Jose E Schutt-Aine

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

22 shared research output

P. Goh

Universiti Sains Malaysia
University of Illinois Urbana-Champaign
Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
School of Electrical and Electronic Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

17 shared research output

Wendemagegnehu T. Beyene

Rambus Inc.
Hewlett-Packard
University of Illinois Urbana-Champaign
IEEE
Hewlett-Packard EEsof Division
Department of Electrical and Computer Engineering
Research and Technology Development
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Rambus Inc.
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

15 shared research output

Bobi Shi

University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

12 shared research output

Er Ping Li

College of Information Science and Electronic Engineering
Zhejiang University
College of Information Science and Electronic Engineering
ZJU-UIUC Institute

External person

12 shared research output

Hanzhi Ma

Zhejiang University
ZJU-UIUC Institute

External person

12 shared research output

Jilin Tan

Cadence Design Systems
PCB System Division
Cadence Design System, Inc.
University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of SPB Analysis
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

11 shared research output

Pavle Milosevic

University of Illinois Urbana-Champaign
Intel
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

10 shared research output

Dmitri Klokotov

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

10 shared research output

Ping Liu

Cadence Design Systems
Cadence Design System, Inc
PCB System Division
Department of Engineering
Washington University St. Louis

External person

8 shared research output

Josh G. Nickel

Silicon Bandwidth
Silicon Bandwidth, Inc.
Santa Clara University
University of Illinois Urbana-Champaign
IEEE
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Center for Computational Electromagnetics
Department of Electrical and Computer Engineering
Center of Computational Electromagnetics
Department of Electrical Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

8 shared research output

Chang Liu

Northwestern University
University of Illinois Urbana-Champaign
Micro and Nanotechnology Lab
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Center for Quantum Devices
Department of Bioengineering
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
University of Illinois at Urbana-Champaign
University of Illinois
University of Illinois at Urbana-Champaign

External person

8 shared research output

J. Zou

University of Illinois Urbana-Champaign
Texas A&M University
Department of Electrical and Computer Engineering, Texas AandM University
Department of Electrical and Computer Engineering
Micro and Nanotechnology Lab
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
Texas A&m University
University of Illinois at Urbana-Champaign

External person

7 shared research output

Yidnekachew Mekonnen

Intel
University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

7 shared research output

Tom Comberiate

Johns Hopkins Applied Physics Laboratory
University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Applied Physics Laboratory
Department of Electrical and Computer Engineering
Applied Physics Laboratory
Johns Hopkins University
University of Illinois at Urbana-Champaign
University of Illinois
University of Illinois at Urbana-Champaign

External person

7 shared research output

Yixuan Zhao

University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

6 shared research output

Feras Al-Hawari

Cadence Design Systems

External person

6 shared research output

Raj Mittra

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

6 shared research output

Yi Zhou

University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

6 shared research output

Kyung S. Oh

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

6 shared research output

Zhichao Deng

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

4 shared research output

Wenliang Dai

Cadence Design Systems

External person

4 shared research output

Dmitri Kuznetsov

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

4 shared research output

Chiu Chih Chou

University of Illinois at Urbana-Champaign
National Central University
University of Illinois at Urbana-Champaign

External person

4 shared research output

Xinying Wang

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

4 shared research output

Rong Gao

University of Illinois Urbana-Champaign
Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

4 shared research output

F. Liu

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Electromagnetics Laboratory
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Synopsys Inc.
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

4 shared research output

Sung Mo Kang

IEEE
University of Illinois Urbana-Champaign
Silicon Perspective Corporation
University of California at Santa Cruz
University of California, Berkeley
Lucent
Rutgers - The State University of New Jersey, New Brunswick
Marshall University
Swiss Federal Institute of Technology Lausanne
Department of Electrical and Computer Engineering and Department of Computer Science
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Center for Compound Semiconductor Microelectronics
Department of Electrical and Computer Engineering
Baskin School of Engineering
Ctr. for Prev. R. and D.
Center for Advanced Study
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
University of California at Berkeley
University of California at Santa Cruz
Nokia
University of Illinois at Urbana-Champaign
University of California

External person

3 shared research output

Wen Yan Yin

Zhejiang University
Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
Key Laboratory of Advanced Micro/Nano Electronic Devices
College of Information and Electronic Engineering
Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province

External person

3 shared research output

Tuomin Tao

ZJU-UIUC Institute
Zhejiang University

External person

3 shared research output

Da Li

ZJU-UIUC Institute
Zhejiang University

External person

3 shared research output

Dawei Wang

Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
Zhejiang University
State Key Laboratory of Modern Optical Instrumentation
Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province

External person

3 shared research output

Zhiguo Qian

Apache Design Solutions
Intel
337 Everitt Lab.
University of Illinois Urbana-Champaign
Center for Computational Electromagnetics
Apache Design Solutions, Inc.
IEEE
Southeast University, Nanjing
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Dept of ECE
Electromagnetics Laboratory
Department of Radio Engineering
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering
Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
Electromagnetics Laboratory
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

3 shared research output

Wenchao Chen

University of Florida
Department of Electrical and Computer Engineering
Zhejiang University
Now at ZJU-UIUC Institute
Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
College of Information Science and Electronic Engineering
ZJU-UIUC Institute
Key Lab. of Sci. and Technol. on Electromagnetic Environ. Effects and Electro-optical Engineering
College of Information Science and Electronic Engineering
College of Information Science and Electronic Engineering
Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
Logistical Engineering University China
ZJU-UIUC Institute
University of Florida

External person

3 shared research output

Ki Hyuk Kim

University of Illinois Urbana-Champaign
IEEE
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

3 shared research output

Guodong Zhu

Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
Zhejiang University
Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province

External person

3 shared research output

J. Chen

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
LSI Logic Corporation
Department of Electrical Engineering
Southern Methodist University
University of Arizona
Center for Electronic Packaging Research
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Arizona
University of Illinois at Urbana-Champaign

External person

3 shared research output

J. Chen

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Motorola
Cellular Research Laboratory
IEEE
University of Houston
Department of Electrical and Computer Engineering
Personal Communications Systems Research Laboratories
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

3 shared research output

Li Jun Jiang

The University of Hong Kong
China Academy of Engineering Physics
Department of Electrical and Electronic Engineering
Department of EEE
University of Illinois at Urbana-Champaign
IBM
University of Illinois at Urbana-Champaign

External person

3 shared research output

Drew Trainor

University of Illinois Urbana-Champaign
IEEE
Department of Electrical and Computer Engineering
Center for Computational Electromagnetics
University of Illinois at Urbana-Champaign

External person

3 shared research output

Wen Huang

University of Illinois at Urbana-Champaign
University of Illinois
Hefei University of Technology
University of Electronic Science and Technology of China
University of Illinois at Urbana-Champaign

External person

3 shared research output

C. Kumar

Cadence Design Systems

External person

3 shared research output

Jun Wei Wu

Wuhan University
School of Electronics and Information

External person

2 shared research output

Xiao Ma

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Civil and Environmental Engineering, University of Illinois Urbana-Champaign
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

2 shared research output

Pingqi Gao

Ningbo Institute of Material Technology and Engineering
Chinese Academy of Sciences
CAS - Ningbo Institute of Material Technology and Engineering
Ningbo Institute of Material Technology and Engineering

External person

2 shared research output

Madhavan Swaminathan

Pennsylvania State University

External person

2 shared research output

Harshil Dave

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois
University of Illinois at Urbana-Champaign

External person

2 shared research output

K. Aygün

Intel
University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign

External person

2 shared research output

Wei Chun Chin

Universiti Sains Malaysia

External person

2 shared research output

Jack Chen

University of Illinois Urbana-Champaign
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

2 shared research output

Ton Wang

Silicon Bandwidth, Inc.
University of Michigan, Ann Arbor

External person

2 shared research output

Wen Sheng Zhao

School of Electronics and Information
Hangzhou Dianzi University

External person

2 shared research output

Stewart Thomas McKee Fryslie

University of Illinois Urbana-Champaign
Freedom Photonics LLC
Freedom Photonics
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Lockheed Martin
Lockheed Martin Laser and Sensor Systems
University of Illinois at Urbana-Champaign
University of Illinois
Freedom Photonics
University of Illinois at Urbana-Champaign

External person

2 shared research output

L. Sang

University of Illinois Urbana-Champaign
University of Electronic Science and Technology of China
EHF Key Laboratory of Fundamental Science
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
School of Microelectronics Engineering
Hefei University of Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

2 shared research output

Xin Yu

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Micro and Nanotechnology Lab
University of Illinois at Urbana-Champaign
U.S Research and Development Center
University of Illinois
U.S Research and Development Center @ Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

2 shared research output

Ambrish Varma

Cadence Design Systems
Department of SPB Analysis

External person

2 shared research output

Robert F. Kummerer

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

2 shared research output

En Xiao Liu

Agency for Science, Technology and Research, Singapore
Department of Electromagnetics and Electronic System

External person

2 shared research output

Dale Becker

External person

2 shared research output

Yan Li

China Jiliang University

External person

2 shared research output

Haofeng Sun

University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

2 shared research output

Zhenguo Zhao

IAPCM

External person

2 shared research output

Xiaoyan Y Z Xiong

The University of Hong Kong
Department of Electrical and Electronic Engineering
Department of EEE

External person

2 shared research output

Q. H. Liu

University of Illinois Urbana-Champaign
Schlumberger
Duke University
University of Electronic Science and Technology of China
New Mexico State University
Department of Electrical and Computer Engineering
Klipsch School of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Intel
The University of Hong Kong
Department of Electrical and Electronic Engineering
Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
National University of Singapore
Department of Electrical and Computer Engineering
Kyocera Wireless Corp.
Ctr. for Compl. Electromagnetics
IEEE
Faculty of Engineering
Electromagnetics Laboratory
Department of Electrical and Electronic Engineering
Center for Computational Electromagnetics
United States Geological Survey
Department of Electrical Engineering and Computer Science Research Laboratory of Electronics
Massachusetts Institute of Technology
Electromagnetics Laboratory
Center of Computational Electromagnetics
Department of Electrical and Electronic Engineering
Center for Computational Electromagnetics
College of Engineering
University of Kentucky
Univ of Illinois, Dep of Electr
Department of Electrical and Electronic Engineering
DEMACO, Inc.
Department of Electrical, and Computer Engineering
University of Texas at Austin
Department of Electrical Engineering
ANSYS, Inc.
Ctr. for Computational Elec.Magnet.
Department of Electrical and Electronic Engineering
Center for Computational Electromagnetics
Electromagnetics Laboratory
Chevron Corporation
Department of Electrical Engineering and Computer Science
Department of Electrical and Electronic Engineering
Department of Electronic and Computer Engineering
Hong Kong University of Science and Technology
Electrical and Computer Engineering
United States Air Force Institute of Technology
Department of Electrical and Computer Engineering
Schlumberaer-Doll Research
Nagasaki University
College of Engineering
F Lectromagnetics Laboratory
Center for Computational Electromagnetics
Department of EEE
Middle East Technical University
Ctr. for Compl. Electromagnetics
Department of Electrical and Electronic Engineering
Faculty of Engineering
Electromagnetics Department
Bilkent University
Princeton University
Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
Department of Electrical and Comouter Engineering
Electrical and Computer Engineering
Purdue University
University of Illinois at Urbana-Champaign
University of Illinois
337 Everitt Lab.
Sclumberger-Doll Research
Purdue University
UNIVERSITY OF ILLINOIS
University of Illinois at Urbana-Champaign
Ansoft Corporation
Massachusetts Institute of Technology

External person

2 shared research output

Dragoslav Milosevic

Cadence Design Systems

External person

2 shared research output

C. Ogata

Silicon Bandwidth, Inc.

External person

2 shared research output

Shurun Tan

ZJU-UIUC Institute
Zhejiang University

External person

2 shared research output

Nur Syazreen Ahmad

Universiti Sains Malaysia

External person

2 shared research output

Gene Shiue

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

2 shared research output

Zhongyong Zhou

Cadence Design Systems
Cadence Design System, Inc
PCB System Division

External person

2 shared research output

James Jeon

Silicon Bandwidth, Inc.

External person

2 shared research output

Andrei Pashkovich

Silvaco Data Systems, Inc.

External person

2 shared research output

Jingye Cai

University of Electronic and Scientific Technology of China
School of Communication and Information Engineering
School of Information and Communication Engineering
University of Electronic Science and Technology of China

External person

1 shared research output

A. Yang

University of Illinois at Urbana-Champaign

External person

1 shared research output

Alexander Pelger

External person

1 shared research output

Eric Michielssen

Tel Aviv University
University of Michigan, Ann Arbor
Ansoft Corporation
Commission B
University of Illinois Urbana-Champaign
IEEE
Center for Computational Electromagnetics
Real-Time Computing Laboratory
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
International Union of Radio Scientists (URSI)
Center for Computational Electromagnetics
Department of Electrical Engineering and Computer Science
Electromagnetics Laboratory
Department of EE
Coordinated Science Laboratory
ANSYS, Inc.
Center of Computational Electromagnetics
Ctr. for Compl. Electromagnetics
Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
UIUC
University of Michigan, Ann Arbor
University of Illinois
University of Illinois at Urbana-Champaign

External person

1 shared research output

Hohyun Keum

Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
Department of Mechanical Science and Engineering
University of Illinois Urbana-Champaign
Dept. of Mat. Sci. and Engineering
Department of Mechanical Science and Engineering, University of Illinois
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Yuanwang Yang

University of Electronic and Scientific Technology of China
School of Communication and Information Engineering
School of Information and Communication Engineering
University of Electronic Science and Technology of China

External person

1 shared research output

Ying Chen

University of Illinois Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Jonatan Aronsson

CEMWorks

External person

1 shared research output

R. Schmitt

Rambus Inc.
Rambus Inc.

External person

1 shared research output

Feng Ling

Xpeedic Technology, Inc.
Nanjing University of Science and Technology

External person

1 shared research output

M. Li

Rambus Inc.

External person

1 shared research output

Richard Baca

Raytheon

External person

1 shared research output

L. Yang

Rambus Inc.
Rambus Inc.

External person

1 shared research output

Mark D. Hampson

Silicon Bandwidth, Inc.
University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Kewen Han

Mechanical Science and Engineering
University of Illinois Urbana-Champaign
Department of Mechanical Science and Engineering
ACRC
MechSE department
Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Hao Zhou

School of Microelectronics Engineering
Hefei University of Technology

External person

1 shared research output

Mark D. Kraman

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Patrick J. Decker

Oracle Corporation

External person

1 shared research output

Yuechen Wang

University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

J. M. Song

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Iowa State University
Department of Electrical Engineering
Center for Computational Electromagnetics
Center for Computational Electromagnetics
University of Kentucky
Department of Electrical, and Computer Engineering
University of Texas at Austin
Digital DNA Labs.
Motorola
Department of Electrical and Computer Engineering
IEEE
Michigan State University
Nanjing University
DEMACO, Inc.
Beijing Broadcasting College
Department of Microwave Engineering
College of Engineering
Electromagnetics Laboratory
Dept. of Electr. and Comput. Eng.
Center for Computational Electromagnetics
Center of Computational Electromagnetics
Ctr. for Compl. Electromagnetics
Electromagnetics Laboratory
Phi Kappa Phi
University of Illinois at Urbana-Champaign
Michigan State University
Iowa State University
Iowa State University
University of Illinois at Urbana-Champaign

External person

1 shared research output

Da Wei

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
Samsung
University of Illinois at Urbana-Champaign

External person

1 shared research output

Michael J. Hill

Intel

External person

1 shared research output

Elmar Griese

University of Siegen

External person

1 shared research output

L. L. Meng

The University of Hong Kong
Department of Electrical and Electronic Engineering

External person

1 shared research output

Rohit Sharma

Indian Institute of Technology Ropar

External person

1 shared research output

Haidi Ibrahim

Universiti Sains Malaysia

External person

1 shared research output

Hao Xie

Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
Zhejiang University
Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province

External person

1 shared research output

Guanghua Shu

Oregon State University
University of Illinois Urbana-Champaign
Oracle Labs
VLSI Research
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of Electrical and Computer Engineering
School of EECS
Indian Institute of Technology Madras
Department of Electrical Engineering
Oracle Corporation
University of Illinois at Urbana-Champaign
Oregon State University
University of Illinois
University of Illinois at Urbana-Champaign

External person

1 shared research output

O. Mikulchenko

Intel

External person

1 shared research output

Jose A. Hejase

NVIDIA

External person

1 shared research output

Fethi Choubani

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Kaisheng Hu

Ciena
Ciena Corporation

External person

1 shared research output

Kai Kang

University of Electronic Science and Technology of China

External person

1 shared research output

Wui Weng Wong

Advanced Micro Devices

External person

1 shared research output

Chang Liu

Cadence Design Systems

External person

1 shared research output

Shiyun Lin

Oracle Corporation

External person

1 shared research output

Ho Young R Chung

Raytheon
University of Illinois Urbana-Champaign
Center for Computational Electromagnetics
University of Illinois at Urbana-Champaign

External person

1 shared research output

Katherine Lakomy

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Benjamin Silva

Intel

External person

1 shared research output

M. Naeem

The University of Hong Kong
Department of Electrical and Electronic Engineering

External person

1 shared research output

Tong Zhang

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Michael Qiu

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

D. Mullen

Rambus Inc.
Rambus Inc.

External person

1 shared research output

Evelyne Clavelier

Tekcem

External person

1 shared research output

Kostas Malinauskas

Silvaco Data Systems, Inc.

External person

1 shared research output

Mohamed Sahouli

Western University

External person

1 shared research output

Quankun Chen

Zhejiang University

External person

1 shared research output

Ali E. Yilmaz

University of Texas at Austin
University of Illinois Urbana-Champaign
IEEE
Department of Electrical, and Computer Engineering
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of Electrical and Computer Engineering
Electromagnetics Laboratory
Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Julian Michaels

University of Illinois Urbana-Champaign
Micro and Nanotechnology Lab
Micro and Nano Technology Laboratory
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Juhitha Konduru

University of Illinois at Urbana-Champaign

External person

1 shared research output

Heidi Barnes

Keysight Technologies

External person

1 shared research output

D. Caruth

Xindium Technologies, Inc.
University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Zohreh Salehi

University of Illinois at Urbana-Champaign

External person

1 shared research output

Jun Zou

External person

1 shared research output

W. Dale Becker

External person

1 shared research output

Tahsin Shameem

University of Illinois at Urbana-Champaign

External person

1 shared research output

Frederic Broyde

Tekcem

External person

1 shared research output

Yiru Jeong

Altair

External person

1 shared research output

Moyang Li

University of Illinois Urbana-Champaign
Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
Department of Electrical and Computer Engineering
Micro and Nanotechnology Lab
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Zining Yang

Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
University of Illinois Urbana-Champaign
Department of Mechanical Science and Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

H. Braunisch

Intel

External person

1 shared research output

Drew E. Handler

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Patrick Chapman

The University of Texas at Arlington
SolarBridge Technologies
University of Illinois Urbana-Champaign
IEEE
Grainger Center for Electric Machinery and Electromechanics
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Grainger Center for Electric Machinery and Electromechanics
Department of Electrical and Computer Engineering
Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
Department of Electrical and Computer Engineering
Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
Depts. of Electrical and Computer Engineering
Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign
UIUC
University of Texas at Arlington
University of Illinois at Urbana-Champaign

External person

1 shared research output

Fei Guo

Advanced Micro Devices

External person

1 shared research output

Shyh Chiang Shen

Georgia Institute of Technology
Xindium Technologies, Inc.
University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Center for Compound Semiconductors
Electrical and Computer Engineering
Center for Compound Semiconductors
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Cheng Wei Qiu

National University of Singapore
Department of Electrical and Computer Engineering

External person

1 shared research output

D. J. Sievers

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Cygnus Photonics
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Thomas Michael Winkel

External person

1 shared research output

Zihe Gao

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Meta
Facebook Reality Labs Redmond
University of Pennsylvania
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Loke Yip Foo

Intel

External person

1 shared research output

Jin Fa Lee

University of Illinois Urbana-Champaign
Ohio State University
Department of Electrical Engineering
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Ohio State University
University of Illinois at Urbana-Champaign
Ohio State University
University of Illinois at Urbana-Champaign

External person

1 shared research output

Zhendong Yang

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Texas at Austin
University of Illinois at Urbana-Champaign

External person

1 shared research output

Bu Wang

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Jr Crane

Silicon Bandwidth, Inc.

External person

1 shared research output

Stanford W. Crane

Silicon Bandwidth, Inc.

External person

1 shared research output

Sung Mo Kang

University of California at Santa Cruz
University of California at Santa Cruz

External person

1 shared research output

Alaeddin A. Aydiner

United States Geological Survey
Intel
University of Illinois Urbana-Champaign
IEEE
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering
Electromagnetics Laboratory
Center of Computational Electromagnetics
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Haojie Zhao

School of Microelectronics Engineering
Hefei University of Technology

External person

1 shared research output

S. Velamparambil

Ansoft Corporation
University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering
Center for Computational Electromagnetics
Ctr. for Computational Elec.Magnet.
Ctr. for Compl. Electromagnetics
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Ctr. for Computational Elec.Magnet.
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Juan S. Ochoa

Qualcomm Incorporated
University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Zuhui Ma

The University of Hong Kong
Yunnan University
Department of Electrical and Electronic Engineering
Department of EEE
Department of Electrical and Electronic Engineering

External person

1 shared research output

D. Chan

Xindium Technologies, Inc.

External person

1 shared research output

Evan Fledell

Intel

External person

1 shared research output

Bradley Thompson

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
Air Force Research Laboratory
University of Illinois at Urbana-Champaign

External person

1 shared research output

David K. McElfresh

Sun Microsystems
University of Illinois Urbana-Champaign
Oracle Corporation
Department of Electrical and Computer Engineering
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Tingdong Zhou

External person

1 shared research output

Nam Pham

IBM
University of Illinois at Urbana-Champaign
Caterva, Inc.

External person

1 shared research output

Maryam Hajimiri

University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Stefano Grivet Talocia

Polytechnic University of Turin

External person

1 shared research output

Pavel Roy Paladhi

External person

1 shared research output

Yidnekachew S. Meknonen

University of Illinois Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Junwei Yu

Zhejiang University

External person

1 shared research output

Vrashank Shukla

Texas Instruments
University of Illinois Urbana-Champaign
Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
University of Illinois at Urbana-Champaign
University of Illinois at Urbana-Champaign

External person

1 shared research output

Hartmut Grabinski

Leibniz University Hannover
Universitaet Hannover

External person

1 shared research output

Tejasvi Anand

University of Illinois at Urbana-Champaign
Oregon State University
University of California at Los Angeles
University of Illinois at Urbana-Champaign
School of Civil and Construction Engineering, Oregon State University

External person

1 shared research output

Jose E Schutt-Aine

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