Jianming Jin

Su Yan

• University of Electronic Science and Technology of China
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Microwave Engineering
• Department of Electrical and Computer Engineering
• Howard University
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Eric Michielssen

• Tel Aviv University
• University of Michigan, Ann Arbor
• Ansoft Corporation
• Commission B
• University of Illinois Urbana-Champaign
• IEEE
• Center for Computational Electromagnetics
• Real-Time Computing Laboratory
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• International Union of Radio Scientists (URSI)
• Center for Computational Electromagnetics
• Department of Electrical Engineering and Computer Science
• Electromagnetics Laboratory
• Department of EE
• Coordinated Science Laboratory
• ANSYS, Inc.
• Center of Computational Electromagnetics
• Ctr. for Compl. Electromagnetics
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• UIUC
• University of Illinois
• University of Illinois at Urbana-Champaign

External person

Zheng Lou

• University of Illinois Urbana-Champaign
• IEEE
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Center for Computational Electromagnetics
• Department of Electrical and Computer Engineering
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• Center for Computational Electromagnetics
• Center of Computational Electromagnetics
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Kedi Zhang

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

John L. Volakis

• University of Michigan, Ann Arbor
• Radiation Laboratory
• Department of Electrical Engineering and Computer Science
• Univ of Michigan, Radiat Lab, Ann
• Real-Time Computing Laboratory
• Department of Electrical Engineering and Computer Science

External person

D. Jiao

• University of Illinois Urbana-Champaign
• IEEE
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Coordinated Science Laboratory
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• University of Illinois at Urbana-Champaign
• University of Illinois
• University of Illinois at Urbana-Champaign

External person

Feng Ling

• Motorola
• Nanjing University of Science and Technology
• University of Illinois Urbana-Champaign
• IEEE
• Xpeedic Technology, Inc.
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• School of Electronic and Optical Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Ali E. Yilmaz

• University of Texas at Austin
• University of Illinois Urbana-Champaign
• IEEE
• Department of Electrical, and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Electromagnetics Laboratory
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Chao Fu Wang

• National University of Singapore
• Temasek Laboratory
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• IEEE
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Ming Feng Xue

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Center of Computational Electromagnetics
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Kalyan C. Donepudi

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Center for Computational Electromagnetics
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

J. M. Song

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Iowa State University
• Department of Electrical Engineering
• Center for Computational Electromagnetics
• Center for Computational Electromagnetics
• University of Kentucky
• Department of Electrical, and Computer Engineering
• University of Texas at Austin
• Digital DNA Labs.
• Motorola
• Department of Electrical and Computer Engineering
• IEEE
• Michigan State University
• Nanjing University
• DEMACO, Inc.
• Beijing Broadcasting College
• Department of Microwave Engineering
• College of Engineering
• Electromagnetics Laboratory
• Dept. of Electr. and Comput. Eng.
• Center for Computational Electromagnetics
• Center of Computational Electromagnetics
• Ctr. for Compl. Electromagnetics
• Electromagnetics Laboratory
• Phi Kappa Phi
• University of Illinois at Urbana-Champaign
• Michigan State University
• Iowa State University
• University of Illinois at Urbana-Champaign

External person

Jian Liu

• University of Illinois Urbana-Champaign
• IEEE
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Zaiping Nie

• University of Electronic Science and Technology of China
• University of Illinois Urbana-Champaign
• The University of Hong Kong
• Department of Microwave Engineering
• School of Electronic Engineering
• Dept of Electrical Engineering
• Department of Electrical and Electronic Engineering
• Department of Electrical and Computer Engineering
• School of Electronic Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Univ of Illinois, Dep of Electr
• Electromagnetics Laboratory
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Yujia Li

• Cadence Design Systems
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Center of Computational Electromagnetics
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Tianjian Lu

• Center for Computational Electromagnetics, Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign
• University of Illinois Urbana-Champaign
• Alphabet Inc.
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Rui Wang

• University of Illinois Urbana-Champaign
• Analog Devices, Inc.
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Andrew D. Greenwood

• University of Illinois Urbana-Champaign
• Air Force Research Laboratory
• Kirtland AFB
• United States Air Force Academy
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Directed Energy Directorate
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Douglas J. Riley

• Northrop Grumman
• Sandia National Laboratories
• University of Illinois Urbana-Champaign
• Aerospace Research Laboratories
• Electromagnetics Department
• Computational Electromagnetic and Plasma Physics Department

External person

Jian Guan

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Marc E. Kowalski

• Pennie and Edmonds LLP
• Stanford University
• University of Illinois Urbana-Champaign
• IEEE
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Advanced Computations Department
• Stanford Linear Accelerator Center
• University of Illinois at Urbana-Champaign
• University of Illinois
• University of Illinois at Urbana-Champaign

External person

Shih Hao Lee

• University of Illinois Urbana-Champaign
• IEEE
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

L. E.Rickard Petersson

• University of Illinois Urbana-Champaign
• IEEE
• Ansoft Corporation
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Beckman Institute for Advanced Science and Technology
• Center for Computational Electromagnetics
• ANSYS, Inc.
• Center of Computational Electromagnetics
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Yanan Liu

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

X. Q. Sheng

• City University of Hong Kong
• University of Illinois Urbana-Champaign
• Department of Electronic Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Center for Computational Electromagnetics
• Department of Electronic Engineering
• Beijing Institute of Technology
• CAS - Institute of Electronics
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Valdis V. Liepa

• University of Michigan, Ann Arbor
• Department of Electrical Engineering and Computer Science

External person

Hongliang Li

• University of Illinois Urbana-Champaign
• University of Illinois at Urbana-Champaign
• Resonant Inc.
• University of Illinois at Urbana-Champaign
• Inc.
• Inc.

External person

Edward K N Yung

• Nanyang Technological University
• City University
• City University of Hong Kong
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electronic Engineering
• School of Electrical and Electronic Engineering
• Wireless Communications Res. Center
• Sch. of Elec. and Electronic Eng.
• Department of Electronic Engineering
• Department of Chemical Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Wang Yao

• Qualcomm Incorporated
• University of Illinois Urbana-Champaign
• Center for Computational Electromagnetics
• Grainger Center for Electric Machinery and Electromechanics
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Yunjia Zeng

• University of Illinois Urbana-Champaign
• Agency for Science, Technology and Research, Singapore
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Agency for Science
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Y. Shi

• University of Illinois Urbana-Champaign
• Xidian University
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Jin Kyu Byun

• Electronics and Telecommunications Research Institute
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Center for Computational Electromagnetics
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Xianming Qing

• Agency for Science, Technology and Research, Singapore
• Agency for Science

External person

Zhi Ning Chen

• National University of Singapore
• Agency for Science, Technology and Research, Singapore
• Department of Electrical and Computer Engineering

External person

Thomas Rylander

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

J. Chen

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Motorola
• Cellular Research Laboratory
• IEEE
• University of Houston
• Department of Electrical and Computer Engineering
• Personal Communications Systems Research Laboratories
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Cai Cheng Lu

• University of Kentucky
• DEMACO, Inc.
• IEEE
• University of Illinois Urbana-Champaign
• Beihang University
• Center for Computational Electromagnetics
• Department of Electrical and Computer Engineering
• Department of Electrical Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Ctr. for Compl. Electromagnetics
• Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
• Center for Computational Electromagnetics
• Electromagnetics Laboratory
• Dept. of Electr. and Comput. Eng.
• Center of Computational Electromagnetics
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• Department of Electrical Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Davi Correia

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Center for Computational Electromagnetics
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• Ctr. for Compl. Electromagnetics
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Sean S. Ni

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Q. H. Liu

• University of Illinois Urbana-Champaign
• Schlumberger
• Duke University
• University of Electronic Science and Technology of China
• New Mexico State University
• Department of Electrical and Computer Engineering
• Klipsch School of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Intel
• The University of Hong Kong
• Department of Electrical and Electronic Engineering
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• National University of Singapore
• Department of Electrical and Computer Engineering
• Kyocera Wireless Corp.
• Ctr. for Compl. Electromagnetics
• IEEE
• Faculty of Engineering
• Electromagnetics Laboratory
• Department of Electrical and Electronic Engineering
• Center for Computational Electromagnetics
• United States Geological Survey
• Department of Electrical Engineering and Computer Science Research Laboratory of Electronics
• Massachusetts Institute of Technology
• Electromagnetics Laboratory
• Center of Computational Electromagnetics
• Department of Electrical and Electronic Engineering
• Center for Computational Electromagnetics
• College of Engineering
• University of Kentucky
• Univ of Illinois, Dep of Electr
• Department of Electrical and Electronic Engineering
• DEMACO, Inc.
• Department of Electrical, and Computer Engineering
• University of Texas at Austin
• Department of Electrical Engineering
• ANSYS, Inc.
• Ctr. for Computational Elec.Magnet.
• Department of Electrical and Electronic Engineering
• Center for Computational Electromagnetics
• Electromagnetics Laboratory
• Chevron Corporation
• Department of Electrical Engineering and Computer Science
• Department of Electrical and Electronic Engineering
• Department of Electronic and Computer Engineering
• Hong Kong University of Science and Technology
• Electrical and Computer Engineering
• United States Air Force Institute of Technology
• Department of Electrical and Computer Engineering
• Schlumberaer-Doll Research
• Nagasaki University
• College of Engineering
• F Lectromagnetics Laboratory
• Center for Computational Electromagnetics
• Department of EEE
• Middle East Technical University
• Ctr. for Compl. Electromagnetics
• Department of Electrical and Electronic Engineering
• Faculty of Engineering
• Electromagnetics Department
• Bilkent University
• Princeton University
• Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
• Department of Electrical and Comouter Engineering
• Electrical and Computer Engineering
• Purdue University
• University of Illinois at Urbana-Champaign
• University of Illinois
• 337 Everitt Lab.
• Sclumberger-Doll Research
• Purdue University
• UNIVERSITY OF ILLINOIS
• University of Illinois at Urbana-Champaign
• Ansoft Corporation

External person

Geng Chen

• University of Illinois Urbana-Champaign
• Jiangsu Normal University
• Jiangsu Normal University3
• Jiangsu Key Lab of Education Big Data Science and Engineering
• School of Mathematics and Statistics
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Center for Computational Science and Engineering
• Center of Computational Science and Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign
• Chinese Academy of Agricultural Sciences

External person

Eric A. Dunn

• SAIC
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Shung Wu Lee

• DEMACO, Inc.
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Joseph Kotulski

• Sandia National Laboratories

External person

Xiaolei Li

• Cadence Design Systems
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of SPB Analysis
• University of Illinois at Urbana-Champaign
• University of Illinois
• University of Illinois at Urbana-Champaign

External person

G. Kang

• University of Illinois Urbana-Champaign
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Lei Zhao

• Jiangsu Normal University
• University of Illinois Urbana-Champaign
• Jiangsu Normal University3
• Southeast University, Nanjing
• Jiangsu Key Lab of Education Big Data Science and Engineering
• School of Mathematics and Statistics
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Center for Computational Science and Engineering
• Stt. Key Lab. of Millimeter Waves
• Center of Computational Science and Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Bertrand M. Hochwald

• University of Notre Dame
• Department of Electrical and Computer Engineering
• Department of Electrical Engineering
• University of Notre Dame

External person

Steven Wong

• Wright-Patterson AFB
• Naval Research Laboratory
• High Performance Technologies Inc.
• High Performance Technologies, Inc.
• Dynamics Research Corporation

External person

Charles S. Liang

• Lockheed Martin
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Charles MacOn

• Wright-Patterson AFB
• Air Force Research Laboratory
• Sensors Directorate

External person

Er Ping Li

• College of Information Science and Electronic Engineering
• Zhejiang University
• College of Information Science and Electronic Engineering
• ZJU-UIUC Institute

External person

A. Chatterjee

• University of Michigan, Ann Arbor
• Department of Electrical Engineering and Computer Science

External person

Mohammad R. Zunoubi

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Qiu Min

• Zhejiang University

External person

Wenhua Yu

• Jiangsu Normal University
• Jiangsu Normal University3
• Jiangsu Key Lab of Education Big Data Science and Engineering
• Center for Computational Science and Engineering
• School of Mathematics and Statistics

External person

Matthys M. Botha

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Daniel S. Weile

• University of Delaware
• University of Illinois Urbana-Champaign
• IEEE
• Dept. of Elec. and Comp. Engineering
• Department of Electrical and Computer Engineering
• Departmeqnt of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Huan Ting Meng

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Ninglong Lu

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

J. S. Shang

• Wright-Patterson AFB
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Air Force Research Laboratory
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Doug Jachowski

• RESON Inc

External person

Er Ping Li

• Agency for Science, Technology and Research, Singapore
• Zhejiang University
• Department of Electromagnetics and Electronic System
• Cyber Innovation Joint Research Center
• College of Information Science and Electronic Engineering
• Laboratory of Advanced Micro/Nano Electronic Devices and Smart System Applications of Zhejiang
• Key Lab of AMESS
• College of Information Science and Electronic Engineering
• ZJU-UIUC Institute

External person

Jeffery D. Collins

• University of Michigan, Ann Arbor
• Department of Electrical Engineering and Computer Science

External person

Kaiyu Mao

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

David J. Love

• Purdue University

External person

Norma Riley

• Northrop Grumman
• Aerospace Research Laboratories

External person

Ahmad Raeisi Najafi

• University of Illinois Urbana-Champaign
• Department of Mechanical Science and Engineering
• Beckman Institute for Advanced Science and Technology
• Drexel University
• Department of Mechanical Engineering and Mechanics
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Kyu Pyung Hwang

• University of Illinois Urbana-Champaign
• IEEE
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Ken Wu

• Alphabet Inc.

External person

Robert R. Arslanbekov

• CFD Research Corporation
• CFD Research Corporation

External person

Robert B. Hammond

• RESON Inc

External person

D. X. Wang

• Nanjing University of Science and Technology
• Department of Electronic Engineering
• Department of Communication Engineering

External person

Guo Xin Fan

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Klipsch School of Electrical and Computer Engineering
• New Mexico State University
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign
• New Mexico State University College of Engineering

External person

Balasubramaniam Shanker

• Iowa State University
• Ansoft Corporation
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Dept. of Biochemistry and Biophysics
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• ANSYS, Inc.
• University of Illinois at Urbana-Champaign
• Iowa State University
• University of Illinois
• University of Illinois at Urbana-Champaign

External person

Vladimir Kolobov

• CFD Research Corporation
• CFD Research Corporation

External person

Ru Shan Chen

• Nanjing University of Science and Technology
• City University of Hong Kong
• University of Illinois Urbana-Champaign
• Wireless Communications Res. Center
• Department of Electronic Engineering
• Department of Electronic Engineering
• Department of Communication Engineering
• Department of Electronic Engineering

External person

Hong Wu

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Extreme DA Corporation
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Pouyan Karimi

• University of Illinois Urbana-Champaign
• Department of Mechanical Science and Engineering
• Department of Mechanical Science and Engineering, University of Illinois
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

C. H. Chan

• City University of Hong Kong
• University of Washington
• Department of Electronic Engineering
• Wireless Communications Res. Center
• Department of Electrical Engineering
• Department of Electronic Engineering

External person

Jin Ma

• University of Electronic Science and Technology of China
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Microwave Engineering
• Dept of Electrical Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Pierre Baldensperger

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois
• University of Illinois at Urbana-Champaign

External person

K. Aygün

• Intel
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign

External person

Mingyu Lu

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

M. S. Leong

• National University of Singapore
• Department of Electrical and Computer Engineering

External person

Mueen Nawaz

• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

S. T. Carolan

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Thomas Perkins

• Inc
• Koninklijke Philips N.V.

External person

Xianyang Zhu

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

R. Magin

• University of Colorado Boulder
• University of Illinois Urbana-Champaign
• College of Education
• California Institute of Technology
• University of Illinois at Chicago
• Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Psychology
• College of Medicine
• Department of Electrical and Computer Engineering
• Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• Department of Electrical Engineering
• University of Illinois at Urbana-Champaign
• California Institute of Technology
• University of Illinois at Chicago
• University of Illinois at Urbana-Champaign

External person

Xin Yu

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Micro and Nanotechnology Lab
• University of Illinois at Urbana-Champaign
• U.S Research and Development Center
• University of Illinois
• U.S Research and Development Center @ Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Christopher M. Long

• Purdue University
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois
• University of Illinois at Urbana-Champaign

External person

H. T. Hui

• Nanyang Technological University
• School of Electrical and Electronic Engineering
• Sch. of Elec. and Electronic Eng.

External person

C. L. Yu

• Pacific Missile Test Center
• Pacific Missile Test Cent

External person

Cheng Zhuo

• College of Information Science and Electronic Engineering
• Zhejiang University
• Key Lab of AMESS

External person

Jinlong Zhu

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Huazhong University of Science and Technology
• State Key Laboratory Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Hakan Baǧci

• University of Michigan, Ann Arbor
• University of Illinois Urbana-Champaign
• Real-Time Computing Laboratory
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

L. W. Li

• National University of Singapore
• Department of Electrical and Computer Engineering

External person

G. Shen

• University of Illinois Urbana-Champaign
• University of Pittsburgh
• Department of Radiology

External person

Bao Lin Nie

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Chao Ping Lin

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Amir Arbabi

• California Institute of Technology
• University of Illinois Urbana-Champaign
• University of Pennsylvania
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• T. J. Watson Laboratory of Applied Physics
• Department of Physics and Astronomy, University of Pennsylvania
• University of Illinois at Urbana-Champaign
• California Institute of Technology
• University of Illinois at Urbana-Champaign

External person

Antonios V. Giannopoulos

• Department of Electrical and Computer Engineering, University of Illinois
• Microlink Devices
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• MicroLink Devices, Inc. Ltd
• Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois
• University of Illinois at Urbana-Champaign

External person

E. A. Forgy

• University of Illinois Urbana-Champaign
• Center of Computational Electromagnetics
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

W. C. Gibson

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Xin Wang

• University of Illinois Urbana-Champaign
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• University of Illinois at Urbana-Champaign

External person

F. L. Teixeira

• Ohio State University
• Massachusetts Institute of Technology
• Center for Computational Electromagnetics
• University of Illinois Urbana-Champaign
• Pontifícia Universidade Católica do Rio de Janeiro
• IEEE
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Research Laboratory of Electronics, Massachusetts Institute of Technology
• Department of Electrical Engineering
• Electromagnetics Laboratory
• Department of Electrical Engineering
• Department of Electrical and Computer Engineering
• Ctr. for Compl. Electromagnetics
• Department of Electrical and Computer Engineering
• Electromagnetics Laboratory
• Dept. of Electr. and Comput. Eng.
• Dept. of Elec. Eng. and Comp. Sci.
• ElectroScience Laboratory and Department of Electrical and Computer Engineering
• Center of Computational Electromagnetics
• Dept. of Electr. and Comput. Eng.
• University of Illinois at Urbana-Champaign
• Ohio State University
• University of Illinois at Urbana-Champaign

External person

Shi Yun Zhou

• College of Information Science and Electronic Engineering
• Zhejiang University
• Key Lab of AMESS

External person

Timothy Rozendal

• Rozendal Associates, Inc.

External person

Chen To Tai

• University of Michigan, Ann Arbor
• Department of Electrical Engineering and Computer Science

External person

L. E. Sun

• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

A. Arif Ergin

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois
• University of Illinois at Urbana-Champaign

External person

Young Mo Kang

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Jiwei Qian

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Zhiyong Zeng

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

P. Fay

• University of Notre Dame
• IEEE
• University of Illinois Urbana-Champaign
• Ctr. Compd. Semiconduct. M.
• University of Ollinois
• Department of Electrical Engineering
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• Center for Compound Semiconductor Microelectronics
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Center for Compound Semiconductor Microelectronics
• Department of Electrical and Computer Engineering
• Department of Electr. Engrg.
• Department of Electrical Engineering
• Department of Electrical Engineering
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois
• University of Notre Dame
• University of Illinois at Urbana-Champaign

External person

S. Velamparambil

• Ansoft Corporation
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Center for Computational Electromagnetics
• Ctr. for Computational Elec.Magnet.
• Ctr. for Compl. Electromagnetics
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Ctr. for Computational Elec.Magnet.
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Xianyang Zhu

• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Xing Chang Wei

• Zhejiang University
• Agency for Science, Technology and Research, Singapore
• College of Information Science and Electronic Engineering
• Cyber Innovation Joint Research Center
• Department of Electromagnetics and Electronic System

External person

Chris Kung

• Naval Research Laboratory
• Wright-Patterson AFB
• High Performance Technologies Inc.
• High Performance Technologies, Inc.

External person

Donald A. Streater

• Lockheed Martin
• Lockheed Martin Aeronautics Company

External person

R. S. Chen

• Nanjing University of Science and Technology

External person

Xin Qing Sheng Edward

• University of Illinois Urbana-Champaign
• City University of Hong Kong
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electronic Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Eric D. Branch

External person

Zhiping Yang

• Alphabet Inc.

External person

Chao Qian

• Zhejiang University

External person

Da Gang Fang

• University of Illinois at Urbana-Champaign

External person

K. D. Trott

• Raytheon
• Antenna and Microwave Department

External person

K. Gang

• University of Illinois Urbana-Champaign
• Center for Computational Electromagnetics
• University of Illinois at Urbana-Champaign

External person

Jieting Chen

• Zhejiang University

External person

Jeffery A. Berrie

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign

External person

Jun Chen

• University of Illinois at Urbana-Champaign

External person

Ming Yao Xia

• City University of Hong Kong
• Peking University
• Wireless Communications Res. Center
• School of Electronics Engineering and Computer Science

External person

J. Gong

• University of Michigan, Ann Arbor

External person

D. Kennedy

• University of Illinois Urbana-Champaign
• ExxonMobil
• Nanjing University
• University of Michigan, Ann Arbor

External person

Ningning Feng

• University of Illinois Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Alejandro Díaz-Morcillo

• Universidad Politkcnica de Cartagena
• Departamento de Tecnologias de la Informacion y las Comunicaciones
• Technical University of Cartagena

External person

Chi H. Chan

• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Arash Ebadi-Shahrivar

• University of Notre Dame
• Department of Electrical Engineering
• University of Notre Dame

External person

Nahil Sobh

• Department of Mechanical Science and Engineering
• University of Illinois Urbana-Champaign
• Ctr. for Proc. Simulation and Design
• Beckman Institute for Advanced Science and Technology
• Civil and Environmental Engineering, University of Illinois Urbana-Champaign
• Center for Nanoscale Science and Technology
• Department of Theoretical Mechanics
• Dept. of Theoretical/Appl. Mechanics
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Pai Yen Chen

• University of Illinois at Chicago

External person

J. N. Sahalos

• Aristotle University of Thessaloniki
• Faculty of Science
• Department of Physics

External person

P. S. Kool

• National University of Singapore
• Department of Electrical and Computer Engineering

External person

J. Song

• Center for Computational Electromagnetics

External person

A. Alexanian

• University of Michigan, Ann Arbor

External person

Jin Y. Kim

• Alphabet Inc.

External person

P. Allilomes

• Democritus University of Thrace
• Department of Electrical Engineering

External person

Xiaozhen Wang

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Zhixiang Fan

• Zhejiang University

External person

Ling Feng

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Wei Hong

• Southeast University, Nanjing
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Radio Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Wenchao Chen

• University of Florida
• Department of Electrical and Computer Engineering
• Zhejiang University
• Now at ZJU-UIUC Institute
• Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
• College of Information Science and Electronic Engineering
• ZJU-UIUC Institute
• Key Lab. of Sci. and Technol. on Electromagnetic Environ. Effects and Electro-optical Engineering
• College of Information Science and Electronic Engineering
• College of Information Science and Electronic Engineering
• Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
• Logistical Engineering University China
• ZJU-UIUC Institute
• PLA University of Science and Technology

External person

Richard Silver

• RESON Inc

External person

L. C. Kempel

• Michigan State University
• Department of Electrical and Computer Engineering
• Michigan State University

External person

Da Yi

• Zhejiang University
• College of Information Science and Electronic Engineering

External person

Haogang Wang

• Zhejiang University

External person

Ali E. Ylmaz

• University of Texas at Austin
• Department of Electrical, and Computer Engineering

External person

Eric Michiclssen

• University of Illinois Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Qingle Zhang

• Department of Electronic Engineering
• City University of Hong Kong

External person

Ji Chen

• University of Houston
• University of Illinois at Urbana-Champaign
• Motorola
• University of Illinois at Urbana-Champaign
• IEEE

External person

P. J. Dimbylow

• Health Protection Agency
• UK Health Security Agency

External person

G. A. Kyriacou

• Democritus University of Thrace
• Department of Electrical Engineering

External person

Robert Kipp

• DEMACO, Inc.

External person

Balam Willemsen

• Resonant Inc.

External person

A. Amiri-Hezaveh

• University of Illinois Urbana-Champaign
• Department of Mechanical Science and Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Hui Gan

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering
• Department of ECE, U. Illinois Urbana-Champaign
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

A. C. Woo

• NASA Ames Research Center

External person

Pang Shyan Kooi

External person

Andrew G. Webb

• University of Illinois Urbana-Champaign
• Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• IEEE
• Department of Electrical and Computer Engineering
• Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
• Department of Bioengineering
• Pennsylvania State University
• Magnetic Resonance Microsensors
• California Institute of Technology
• Departments of Biochemistry, Chemistry
• University of Colorado Boulder
• Department of Psychology
• Physikalisches Institut
• University of Würzburg
• University of Illinois at Chicago
• Department of Bioengineering
• C.J. Gorter Center for High Field MRI
• Leiden University
• Biomedical Magnetic Resonance Laboratory
• Northeastern University
• Barnett Inst. Chem./Biol. Analysis
• Department of Biochemistry
• University of Illinois at Urbana-Champaign
• California Institute of Technology
• University of Illinois at Chicago
• University of Illinois
• Carle Illinois Advanced Imaging Center
• Carle Foundation Hospital
• University of Illinois at Urbana-Champaign

External person

Danilo Erricolo

• University of Illinois at Chicago
• Department of Electrical and Computer Engineering
• University of Illinois at Chicago

External person

Mark Kragalott

• Naval Research Laboratory

External person

Miguel R. Castellanos

• Purdue University

External person

Jun Ren

• Department of Electrical Engineering
• University of Notre Dame
• University of Notre Dame

External person

Amir Hajiaboli

• RESON Inc

External person

Yong Sheng Li

• College of Information Science and Electronic Engineering
• Zhejiang University
• Key Lab of AMESS

External person

Youfei Zhang

• Zhejiang University
• ZJU-UIUC Institute

External person

Kai Ning Yung

• City University of Hong Kong
• Department of Electronic Engineering

External person

Bhuwan Singh

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Steven J. McKeown

• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Christophe Caloz

• Polytechnique Montreal
• Ecole Polytechnique de Montreal

External person

Xian Zhang

• University of Illinois Urbana-Champaign
• Department of Mechanical Science and Engineering
• University of Illinois at Urbana-Champaign
• Yale University
• University of Illinois at Urbana-Champaign

External person

W. C. Chew

• University of Illinois Urbana-Champaign
• Purdue University
• University of Illinois at Urbana-Champaign
• Purdue University
• UNIVERSITY OF ILLINOIS
• The University of Hong Kong
• University of Illinois at Urbana-Champaign

External person

Francesco Andriulli

• Polytechnic University of Turin

External person

Jie Zhang

• Zhejiang University

External person

Shyh Kang Jeng

• University of Illinois Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Jian Li

• University of Electronic Science and Technology of China
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Centre for RFIC and System Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

David Henn

• DeposiTech.

External person

Feini Zhang

• University of Illinois Urbana-Champaign
• Department of Mechanical Science and Engineering
• University of Illinois at Urbana-Champaign

External person

Julius Koskela

• Resonant Inc.

External person

Jilin Tan

• Cadence Design Systems
• PCB System Division
• Cadence Design System, Inc.
• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of SPB Analysis
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

E. Vafiadis

• Aristotle University of Thessaloniki
• Faculty of Science
• Department of Physics

External person

Jackson W. Massey

• Resonant Inc.

External person

Z. Feng

• Massachusetts Institute of Technology
• University of Illinois Urbana-Champaign
• IEEE
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
• University of Illinois at Urbana-Champaign
• Tianjin University
• University of Illinois at Urbana-Champaign

External person

Hong Gan

• University of Illinois at Urbana-Champaign

External person

Renjie Zhou

• University of Illinois Urbana-Champaign
• Massachusetts Institute of Technology
• Chinese University of Hong Kong
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Biomedical Engineering
• G. R. Harrison Spectroscopy Laboratory, Massachusetts Institute of Technology
• Department of Electrical and Computer Engineering
• George R. Harrison Spectroscopy Laboratory
• Micro and Nanotechnology Lab
• Laser Biomedical Research Center
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

P. Wang

• University of Illinois Urbana-Champaign
• Peking University
• School of Electronics Engineering and Computer Science
• Department of Electrical and Computer Engineering
• University of Illinois at Urbana-Champaign
• University of Illinois
• University of Illinois at Urbana-Champaign

External person

Fang Pin Xiang

• Zhejiang University
• Department of Information Science and Electronic Engineering

External person

Matthew P. Magill

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Myoung Joon Choi

• Intel
• University of Illinois Urbana-Champaign
• IEEE
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

H. Y. Chao

• Synopsis Inc
• NCTU
• University of Illinois Urbana-Champaign
• Electromagnetics Laboratory
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• Department of Electrical and Computer Engineering
• Synopsys Inc.
• National Yang Ming Chiao Tung University
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Li Li Yang

• Zhejiang University
• College of Information Science and Electronic Engineering

External person

Jiming M. Song Ieee

• University of Illinois Urbana-Champaign
• IEEE
• Department of Electrical and Computer Engineering
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Zhang Cheng Hao

• Southeast University, Nanjing
• Stt. Key Lab. of Millimeter Waves

External person

Juin Tan

• Cadence Design Systems

External person

Jian Li

• University of Illinois Urbana-Champaign
• University of Electronic Science and Technology of China
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Chang Pao Chang

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• University of Illinois at Urbana-Champaign

External person

Xi Lin

• University of Illinois Urbana-Champaign
• Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
• University of Illinois at Urbana-Champaign
• Peking University
• Beijing Academy of Quantum Information Sciences
• University of Chinese Academy of Sciences
• The Collaborative Innovation Center of Quantum Matter (CICQM)
• The Collaborative Innovation Center of Quantum Matter (CICQM)
• The Collaborative Innovation Center of Quantum Matter (CICQM)
• University of Illinois at Urbana-Champaign

External person

Hongsheng Chen

• Zhejiang University

External person

Srikumar Sandeep

• Polytechnique Montreal
• Ecole Polytechnique de Montreal

External person

Borja Peleato

• Purdue University
• School of Electrical and Computer Engineering

External person

Babak Behnia

• Agilent Technologies

External person

Jun Wang

• Jiangsu Normal University
• Southeast University, Nanjing
• Center for Computational Science and Engineering
• Stt. Key Lab. of Millimeter Waves
• China Agricultural University

External person

Jing Ping Zhang

• University of Illinois at Urbana-Champaign

External person

L. Z. Zhou

• Peking University
• School of Electronics Engineering and Computer Science

External person