Jose E Schutt-Aine

Network

Songbin Gong

Person: Academic

Thong Nguyen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. Goh

  • Universiti Sains Malaysia
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Electrical and Electronic Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wendemagegnehu T. Beyene

  • Rambus Inc.
  • Hewlett-Packard
  • University of Illinois Urbana-Champaign
  • IEEE
  • Hewlett-Packard EEsof Division
  • Department of Electrical and Computer Engineering
  • Research and Technology Development
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Rambus Inc.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hanzhi Ma

  • Zhejiang University
  • ZJU-UIUC Institute

External person

Jilin Tan

  • Cadence Design Systems
  • PCB System Division
  • Cadence Design System, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of SPB Analysis
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pavle Milosevic

  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Er Ping Li

  • College of Information Science and Electronic Engineering
  • Zhejiang University
  • College of Information Science and Electronic Engineering
  • ZJU-UIUC Institute

External person

Dmitri Klokotov

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bobi Shi

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ping Liu

  • Cadence Design Systems
  • Cadence Design System, Inc
  • PCB System Division
  • Department of Engineering
  • Washington University St. Louis

External person

Josh G. Nickel

  • Silicon Bandwidth
  • Silicon Bandwidth, Inc.
  • Santa Clara University
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Computational Electromagnetics
  • Department of Electrical and Computer Engineering
  • Center of Computational Electromagnetics
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chang Liu

  • Northwestern University
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Quantum Devices
  • Department of Bioengineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

J. Zou

  • University of Illinois Urbana-Champaign
  • Texas A&M University
  • Department of Electrical and Computer Engineering, Texas AandM University
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Texas A&m University
  • University of Illinois at Urbana-Champaign

External person

Yidnekachew Mekonnen

  • Intel
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tom Comberiate

  • Johns Hopkins Applied Physics Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Applied Physics Laboratory
  • Department of Electrical and Computer Engineering
  • Applied Physics Laboratory
  • Johns Hopkins University
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Yixuan Zhao

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Feras Al-Hawari

  • Cadence Design Systems

External person

Raj Mittra

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kyung S. Oh

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhichao Deng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wenliang Dai

  • Cadence Design Systems

External person

Dmitri Kuznetsov

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chiu Chih Chou

  • University of Illinois at Urbana-Champaign
  • National Central University
  • University of Illinois at Urbana-Champaign

External person

Xinying Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yi Zhou

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rong Gao

  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

F. Liu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Electromagnetics Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Synopsys Inc.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sung Mo Kang

  • IEEE
  • University of Illinois Urbana-Champaign
  • Silicon Perspective Corporation
  • University of California at Santa Cruz
  • University of California, Berkeley
  • Lucent
  • Rutgers - The State University of New Jersey, New Brunswick
  • Marshall University
  • Swiss Federal Institute of Technology Lausanne
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Baskin School of Engineering
  • Ctr. for Prev. R. and D.
  • Center for Advanced Study
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of California at Santa Cruz
  • Nokia
  • University of Illinois at Urbana-Champaign
  • University of California

External person

Wen Yan Yin

  • Zhejiang University
  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
  • Key Laboratory of Advanced Micro/Nano Electronic Devices
  • College of Information and Electronic Engineering
  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province

External person

Tuomin Tao

  • ZJU-UIUC Institute
  • Zhejiang University

External person

Da Li

  • ZJU-UIUC Institute
  • Zhejiang University

External person

Dawei Wang

  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
  • Zhejiang University
  • State Key Laboratory of Modern Optical Instrumentation
  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province

External person

Zhiguo Qian

  • Apache Design Solutions
  • Intel
  • 337 Everitt Lab.
  • University of Illinois Urbana-Champaign
  • Center for Computational Electromagnetics
  • Apache Design Solutions, Inc.
  • IEEE
  • Southeast University, Nanjing
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept of ECE
  • Electromagnetics Laboratory
  • Department of Radio Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Electromagnetics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wenchao Chen

  • University of Florida
  • Department of Electrical and Computer Engineering
  • Zhejiang University
  • Now at ZJU-UIUC Institute
  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
  • College of Information Science and Electronic Engineering
  • ZJU-UIUC Institute
  • Key Lab. of Sci. and Technol. on Electromagnetic Environ. Effects and Electro-optical Engineering
  • College of Information Science and Electronic Engineering
  • College of Information Science and Electronic Engineering
  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
  • Logistical Engineering University China
  • ZJU-UIUC Institute
  • University of Florida

External person

Ki Hyuk Kim

  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Guodong Zhu

  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
  • Zhejiang University
  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province

External person

J. Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • LSI Logic Corporation
  • Department of Electrical Engineering
  • Southern Methodist University
  • University of Arizona
  • Center for Electronic Packaging Research
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Arizona
  • University of Illinois at Urbana-Champaign

External person

J. Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Motorola
  • Cellular Research Laboratory
  • IEEE
  • University of Houston
  • Department of Electrical and Computer Engineering
  • Personal Communications Systems Research Laboratories
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Li Jun Jiang

  • The University of Hong Kong
  • China Academy of Engineering Physics
  • Department of Electrical and Electronic Engineering
  • Department of EEE
  • University of Illinois at Urbana-Champaign
  • IBM
  • University of Illinois at Urbana-Champaign

External person

Drew Trainor

  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Center for Computational Electromagnetics
  • University of Illinois at Urbana-Champaign

External person

Wen Huang

  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Hefei University of Technology
  • University of Electronic Science and Technology of China
  • University of Illinois at Urbana-Champaign

External person

C. Kumar

  • Cadence Design Systems

External person

Jun Wei Wu

  • Wuhan University
  • School of Electronics and Information

External person

Xiao Ma

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pingqi Gao

  • Ningbo Institute of Material Technology and Engineering
  • Chinese Academy of Sciences
  • CAS - Ningbo Institute of Material Technology and Engineering
  • Ningbo Institute of Material Technology and Engineering

External person

Madhavan Swaminathan

  • Pennsylvania State University

External person

Harshil Dave

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

K. Ayg├╝n

  • Intel
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Wei Chun Chin

  • Universiti Sains Malaysia

External person

Jack Chen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ton Wang

  • Silicon Bandwidth, Inc.
  • University of Michigan, Ann Arbor

External person

Wen Sheng Zhao

  • School of Electronics and Information
  • Hangzhou Dianzi University

External person

Stewart Thomas McKee Fryslie

  • University of Illinois Urbana-Champaign
  • Freedom Photonics LLC
  • Freedom Photonics
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Lockheed Martin
  • Lockheed Martin Laser and Sensor Systems
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Freedom Photonics
  • University of Illinois at Urbana-Champaign

External person

L. Sang

  • University of Illinois Urbana-Champaign
  • University of Electronic Science and Technology of China
  • EHF Key Laboratory of Fundamental Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Microelectronics Engineering
  • Hefei University of Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xin Yu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • U.S Research and Development Center
  • University of Illinois
  • U.S Research and Development Center @ Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ambrish Varma

  • Cadence Design Systems
  • Department of SPB Analysis

External person

Robert F. Kummerer

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

En Xiao Liu

  • Agency for Science, Technology and Research, Singapore
  • Department of Electromagnetics and Electronic System

External person

Yan Li

  • China Jiliang University

External person

Xiaoyan Y Z Xiong

  • The University of Hong Kong
  • Department of Electrical and Electronic Engineering
  • Department of EEE

External person

Q. H. Liu

  • University of Illinois Urbana-Champaign
  • Schlumberger
  • Duke University
  • University of Electronic Science and Technology of China
  • New Mexico State University
  • Department of Electrical and Computer Engineering
  • Klipsch School of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Intel
  • The University of Hong Kong
  • Department of Electrical and Electronic Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • National University of Singapore
  • Department of Electrical and Computer Engineering
  • Kyocera Wireless Corp.
  • Ctr. for Compl. Electromagnetics
  • IEEE
  • Faculty of Engineering
  • Electromagnetics Laboratory
  • Department of Electrical and Electronic Engineering
  • Center for Computational Electromagnetics
  • United States Geological Survey
  • Department of Electrical Engineering and Computer Science Research Laboratory of Electronics
  • Massachusetts Institute of Technology
  • Electromagnetics Laboratory
  • Center of Computational Electromagnetics
  • Department of Electrical and Electronic Engineering
  • Center for Computational Electromagnetics
  • College of Engineering
  • University of Kentucky
  • Univ of Illinois, Dep of Electr
  • Department of Electrical and Electronic Engineering
  • DEMACO, Inc.
  • Department of Electrical, and Computer Engineering
  • University of Texas at Austin
  • Department of Electrical Engineering
  • ANSYS, Inc.
  • Ctr. for Computational Elec.Magnet.
  • Department of Electrical and Electronic Engineering
  • Center for Computational Electromagnetics
  • Electromagnetics Laboratory
  • Chevron Corporation
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical and Electronic Engineering
  • Department of Electronic and Computer Engineering
  • Hong Kong University of Science and Technology
  • Electrical and Computer Engineering
  • United States Air Force Institute of Technology
  • Department of Electrical and Computer Engineering
  • Schlumberaer-Doll Research
  • Nagasaki University
  • College of Engineering
  • F Lectromagnetics Laboratory
  • Center for Computational Electromagnetics
  • Department of EEE
  • Middle East Technical University
  • Ctr. for Compl. Electromagnetics
  • Department of Electrical and Electronic Engineering
  • Faculty of Engineering
  • Electromagnetics Department
  • Bilkent University
  • Princeton University
  • Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
  • Department of Electrical and Comouter Engineering
  • Electrical and Computer Engineering
  • Purdue University
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • 337 Everitt Lab.
  • Sclumberger-Doll Research
  • Purdue University
  • UNIVERSITY OF ILLINOIS
  • University of Illinois at Urbana-Champaign
  • College of Engineering
  • Ansoft Corporation
  • Massachusetts Institute of Technology
  • Massachusetts Inst. of Technology

External person

Dragoslav Milosevic

  • Cadence Design Systems

External person

C. Ogata

  • Silicon Bandwidth, Inc.

External person

Shurun Tan

  • ZJU-UIUC Institute
  • Zhejiang University

External person

Nur Syazreen Ahmad

  • Universiti Sains Malaysia

External person

Gene Shiue

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhongyong Zhou

  • Cadence Design Systems
  • Cadence Design System, Inc
  • PCB System Division

External person

James Jeon

  • Silicon Bandwidth, Inc.

External person

Andrei Pashkovich

  • Silvaco Data Systems, Inc.

External person

Jingye Cai

  • University of Electronic and Scientific Technology of China
  • School of Communication and Information Engineering
  • School of Information and Communication Engineering
  • University of Electronic Science and Technology of China

External person

Eric Michielssen

  • Tel Aviv University
  • University of Michigan, Ann Arbor
  • Ansoft Corporation
  • Commission B
  • University of Illinois Urbana-Champaign
  • IEEE
  • Center for Computational Electromagnetics
  • Real-Time Computing Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • International Union of Radio Scientists (URSI)
  • Center for Computational Electromagnetics
  • Department of Electrical Engineering and Computer Science
  • Electromagnetics Laboratory
  • Department of EE
  • Coordinated Science Laboratory
  • ANSYS, Inc.
  • Center of Computational Electromagnetics
  • Ctr. for Compl. Electromagnetics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Michigan, Ann Arbor
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Hohyun Keum

  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yuanwang Yang

  • University of Electronic and Scientific Technology of China
  • School of Communication and Information Engineering
  • School of Information and Communication Engineering
  • University of Electronic Science and Technology of China

External person

Ying Chen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. Schmitt

  • Rambus Inc.
  • Rambus Inc.

External person

Feng Ling

  • Xpeedic Technology, Inc.
  • Nanjing University of Science and Technology

External person

M. Li

  • Rambus Inc.

External person

L. Yang

  • Rambus Inc.
  • Rambus Inc.

External person

Mark D. Hampson

  • Silicon Bandwidth, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kewen Han

  • Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • ACRC
  • MechSE department
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hao Zhou

  • School of Microelectronics Engineering
  • Hefei University of Technology

External person

Mark D. Kraman

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Patrick J. Decker

  • Oracle Corporation

External person

Yuechen Wang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. M. Song

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Iowa State University
  • Department of Electrical Engineering
  • Center for Computational Electromagnetics
  • Center for Computational Electromagnetics
  • University of Kentucky
  • Department of Electrical, and Computer Engineering
  • University of Texas at Austin
  • Digital DNA Labs.
  • Motorola
  • Department of Electrical and Computer Engineering
  • IEEE
  • Michigan State University
  • Nanjing University
  • DEMACO, Inc.
  • Beijing Broadcasting College
  • Department of Microwave Engineering
  • College of Engineering
  • Electromagnetics Laboratory
  • Dept. of Electr. and Comput. Eng.
  • Center for Computational Electromagnetics
  • Center of Computational Electromagnetics
  • Ctr. for Compl. Electromagnetics
  • Electromagnetics Laboratory
  • Phi Kappa Phi
  • University of Illinois at Urbana-Champaign
  • Michigan State University
  • Iowa State University
  • Iowa State University
  • University of Illinois at Urbana-Champaign

External person

Da Wei

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Samsung
  • University of Illinois at Urbana-Champaign

External person

Elmar Griese

  • University of Siegen

External person

L. L. Meng

  • The University of Hong Kong
  • Department of Electrical and Electronic Engineering

External person

Haidi Ibrahim

  • Universiti Sains Malaysia

External person

Hao Xie

  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
  • Zhejiang University
  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province

External person

Guanghua Shu

  • Oregon State University
  • University of Illinois Urbana-Champaign
  • Oracle Labs
  • VLSI Research
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • School of EECS
  • Indian Institute of Technology Madras
  • Department of Electrical Engineering
  • Oracle Corporation
  • University of Illinois at Urbana-Champaign
  • Oregon State University
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Er Ping Li

  • Agency for Science, Technology and Research, Singapore
  • Zhejiang University
  • Department of Electromagnetics and Electronic System
  • Cyber Innovation Joint Research Center
  • College of Information Science and Electronic Engineering
  • Laboratory of Advanced Micro/Nano Electronic Devices and Smart System Applications of Zhejiang
  • Key Lab of AMESS
  • College of Information Science and Electronic Engineering
  • ZJU-UIUC Institute

External person

Fethi Choubani

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kaisheng Hu

  • Ciena
  • Ciena Corporation

External person

Kai Kang

  • University of Electronic Science and Technology of China

External person

Wui Weng Wong

  • Advanced Micro Devices

External person

Shiyun Lin

  • Oracle Corporation

External person

Ho Young R Chung

  • Raytheon
  • University of Illinois Urbana-Champaign
  • Center for Computational Electromagnetics
  • University of Illinois at Urbana-Champaign

External person

Katherine Lakomy

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Naeem

  • The University of Hong Kong
  • Department of Electrical and Electronic Engineering

External person

Tong Zhang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Michael Qiu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. Mullen

  • Rambus Inc.
  • Rambus Inc.

External person

Kostas Malinauskas

  • Silvaco Data Systems, Inc.

External person

Mohamed Sahouli

  • Western University

External person

Quankun Chen

  • Zhejiang University

External person

Ali E. Yilmaz

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical, and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Electromagnetics Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Julian Michaels

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Micro and Nano Technology Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Heidi Barnes

  • Keysight Technologies

External person

D. Caruth

  • Xindium Technologies, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Moyang Li

  • University of Illinois Urbana-Champaign
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zining Yang

  • Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Drew E. Handler

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Patrick Chapman

  • The University of Texas at Arlington
  • SolarBridge Technologies
  • University of Illinois Urbana-Champaign
  • IEEE
  • Grainger Center for Electric Machinery and Electromechanics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Grainger Center for Electric Machinery and Electromechanics
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Depts. of Electrical and Computer Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Texas at Arlington
  • University of Illinois at Urbana-Champaign

External person

Fei Guo

  • Advanced Micro Devices

External person

Shyh Chiang Shen

  • Georgia Institute of Technology
  • Xindium Technologies, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductors
  • Electrical and Computer Engineering
  • Center for Compound Semiconductors
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Cheng Wei Qiu

  • National University of Singapore
  • Department of Electrical and Computer Engineering

External person

D. J. Sievers

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Cygnus Photonics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zihe Gao

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Meta
  • Facebook Reality Labs Redmond
  • University of Pennsylvania
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alan S. Yang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

Jin Fa Lee

  • University of Illinois Urbana-Champaign
  • Ohio State University
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Ohio State University
  • University of Illinois at Urbana-Champaign
  • Ohio State University
  • University of Illinois at Urbana-Champaign

External person

Zhendong Yang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Texas at Austin
  • University of Illinois at Urbana-Champaign

External person

Bu Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jr Crane

  • Silicon Bandwidth, Inc.

External person

Chang Liu

  • Cadence Design Systems

External person

Rohit Sharma

  • Indian Institute of Technology Ropar

External person

Stanford W. Crane

  • Silicon Bandwidth, Inc.

External person

Sung Mo Kang

  • University of California at Santa Cruz
  • University of California at Santa Cruz

External person

Alaeddin A. Aydiner

  • United States Geological Survey
  • Intel
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Electromagnetics Laboratory
  • Center of Computational Electromagnetics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Haojie Zhao

  • School of Microelectronics Engineering
  • Hefei University of Technology

External person

S. Velamparambil

  • Ansoft Corporation
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Center for Computational Electromagnetics
  • Ctr. for Computational Elec.Magnet.
  • Ctr. for Compl. Electromagnetics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Ctr. for Computational Elec.Magnet.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Juan S. Ochoa

  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zuhui Ma

  • The University of Hong Kong
  • Yunnan University
  • Department of Electrical and Electronic Engineering
  • Department of EEE
  • Department of Electrical and Electronic Engineering

External person

D. Chan

  • Xindium Technologies, Inc.

External person

Bradley Thompson

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Air Force Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

David K. McElfresh

  • Sun Microsystems
  • University of Illinois Urbana-Champaign
  • Oracle Corporation
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nam Pham

  • IBM
  • University of Illinois at Urbana-Champaign
  • Caterva, Inc.

External person

Maryam Hajimiri

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Stefano Grivet Talocia

  • Polytechnic University of Turin

External person

Yidnekachew S. Meknonen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Vrashank Shukla

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hartmut Grabinski

  • Leibniz University Hannover
  • Universitaet Hannover

External person

Tejasvi Anand

  • University of Illinois at Urbana-Champaign
  • Oregon State University
  • University of California at Los Angeles
  • University of Illinois at Urbana-Champaign
  • School of Civil and Construction Engineering, Oregon State University

External person