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Research Output

Conference contribution

Improved latency insertion method for simulation of large networks with low latency

Gao, R. & Schutt-Aine, J. E., Jan 1 2002, Electrical Performance of Electronic Packaging, EPEP 2002. Institute of Electrical and Electronics Engineers Inc., p. 37-40 4 p. 1057878. (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; vol. 2002-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Interconnect simulation using order reduction and scattering parameters

Beyene, W. T. & Schutt-Aine, J. E., Jan 1 1998, 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998. Institute of Electrical and Electronics Engineers Inc., p. 627-631 5 p. 678761. (Proceedings - Electronic Components and Technology Conference; vol. Part F133492).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Krylov subspace-based model-order reduction techniques for circuit simulations

Beyene, W. T. & Schutt-Aine, J. E., 1996, Midwest Symposium on Circuits and Systems. Cameron, G., Hassoun, M., Jerdee, A. & Melvin, C. (eds.). IEEE, Vol. 1. p. 331-334 4 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Latency Insertion Method (LIM) for CMOS circuit simulations with multi-rate considerations

Goh, P. & Schutt-Aine, J. E., Dec 1 2011, 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011. p. 125-128 4 p. 6100205. (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Latency insertion method for the analysis of steady state on-chip power distribution networks and transient simulation of lossy interconnects

Klokotov, D. & José, S. A., Dec 1 2008, Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008. 4958455. (Proceedings of 2008 Asia Pacific Microwave Conference, APMC 2008).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Latency insertion method with frequency dependent effect

Deng, Z., Schutt-Aine, J., Tan, J., Kumar, C. & Milosevic, D., Jan 1 2006, ESTC 2006 - 1st Electronics Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 503-506 4 p. 4060773. (ESTC 2006 - 1st Electronics Systemintegration Technology Conference; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

LIM Algorithms for Diodes and Branch Capacitors

Schutt-Aine, J. & Goh, P., Jul 2 2018, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018. Institute of Electrical and Electronics Engineers Inc., 8680874. (IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

LIM Algorithms for MOSFET Models

Schutt-Aine, J. & Goh, P., Mar 14 2019, 2019 IEEE 10th Latin American Symposium on Circuits and Systems, LASCAS 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 33-36 4 p. 8667600. (2019 IEEE 10th Latin American Symposium on Circuits and Systems, LASCAS 2019 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

LIM-based algorithms for the transient simulation of large networks

Schutt-Ainé, J., Dec 1 2007, IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP. p. 233-236 4 p. 4387169. (IEEE Topical Meeting on Electrical Performance of Electronic Packaging).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

LIM-SPICE for the analysis of power distribution networks

Deng, Z. & Schutt-Aine, J., Dec 1 2005, Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005. p. 17-20 4 p. 1500882. (Proceedings - 9th IEEE Workshop on Signal Propagation on Interconnects, SPI 2005; vol. 2005).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Miniaturized on-chip passive devices based on self-rolled-up SiN x nanomembrane inductive tube

Huang, W., Yu, X., Comberiate, T., Qiu, C. W., Schutt-Aine, J. E. & Li, X., Dec 16 2013, 71st Device Research Conference, DRC 2013 - Conference Digest. p. 227-228 2 p. 6633876. (Device Research Conference - Conference Digest, DRC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling and simulation of high speed I/O links using X parameters

Schutt-Ainé, J. E., Milosevic, P. & Beyene, W. T., Jan 1 2010, 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010. IEEE Computer Society, p. 29-32 4 p. 5642536. (2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver

Wu, J. W., Schutt-Aine, J. E., Qian, Z. G. & Chew, W. C., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 203-206 4 p. 6703499. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling I/O buffers using X-parameters

Comberiate, T. M. & Schutt-Aine, J. E., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 25-28 4 p. 6703459. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling I/O links with X parameters

Schutt-Ainé, J., Milosevic, P. & Beyene, W. T., Dec 1 2011, DesignCon 2011. p. 928-948 21 p. (DesignCon 2011; vol. 2).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling interconnections with nonlinear discontinuities

Schutt-Aine, J. E. & Oh, K. S., Jan 1 1993, Proceedings - IEEE International Symposium on Circuits and Systems. Publ by IEEE, p. 2122-2124 3 p. (Proceedings - IEEE International Symposium on Circuits and Systems; vol. 3).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modulation enhancements of photonic crystal vcsels

Dave, H., Fryslie, S. T. M., Schutt-Aine, J. E. & Choquette, K. D., Jan 1 2017, Vertical-Cavity Surface-Emitting Lasers XXI. Choquette, K. D. & Lei, C. (eds.). SPIE, 1012207. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 10122).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Monte Carlo estimation of sparse grid interpolation residual for stochastic collocation of high-order systems with uncertainties

Chen, X., Ma, X., Rong, A., Schutt-Aine, J. E. & Cangellaris, A. C., Jun 7 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7944004. (2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MOS models for LIM transient simulations

Hajimiri, M. & Schutt-Aine, J. E., Dec 3 2015, 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015. Institute of Electrical and Electronics Engineers Inc., p. 189-192 4 p. 7347159

Research output: Chapter in Book/Report/Conference proceedingConference contribution

On-chip oscilloscope for signal integrity characterization of interconnects in 130nm CMOS technology

Milosevic, P. & Schutt-Aine, J. E., Dec 31 2008, Electrical Performance of Electronic Packaging, EPEP 2008. p. 65-68 4 p. 4675878. (Electrical Performance of Electronic Packaging, EPEP).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Optimal relaxation of I/O electrical requirements under packaging uncertainty by stochastic methods

Chen, X., Ochoa, J. S., Schutt-Aine, J. E. & Cangellaris, A. C., Sep 11 2014, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 717-722 6 p. 6897363. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Packaging education for the 21st century

Schutt-Aine, J., Cangellaris, A. & Michielssen, E., Jan 1 1998, 1998 Proceedings - 48th Electronic Components and Technology Conference, ECTC 1998. Institute of Electrical and Electronics Engineers Inc., p. 544-546 3 p. 678747. (Proceedings - Electronic Components and Technology Conference; vol. Part F133492).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Partitioned latency insertion method (PLIM) with stability considerations

Goh, P., Schutt-Aine, J. E., Klokotov, D., Tan, J., Liu, P., Dai, W. & Al-Hawari, F., Aug 3 2011, 2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings. p. 107-110 4 p. 5898851. (2011 IEEE 15th Workshop on Signal Propagation on Interconnects, SPI 2011 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Perspectives and challenges in 111-V devices and system-level integration for future wireless applications

Schutt-Aine, J. E. & Feng, M., Jan 1 2003, 2003 IEEE Topical Conference on Wireless Communication Technology. Institute of Electrical and Electronics Engineers Inc., p. 94-96 3 p. 1321443. (2003 IEEE Topical Conference on Wireless Communication Technology).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Phase-locked loop simulations using the latency insertion method

Schutt-Aine, J. E. & Goh, P. K., 2013, 2013 IEEE 4th Latin American Symposium on Circuits and Systems, LASCAS 2013 - Conference Proceedings. 6519090

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rapid electro-thermal modeling for 3D integration using circuit simulation techniques

Shiue, G. & Schutt-Aine, J., Jun 22 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers Inc., 1 p. (2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Solving large scale electromagnetic problems using a linux cluster and parallel MLFMA

Velamparambil, S. V., Schutt-Aine, J. E., Nickel, J. G., Song, J. M. & Chew, W. C., Jan 1 1999, IEEE Antennas and Propagation Society International Symposium: Wireless Technologies and Information Networks, APS 1999 - Held in conjunction with USNC/URSI National Radio Science Meeting. Institute of Electrical and Electronics Engineers Inc., p. 636-639 4 p. 789219. (IEEE Antennas and Propagation Society International Symposium: Wireless Technologies and Information Networks, APS 1999 - Held in conjunction with USNC/URSI National Radio Science Meeting; vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Some internal crosstalk reduction schemes

Broyde, F., Clavelier, E. & Schutt-Aine, J. E., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 227-230 4 p. 6703505. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

SPICE circuit synthesis from complex pole-residue S-parameter representation

Schutt-Ainé, J., Jul 26 2016, 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 1050-1052 3 p. 7522942. (2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stability analysis for semi-implicit LIM algorithm

Schutt-Ainé, J., Dec 1 2009, APMC 2009 - Asia Pacific Microwave Conference 2009. p. 1270-1272 3 p. 5384449. (APMC 2009 - Asia Pacific Microwave Conference 2009).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stability analysis of the latency insertion method using a block matrix formulation

Schutt-Ainé, J., Dec 1 2008, 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings. p. 155-158 4 p. 4736023. (2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards

Zhang, T., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 1 2014, 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings. IEEE Computer Society, 6844540. (2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic electromagnetic-circuit simulation for system-level EMI analysis

Ma, X., Chen, X., Rong, A., Schutt-Aine, J. E. & Cangellaris, A. C., Oct 20 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 118-123 6 p. 8077852. (IEEE International Symposium on Electromagnetic Compatibility).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for transient simulation of circuits with uncertainties

Chen, X., Qiu, M., Schutt-Ainé, J. E. & Cangellaris, A. C., May 7 2015, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., p. 29-32 4 p. 7103585. (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for Transient Simulations of Printed Circuit Board Transmission Lines with Uncertainties

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Aug 16 2016, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 2297-2304 8 p. 7545744. (Proceedings - Electronic Components and Technology Conference; vol. 2016-August).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for Transient Solution of Electromagnetic and Circuit Problems with Uncertainties

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., May 10 2019, 2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019. Institute of Electrical and Electronics Engineers Inc., 8712858. (2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for uncertainty characterization of fiber-weave effect on coupled transmission lines

Chen, X., Schutt-Ainé, J. E. & Cangellaris, A. C., Jan 20 2018, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

System-level characterization of modal signaling for high-density off-chip interconnects

Milosevic, P. & Schutt-Aine, J. E., Dec 1 2011, 2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011. 6213748. (2011 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2011).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Transient simulation of lossy interconnects using the Latency Insertion Method (LIM)

Klokotov, D. & Schutt-Ainé, J., Dec 31 2008, Electrical Performance of Electronic Packaging, EPEP 2008. p. 251-254 4 p. 4675927. (Electrical Performance of Electronic Packaging, EPEP).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Turbo-SPICE with Latency Insertion Method (LIM)

Zhichao, D. & Schutt-Aine, J. E., Dec 1 2005, 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005. p. 329-332 4 p. 1563772. (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; vol. 2005).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Using the latency insertion method (LIM) to generate X parameters

Comberiate, T. M. & Schutt-Aine, J. E., 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. p. 280-283 4 p. 6457896

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Using X-parameters to generate IBIS models

Comberiate, T. M. & Schutt-Aine, J. E., 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558350

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Volterra Kernel Extraction through Monomial Power Series Feed Forward Neural Network for Behavior Modeling of High Speed I/O Buffer

Wang, X., Nguyen, T. & Schutt-Aine, J., Jun 2019, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019. Institute of Electrical and Electronics Engineers Inc., p. 564-567 4 p. 8893957. (2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Volterra kernels extraction from frequency-domain data for weakly non-linear circuit time-domain simulation

Nguyen, T., Schutt-Aine, J. E. & Chen, Y., Dec 29 2017, 2017 IEEE Radio and Antenna Days of the Indian Ocean, RADIO 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-2 2 p. (2017 IEEE Radio and Antenna Days of the Indian Ocean, RADIO 2017; vol. 2017-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

X-parameter techniques for signal integrity in high-speed links

Schutt-Aine, J. & Comberiate, T., Dec 1 2013, Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013. p. 235-239 5 p. 6745719. (Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Editorial

Foreword: Contributions from the eighth workshop on signal propagation on interconnects

Grabinski, H. & Schutt-Aine, J. E., May 1 2005, In : IEEE Transactions on Advanced Packaging. 28, 2, p. 150-151 2 p.

Research output: Contribution to journalEditorial

Foreword

Schutt-Ainé, J. & Swaminathan, M., Apr 5 2017, In : 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. p. iii 7893093.

Research output: Contribution to journalEditorial