1983 …2019

Research output per year

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Research Output

2019

A deep learning approach for volterra kernel extraction for time domain simulation of weakly nonlinear circuits

Nguyen, T., Wang, X., Chen, X. & Schutt-Aine, J. E., May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1889-1896 8 p. 8811319. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

An Improved Algorithm for Drift Diffusion Transport and Its Application on Large Scale Parallel Simulation of Resistive Random Access Memory Arrays

Wang, D. W., Chen, W., Zhao, W. S., Zhu, G. D., Zhao, Z. G., Schutt-Aine, J. E. & Yin, W. Y., Jan 1 2019, In : IEEE Access. 7, p. 31273-31285 13 p., 8656503.

Research output: Contribution to journalArticle

Open Access

Deep Learning Method for Prediction of Planar Radiating Sources from Near-Field Intensity Data

Ma, H., Li, E. P., Schutt-Aine, J. & Cangellaris, A. C., Jul 2019, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019. Institute of Electrical and Electronics Engineers Inc., p. 610-615 6 p. 8825271. (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fully coupled electrothermal simulation of large RRAM arrays in the 'thermal-house'

Wang, D. W., Chen, W., Zhao, W. S., Zhu, G. D., Kang, K., Gao, P., Schutt-Aine, J. E. & Yin, W. Y., Jan 1 2019, In : IEEE Access. 7, p. 3897-3908 12 p., 8580571.

Research output: Contribution to journalArticle

LIM Algorithms for Diodes and Branch Capacitors

Schutt-Aine, J. E. & Goh, P., Apr 2 2019, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018. Institute of Electrical and Electronics Engineers Inc., 8680874. (IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

LIM Algorithms for MOSFET Models

Schutt-Aine, J. & Goh, P., Mar 14 2019, 2019 IEEE 10th Latin American Symposium on Circuits and Systems, LASCAS 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 33-36 4 p. 8667600. (2019 IEEE 10th Latin American Symposium on Circuits and Systems, LASCAS 2019 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Monolithic radio frequency SiN x self-rolled-up nanomembrane interdigital capacitor modeling and fabrication

Sang, L., Zhou, H., Yang, Z., Kraman, M. D., Zhao, H., Michaels, J. A., Sievers, D. J., Schutt-Aine, J. E., Li, X. & Huang, W., Jun 17 2019, In : Nanotechnology. 30, 36, 364001.

Research output: Contribution to journalArticle

Stochastic LIM for Transient Solution of Electromagnetic and Circuit Problems with Uncertainties

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., May 10 2019, 2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019. Institute of Electrical and Electronics Engineers Inc., 8712858. (2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Study on high-density integration resistive random access memory array from multiphysics perspective by parallel computing

Zhu, G., Chen, W., Wang, D., Xie, H., Zhao, Z., Gao, P., Schutt-Aine, J. E. & Yin, W. Y., Apr 2019, In : IEEE Transactions on Electron Devices. 66, 4, p. 1747-1753 7 p., 8663604.

Research output: Contribution to journalArticle

Volterra Kernel Extraction through Monomial Power Series Feed Forward Neural Network for Behavior Modeling of High Speed I/O Buffer

Wang, X., Nguyen, T. & Schutt-Aine, J., Jun 2019, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019. Institute of Electrical and Electronics Engineers Inc., p. 564-567 4 p. 8893957. (2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2018

A 10-Gb/s/ch, 0.6-pJ/bit/mm Power Scalable Rapid-ON/OFF Transceiver for On-Chip Energy Proportional Interconnects

Wei, D., Anand, T., Shu, G., Schutt-Ainé, J. E. & Hanumolu, P. K., Mar 2018, In : IEEE Journal of Solid-State Circuits. 53, 3, p. 873-883 11 p.

Research output: Contribution to journalArticle

Adaptive wavelet stochastic collocation for resonant transmission line circuits

Yang, A. S., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Apr 2 2018, 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

A pseudo-supervised machine learning approach to broadband LTI macro-modeling

Nguyen, T. & Schutt-Aine, J. E., Jun 22 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers Inc., p. 1018-1021 4 p. (2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Circuit synthesis of blackbox macromodels from S-parameter representation

Schutt-Ainé, J., Jun 29 2018, 2018 IEEE 22nd Workshop on Signal and Power Integrity, SPI 2018 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2018 IEEE 22nd Workshop on Signal and Power Integrity, SPI 2018 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

FFT-based macromodeling of power delivery network with uncertainties using Latency Insertion Method and stochastic collocation

Kummerer, R. F., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 20 2018, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Rapid electro-thermal modeling for 3D integration using circuit simulation techniques

Shiue, G. & Schutt-Aine, J., Jun 22 2018, 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018. Institute of Electrical and Electronics Engineers Inc., 1 p. (2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility, EMC/APEMC 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for uncertainty characterization of fiber-weave effect on coupled transmission lines

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 20 2018, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2017. Institute of Electrical and Electronics Engineers Inc., Vol. 2018-January. p. 1-3 3 p.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2017

Comparison of techniques for model order reduction of frequency-dependent networks

Nguyen, T. & Schutt-Aine, J., Apr 5 2017, 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. Institute of Electrical and Electronics Engineers Inc., p. 87-89 3 p. 7893133. (2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

FFT-based macromodeling of power delivery network with uncertainties using latency insertion method

Kummerer, R. F., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jun 7 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7944035. (2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Foreword

Schutt-Ainé, J. & Swaminathan, M., Apr 5 2017, In : 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016. p. iii 7893093.

Research output: Contribution to journalEditorial

Modulation enhancements of photonic crystal vcsels

Dave, H., Fryslie, S. T. M., Schutt-Aine, J. E. & Choquette, K. D., Jan 1 2017, Vertical-Cavity Surface-Emitting Lasers XXI. Choquette, K. D. & Lei, C. (eds.). SPIE, 1012207. (Proceedings of SPIE - The International Society for Optical Engineering; vol. 10122).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Modulation of coherently coupled phased photonic crystal vertical cavity laser arrays

Fryslie, S. T. M., Gao, Z., Dave, H., Thompson, B. J., Lakomy, K., Lin, S., Decker, P. J., Mcelfresh, D. K., Schutt-Aine, J. E. & Choquette, K. D., Nov 1 2017, In : IEEE Journal of Selected Topics in Quantum Electronics. 23, 6, 7914664.

Research output: Contribution to journalArticle

Monte Carlo estimation of sparse grid interpolation residual for stochastic collocation of high-order systems with uncertainties

Chen, X., Ma, X., Rong, A., Schutt-Aine, J. E. & Cangellaris, A. C., Jun 7 2017, 2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7944004. (2017 IEEE 21st Workshop on Signal and Power Integrity, SPI 2017 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic electromagnetic-circuit simulation for system-level EMI analysis

Ma, X., Chen, X., Rong, A., Schutt-Aine, J. E. & Cangellaris, A. C., Oct 20 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017 - Proceedings. Institute of Electrical and Electronics Engineers Inc., p. 118-123 6 p. 8077852. (IEEE International Symposium on Electromagnetic Compatibility).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Volterra kernels extraction from frequency-domain data for weakly non-linear circuit time-domain simulation

Nguyen, T., Schutt-Aine, J. E. & Chen, Y., Dec 29 2017, 2017 IEEE Radio and Antenna Days of the Indian Ocean, RADIO 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-2 2 p. (2017 IEEE Radio and Antenna Days of the Indian Ocean, RADIO 2017; vol. 2017-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Volterra Series-Based Time-Domain Macromodeling of Nonlinear Circuits

Xiong, X. Y. Z., Jiang, L. J., Schutt-Aine, J. E. & Chew, W. C., Jan 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 1, p. 39-49 11 p., 7763759.

Research output: Contribution to journalArticle

2016

Finite difference schemes for transient simulation of transmission lines exhibiting uncertainties

Chen, X., Schutt-Ainé, J. E. & Cangellaris, A. C., Jun 20 2016, 2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 7496311. (2016 IEEE 20th Workshop on Signal and Power Integrity, SPI 2016 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Microassembly of heterogeneous materials using transfer printing and thermal processing

Keum, H., Yang, Z., Han, K., Handler, D. E., Nguyen, T. N., Schutt-Aine, J., Bahl, G. & Kim, S., Jul 18 2016, In : Scientific reports. 6, 29925.

Research output: Contribution to journalArticle

SPICE circuit synthesis from complex pole-residue S-parameter representation

Schutt-Ainé, J., Jul 26 2016, 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016. Institute of Electrical and Electronics Engineers Inc., p. 1050-1052 3 p. 7522942. (2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2016).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for Transient Simulations of Printed Circuit Board Transmission Lines with Uncertainties

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Aug 16 2016, Proceedings - ECTC 2016: 66th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 2297-2304 8 p. 7545744. (Proceedings - Electronic Components and Technology Conference; vol. 2016-August).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

MOS models for LIM transient simulations

Hajimiri, M. & Schutt-Aine, J. E., Dec 3 2015, 2015 IEEE 24th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2015. Institute of Electrical and Electronics Engineers Inc., p. 189-192 4 p. 7347159

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stochastic LIM for transient simulation of circuits with uncertainties

Chen, X., Qiu, M., Schutt-Ainé, J. E. & Cangellaris, A. C., May 7 2015, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., p. 29-32 4 p. 7103585. (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ultra-Small, High-Frequency, and Substrate-Immune Microtube Inductors Transformed from 2D to 3D

Yu, X., Huang, W., Li, M., Comberiate, T. M., Gong, S., Schutt-Aine, J. E. & Li, X., Apr 27 2015, In : Scientific reports. 5, 9661.

Research output: Contribution to journalArticle

2014

Blackbox macro-modeling of the nonlinearity based on Volterra series representation of X-parameters

Xiong, X. Y. Z., Jiang, L. J., Schutt-Ainé, J. E. & Chew, W. C., Jan 1 2014, 2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014. Institute of Electrical and Electronics Engineers Inc., p. 85-88 4 p. 7103601. (2014 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fast solution of low-frequency complex problems over a frequency band using enhanced A-EFIE and FMM

Wu, J. W., Qian, Z. G., Schutt-Ainé, J. E. & Chew, W. C., Sep 2014, In : Microwave and Optical Technology Letters. 56, 9, p. 2153-2158 6 p.

Research output: Contribution to journalArticle

Improving fast S-parameter convolution by optimising reference impedance

Goh, P. & Schutt-Aine, J. E., Jan 1 2014, In : Electronics Letters. 50, 18, p. 1290-1292 3 p.

Research output: Contribution to journalArticle

LIM2X: Generating X-parameters in the time domain using the latency insertion method

Comberiate, T. M. & Schutt-Ainé, J. E., Jul 2014, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 4, 7, p. 1136-1143 8 p., 6816029.

Research output: Contribution to journalArticle

Optimal relaxation of I/O electrical requirements under packaging uncertainty by stochastic methods

Chen, X., Ochoa, J. S., Schutt-Aine, J. E. & Cangellaris, A. C., Sep 11 2014, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 717-722 6 p. 6897363. (Proceedings - Electronic Components and Technology Conference).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Robust SPICE circuit generation using scattering parameters

Schutt-Aine, J., Sep 15 2014, In : IEEE International Symposium on Electromagnetic Compatibility. 2014-September, September, p. 230-233 4 p., 6898975.

Research output: Contribution to journalConference article

Statistical analysis of fiber weave effect over differential microstrips on printed circuit boards

Zhang, T., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Jan 1 2014, 2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings. IEEE Computer Society, 6844540. (2014 18th IEEE Workshop on Signal and Power Integrity, SPI 2014 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

The latency insertion method for simulations of phase-locked loops

Goh, P. & Schutt-Aine, J. E., Jun 2014, In : Journal of Computational Electronics. 13, 2, p. 529-536 8 p.

Research output: Contribution to journalArticle

2013

A strategy to optimize Modal Signaling over microstrip lines with spacing variability

Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Aug 20 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558338. (2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Comparing fast convolution and model order reduction methods for S-parameter simulation

Schutt-Ainé, J. E. & Goh, P., Dec 1 2013, EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium. p. 134-137 4 p. 6724407. (EDAPS 2013 - 2013 IEEE Electrical Design of Advanced Packaging Systems Symposium).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fast and accurate multiscale electromagnetic modeling framework: An overview

Chew, W. C., Cangellaris, A. C., Schutt-Aine, J. E., Braunisch, H., Qian, Z. G., Aydiner, A. A., Aygun, K., Jiang, L. J., Ma, Z. H., Meng, L. L. & Naeem, M., Aug 20 2013, 2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013. 6558315. (2013 17th IEEE Workshop on Signal and Power Integrity, SPI 2013).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

IBIS simulation using the latency insertion method (LIM)

Schutt-Aine, J. E., Liu, P., Tan, J. & Varma, A., May 20 2013, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 7, p. 1228-1236 9 p., 6515598.

Research output: Contribution to journalArticle

Miniaturized on-chip passive devices based on self-rolled-up SiN x nanomembrane inductive tube

Huang, W., Yu, X., Comberiate, T., Qiu, C. W., Schutt-Aine, J. E. & Li, X., Dec 16 2013, 71st Device Research Conference, DRC 2013 - Conference Digest. p. 227-228 2 p. 6633876. (Device Research Conference - Conference Digest, DRC).

Research output: Chapter in Book/Report/Conference proceedingConference contribution