt-Ainé, J. E. & Cangellaris, A. C., May 7 2015, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., p. 29-32 4 p. 7103585. (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2014

Blackbox macro-modeling of the nonlinearity based on Volterra series representation of X-parameters

Xiong, X. Y. Z., Jiang, L. J., Schutt-Ainé, J. E. & Chew, W. C., Jan 1 2014, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., p. 85-88 4 p. 7103601. (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Optimal relaxation of I/O electrical requirements under packaging uncertainty by stochastic methods

Chen, X., Ochoa, J. S., Schutt-Aine, J. E. & Cangellaris, A. C., Sep 11 2014, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 717-722 6 p. 6897363. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards

Zhang, T., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 1 2014, 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings. IEEE Computer Society, 6844540. (2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2013

A strategy to optimize Modal Signaling over microstrip lines with spacing variability

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Aug 20 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558338. (2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Comparing fast convolution and model order reduction methods for S-parameter simulation

Schutt-Ainé, J. E. & Goh, P., Dec 1 2013, EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. p. 134-137 4 p. 6724407. (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fast and accurate multiscale electromagnetic modeling framework: An overview

Chew, W. C., Cangellaris, A. C., Schutt-Aine, J. E., Braunisch, H., Qian, Z. G., Aydiner, A. A., Aygun, K., Jiang, L. J., Ma, Z. H., Meng, L. L. & Naeem, M., Aug 20 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558315. (2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miniaturized on-chip passive devices based on self-rolled-up SiN x nanomembrane inductive tube

Huang, W., Yu, X., Comberiate, T., Qiu, C. W., Schutt-Aine, J. E. & Li, X., Dec 16 2013, 71st Device Research Conference, DRC 2013 - Conference Digest. p. 227-228 2 p. 6633876. (Device Research Conference - Conference Digest, DRC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver

Wu, J. W., Schutt-Aine, J. E., Qian, Z. G. & Chew, W. C., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 203-206 4 p. 6703499. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling I/O buffers using X-parameters

Comberiate, T. M. & Schutt-Aine, J. E., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 25-28 4 p. 6703459. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Phase-locked loop simulations using the latency insertion method

Schutt-Aine, J. E. & Goh, P. K., 2013, 2013 IEEE 4th Latin American Symposium on Circuits and Systems, LASCAS 2013 - Conference Proceedings. 6519090

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Some internal crosstalk reduction schemes

Broyde, F., Clavelier, E. & Schutt-Aine, J. E., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 227-230 4 p. 6703505. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Using X-parameters to generate IBIS models

Comberiate, T. M. & Schutt-Aine, J. E., 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558350

Research output: Chapter in Book/Report/Conference proceedingConference contribution

X-parameter techniques for signal integrity in high-speed links

Schutt-Aine, J. & Comberiate, T., Dec 1 2013, Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013. p. 235-239 5 p. 6745719. (Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2012

IBIS modeling using latency insertion method (LIM)

Schutt-Aine, J. E., Tan, J., Liu, P., Al-Hawari, F. & Varma, A., Jul 27 2012, 2012 IEEE 16th Workshop on Signal and Power Integrity, SPI 2012 - Proceedings. p. 97-100 4 p. 6222920. (2012 IEEE 16th Workshop on Signal and Power Integrity, SPI 2012 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Using the latency insertion method (LIM) to generate X parameters

Comberiate, T. M. & Schutt-Aine, J. E., 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. p. 280-283 4 p. 6457896

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2011

A comparison of two latency insertion methods in dependent sources applications

Liu, P., Tan, J., Zhou, Z., Schutt-Aine, J. E. & Goh, P., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 295-298 4 p. 6100250. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Application of the amplification matrix latency insertion method to circuits with dependent sources

Liu, P., Tan, J., Zhou, Z., Schutt-Aine, J. E. & Goh, P., Dec 1 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 6213771. (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Application of the latency insertion method to electro-thermal circuit analysis

Klokotov, D., Schutt-Ainé, J., Beyene, W., Mullen, D., Li, M., Schmitt, R. & Yang, L., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 263-266 4 p. 6100242. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Design of a 12Gb/s transceiver for high-density links with discontinuities using modal signaling

Milosevic, P. & Schutt-Ainé, J. E., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 215-218 4 p. 6100230. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Latency Insertion Method (LIM) for CMOS circuit simulations with multi-rate considerations

Goh, P. & Schutt-Aine, J. E., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 125-128 4 p. 6100205. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling I/O links with X parameters

Schutt-Ainé, J., Milosevic, P. & Beyene, W. T., Dec 1 2011, DesignCon 2011. p. 928-948 21 p. (DesignCon 2011; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Partitioned latency insertion method (PLIM) with stability considerations

Goh, P., Schutt-Aine, J. E., Klokotov, D., Tan, J., Liu, P., Dai, W. & Al-Hawari, F., Aug 3 2011, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings. p. 107-110 4 p. 5898851. (2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

System-level characterization of modal signaling for high-density off-chip interconnects

Milosevic, P. & Schutt-Aine, J. E., Dec 1 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 6213748. (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2010

Application of the latency insertion method (LIM) to the modeling of CDM ESD events

Klokotov, D., Shukla, V., Schutt-Ainé, J. & Rosenbaum, E., Aug 9 2010, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. p. 652-656 5 p. 5490800. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Crosstalk mitigation of high-speed interconnects with discontinuities using modal signaling

Milosevic, P., Schutt-Ainé, J. E. & Beyene, W. T., Jan 1 2010, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society, p. 21-24 4 p. 5642534. (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling and simulation of high speed I/O links using X parameters

Schutt-Ainé, J. E., Milosevic, P. & Beyene, W. T., Jan 1 2010, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society, p. 29-32 4 p. 5642536. (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2009

Application of the latency insertion method to circuits with blackbox macromodel representation

Schutt-Aine, J. E., Klokotov, D., Goh, P., Tan, J., Al-Hawari, F., Liu, P. & Dai, W., Dec 1 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 92-95 4 p. 5416569. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution