1983 …2019
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Fingerprint Fingerprint is based on mining the text of the expert's scholarly documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

  • 4 Similar Profiles
Scattering parameters Engineering & Materials Science
Electric lines Engineering & Materials Science
Networks (circuits) Engineering & Materials Science
Circuit simulation Engineering & Materials Science
Crosstalk Engineering & Materials Science
Convolution Engineering & Materials Science
transmission lines Physics & Astronomy
Microstrip lines Engineering & Materials Science

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Research Output 1983 2019

A deep learning approach for volterra kernel extraction for time domain simulation of weakly nonlinear circuits

Nguyen, T., Wang, X., Chen, X. & Schutt-Aine, J. E., May 2019, Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019. Institute of Electrical and Electronics Engineers Inc., p. 1889-1896 8 p. 8811319. (Proceedings - Electronic Components and Technology Conference; vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Feedforward neural networks
Networks (circuits)
Buffers
Topology
Neural networks

An Improved Algorithm for Drift Diffusion Transport and Its Application on Large Scale Parallel Simulation of Resistive Random Access Memory Arrays

Wang, D. W., Chen, W., Zhao, W. S., Zhu, G. D., Zhao, Z. G., Schutt-Aine, J. E. & Yin, W. Y., Jan 1 2019, In : IEEE Access. 7, p. 31273-31285 13 p., 8656503.

Research output: Contribution to journalArticle

Open Access
Simulators
Data storage equipment
Domain decomposition methods
Supercomputers
Reliability analysis

Deep Learning Method for Prediction of Planar Radiating Sources from Near-Field Intensity Data

Ma, H., Li, E. P., Schutt-Aine, J. E. & Cangellaris, A. C., Jul 2019, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019. Institute of Electrical and Electronics Engineers Inc., p. 610-615 6 p. 8825271. (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Neural networks
Deep learning

Fully coupled electrothermal simulation of large RRAM arrays in the 'thermal-house'

Wang, D. W., Chen, W., Zhao, W. S., Zhu, G. D., Kang, K., Gao, P., Schutt-Aine, J. E. & Yin, W. Y., Jan 1 2019, In : IEEE Access. 7, p. 3897-3908 12 p., 8580571.

Research output: Contribution to journalArticle

Crosstalk
Temperature control
Hot Temperature
RRAM
Simulators

LIM Algorithms for Diodes and Branch Capacitors

Schutt-Aine, J. E. & Goh, P., Apr 2 2019, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018. Institute of Electrical and Electronics Engineers Inc., 8680874. (IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2018).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Diodes
Capacitors
Topology
Networks (circuits)