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Research Output

2013

Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver

Wu, J. W., Schutt-Aine, J. E., Qian, Z. G. & Chew, W. C., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 203-206 4 p. 6703499. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling I/O buffers using X-parameters

Comberiate, T. M. & Schutt-Aine, J. E., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 25-28 4 p. 6703459. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Phase-locked loop simulations using the latency insertion method

Schutt-Aine, J. E. & Goh, P. K., 2013, 2013 IEEE 4th Latin American Symposium on Circuits and Systems, LASCAS 2013 - Conference Proceedings. 6519090

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Some internal crosstalk reduction schemes

Broyde, F., Clavelier, E. & Schutt-Aine, J. E., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 227-230 4 p. 6703505. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Transceiver design for high-density links with discontinuities using modal signaling

Milosevic, P. & Schutt-Aine, J. E., Jan 1 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 1, p. 10-20 11 p., 6365869.

Research output: Contribution to journalArticle

Using X-parameters to generate IBIS models

Comberiate, T. M. & Schutt-Aine, J. E., 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558350

Research output: Chapter in Book/Report/Conference proceedingConference contribution

X-parameter techniques for signal integrity in high-speed links

Schutt-Aine, J. & Comberiate, T., Dec 1 2013, Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013. p. 235-239 5 p. 6745719. (Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2012

An improved nonlinear current model for GaN HEMT high power amplifier with large gate periphery

Sang, L. & Schutt-Aine, J. E., Aug 10 2012, In : Journal of Electromagnetic Waves and Applications. 26, 2-3, p. 284-293 10 p.

Research output: Contribution to journalArticle

IBIS modeling using latency insertion method (LIM)

Schutt-Aine, J. E., Tan, J., Liu, P., Al-Hawari, F. & Varma, A., Jul 27 2012, 2012 IEEE 16th Workshop on Signal and Power Integrity, SPI 2012 - Proceedings. p. 97-100 4 p. 6222920. (2012 IEEE 16th Workshop on Signal and Power Integrity, SPI 2012 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Using the latency insertion method (LIM) to generate X parameters

Comberiate, T. M. & Schutt-Aine, J. E., 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. p. 280-283 4 p. 6457896

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2011

A comparison of two latency insertion methods in dependent sources applications

Liu, P., Tan, J., Zhou, Z., Schutt-Aine, J. E. & Goh, P., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 295-298 4 p. 6100250. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Application of the amplification matrix latency insertion method to circuits with dependent sources

Liu, P., Tan, J., Zhou, Z., Schutt-Aine, J. E. & Goh, P., Dec 1 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 6213771. (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Application of the latency insertion method to electro-thermal circuit analysis

Klokotov, D., Schutt-Ainé, J., Beyene, W., Mullen, D., Li, M., Schmitt, R. & Yang, L., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 263-266 4 p. 6100242. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Comparative study of convolution and order reduction techniques for blackbox macromodeling using scattering parameters

Schutt-Aine, J. E., Goh, P., Mekonnen, Y., Tan, J., Al-Hawari, F., Liu, P. & Dai, W., Oct 1 2011, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 1, 10, p. 1642-1650 9 p., 6021337.

Research output: Contribution to journalArticle

Design of a 12Gb/s transceiver for high-density links with discontinuities using modal signaling

Milosevic, P. & Schutt-Ainé, J. E., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 215-218 4 p. 6100230. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Latency Insertion Method (LIM) for CMOS circuit simulations with multi-rate considerations

Goh, P. & Schutt-Aine, J. E., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 125-128 4 p. 6100205. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Latency insertion method (LIM) for DC analysis of power supply networks

Klokotov, D., Goh, P. & Schutt-Aine, J. E., Nov 1 2011, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 1, 11, p. 1839-1845 7 p., 6009178.

Research output: Contribution to journalArticle

Modeling I/O links with X parameters

Schutt-Ainé, J., Milosevic, P. & Beyene, W. T., Dec 1 2011, DesignCon 2011. p. 928-948 21 p. (DesignCon 2011; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Partitioned latency insertion method (PLIM) with stability considerations

Goh, P., Schutt-Aine, J. E., Klokotov, D., Tan, J., Liu, P., Dai, W. & Al-Hawari, F., Aug 3 2011, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings. p. 107-110 4 p. 5898851. (2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Partitioned latency insertion method with a generalized stability criteria

Goh, P., Schutt-Ainé, J. E., Klokotov, D., Tan, J., Liu, P., Dai, W. & Al-Hawari, F., Sep 1 2011, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 1, 9, p. 1447-1455 9 p., 5954162.

Research output: Contribution to journalArticle

System-level characterization of modal signaling for high-density off-chip interconnects

Milosevic, P. & Schutt-Aine, J. E., Dec 1 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 6213748. (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2010

Application of the latency insertion method (LIM) to the modeling of CDM ESD events

Klokotov, D., Shukla, V., Schutt-Ainé, J. & Rosenbaum, E., Aug 9 2010, 2010 Proceedings 60th Electronic Components and Technology Conference, ECTC 2010. p. 652-656 5 p. 5490800. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Crosstalk mitigation of high-speed interconnects with discontinuities using modal signaling

Milosevic, P., Schutt-Ainé, J. E. & Beyene, W. T., Jan 1 2010, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society, p. 21-24 4 p. 5642534. (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling and simulation of high speed I/O links using X parameters

Schutt-Ainé, J. E., Milosevic, P. & Beyene, W. T., Jan 1 2010, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society, p. 29-32 4 p. 5642536. (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2009

Application of the latency insertion method to circuits with blackbox macromodel representation

Schutt-Aine, J. E., Klokotov, D., Goh, P., Tan, J., Al-Hawari, F., Liu, P. & Dai, W., Dec 1 2009, EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. p. 92-95 4 p. 5416569. (Proceedings of the Electronic Packaging Technology Conference, EPTC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

DSP-based multimode signaling for FEXT reduction in multi-Gbps links

Milosevic, P., Schutt-Aine, J. E. & Shanbhag, N. R., Dec 1 2009, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09. p. 45-48 4 p. 5338480. (2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Extensions of the latency insertion method (LIM) to DC analysis of power supply networks and modeling of circuit interconnects with frequency-dependent parameters

Klokotov, D. & Schutt-Aine, J. E., 2009, 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009. p. 1624-1629 6 p. 5074232

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stability analysis for semi-implicit LIM algorithm

Schutt-Ainé, J., Dec 1 2009, APMC 2009 - Asia Pacific Microwave Conference 2009. p. 1270-1272 3 p. 5384449. (APMC 2009 - Asia Pacific Microwave Conference 2009).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2008

Blackbox macromodel with S-parameters and fast convolution

Schutt-Ainé, J., Tan, J., Kumar, C. & Al-Hawari, F., Sep 22 2008, 12th IEEE Workshop on Signal Propagation on Interconnects, SPI. 4558338. (12th IEEE Workshop on Signal Propagation on Interconnects, SPI).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fast broadband macromodeling technique of sampled time/frequency data using z-domain vector-fitting method

Mekonnen, Y. S. & Schutt-Ainé, J. E., Sep 15 2008, 2008 Proceedings 58th Electronic Components and Technology Conference, ECTC. p. 1231-1235 5 p. 4550132. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Latency insertion method for the analysis of steady state on-chip power distribution networks and transient simulation of lossy interconnects

Klokotov, D. & José, S. A., Dec 1 2008, Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008. 4958455. (Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

On-chip oscilloscope for signal integrity characterization of interconnects in 130nm CMOS technology

Milosevic, P. & Schutt-Aine, J. E., Dec 31 2008, Electrical Performance of Electronic Packaging, EPEP 2008. p. 65-68 4 p. 4675878. (Electrical Performance of Electronic Packaging, EPEP).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stability analysis of the latency insertion method using a block matrix formulation

Schutt-Ainé, J., Dec 1 2008, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. p. 155-158 4 p. 4736023. (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Transient simulation of lossy interconnects using the Latency Insertion Method (LIM)

Klokotov, D. & Schutt-Ainé, J., Dec 31 2008, Electrical Performance of Electronic Packaging, EPEP 2008. p. 251-254 4 p. 4675927. (Electrical Performance of Electronic Packaging, EPEP).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2007

Broadband macromodeling of sampled frequency data using z-domain vector-fitting method

Mekonnen, Y. S. & Schutt-Ainé, J. E., Dec 1 2007, Proceedings - 11th IEEE Workshop on Signal Propagation on Interconnects, SPI 2007. p. 45-48 4 p. 4512205. (Proceedings - 11th IEEE Workshop on Signal Propagation on Interconnects, SPI 2007).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Cut-off frequency Enhanced hybrid electromagnetic Bandgap (EBG) structures with wideband noise suppression characteristics

Kim, K. H., Milosevic, P. & Schutt-Aine, J. E., Dec 1 2007, 2007 IEEE Antennas and Propagation Society International Symposium, AP-S. p. 2912-2916 5 p. 4396145. (IEEE Antennas and Propagation Society, AP-S International Symposium (Digest)).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fast macromodeling technique of sampled time/frequency data using z-domain vector-fitting method

Mekonnen, Y. S. & Schutt-Aine, J. E., 2007, IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP. p. 47-50 4 p. 4387120

Research output: Chapter in Book/Report/Conference proceedingConference contribution

LIM-based algorithms for the transient simulation of large networks

Schutt-Ainé, J., Dec 1 2007, IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP. p. 233-236 4 p. 4387169. (IEEE Topical Meeting on Electrical Performance of Electronic Packaging).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2006

Latency insertion method with frequency dependent effect

Deng, Z., Schutt-Aine, J., Tan, J., Kumar, C. & Milosevic, D., Jan 1 2006, ESTC 2006 - 1st Electronics Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 503-506 4 p. 4060773. (ESTC 2006 - 1st Electronics Systemintegration Technology Conference; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2005

Black-box modeling of passive systems by rational function approximation

Gao, R., Mekonnen, Y. S., Beyene, W. T. & Schutt-Aine, J. E., May 1 2005, In : IEEE Transactions on Advanced Packaging. 28, 2, p. 209-215 7 p.

Research output: Contribution to journalArticle

Combining rational interpolation with the vector fitting method

Mekonnen, Y. S., Schutt-Ainé, J., Tan, J., Kumar, C. & Milosevic, D., Dec 1 2005, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. p. 51-54 4 p. 1563698. (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; vol. 2005).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Efficient macromodeling for systems characterized by sampled data

Gao, R., Meknonen, Y. S., Beyene, W. T. & Schutt-Ainé, J., Dec 1 2005, 2005 IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics. p. 567-570 4 p. 1469650. (2005 IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics; vol. 2005).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Foreword: Contributions from the eighth workshop on signal propagation on interconnects

Grabinski, H. & Schutt-Aine, J. E., May 1 2005, In : IEEE Transactions on Advanced Packaging. 28, 2, p. 150-151 2 p.

Research output: Contribution to journalEditorial

LIM-SPICE for the analysis of power distribution networks

Deng, Z. & Schutt-Aine, J., Dec 1 2005, Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005. p. 17-20 4 p. 1500882. (Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005; vol. 2005).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Turbo-SPICE with Latency Insertion Method (LIM)

Zhichao, D. & Schutt-Aine, J. E., Dec 1 2005, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. p. 329-332 4 p. 1563772. (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; vol. 2005).

Research output: Chapter in Book/Report/Conference proceedingConference contribution