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Research Output

2012

Using the latency insertion method (LIM) to generate X parameters

Comberiate, T. M. & Schutt-Aine, J. E., 2012, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. p. 280-283 4 p. 6457896

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2013

A strategy to optimize Modal Signaling over microstrip lines with spacing variability

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Aug 20 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558338. (2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Comparing fast convolution and model order reduction methods for S-parameter simulation

Schutt-Ainé, J. E. & Goh, P., Dec 1 2013, EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. p. 134-137 4 p. 6724407. (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fast and accurate multiscale electromagnetic modeling framework: An overview

Chew, W. C., Cangellaris, A. C., Schutt-Aine, J. E., Braunisch, H., Qian, Z. G., Aydiner, A. A., Aygun, K., Jiang, L. J., Ma, Z. H., Meng, L. L. & Naeem, M., Aug 20 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558315. (2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

IBIS simulation using the latency insertion method (LIM)

Schutt-Aine, J. E., Liu, P., Tan, J. & Varma, A., May 20 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 7, p. 1228-1236 9 p., 6515598.

Research output: Contribution to journalArticle

Miniaturized on-chip passive devices based on self-rolled-up SiN x nanomembrane inductive tube

Huang, W., Yu, X., Comberiate, T., Qiu, C. W., Schutt-Aine, J. E. & Li, X., Dec 16 2013, 71st Device Research Conference, DRC 2013 - Conference Digest. p. 227-228 2 p. 6633876. (Device Research Conference - Conference Digest, DRC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling broadband equivalent circuit of interconnects with full wave electromagnetic solver

Wu, J. W., Schutt-Aine, J. E., Qian, Z. G. & Chew, W. C., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 203-206 4 p. 6703499. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modeling I/O buffers using X-parameters

Comberiate, T. M. & Schutt-Aine, J. E., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 25-28 4 p. 6703459. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Phase-locked loop simulations using the latency insertion method

Schutt-Aine, J. E. & Goh, P. K., 2013, 2013 IEEE 4th Latin American Symposium on Circuits and Systems, LASCAS 2013 - Conference Proceedings. 6519090

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Some internal crosstalk reduction schemes

Broyde, F., Clavelier, E. & Schutt-Aine, J. E., Jan 1 2013, 2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013. IEEE Computer Society, p. 227-230 4 p. 6703505. (2013 IEEE 22nd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Transceiver design for high-density links with discontinuities using modal signaling

Milosevic, P. & Schutt-Aine, J. E., Jan 1 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 1, p. 10-20 11 p., 6365869.

Research output: Contribution to journalArticle

Using X-parameters to generate IBIS models

Comberiate, T. M. & Schutt-Aine, J. E., 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558350

Research output: Chapter in Book/Report/Conference proceedingConference contribution

X-parameter techniques for signal integrity in high-speed links

Schutt-Aine, J. & Comberiate, T., Dec 1 2013, Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013. p. 235-239 5 p. 6745719. (Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2014

Blackbox macro-modeling of the nonlinearity based on Volterra series representation of X-parameters

Xiong, X. Y. Z., Jiang, L. J., Schutt-Ainé, J. E. & Chew, W. C., Jan 1 2014, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., p. 85-88 4 p. 7103601. (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fast solution of low-frequency complex problems over a frequency band using enhanced A-EFIE and FMM

Wu, J. W., Qian, Z. G., Schutt-Ainé, J. E. & Chew, W. C., Sep 2014, In : Microwave and Optical Technology Letters. 56, 9, p. 2153-2158 6 p.

Research output: Contribution to journalArticle

Improving fast S-parameter convolution by optimising reference impedance

Goh, P. & Schutt-Aine, J. E., Jan 1 2014, In : Electronics Letters. 50, 18, p. 1290-1292 3 p.

Research output: Contribution to journalArticle

LIM2X: Generating X-parameters in the time domain using the latency insertion method

Comberiate, T. M. & Schutt-Ainé, J. E., Jul 2014, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 4, 7, p. 1136-1143 8 p., 6816029.

Research output: Contribution to journalArticle

Optimal relaxation of I/O electrical requirements under packaging uncertainty by stochastic methods

Chen, X., Ochoa, J. S., Schutt-Aine, J. E. & Cangellaris, A. C., Sep 11 2014, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 717-722 6 p. 6897363. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Robust SPICE circuit generation using scattering parameters

Schutt-Aine, J., Sep 15 2014, In : IEEE International Symposium on Electromagnetic Compatibility. 2014-September, September, p. 230-233 4 p., 6898975.

Research output: Contribution to journalConference article

Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards

Zhang, T., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 1 2014, 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings. IEEE Computer Society, 6844540. (2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The latency insertion method for simulations of phase-locked loops

Goh, P. & Schutt-Aine, J. E., Jun 2014, In : Journal of Computational Electronics. 13, 2, p. 529-536 8 p.

Research output: Contribution to journalArticle

MOS models for LIM transient simulations

Hajimiri, M. & Schutt-Aine, J. E., Dec 3 2015, 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015. Institute of Electrical and Electronics Engineers Inc., p. 189-192 4 p. 7347159

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for transient simulation of circuits with uncertainties

Chen, X., Qiu, M., Schutt-Ainé, J. E. & Cangellaris, A. C., May 7 2015, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., p. 29-32 4 p. 7103585. (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ultra-Small, High-Frequency, and Substrate-Immune Microtube Inductors Transformed from 2D to 3D

Yu, X., Huang, W., Li, M., Comberiate, T. M., Gong, S., Schutt-Aine, J. E. & Li, X., Apr 27 2015, In : Scientific reports. 5, 9661.

Research output: Contribution to journalArticle

2016

Finite difference schemes for transient simulation of transmission lines exhibiting uncertainties

Chen, X., Schutt-Ainé, J. E. & Cangellaris, A. C., Jun 20 2016, 2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7496311. (2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microassembly of heterogeneous materials using transfer printing and thermal processing

Keum, H., Yang, Z., Han, K., Handler, D. E., Nguyen, T. N., Schutt-Aine, J., Bahl, G. & Kim, S., Jul 18 2016, In : Scientific reports. 6, 29925.

Research output: Contribution to journalArticle

SPICE circuit synthesis from complex pole-residue S-parameter representation

Schutt-Ainé, J., Jul 26 2016, 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 1050-1052 3 p. 7522942. (2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for Transient Simulations of Printed Circuit Board Transmission Lines with Uncertainties

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Aug 16 2016, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 2297-2304 8 p. 7545744. (Proceedings - Electronic Components and Technology Conference; vol. 2016-August).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2017

Comparison of techniques for model order reduction of frequency-dependent networks

Nguyen, T. & Schutt-Aine, J., Apr 5 2017, 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. Institute of Electrical and Electronics Engineers Inc., p. 87-89 3 p. 7893133. (2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

FFT-based macromodeling of power delivery network with uncertainties using latency insertion method

Kummerer, R. F., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jun 7 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7944035. (2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Foreword

Schutt-Ainé, J. & Swaminathan, M., Apr 5 2017, In : 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. p. iii 7893093.

Research output: Contribution to journalEditorial

Modulation enhancements of photonic crystal vcsels

Dave, H., Fryslie, S. T. M., Schutt-Aine, J. E. & Choquette, K. D., Jan 1 2017, Vertical-Cavity Surface-Emitting Lasers XXI. Choquette, K. D. & Lei, C. (eds.). SPIE, 1012207. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 10122).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modulation of coherently coupled phased photonic crystal vertical cavity laser arrays

Fryslie, S. T. M., Gao, Z., Dave, H., Thompson, B. J., Lakomy, K., Lin, S., Decker, P. J., Mcelfresh, D. K., Schutt-Aine, J. E. & Choquette, K. D., Nov 1 2017, In : IEEE Journal of Selected Topics in Quantum Electronics. 23, 6, 7914664.

Research output: Contribution to journalArticle

Monte Carlo estimation of sparse grid interpolation residual for stochastic collocation of high-order systems with uncertainties

Chen, X., Ma, X., Rong, A., Schutt-Aine, J. E. & Cangellaris, A. C., Jun 7 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7944004. (2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic electromagnetic-circuit simulation for system-level EMI analysis

Ma, X., Chen, X., Rong, A., Schutt-Aine, J. E. & Cangellaris, A. C., Oct 20 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 118-123 6 p. 8077852. (IEEE International Symposium on Electromagnetic Compatibility).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Volterra kernels extraction from frequency-domain data for weakly non-linear circuit time-domain simulation

Nguyen, T., Schutt-Aine, J. E. & Chen, Y., Dec 29 2017, 2017 IEEE Radio and Antenna Days of the Indian Ocean, RADIO 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-2 2 p. (2017 IEEE Radio and Antenna Days of the Indian Ocean, RADIO 2017; vol. 2017-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Volterra Series-Based Time-Domain Macromodeling of Nonlinear Circuits

Xiong, X. Y. Z., Jiang, L. J., Schutt-Aine, J. E. & Chew, W. C., Jan 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 1, p. 39-49 11 p., 7763759.

Research output: Contribution to journalArticle

2018

A 10-Gb/s/ch, 0.6-pJ/bit/mm Power Scalable Rapid-ON/OFF Transceiver for On-Chip Energy Proportional Interconnects

Wei, D., Anand, T., Shu, G., Schutt-Ainé, J. E. & Hanumolu, P. K., Mar 2018, In : IEEE Journal of Solid-State Circuits. 53, 3, p. 873-883 11 p.

Research output: Contribution to journalArticle

Adaptive wavelet stochastic collocation for resonant transmission line circuits

Yang, A. S., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Apr 2 2018, 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

A pseudo-supervised machine learning approach to broadband LTI macro-modeling

Nguyen, T. & Schutt-Aine, J. E., Jun 22 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1018-1021 4 p. (2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Circuit synthesis of blackbox macromodels from S-parameter representation

Schutt-Ainé, J., Jun 29 2018, 2018 IEEE 22nd Workshop on Signal and Power Integrity, SPI 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2018 IEEE 22nd Workshop on Signal and Power Integrity, SPI 2018 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

FFT-based macromodeling of power delivery network with uncertainties using Latency Insertion Method and stochastic collocation

Kummerer, R. F., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 20 2018, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

LIM Algorithms for Diodes and Branch Capacitors

Schutt-Aine, J. & Goh, P., Jul 2 2018, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018. Institute of Electrical and Electronics Engineers Inc., 8680874. (IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rapid electro-thermal modeling for 3D integration using circuit simulation techniques

Shiue, G. & Schutt-Aine, J., Jun 22 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers Inc., 1 p. (2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for uncertainty characterization of fiber-weave effect on coupled transmission lines

Chen, X., Schutt-Ainé, J. E. & Cangellaris, A. C., Jan 20 2018, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution