Network

Harish Krishnaswamy

  • Columbia University
  • Electrical Engineering Dept.

External person

Gil Zussman

  • Columbia University
  • Electrical Engineering Dept.

External person

Negar Reiskarimian

  • Columbia University
  • Electrical Engineering Dept.

External person

Tingjun Chen

  • Columbia University
  • Electrical Engineering Dept.

External person

Ning Li

  • Fudan University
  • State Key Laboratory of ASIC and System
  • State Key Laboratory of ASIC and System, Fudan University

External person

Hyungjoo Seo

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wei Li

  • Fudan University
  • Southern Methodist University
  • State Key Laboratory of ASIC and System
  • Department of Electrical Engineering
  • State Key Laboratory of ASIC and System, Fudan University

External person

Mahmood Baraani Dastjerdi

  • Columbia University
  • Electrical Engineering Dept.

External person

Junyan Ren

  • Fudan University
  • State Key Laboratory of ASIC and System
  • Micro-/Nano-Electronics Science and Technology Innovation Platform
  • State Key Laboratory of ASIC and System, Fudan University

External person

Deping Huang

  • Fudan University
  • Southern Methodist University
  • University of Arizona
  • State Key Laboratory of ASIC and System
  • Department of Electrical Engineering
  • Center for Electronic Packaging Research
  • University of Arizona

External person

Jelena Marašević

  • Columbia University
  • Electrical Engineering Dept.

External person

Tolga Dinc

  • Columbia University
  • Electrical Engineering Dept.
  • Texas Instruments

External person

J. Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • LSI Logic Corporation
  • Department of Electrical Engineering
  • Southern Methodist University
  • University of Arizona
  • Center for Electronic Packaging Research
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Arizona
  • University of Illinois at Urbana-Champaign

External person

Albert Cabellos-Aparicio

  • Polytechnic University of Catalonia
  • NaNo-Networking Center in Catalonia (N3Cat)
  • NaNoNetworking Center in Catalunya (N3Cat)
  • University of Illinois Urbana-Champaign

External person

Ruochen Lu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Virginia
  • University of Illinois at Urbana-Champaign
  • University of Texas at Austin
  • University of Illinois at Urbana-Champaign

External person

Tsung Hao Chuang

  • Columbia University
  • Electrical Engineering Dept.

External person

Yuhe Cao

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sergi Abadal

  • Polytechnic University of Catalonia
  • University of Illinois Urbana-Champaign
  • NaNo-Networking Center in Catalonia (N3Cat)
  • NaNoNetworking Center in Catalunya (N3Cat)
  • University of Illinois at Urbana-Champaign

External person

Antonio Franques

  • System Integration and Interconnection Technologies
  • Fraunhofer Institute for Reliability and Microintegration
  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Fraunhofer - BE-BB-ST-MV
  • University of Illinois at Urbana-Champaign

External person

Jelena Diakonikolas

  • Boston University
  • University of California, Berkeley
  • University of California at Berkeley

External person

Shuxin Ming

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Eduard Alarcón

  • Polytechnic University of Catalonia
  • NaNo-Networking Center in Catalonia (N3Cat)
  • NaNoNetworking Center in Catalunya (N3Cat)
  • University of Illinois Urbana-Champaign

External person

Mengze Sha

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xavier Timoneda

  • NaNoNetworking Center in Catalunya (N3Cat)
  • Polytechnic University of Catalonia

External person

Chen Lian

  • Fudan University
  • State Key Laboratory of ASIC and System

External person

Tomas Manzaneque

  • Delft University of Technology
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yansong Yang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Micro and Nanotechnology Laboratory
  • University of Illinois at Urbana-Champaign
  • Hong Kong University of Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Dionysios Manessis

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • System Integration and Interconnection Technologies
  • Fraunhofer Institute for Reliability and Microintegration
  • University of Illinois at Urbana-Champaign
  • Fraunhofer - BE-BB-ST-MV
  • University of Illinois at Urbana-Champaign

External person

Yuan Zhong

  • Columbia University
  • University of California, Berkeley
  • The University of Chicago
  • Industrial Engineering and Operations Research Dept.
  • Booth School of Business
  • The University of Chicago
  • University of California at Berkeley

External person

Peter R. Kinget

  • Columbia University
  • Electrical Engineering Dept.

External person

Ritesh Bhat

  • Columbia University
  • Electrical Engineering Dept.

External person

Guy Farkash

  • Columbia University
  • Electrical Engineering Dept.

External person

Jitian Zhang

  • University of Illinois at Urbana-Champaign

External person

Anandaroop Chakrabarti

  • Columbia University
  • Electrical Engineering Dept.

External person

Hamidreza Taghvaee

  • NaNoNetworking Center in Catalunya (N3Cat)
  • Polytechnic University of Catalonia

External person

Nicole Grimwood

  • Columbia University
  • Electrical Engineering Dept.

External person

Dimitrios Peroulis

  • Purdue University
  • School of Electrical and Computer Engineering
  • Network for Computational Nanotechnology
  • School of Electrical and Computer Engineering
  • Birck Nanotechnology Center
  • College of Engineering

External person

Junfeng Guan

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Swiss Federal Institute of Technology Lausanne

External person

Adrián Marruedo

  • NaNoNetworking Center in Catalunya (N3Cat)
  • Polytechnic University of Catalonia

External person

Jackson Welles

  • Columbia University

External person

Sara A. Pozzi

  • University of Michigan, Ann Arbor
  • Department of Nuclear Engineering and Radiological Sciences
  • University of Michigan, Ann Arbor

External person

Mohammad Abu Khater

  • Purdue University

External person

Xuanzhen Cao

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kyle A. Beyer

  • University of Michigan, Ann Arbor
  • Department of Nuclear Engineering and Radiological Sciences
  • University of Michigan, Ann Arbor

External person

Yu Chen Wu

  • Purdue University

External person

Rel Fogel

  • Columbia University
  • Electrical Engineering Dept.

External person

Jinyao Yang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. D. Clarke

  • University of Michigan, Ann Arbor
  • Department of Nuclear Engineering and Radiological Sciences
  • University of Michigan, Ann Arbor
  • University of Michigan Ann Arbor MI

External person

Rakibul Islam

  • University of Illinois at Urbana-Champaign

External person