John Michael Dallesasse

Network

Brian T Cunningham

Person: Academic

Andrew M Smith

Person: Academic

N. Holonyak

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • Department of Electrical and Computer Engineering
  • Department of Physics
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Electrical Engineering Research Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Materials Research Laboratory
  • Beckman Institute for Advanced Science and Technology
  • IEEE
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Patrick Su

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

John A. Carlson

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • HRL Laboratories

External person

Benjamin Kesler

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Fu Chen Hsiao

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • North Carolina State University
  • University of Illinois at Urbana-Champaign

External person

F. A. Kish

  • Infinera Corporation
  • Hewlett-Packard
  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • Hewlett-Packard Company
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. D. Burnham

  • BP plc
  • Amoco Research and Development
  • Palo Alto Research Center
  • Amoco Technology Center
  • Amoco Technology Company

External person

A. Sugg

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

N. El-Zein

  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

S. C. Smith

  • BP plc
  • Amoco Technology Center
  • Amoco Technology Company

External person

Guan Lin Su

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. K. Bhattacharya

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor
  • University of Illinois at Urbana-Champaign

External person

Saoud A. Al-Mulla

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. C. Hsieh

  • Dept. of Elec. and Comp. Engineering
  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Electrical Engineering Research Laboratory
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Ctr. Compd. Semiconduct. M.
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Thomas O'Brien

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Caracci

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Electrical Engineering Research Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. Walter

  • Quantum Electro Opto Systems Sdn Bhd
  • Quantum Electro Opto Systems Sdn Bhd. Melaka
  • University of Illinois Urbana-Champaign
  • Quantum Electro Opto Systems Sdn Bhd
  • SDN.
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Quantum Electro Opto Systems
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • Quantum Electro Opto Systems Sdn Bhd
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

C. P. Kuo

  • Hewlett-Packard
  • Hewlett Packard Optoelectronics Division
  • Hewlett-Packard Company
  • Hewlett Packard Optoelectronics Division

External person

Christopher C. Blivin

  • Skorpios Technologies, Inc.

External person

R. M. Fletcher

  • Hewlett-Packard
  • Hewlett Packard Optoelectronics Division
  • Hewlett-Packard Company
  • Hewlett Packard Optoelectronics Division

External person

Mark D. Kraman

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Robert B. Kaufman

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Paul K.L. Yu

  • Skorpios Technologies, Inc.

External person

Elton Marchena

  • Skorpios Technologies, Inc.

External person

Amit Mizrahi

  • Skorpios Technologies, Inc.

External person

Kanuo Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. D. Osentowski

  • Hewlett-Packard
  • Hewlett Packard Optoelectronics Division
  • Hewlett-Packard Company
  • Hewlett Packard Optoelectronics Division

External person

Stephen B. Krasulick

  • Skorpios Technologies, Inc.

External person

T. A. Richard

  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Robert J. Stone

  • Skorpios Technologies, Inc.

External person

John Y. Spann

  • Skorpios Technologies, Inc.

External person

Kevin P. Pikul

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Timothy Creazzo

  • Skorpios Technologies, Inc.

External person

J. E. Baker

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Electrical Engineering Research Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. L. Lam

  • Quantum Electro Opto Systems Sdn Bhd
  • Quantum Electro Opto Systems Sdn Bhd. Melaka
  • SDN.
  • University of Illinois Urbana-Champaign
  • Quantum Electro Opto Systems
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Quantum Electro Opto Systems Sdn Bhd
  • University of Illinois at Urbana-Champaign

External person

Thomas Frost

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor

External person

M. G. Craford

  • Hewlett-Packard
  • Philips Medical Systems US
  • Philips Lighting
  • Hewlett Packard Optoelectronics Division
  • Hewlett-Packard Company
  • Koninklijke Philips N.V.
  • Hewlett Packard Optoelectronics Division

External person

Y. Wan

  • Beihang University
  • University of Illinois Urbana-Champaign
  • School of Electronic and Information Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Leah Espenhahn

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yanjing Li

  • The University of Chicago
  • Department of Computer Science
  • The University of Chicago

External person

Wang Peng

  • Huazhong University of Science and Technology
  • University of Illinois Urbana-Champaign
  • School of Mechanical Science and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Maranowski

  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mohammad Reza Jokar

  • The University of Chicago
  • Department of Computer Science
  • The University of Chicago

External person

Maanav Ganjoo

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nick Holonyak

  • University of Illinois Urbana-Champaign

External person

D. G. Deppe

  • University of Central Florida
  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • College of Optics and Photonics (CREOL), University of Central Florida
  • SdPhotonics, LLC
  • University of Illinois at Urbana-Champaign
  • SdPhotonics LLC
  • LLC
  • LLC

External person

W. E. Plano

  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Arnab Hazari

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor
  • University of Illinois at Urbana-Champaign

External person

Frederic T. Chong

  • The University of Chicago
  • Department of Computer Science
  • The University of Chicago

External person

Derek Van Orden

  • Skorpios Technologies, Inc.

External person

M. J. Ries

  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Petros Varangis

  • Skorpios Technologies, Inc.

External person

D. W. Nam

  • University of Illinois at Urbana-Champaign

External person

Junyi Qiu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rohan Bambery

  • IEEE
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Beitong Tian

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Qiuwen Lou

  • University of Notre Dame
  • University of Notre Dame
  • University of Notre Dame

External person

D. C. Hall

  • Electrical Engineering Research Laboratory
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

E. J. Vesely

  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Brittany Joy

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hong Cai

  • Skorpios Technologies, Inc.

External person

Aditi Udupa

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kenneth D. Long

  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Micro and Nanotechnology Lab
  • University of Illinois Urbana-Champaign
  • Bioengineering
  • University of Illinois at Chicago
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Chicago
  • University of Illinois at Urbana-Champaign

External person

G. C. Papen

  • University of Illinois Urbana-Champaign
  • University of California at San Diego
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

L. J. Guido

  • Yale University
  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering
  • Electrical Engineering Research Laboratory
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yia Chung Chang

  • Academia Sinica - Research Center for Applied Science

External person

Derek V. Orden

  • Skorpios Technologies, Inc.

External person

Lina He

  • Skorpios Technologies, Inc.

External person

P. Gavrilovic

  • Polaroid Corporation
  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • Microelectronics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. E. Höfler

  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

David J. Brady

  • Duke University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Duke University

External person

G. M. Murphy

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mingdai Yang

  • The University of Chicago

External person

Yuming Liu

  • The University of Chicago
  • Tsinghua University

External person

J. N. Baillargeon

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Electrical Engineering Research Laboratory
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign

External person

Bohao Wu

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Todd Nicholson

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. S. Major

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Brian D. Li

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Intel
  • University of Illinois at Urbana-Champaign
  • Nick Holonyak
  • University of Illinois at Urbana-Champaign

External person

Yaohui Wang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Elizabeth V. Woodburn

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Bioengineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Illinois College
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. C. Chang

  • University of Illinois at Urbana-Champaign
  • Academia Sinica - Research Center for Applied Science
  • University of Illinois at Urbana-Champaign

External person

Fei Tan

  • IEEE
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Phuong Nguyen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Ramin Rajaei

  • University of Notre Dame

External person

Gianni Pezzarossi

  • University of Illinois at Urbana-Champaign

External person

X. Sharon Hu

  • University of Notre Dame
  • Carnegie Mellon University
  • Carnegie Mellon University
  • University of Notre Dame

External person

Hessam Moeini

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. W. Treat

  • Palo Alto Research Center

External person

Ragini Gupta

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. Wan

  • Beihang University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Electronic and Information Engineering

External person

Junseok Heo

  • Ajou University
  • Department of Electrical and Computer Engineering

External person

Shun Lien Chuang

  • Dept. of Elec. and Comp. Engineering
  • University of Illinois Urbana-Champaign
  • Princeton Optronics
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Ctr. Compd. Semiconduct. M.
  • Dept. of Etearical and Computer Eng.
  • Engineering and Computer Science Department
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. Kaliski

  • Springs, CO, USA
  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Zhuoran Wang

  • University of Electronic Science and Technology of China
  • School of Optoelectronic Information
  • School of Information and Communication Engineering

External person

M. J. Brophy

  • Electronic Decisions Inc

External person

Sung Jun Lim

  • Department of Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • University of Illinois Urbana-Champaign
  • Daegu Gyeongbuk Institute of Science and Technology
  • Intelligent Devices and Systems Research Group
  • Micro and Nanotechnology Lab

External person

Tarek Elgamal

  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Zhiyuan Lin

  • School of Information and Communication Engineering
  • University of Electronic Science and Technology of China
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • School of Optoelectronic Information
  • University of Illinois at Urbana-Champaign

External person

J. Caracci

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Benjamin Keslera

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

I. Szafranek

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Center for Compound Semiconductor Microelectronics
  • Materials Research Laboratory
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Stuart Turner

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bor Long Twu

  • BeamExpress Inc.

External person

Lunkai Zhang

  • The University of Chicago
  • The University of Chicago

External person

M. Sardela

  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Center for Microanalysis of Materials
  • Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. E. Stillman

  • University of Illinois Urbana-Champaign
  • Urbana, IL, USA
  • Dept. of Elec. and Comp. Engineering
  • California Institute of Technology
  • HRL Laboratories
  • EpiWorks
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Materials Research Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Electrical Engineering Research Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Department of Chemistry
  • Ctr. Compd. Semiconduct. M.
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

A. E. Mironov

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Laboratory for Optical Physics and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Laboratory for Optical Physics and Engineering
  • Cygnus Photonics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Michael Chan

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. J. Hoskins

  • Electronic Decisions Inc

External person

K. Meehan

  • Polaroid Corporation
  • Microelectronics Laboratory
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. Spila

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science
  • Center for Microanalysis of Materials
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Curtis Yilin Wang

  • IEEE
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mark McCollum

  • University of Illinois at Urbana-Champaign

External person

Steven Konstanty

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhe Yang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

M. J. Miller

  • Electronic Decisions Inc

External person

K. Y. Cheng

  • University of Illinois Urbana-Champaign
  • National Tsing Hua University
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Coleman G. Williams

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mijung Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. P. Bour

  • Palo Alto Research Center
  • BRIDGELUX Inc.
  • Electronic Materials Laboratory

External person

Pankul Dhingra

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Lifan Yan

  • University of Michigan, Ann Arbor
  • Department of Materials Science and Engineering
  • University of Michigan, Ann Arbor

External person

Ruixiao Zhang

  • University of Illinois at Urbana-Champaign

External person

Russell D. Dupuis

  • Georgia Institute of Technology
  • University of Texas at Austin
  • EMCORE Corporation - Somerset
  • School of Materials Science and Engineering
  • IEEE
  • School of Material Science and Engineering, Georgia Institute of Technology
  • Center for Compound Semiconductors
  • Microelectronics Research Center
  • Microelectronics Research Center
  • Electrical and Computer Engineering
  • School of Materials Science and Engineering
  • Microelectronics Research Center PRC/MER 1.606D-R9900
  • Georgia Institute of Technology

External person

Joanna Mirecki Millunchick

  • University of Michigan, Ann Arbor
  • Department of Materials Science and Engineering
  • University of Michigan, Ann Arbor

External person

Shanbo Zhang

  • University of Illinois at Urbana-Champaign

External person

X. Sharon Hu

  • University of Notre Dame

External person

Mingyuan Wu

  • University of Illinois at Urbana-Champaign
  • Southern University of Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

Aaron J. Muhowski

  • University of Texas at Austin

External person

Wang Peng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering

External person

Ching Tarng Liang

  • Academia Sinica - Research Center for Applied Science

External person

Haozhen Zheng

  • University of Illinois at Urbana-Champaign

External person

J. E. Williams

  • Polaroid Corporation
  • Microelectronics Laboratory

External person

J. W. Peterson

  • Electronic Decisions Inc
  • Akselos

External person

Shiv Trivedi

  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

R. Hool

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • Nick Holonyak
  • University of Illinois at Urbana-Champaign
  • SolAero by Rocket Lab

External person

Raman Kumar

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bo Chen

  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • George Mason University

External person

V. M. Robbins

  • University of Illinois Urbana-Champaign
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign

External person