Jianming Jin

Network

Lynford L Goddard

Person: Academic

Philip T Krein

Person: Academic

Su Yan

  • University of Electronic Science and Technology of China
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Microwave Engineering
  • Department of Electrical and Computer Engineering
  • Howard University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Howard University

External person

Eric Michielssen

  • Tel Aviv University
  • University of Michigan, Ann Arbor
  • Ansoft Corporation
  • Commission B
  • University of Illinois Urbana-Champaign
  • IEEE
  • Center for Computational Electromagnetics
  • Real-Time Computing Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • International Union of Radio Scientists (URSI)
  • Center for Computational Electromagnetics
  • Department of Electrical Engineering and Computer Science
  • Electromagnetics Laboratory
  • Department of EE
  • Coordinated Science Laboratory
  • ANSYS, Inc.
  • Center of Computational Electromagnetics
  • Ctr. for Compl. Electromagnetics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Michigan, Ann Arbor
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Zheng Lou

  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Center for Computational Electromagnetics
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Computational Electromagnetics
  • Center of Computational Electromagnetics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kedi Zhang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

John L. Volakis

  • University of Michigan, Ann Arbor
  • Radiation Laboratory
  • Department of Electrical Engineering and Computer Science
  • Univ of Michigan, Radiat Lab, Ann
  • Real-Time Computing Laboratory
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor
  • University of Michigan Ann Arbor MI

External person

D. Jiao

  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Coordinated Science Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Feng Ling

  • Motorola
  • Nanjing University of Science and Technology
  • University of Illinois Urbana-Champaign
  • IEEE
  • Xpeedic Technology, Inc.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • School of Electronic and Optical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chao Fu Wang

  • National University of Singapore
  • Temasek Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ali E. Yilmaz

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical, and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Electromagnetics Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ming Feng Xue

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center of Computational Electromagnetics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kalyan C. Donepudi

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Center for Computational Electromagnetics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. M. Song

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Iowa State University
  • Department of Electrical Engineering
  • Center for Computational Electromagnetics
  • Center for Computational Electromagnetics
  • University of Kentucky
  • Department of Electrical, and Computer Engineering
  • University of Texas at Austin
  • Digital DNA Labs.
  • Motorola
  • Department of Electrical and Computer Engineering
  • IEEE
  • Michigan State University
  • Nanjing University
  • DEMACO, Inc.
  • Beijing Broadcasting College
  • Department of Microwave Engineering
  • College of Engineering
  • Electromagnetics Laboratory
  • Dept. of Electr. and Comput. Eng.
  • Center for Computational Electromagnetics
  • Center of Computational Electromagnetics
  • Ctr. for Compl. Electromagnetics
  • Electromagnetics Laboratory
  • Phi Kappa Phi
  • University of Illinois at Urbana-Champaign
  • Michigan State University
  • Iowa State University
  • Iowa State University
  • University of Illinois at Urbana-Champaign

External person

Jian Liu

  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zaiping Nie

  • University of Electronic Science and Technology of China
  • University of Illinois Urbana-Champaign
  • The University of Hong Kong
  • Department of Microwave Engineering
  • School of Electronic Engineering
  • Dept of Electrical Engineering
  • Department of Electrical and Electronic Engineering
  • Department of Electrical and Computer Engineering
  • School of Electronic Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Univ of Illinois, Dep of Electr
  • Electromagnetics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yujia Li

  • Cadence Design Systems
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Center of Computational Electromagnetics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tianjian Lu

  • Center for Computational Electromagnetics, Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Alphabet Inc.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rui Wang

  • University of Illinois Urbana-Champaign
  • Analog Devices, Inc.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Andrew D. Greenwood

  • University of Illinois Urbana-Champaign
  • Air Force Research Laboratory
  • Kirtland AFB
  • United States Air Force Academy
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Directed Energy Directorate
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Douglas J. Riley

  • Northrop Grumman
  • Sandia National Laboratories
  • University of Illinois Urbana-Champaign
  • Aerospace Research Laboratories
  • Electromagnetics Department
  • Computational Electromagnetic and Plasma Physics Department

External person

Jian Guan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Marc E. Kowalski

  • Pennie and Edmonds LLP
  • Stanford University
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Advanced Computations Department
  • Stanford Linear Accelerator Center
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Shih Hao Lee

  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

L. E.Rickard Petersson

  • University of Illinois Urbana-Champaign
  • IEEE
  • Ansoft Corporation
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Center for Computational Electromagnetics
  • ANSYS, Inc.
  • Center of Computational Electromagnetics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

X. Q. Sheng

  • City University of Hong Kong
  • University of Illinois Urbana-Champaign
  • Department of Electronic Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Computational Electromagnetics
  • Department of Electronic Engineering
  • Beijing Institute of Technology
  • CAS - Institute of Electronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Valdis V. Liepa

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor

External person

Edward K N Yung

  • Nanyang Technological University
  • City University
  • City University of Hong Kong
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electronic Engineering
  • School of Electrical and Electronic Engineering
  • Wireless Communications Res. Center
  • Sch. of Elec. and Electronic Eng.
  • Department of Electronic Engineering
  • Department of Chemical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yanan Liu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hongliang Li

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Resonant Inc.
  • University of Illinois at Urbana-Champaign

External person

Wang Yao

  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign
  • Center for Computational Electromagnetics
  • Grainger Center for Electric Machinery and Electromechanics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yunjia Zeng

  • University of Illinois Urbana-Champaign
  • Agency for Science, Technology and Research, Singapore
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Agency for Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Motorola
  • Cellular Research Laboratory
  • IEEE
  • University of Houston
  • Department of Electrical and Computer Engineering
  • Personal Communications Systems Research Laboratories
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. Shi

  • University of Illinois Urbana-Champaign
  • Xidian University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jin Kyu Byun

  • Electronics and Telecommunications Research Institute
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Center for Computational Electromagnetics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xianming Qing

  • Agency for Science, Technology and Research, Singapore
  • Agency for Science

External person

Zhi Ning Chen

  • National University of Singapore
  • Agency for Science, Technology and Research, Singapore
  • Department of Electrical and Computer Engineering

External person

Thomas Rylander

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Cai Cheng Lu

  • University of Kentucky
  • DEMACO, Inc.
  • IEEE
  • University of Illinois Urbana-Champaign
  • Beihang University
  • Center for Computational Electromagnetics
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Ctr. for Compl. Electromagnetics
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Center for Computational Electromagnetics
  • Electromagnetics Laboratory
  • Dept. of Electr. and Comput. Eng.
  • Center of Computational Electromagnetics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Davi Correia

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Center for Computational Electromagnetics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Ctr. for Compl. Electromagnetics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sean S. Ni

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Q. H. Liu

  • University of Illinois Urbana-Champaign
  • Schlumberger
  • Duke University
  • University of Electronic Science and Technology of China
  • New Mexico State University
  • Department of Electrical and Computer Engineering
  • Klipsch School of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Intel
  • The University of Hong Kong
  • Department of Electrical and Electronic Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • National University of Singapore
  • Department of Electrical and Computer Engineering
  • Kyocera Wireless Corp.
  • Ctr. for Compl. Electromagnetics
  • IEEE
  • Faculty of Engineering
  • Electromagnetics Laboratory
  • Department of Electrical and Electronic Engineering
  • Center for Computational Electromagnetics
  • United States Geological Survey
  • Department of Electrical Engineering and Computer Science Research Laboratory of Electronics
  • Massachusetts Institute of Technology
  • Electromagnetics Laboratory
  • Center of Computational Electromagnetics
  • Department of Electrical and Electronic Engineering
  • Center for Computational Electromagnetics
  • College of Engineering
  • University of Kentucky
  • Univ of Illinois, Dep of Electr
  • Department of Electrical and Electronic Engineering
  • DEMACO, Inc.
  • Department of Electrical, and Computer Engineering
  • University of Texas at Austin
  • Department of Electrical Engineering
  • ANSYS, Inc.
  • Ctr. for Computational Elec.Magnet.
  • Department of Electrical and Electronic Engineering
  • Center for Computational Electromagnetics
  • Electromagnetics Laboratory
  • Chevron Corporation
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical and Electronic Engineering
  • Department of Electronic and Computer Engineering
  • Hong Kong University of Science and Technology
  • Electrical and Computer Engineering
  • United States Air Force Institute of Technology
  • Department of Electrical and Computer Engineering
  • Schlumberaer-Doll Research
  • Nagasaki University
  • College of Engineering
  • F Lectromagnetics Laboratory
  • Center for Computational Electromagnetics
  • Department of EEE
  • Middle East Technical University
  • Ctr. for Compl. Electromagnetics
  • Department of Electrical and Electronic Engineering
  • Faculty of Engineering
  • Electromagnetics Department
  • Bilkent University
  • Princeton University
  • Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
  • Department of Electrical and Comouter Engineering
  • Electrical and Computer Engineering
  • Purdue University
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • 337 Everitt Lab.
  • Sclumberger-Doll Research
  • Purdue University
  • UNIVERSITY OF ILLINOIS
  • University of Illinois at Urbana-Champaign
  • College of Engineering
  • Ansoft Corporation
  • Massachusetts Institute of Technology

External person

Geng Chen

  • University of Illinois Urbana-Champaign
  • Jiangsu Normal University
  • Jiangsu Normal University3
  • Jiangsu Key Lab of Education Big Data Science and Engineering
  • School of Mathematics and Statistics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Computational Science and Engineering
  • Center of Computational Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Chinese Academy of Agricultural Sciences

External person

Eric A. Dunn

  • SAIC
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shung Wu Lee

  • DEMACO, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Joseph Kotulski

  • Sandia National Laboratories

External person

Matthys M. Botha

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaolei Li

  • Cadence Design Systems
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of SPB Analysis
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

G. Kang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Lei Zhao

  • Jiangsu Normal University
  • University of Illinois Urbana-Champaign
  • Jiangsu Normal University3
  • Southeast University, Nanjing
  • Jiangsu Key Lab of Education Big Data Science and Engineering
  • School of Mathematics and Statistics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Computational Science and Engineering
  • Stt. Key Lab. of Millimeter Waves
  • Center of Computational Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bertrand M. Hochwald

  • University of Notre Dame
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • University of Notre Dame
  • University of Notre Dame

External person

Steven Wong

  • Wright-Patterson AFB
  • Naval Research Laboratory
  • High Performance Technologies Inc.
  • High Performance Technologies, Inc.
  • Dynamics Research Corporation

External person

Charles S. Liang

  • Lockheed Martin
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Charles MacOn

  • Wright-Patterson AFB
  • Air Force Research Laboratory
  • Sensors Directorate

External person

Er Ping Li

  • College of Information Science and Electronic Engineering
  • Zhejiang University
  • College of Information Science and Electronic Engineering
  • ZJU-UIUC Institute

External person

A. Chatterjee

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor

External person

Mohammad R. Zunoubi

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Qiu Min

  • Zhejiang University

External person

Wenhua Yu

  • Jiangsu Normal University
  • Jiangsu Normal University3
  • Jiangsu Key Lab of Education Big Data Science and Engineering
  • Center for Computational Science and Engineering
  • School of Mathematics and Statistics

External person

Huan Ting Meng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ninglong Lu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. S. Shang

  • Wright-Patterson AFB
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Air Force Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Er Ping Li

  • Agency for Science, Technology and Research, Singapore
  • Zhejiang University
  • Department of Electromagnetics and Electronic System
  • Cyber Innovation Joint Research Center
  • College of Information Science and Electronic Engineering
  • Laboratory of Advanced Micro/Nano Electronic Devices and Smart System Applications of Zhejiang
  • Key Lab of AMESS
  • College of Information Science and Electronic Engineering
  • ZJU-UIUC Institute

External person

Jeffery D. Collins

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor

External person

Kaiyu Mao

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Daniel S. Weile

  • University of Delaware
  • University of Illinois Urbana-Champaign
  • IEEE
  • Dept. of Elec. and Comp. Engineering
  • Department of Electrical and Computer Engineering
  • Departmeqnt of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David J. Love

  • Purdue University

External person

Norma Riley

  • Northrop Grumman
  • Aerospace Research Laboratories

External person

Ahmad Raeisi Najafi

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Drexel University
  • Department of Mechanical Engineering and Mechanics
  • University of Illinois at Urbana-Champaign
  • Drexel University College of Engineering
  • University of Illinois at Urbana-Champaign

External person

Kyu Pyung Hwang

  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ken Wu

  • Alphabet Inc.

External person

Robert R. Arslanbekov

  • CFD Research Corporation
  • CFD Research Corporation

External person

D. X. Wang

  • Nanjing University of Science and Technology
  • Department of Electronic Engineering
  • Department of Communication Engineering

External person

Guo Xin Fan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Klipsch School of Electrical and Computer Engineering
  • New Mexico State University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • New Mexico State University College of Engineering

External person

Balasubramaniam Shanker

  • Iowa State University
  • Ansoft Corporation
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Biochemistry and Biophysics
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • ANSYS, Inc.
  • University of Illinois at Urbana-Champaign
  • Iowa State University
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • Iowa State University

External person

Vladimir Kolobov

  • CFD Research Corporation
  • CFD Research Corporation

External person

Ru Shan Chen

  • Nanjing University of Science and Technology
  • City University of Hong Kong
  • University of Illinois Urbana-Champaign
  • Wireless Communications Res. Center
  • Department of Electronic Engineering
  • Department of Electronic Engineering
  • Department of Communication Engineering
  • Department of Electronic Engineering

External person

Hong Wu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Extreme DA Corporation
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pouyan Karimi

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. H. Chan

  • City University of Hong Kong
  • University of Washington
  • Department of Electronic Engineering
  • Wireless Communications Res. Center
  • Department of Electrical Engineering
  • Department of Electronic Engineering
  • University of Washington

External person

Jin Ma

  • University of Electronic Science and Technology of China
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Microwave Engineering
  • Dept of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pierre Baldensperger

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

K. Aygün

  • Intel
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Mingyu Lu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. S. Leong

  • National University of Singapore
  • Department of Electrical and Computer Engineering

External person

Mueen Nawaz

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. T. Carolan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Thomas Perkins

  • Inc
  • Koninklijke Philips N.V.

External person

Xianyang Zhu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. Magin

  • University of Colorado Boulder
  • University of Illinois Urbana-Champaign
  • College of Education
  • California Institute of Technology
  • University of Illinois at Chicago
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Psychology
  • College of Medicine
  • Department of Electrical and Computer Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Chicago
  • University of Illinois at Urbana-Champaign

External person

Xin Yu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • U.S Research and Development Center
  • University of Illinois
  • U.S Research and Development Center @ Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Christopher M. Long

  • Purdue University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

H. T. Hui

  • Nanyang Technological University
  • School of Electrical and Electronic Engineering
  • Sch. of Elec. and Electronic Eng.

External person

C. L. Yu

  • Pacific Missile Test Center
  • Pacific Missile Test Cent

External person

Cheng Zhuo

  • College of Information Science and Electronic Engineering
  • Zhejiang University
  • Key Lab of AMESS

External person

Jinlong Zhu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Huazhong University of Science and Technology
  • State Key Laboratory Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hakan Baǧci

  • University of Michigan, Ann Arbor
  • University of Illinois Urbana-Champaign
  • Real-Time Computing Laboratory
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Michigan, Ann Arbor
  • University of Illinois at Urbana-Champaign

External person

L. W. Li

  • National University of Singapore
  • Department of Electrical and Computer Engineering

External person

G. Shen

  • University of Illinois Urbana-Champaign
  • University of Pittsburgh
  • Department of Radiology

External person

Bao Lin Nie

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chao Ping Lin

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Amir Arbabi

  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • University of Pennsylvania
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • T. J. Watson Laboratory of Applied Physics
  • Department of Physics and Astronomy, University of Pennsylvania
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Antonios V. Giannopoulos

  • Department of Electrical and Computer Engineering, University of Illinois
  • Microlink Devices
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • MicroLink Devices, Inc. Ltd
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

E. A. Forgy

  • University of Illinois Urbana-Champaign
  • Center of Computational Electromagnetics
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

W. C. Gibson

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Xin Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign

External person

L. E. Sun

  • 337 Everitt Lab.
  • University of Illinois Urbana-Champaign
  • Youngstown State University
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE
  • Electromagnetics Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE, Younstown State U
  • Dept ECE, Younstown State U
  • Dept ECE
  • Dept ECE
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

F. L. Teixeira

  • Ohio State University
  • Massachusetts Institute of Technology
  • Center for Computational Electromagnetics
  • University of Illinois Urbana-Champaign
  • Pontifícia Universidade Católica do Rio de Janeiro
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Research Laboratory of Electronics, Massachusetts Institute of Technology
  • Department of Electrical Engineering
  • Electromagnetics Laboratory
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Ctr. for Compl. Electromagnetics
  • Department of Electrical and Computer Engineering
  • Electromagnetics Laboratory
  • Dept. of Electr. and Comput. Eng.
  • Dept. of Elec. Eng. and Comp. Sci.
  • ElectroScience Laboratory and Department of Electrical and Computer Engineering
  • Center of Computational Electromagnetics
  • Dept. of Electr. and Comput. Eng.
  • University of Illinois at Urbana-Champaign
  • Ohio State University
  • Ohio State University
  • University of Illinois at Urbana-Champaign
  • Massachusetts Institute of Technology

External person

Shi Yun Zhou

  • College of Information Science and Electronic Engineering
  • Zhejiang University
  • Key Lab of AMESS

External person

Timothy Rozendal

  • Rozendal Associates, Inc.

External person

Chen To Tai

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor

External person

A. Arif Ergin

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Jilin Tan

  • Cadence Design Systems
  • PCB System Division
  • Cadence Design System, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of SPB Analysis
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Young Mo Kang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jiwei Qian

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhiyong Zeng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. Fay

  • University of Notre Dame
  • IEEE
  • University of Illinois Urbana-Champaign
  • Ctr. Compd. Semiconduct. M.
  • University of Ollinois
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Department of Electr. Engrg.
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Notre Dame
  • University of Notre Dame
  • University of Illinois at Urbana-Champaign

External person

S. Velamparambil

  • Ansoft Corporation
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Center for Computational Electromagnetics
  • Ctr. for Computational Elec.Magnet.
  • Ctr. for Compl. Electromagnetics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Ctr. for Computational Elec.Magnet.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xianyang Zhu

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xing Chang Wei

  • Zhejiang University
  • Agency for Science, Technology and Research, Singapore
  • College of Information Science and Electronic Engineering
  • Cyber Innovation Joint Research Center
  • Department of Electromagnetics and Electronic System

External person

Chris Kung

  • Naval Research Laboratory
  • Wright-Patterson AFB
  • High Performance Technologies Inc.
  • High Performance Technologies, Inc.

External person

Donald A. Streater

  • Lockheed Martin
  • Lockheed Martin Aeronautics Company

External person

R. S. Chen

  • Nanjing University of Science and Technology

External person

Xin Qing Sheng Edward

  • University of Illinois Urbana-Champaign
  • City University of Hong Kong
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electronic Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhiping Yang

  • Alphabet Inc.

External person

Chao Qian

  • Zhejiang University

External person

Da Gang Fang

  • University of Illinois at Urbana-Champaign

External person

K. D. Trott

  • Raytheon
  • Antenna and Microwave Department

External person

K. Gang

  • University of Illinois Urbana-Champaign
  • Center for Computational Electromagnetics
  • University of Illinois at Urbana-Champaign

External person

Jieting Chen

  • Zhejiang University

External person

Jeffery A. Berrie

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Jun Chen

  • University of Illinois at Urbana-Champaign

External person

Ming Yao Xia

  • City University of Hong Kong
  • Peking University
  • Wireless Communications Res. Center
  • School of Electronics Engineering and Computer Science

External person

J. Gong

  • University of Michigan, Ann Arbor

External person

D. Kennedy

  • University of Illinois Urbana-Champaign
  • ExxonMobil
  • Nanjing University
  • University of Michigan, Ann Arbor

External person

Ningning Feng

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alejandro Díaz-Morcillo

  • Universidad Politkcnica de Cartagena
  • Departamento de Tecnologias de la Informacion y las Comunicaciones
  • Technical University of Cartagena

External person

Chi H. Chan

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Arash Ebadi-Shahrivar

  • University of Notre Dame
  • Department of Electrical Engineering
  • University of Notre Dame
  • University of Notre Dame

External person

Nahil Sobh

  • Department of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Ctr. for Proc. Simulation and Design
  • Beckman Institute for Advanced Science and Technology
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Center for Nanoscale Science and Technology
  • Department of Theoretical Mechanics
  • Dept. of Theoretical/Appl. Mechanics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pai Yen Chen

  • University of Illinois at Chicago

External person

J. N. Sahalos

  • Aristotle University of Thessaloniki
  • Faculty of Science
  • Department of Physics

External person

P. S. Kool

  • National University of Singapore
  • Department of Electrical and Computer Engineering

External person

J. Song

  • Center for Computational Electromagnetics

External person

A. Alexanian

  • University of Michigan, Ann Arbor
  • University of Michigan Ann Arbor MI

External person

Jin Y. Kim

  • Alphabet Inc.

External person

P. Allilomes

  • Democritus University of Thrace
  • Department of Electrical Engineering

External person

Xiaozhen Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhixiang Fan

  • Zhejiang University

External person

Ling Feng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wei Hong

  • Southeast University, Nanjing
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Radio Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wenchao Chen

  • University of Florida
  • Department of Electrical and Computer Engineering
  • Zhejiang University
  • Now at ZJU-UIUC Institute
  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
  • College of Information Science and Electronic Engineering
  • ZJU-UIUC Institute
  • Key Lab. of Sci. and Technol. on Electromagnetic Environ. Effects and Electro-optical Engineering
  • College of Information Science and Electronic Engineering
  • College of Information Science and Electronic Engineering
  • Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
  • Logistical Engineering University China
  • ZJU-UIUC Institute
  • University of Florida

External person

L. C. Kempel

  • Michigan State University
  • Department of Electrical and Computer Engineering
  • Michigan State University

External person

Da Yi

  • Zhejiang University
  • College of Information Science and Electronic Engineering

External person

Haogang Wang

  • Zhejiang University

External person

Ali E. Ylmaz

  • University of Texas at Austin
  • Department of Electrical, and Computer Engineering

External person

Eric Michiclssen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Qingle Zhang

  • Department of Electronic Engineering
  • City University of Hong Kong

External person

P. J. Dimbylow

  • Health Protection Agency
  • UK Health Security Agency

External person

G. A. Kyriacou

  • Democritus University of Thrace
  • Department of Electrical Engineering

External person

Robert Kipp

  • DEMACO, Inc.

External person

Balam Willemsen

  • Resonant Inc.

External person

A. Amiri-Hezaveh

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hui Gan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of ECE, U. Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. C. Woo

  • NASA Ames Research Center

External person

Andrew G. Webb

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Bioengineering
  • Pennsylvania State University
  • Magnetic Resonance Microsensors
  • California Institute of Technology
  • Departments of Biochemistry, Chemistry
  • University of Colorado Boulder
  • Department of Psychology
  • Physikalisches Institut
  • University of Würzburg
  • University of Illinois at Chicago
  • Department of Bioengineering
  • C.J. Gorter Center for High Field MRI
  • Leiden University
  • Biomedical Magnetic Resonance Laboratory
  • Northeastern University
  • Barnett Inst. Chem./Biol. Analysis
  • Department of Biochemistry
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Chicago
  • University of Illinois
  • Carle Illinois Advanced Imaging Center
  • Carle Foundation Hospital
  • University of Illinois at Urbana-Champaign

External person

Danilo Erricolo

  • University of Illinois at Chicago
  • Department of Electrical and Computer Engineering
  • University of Illinois at Chicago

External person

Mark Kragalott

  • Naval Research Laboratory

External person

Miguel R. Castellanos

  • Purdue University

External person

Jun Ren

  • Department of Electrical Engineering
  • University of Notre Dame
  • University of Notre Dame
  • University of Notre Dame

External person

Yong Sheng Li

  • College of Information Science and Electronic Engineering
  • Zhejiang University
  • Key Lab of AMESS

External person

Youfei Zhang

  • Zhejiang University
  • ZJU-UIUC Institute

External person

Kai Ning Yung

  • City University of Hong Kong
  • Department of Electronic Engineering

External person

Bhuwan Singh

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Steven J. McKeown

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Christophe Caloz

  • Polytechnique Montreal
  • Ecole Polytechnique de Montreal

External person

Xian Zhang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Yale University

External person

W. C. Chew

  • University of Illinois Urbana-Champaign
  • Purdue University
  • University of Illinois at Urbana-Champaign
  • Purdue University
  • UNIVERSITY OF ILLINOIS
  • The University of Hong Kong
  • University of Illinois at Urbana-Champaign

External person

Francesco Andriulli

  • Polytechnic University of Turin

External person

Jie Zhang

  • Zhejiang University

External person

Shyh Kang Jeng

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jian Li

  • University of Electronic Science and Technology of China
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Centre for RFIC and System Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David Henn

  • DeposiTech.

External person

Feini Zhang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Julius Koskela

  • Resonant Inc.

External person

E. Vafiadis

  • Aristotle University of Thessaloniki
  • Faculty of Science
  • Department of Physics

External person

Jackson W. Massey

  • Resonant Inc.

External person

Z. Feng

  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Tianjin University
  • University of Illinois at Urbana-Champaign

External person

Hong Gan

  • University of Illinois at Urbana-Champaign

External person

Renjie Zhou

  • University of Illinois Urbana-Champaign
  • Massachusetts Institute of Technology
  • Chinese University of Hong Kong
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Biomedical Engineering
  • G. R. Harrison Spectroscopy Laboratory, Massachusetts Institute of Technology
  • Department of Electrical and Computer Engineering
  • George R. Harrison Spectroscopy Laboratory
  • Micro and Nanotechnology Lab
  • Laser Biomedical Research Center
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. Wang

  • University of Illinois Urbana-Champaign
  • Peking University
  • School of Electronics Engineering and Computer Science
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Fang Pin Xiang

  • Zhejiang University
  • Department of Information Science and Electronic Engineering

External person

Matthew P. Magill

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Myoung Joon Choi

  • Intel
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. Y. Chao

  • Synopsis Inc
  • NCTU
  • University of Illinois Urbana-Champaign
  • Electromagnetics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Synopsys Inc.
  • National Yang Ming Chiao Tung University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Li Li Yang

  • Zhejiang University
  • College of Information Science and Electronic Engineering

External person

Jiming M. Song Ieee

  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhang Cheng Hao

  • Southeast University, Nanjing
  • Stt. Key Lab. of Millimeter Waves

External person

Jian Li

  • University of Illinois Urbana-Champaign
  • University of Electronic Science and Technology of China
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chang Pao Chang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xi Lin

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Peking University
  • Beijing Academy of Quantum Information Sciences
  • University of Chinese Academy of Sciences
  • The Collaborative Innovation Center of Quantum Matter (CICQM)
  • The Collaborative Innovation Center of Quantum Matter (CICQM)
  • The Collaborative Innovation Center of Quantum Matter (CICQM)
  • University of Illinois at Urbana-Champaign

External person

Hongsheng Chen

  • Zhejiang University

External person

Srikumar Sandeep

  • Polytechnique Montreal
  • Ecole Polytechnique de Montreal

External person

Borja Peleato

  • Purdue University
  • School of Electrical and Computer Engineering
  • College of Engineering

External person

Babak Behnia

  • Agilent Technologies

External person

Jun Wang

  • Jiangsu Normal University
  • Southeast University, Nanjing
  • Center for Computational Science and Engineering
  • Stt. Key Lab. of Millimeter Waves
  • China Agricultural University

External person

Jing Ping Zhang

  • University of Illinois at Urbana-Champaign

External person

L. Z. Zhou

  • Peking University
  • School of Electronics Engineering and Computer Science

External person