Research output per year
Research output per year
Fingerprint
Fingerprint is based on mining the text of the expert's scholarly documents to create an index of weighted terms, which defines the key subjects of each individual researcher.
- 6 Similar Profiles
Collaborations and top research areas from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
-
Latency Insertion Method for Accelerated Simulation of Memristor Crossbar Array in Neuromorphic Chip
Zhou, Y., Ma, H., Yu, J., Shameem, T., Salehi, Z., Rakheja, S., Li, E. & Schutt-Ainé, J. E., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 2200-2204 5 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
-
Latency Insertion Method for Fast Electro-Thermal Simulation of FinFET with Self-Heating Effect
Zhou, Y. & Schutt-Ainé, J. E., 2024, 33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024. Institute of Electrical and Electronics Engineers Inc., (33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
-
Latency Insertion Method for FinFET Simulation Incorporating Parasitic Source/Drain Resistances
Zhou, Y. & Schutt-Ainé, J. E., 2024, 2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (2024 IEEE 10th Electronics System-Integration Technology Conference, ESTC 2024 - Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
-
Modeling and Analysis of Heterogeneously Integrated Chiplet-to-Chiplet Communication Link in 2.5D Advanced Packaging
Sun, H., Shi, B., Nguyen, T. & Schutt-Ainé, J. E., 2024, Proceedings - IEEE 74th Electronic Components and Technology Conference, ECTC 2024. Institute of Electrical and Electronics Engineers Inc., p. 1078-1084 7 p. (Proceedings - Electronic Components and Technology Conference).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
-
Signal and Power Integrity Co-Simulation of Chiplet-to-Chiplet Channel based on Latency Insertion Method
Zhou, Y., Shi, B., Nguyen, T., Sun, H. & Schutt-Ainé, J. E., 2024, SPI 2024 - 28th IEEE Workshop on Signal and Power Integrity, Proceedings. Institute of Electrical and Electronics Engineers Inc., (SPI 2024 - 28th IEEE Workshop on Signal and Power Integrity, Proceedings).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Honors & Recognition
-
IEEE EPS Outstanding Sustained Technical Contribution Award
Schutt-Aine, J. (Recipient), 2024
Prize: Prize/Award
-