Network

Ralph G Nuzzo

Person: Academic

David G Cahill

Person: Academic

Daniel Philip Shoemaker

Person: Academic

Andrew A Gewirth

Person: Academic

Elif Ertekin

Person: Academic

Jeffrey S Moore

Person: Academic

Yi Lu

  • Chemistry - Jay and Ann Schenck Professor Emeritus

Person: Academic

Placid Mathew Ferreira

Person: Academic

William Paul King

Person: Academic

Philip T Krein

Person: Academic

J. C. Spence

  • Arizona State University
  • Department of Physics
  • Department of Physics, Arizona State University
  • Max-Planck-Institut fur Metallforschung
  • Peking University
  • Alcatel-Lucent
  • Max Planck Institute for Intelligent Systems
  • Lawrence Berkeley National Laboratory
  • Department of Physics and Astronomy
  • Key Laboratory for Physics and Chemistry of Nanodevices

External person

A. B. Shah

  • Engineering University of Illinois
  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Depts. of Mat. Sci. and Eng.
  • Center for Microanalysis of Materials
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Center for Microanalysis of Materials
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jian Guo Wen

  • Argonne National Laboratory
  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Electron Microscopy Center
  • Materials Science Division, Argonne National Laboratory
  • Center for Microanalysis of Materials
  • Electron Microscopy Center
  • Materials Science Division
  • Department of Chemistry
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Electron Microscopy Center
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

Wenpei Gao

  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • University of California at Irvine
  • Department of Chemical Engineering and Materials Science
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of California at Irvine
  • University of Illinois at Urbana-Champaign
  • Univ. of California Irvine

External person

A. Bhattacharya

  • Argonne National Laboratory
  • Harvard University
  • University of British Columbia
  • Electron Microscopy Center
  • Materials Science Division, Argonne National Laboratory
  • Department of Physics
  • Department of Physics and Astronomy
  • Material Science Division
  • Center for Nanoscale Materials, Argonne National Laboratory, Bldg 440
  • Materials Science Division
  • Materials Science Division, Argonne National Laboratory
  • Materials Science Division
  • The University of Chicago
  • Argonne National Laboratory
  • Harvard University

External person

Haw Wen Hsiao

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kyou Hyun Kim

  • University of Illinois Urbana-Champaign
  • Korea Institute of Industrial Technology
  • Dept. of Mat. Sci. and Engineering
  • Advanced Process and Materials R and BD Group
  • Seitz Materials Research Laboratory
  • Advanced Process and Materials RandD Group
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

B. Jiang

  • Arizona State University
  • Department of Physics and Astronomy
  • Department of Physics, Arizona State University
  • Department of Physics
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Saran Pidaparthy

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

Hefei Hu

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • Department of Physics
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Tao

  • Brookhaven National Laboratory
  • Oak Ridge National Laboratory
  • University of Illinois Urbana-Champaign
  • 3M Materials Laboratory
  • Quantum Condensed Matter Division
  • Condensed Matter Physics
  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Department of Materials Science and Engineering
  • Department of Physics and Astronomy
  • Arizona State University
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Condensed Matter Physics and Materials Science
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ji Hwan Kwon

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Korea Research Institute of Standards and Science
  • Division of Industrial Metrology
  • Center for Correlated Electron Systems
  • Institute for Basic Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Zhang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Intel
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

B. Q. Li

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yifei Meng

  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yu Tsun Shao

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Cornell University
  • University of Southern California
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, University of Southern California

External person

R. Yuan

  • University of Illinois Urbana-Champaign
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Intel
  • University of Illinois at Urbana-Champaign

External person

Miyoung Kim

  • Department of Materials Science & Engineering and RIAM
  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University
  • Institute for Basic Science
  • Analytical Engineering Center
  • Samsung
  • Department of Physics and Astronomy
  • Arizona State University
  • Department of Materials Science and Engineering
  • Department of Physics
  • Department of Materials Science and Engineering
  • Samsung Advanced Institute of Technology
  • Department of Physics, Arizona State University

External person

Xiaofang Zhai

  • USTC
  • Synergetic Innovation Center of Quantum Information and Quantum Physics, University of Science and Technology of China
  • University of Illinois Urbana-Champaign
  • Department of Physics University of Illinois
  • University of Science and Technology of China
  • University of Science and Technology of China
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Hefei National Laboratory for Physical Sciences at the Microscale, Department of Physics, University of Science and Technology of China
  • Department of Physics
  • Department of Physics
  • Materials Research Laboratory
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • ShanghaiTech University
  • University of Illinois at Urbana-Champaign

External person

T. Kim

  • University of Illinois at Urbana-Champaign
  • Sandia National Laboratories
  • University of Illinois at Urbana-Champaign

External person

Honggyu Kim

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Materials Department
  • University of California at Santa Barbara
  • University of Illinois at Urbana-Champaign
  • UC Santa Barbara College of Engineering
  • University of Illinois at Urbana-Champaign

External person

M. Gao

  • University of Illinois at Urbana-Champaign
  • Ohio State University
  • University of Illinois at Urbana-Champaign

External person

W. J. Huang

  • University of Illinois Urbana-Champaign
  • Carl Zeiss SMT AG
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jean Luc Rouviére

  • SP2M, LEMMA
  • CEA/INAC/SP2M/LEMMA
  • Minatec
  • CEA INAC/UJF-Grenoble1 UMR-E
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Universite Joseph Fourier
  • Université Grenoble Alpes

External person

I. Petrov

  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Technique and Applications
  • International Union for Vacuum Science
  • Dept. of Mat. Sci. and Engineering
  • Linköping University
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. O'Keeffe

  • Arizona State University
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • Department of Chemistry
  • Department of Physics

External person

Qing Chen

  • Peking University
  • School of Electronics Engineering and Computer Science
  • Key Laboratory for Physics and Chemistry of Nanodevices
  • Key Laboratory for Physics and Chemistry of Nanodevices
  • Department of Electronics

External person

R. Holmestad

  • Arizona State University
  • Department of Physics, Norwegian Univ. of Sci. Technology
  • NTNU
  • Norwegian University of Science and Technology
  • Norwegian Univ. of Sci. Technology
  • Norwegian University of Science and Technology
  • Department of Physics

External person

R. Hoier

  • University of Trondheim-NTH
  • Department of Physics
  • University of Trondheim-Norges Tekniske Ho/gskole
  • Norwegian Univ. Sci. Technol., 7034
  • Department of Physics, Norwegian Univ. of Sci. Technology
  • Norwegian Univ. of Sci. and Technol.
  • Arizona State University
  • Norwegian Univ. of Sci. Technology
  • Norwegian University of Science and Technology
  • Department of Physics

External person

Haoyang Ni

  • Oak Ridge National Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. Ran

  • University of Illinois Urbana-Champaign
  • Peking University
  • Dept. of Mat. Sci. and Engineering
  • Key Laboratory for Physics and Chemistry of Nanodevices
  • Key Laboratory for Physics and Chemistry of Nanodevices
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Electronics
  • Department of Materials Science and Engineering
  • Center for Microanalysis of Materials
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Aram Yoon

  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

L. M. Peng

  • Peking University
  • Chinese Academy of Sciences
  • Chenese Academy of Sciences
  • CAS - Institute of Physics
  • University of Oxford
  • Department of Electronics
  • Department of Materials
  • Beijing Lab. of Electron Microscopy
  • Beijing Lab. of Electron Micoscopy
  • Key Laboratory for Physics and Chemistry of Nanodevices

External person

Q. Yang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • ShanghaiTech University
  • School of Physical Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • ShanghaiTech University
  • University of Minnesota Twin Cities
  • University of Illinois at Urbana-Champaign

External person

Xun Zhan

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jianbo Wu

  • Shanghai Jiao Tong University
  • School of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Departments of Chemistry of Chemical and Biomolecular Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical and Biomolecular Engineering
  • Seitz Materials Research Laboratory
  • Hydrogen Science Research Center
  • State Key Laboratory of Metal Matrix Composites
  • Department of Chemical and Biomolecular Engineering
  • University of Rochester
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Rochester

External person

S. J. May

  • Argonne National Laboratory
  • Material Science Division
  • Materials Science Division, Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Drexel University
  • Department of Materials Science and Engineering
  • Argonne National Laboratory
  • Drexel University College of Engineering

External person

Ren Liang Yuan

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yonggang Huang

  • Northwestern University
  • University of Illinois at Urbana-Champaign
  • University of Connecticut
  • Tsinghua University
  • Department of Chemistry
  • Center for Engineering and Health and Skin Disease Research Center
  • CAS - Institute of Semiconductors
  • University of Pennsylvania
  • Center for Engineering and Health
  • University of Illinois at Urbana-Champaign
  • Zhejiang University
  • Department of Civil and Environmental Engineering, Center for Engineering and Health, Northwestern University

External person

David A. Payne

  • American Ceramic Society
  • University of Illinois Urbana-Champaign
  • The American Ceramic Society
  • Seitz Materials Research Laboratory
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Eagineering
  • Department of Materials Science and Engineering
  • United States Department of Energy
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shankar Sivaramakrishnan

  • General Electric
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ping Lu

  • Sandia National Laboratories

External person

Ayten Celik-Aktas

  • University of Wisconsin-Milwaukee
  • University of Illinois Urbana-Champaign
  • Department of Nuclear
  • Department of Nuclear
  • Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign
  • Department of Physics
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yang Hu

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

L. A. Nagahara

  • Motorola
  • Physical Sciences Research Laboratories

External person

J. C. Mabon

  • Center for Microanalysis of Materials
  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Center for Microanalysis of Materials
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. Twesten

  • Frederick Seitz Materials Res. Lab.
  • Sandia National Laboratories
  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • 3M Materials Laboratory
  • Center for Microanalysis of Materials
  • Department of Physics
  • Ctr. Compd. Semiconduct. Technol.
  • Ctr. Compd. Semiconduct. Technol.
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci./Engineering
  • Department of Physics
  • Micro and Nanotechnology Lab
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jiangchao Qian

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Daniel P. Abraham

  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

Hao Chen

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ling Zang

  • University of Utah
  • Southern Illinois University
  • Department of Materials Science and Engineering
  • Nano Institute of Utah, Department of Materials Science and Engineering, University of Utah
  • Department of Chemistry and Biochemistry
  • Department of Materials Science and Engineering
  • Department of Chemistry and Biochemistry
  • Department of Materials Science and Engineering
  • Southern Illinois University
  • University of Utah

External person

Seongwon Kim

  • Korea Institute of Ceramic Engineering and Technology
  • Seoul National University
  • Korea Institute of Ceramic Engineering And Technology
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Engineering Ceramic Center
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Compound Semiconductor Epitaxy Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wenxiang Chen

  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Q. M. Ramasse

  • SuperSTEM Laboratory
  • Lawrence-Berkeley National Laboratory
  • Lawrence-Berkeley National Lab.
  • Lawrence Berkeley National Laboratory
  • Natl. Center for Electron Microscopy
  • Engineering and Physical Sciences Research Council

External person

D. Niebieskikwiat

  • Universidad San Francisco de Quito
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Physics
  • Department of Physics
  • Colegio de Ciencias e Ingeniería
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. B. Salamon

  • University of Texas at Dallas
  • Vanderbilt University
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Physics
  • Dept. Phys. Sci. Technol. Ctr. S.
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Department of Physics and Astronomy
  • Department of Physics
  • Physics Department
  • School of Natural Sciences and Mathematics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hsu Chih Ni

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. F. Shi

  • University of Illinois Urbana-Champaign
  • 3M Materials Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Robert Busch

  • University of Illinois at Urbana-Champaign

External person

Y. Zhu

  • Brookhaven National Laboratory

External person

Hyuk Park

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. W. Kim

  • Seoul National University
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Beckman Institute for Advanced Science and Technology
  • Sch. of Mat. Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yung Tin Pan

  • Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign, 114 Roger Adams Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

Xiaomei Yang

  • University of Utah
  • Southern Illinois University
  • Nano Institute of Utah, Department of Materials Science and Engineering, University of Utah
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Chemistry and Biochemistry
  • Department of Chemistry and Biochemistry
  • Department of Materials Science and Engineering
  • Southern Illinois University
  • University of Utah

External person

U. Welp

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

R. Zhang

  • Motorola
  • Physical Sciences Research Laboratories

External person

Jerome Pacaud

  • University of Poitiers, Chasseneuil
  • UMR 6630, SP2MI, BP179, Univ. P.
  • Université de Poitiers
  • UMR 6630, SP2MI, BP179, Univ. P.
  • Laboratourie de Metallurgie Physique
  • Lab. de Metallic Phys.

External person

W. K. Kwok

  • Argonne National Laboratory

External person

S. D. Bader

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • Center for Nanoscale Materials, Argonne National Laboratory, Bldg 440
  • Material Science Division
  • Materials Science Division, Argonne National Laboratory
  • Materials Science Division
  • Materials Science Division
  • The University of Chicago
  • Biosciences Division, Argonne National Laboratory
  • Electron Microscopy Center
  • Electron Microscopy Center
  • Materials Science Division
  • Argonne National Laboratory

External person

Xiaofeng Zhang

  • Hitachi High Technologies America
  • Hitachi, Ltd.

External person

B. Liu

  • University of Illinois at Urbana-Champaign
  • Tsinghua University
  • University of Illinois at Urbana-Champaign

External person

Yanke Che

  • University of Utah
  • Southern Illinois University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Chemistry and Biochemistry
  • Department of Chemistry and Biochemistry
  • Nano Institute of Utah, Department of Materials Science and Engineering, University of Utah
  • Southern Illinois University
  • University of Utah

External person

Gyeong Su Park

  • Samsung Advanced Institute of Technology
  • Samsung Adv. Institute of Technology
  • Samsung Advanced Institute of Technology
  • Analytical Engineering Center
  • Samsung

External person

Fakhruddin Bohra

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

U. Weierstall

  • Arizona State University
  • Department of Physics and Astronomy

External person

Kaushik Balakrishnan

  • Rice University
  • Southern Illinois University
  • University of Arizona
  • Department of Chemistry and Biochemistry
  • College of Optical Science
  • Department of Chemistry
  • Mechanical Engineering and Materials Science Department
  • Southern Illinois University
  • Rice University

External person

Mao Zheng

  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kazuhisa Sato

  • Tohoku University
  • University of Illinois Urbana-Champaign
  • Osaka University
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Institute of Scientific and Industrial Research
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Keh Chih Hwang

  • Tsinghua University
  • Center for Mechanics and Materials, Tsinghua University
  • Department of Engineering Mechanics, Tsinghua University
  • Department of Engineering Mechanics
  • AML
  • Department of Engineering Mechanics
  • Dept. of Eng. Mech.
  • Department of Engineering Mechanics
  • Department of Engineering Mechanics
  • Department of Engineering Mechanics

External person

Ki Jun Yu

  • Dept. of Mat. Sci. and Engineering
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Yonsei University
  • School of Electrical and Electronic Engineering, Yonsei University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Olle G. Heinonen

  • Argonne National Laboratory
  • Northwestern University
  • Materials Science Division, Argonne National Laboratory
  • Northwestern-Argonne Institute for Science and Engineering
  • The University of Chicago
  • Center for Interdisciplinary Exploration and Research in Astrophysics (CIERA)
  • Computation Institute
  • The University of Chicago
  • Argonne National Laboratory

External person

K. Marthinsen

  • SINTEF
  • Dept. Mat. Technol. and Electrochem., Norwegian Univ. of Sci. Technology
  • Norwegian Univ. of Sci. Technology
  • SINTEF
  • Norwegian University of Science and Technology

External person

S. T. Pantelides

  • Vanderbilt University
  • Oak Ridge National Laboratory
  • Department of Physics and Astronomy
  • Quantum Condensed Matter Division
  • Department of Physics and Astronomy
  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Department of Physics and Astronomy

External person

S. J. Pennycook

  • Oak Ridge National Laboratory
  • Vanderbilt University
  • Quantum Condensed Matter Division
  • Department of Physics and Astronomy
  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Department of Physics and Astronomy

External person

Jae Cheol Shin

  • Korea Photonics Technology and Institute
  • Korea Photonics Technology Institute
  • Korea Potonics Technology Institute
  • University of Illinois Urbana-Champaign
  • Yeungnam University
  • Department of Physics
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Photonics-Energy Center
  • Photonic-Energy Center
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Korea Photonics Technology Institute
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. J. Miller

  • Argonne National Laboratory
  • Center for Nanoscale Materials, Argonne National Laboratory, Bldg 440
  • Electron Microscopy Center
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

A. L. Weickenmeier

  • Arizona State University
  • Department of Physics and Astronomy

External person

Eric Olson

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Sardela

  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Center for Microanalysis of Materials
  • Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Bording

  • University of Illinois Urbana-Champaign
  • 3M Materials Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci./Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sergio I. Sanchez

  • University of Illinois Urbana-Champaign
  • Department of Chemistry
  • Center for Microanalysis of Materials
  • Department of Chemistry
  • School of Chemical Sciences, University of Illinois
  • Departments of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • School of Chemical Sciences and Fredrick Seitz Materials Research Laboratory
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zujin Shi

  • Peking University
  • Beijing National Laboratory for Molecular Sciences, College of Chemistry and Molecular Engineering, Peking University

External person

Richard T. Haasch

  • Frederick Seitz Mat. Research Lab.
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Center for Microanalysis of Materials
  • Department of Mechanical Science and Engineering, University of Illinois
  • Materials Research Laboratory
  • Center for Microanalysis of Materials
  • Department of Chemistry
  • Department of Mechanical Science and Engineering
  • Center for Microanalysis of Materials
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Varela

  • Oak Ridge National Laboratory
  • Quantum Condensed Matter Division
  • Materials Science and Technology Division, Oak Ridge National Laboratory

External person

Jianliang Xiao

  • Northwestern University
  • University of Colorado Boulder
  • University of Illinois at Urbana-Champaign
  • Tsinghua University
  • University of Colorado Boulder
  • University of Illinois at Urbana-Champaign

External person

Matthew W. Small

  • Departments of Chemistry
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • School of Chemical Sciences and Fredrick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Arghya Patra

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Cheng Zhang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

V. Novosad

  • Stanford University
  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Stanford Linear Accelerator Center
  • Argonne National Laboratory

External person

Peter K. Liaw

  • University of Tennessee, Knoxville
  • Department of Materials Science and Engineering, The University of Tennessee
  • University of Tennessee System
  • Department of Materials Science and Engineering, University of Tennessee
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • National Tsing Hua University
  • University of Tennessee Civil
  • The University of Tennessee
  • Univ. of Tennessee

External person

Sung Jin Kang

  • Seitz Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Seoul National University
  • Institute for Basic Science (IBS)
  • Department of Materials Science & Engineering and RIAM
  • Center for Correlated Electron Systems
  • Institute for Basic Science
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University
  • Center for Correlated Electron Systems
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hanyu Hou

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kaijun Yin

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Young Kyun Kwon

  • Department of Physics, Research Institute for Basic Sciences, Kyung Hee University
  • Kyung Hee University

External person

John W. Freeland

  • Argonne National Laboratory
  • The University of Chicago
  • United States Department of Energy

External person

S. G E Te Velthuis

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Material Science Division
  • Materials Science Division
  • Materials Science Division
  • Center for Nanoscale Materials, Argonne National Laboratory, Bldg 440
  • Argonne National Laboratory

External person

W. D. Luo

  • Vanderbilt University
  • Oak Ridge National Laboratory
  • Department of Physics and Astronomy
  • Quantum Condensed Matter Division
  • Department of Physics and Astronomy
  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Department of Physics and Astronomy

External person

Weixing Zhou

  • University of Illinois Urbana-Champaign
  • Dept. of Mech. and Indust. Eng.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ryan M. Stephens

  • University of Illinois Urbana-Champaign
  • The Electrochemical Society
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Shell International Exploration and Production Inc.
  • Royal Dutch Shell PLC
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Chandra S. Mohapatra

  • Department of Physics University of Illinois
  • Intel
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Materials Research Laboratory
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Z. H. Jiang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yi Li

  • Materials Science Division, Argonne National Laboratory
  • Oakland University
  • Department of Physics
  • Argonne National Laboratory
  • Argonne National Laboratory

External person

Shibom Basu

  • Department of Chemistry and Biochemistry, Arizona State University
  • Arizona State University

External person

Hui Wei

  • University of Illinois Urbana-Champaign
  • Nanjing National Laboratory of Microstructures
  • Nanjing University
  • Georgia Institute of Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Biomedical Engineering
  • State Key Laboratory of Analytical for Life Science
  • Department of Biomedical Engineering
  • College of Engineering and Applied Sciences
  • Department of Chemistry
  • Departments of Chemistry
  • Department of Biomedical Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

T. S. Santos

  • Argonne National Laboratory
  • Material Science Division
  • Center for Nanoscale Materials, Argonne National Laboratory, Bldg 440
  • The University of Chicago
  • Argonne National Laboratory

External person

Howard Robinson

  • Dept. of Cell and Structural Biology, Univ. Illinois at Urbana-Champaign
  • Brookhaven National Laboratory
  • Department of Biology, Brookhaven National Laboratory
  • University of Illinois Urbana-Champaign
  • Academia Sinica Taiwan
  • Leiden University
  • Hiroshima University
  • Biology Department
  • Departments of Biochemistry, Chemistry
  • Institute of Biological Chemistry
  • Department of Endocrinology, and Metabolic Diseases
  • Department of Chemistry
  • Center for Biophysics and Computational Biology
  • Department of Orthopaedic Surgery
  • Dept. of Cell and Structural Biology
  • Academia Sinica - Institute of Biological Chemistry
  • Department of Biochemistry
  • University of Illinois at Urbana-Champaign
  • United States Department of Energy

External person

W. K. Park

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Per Erik Vullum

  • Norwegian University of Science and Technology
  • SINTEF Materials and Chemistry
  • SINTEF
  • Department of Physics, Norwegian Univ. of Sci. Technology

External person

Changjiang Liu

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Xin Chen

  • East China University of Science and Technology
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • School of Materials Science and Engineering
  • Key Laboratory for Ultrafine Materials of Ministry of Education
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pei Chieh Shih

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

Jonathan D. Poplawsky

  • Oak Ridge National Laboratory
  • Center for Nanophase Materials Sciences
  • Center for Nanophase Materials Sciences

External person

P. Rez

  • Arizona State University
  • Department of Chemistry
  • Department of Physics and Astronomy

External person

P. Ganesh

  • Center for Nanophase Materials Sciences
  • Oak Ridge National Laboratory
  • Center for Nanophase Materials Sciences

External person

Qiang Li

  • Brookhaven National Laboratory

External person

Z. Horita

  • Arizona State University
  • Kyushu University
  • Department of Materials Science and Engineering
  • International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University

External person

D. Meyers

  • University of Arkansas System
  • Brookhaven National Laboratory
  • Department of Physics
  • Department of Condensed Matter Physics and Materials Science

External person

M. R. McCartney

  • Arizona State University
  • Center for Solid State Science
  • Ctr. High Resolution Electron. M.

External person

Haiguang Liu

  • Department of Physics, Arizona State University
  • Arizona State University

External person

Jesper Friis

  • Norwegian Univ. of Sci. and Technol.
  • NTNU
  • Norwegian University of Science and Technology
  • Arizona State University
  • Department of Physics
  • Department of Physics

External person

Genda Gu

  • Brookhaven National Laboratory
  • University of New South Wales
  • Department of Condensed Matter Physics and Materials Science
  • National Synchrotron Light Source
  • School of Physics

External person

L. D. Marks

  • Northwestern University
  • Department of Materials Science and Engineering

External person

Michael E. Scarpelli

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. Jia

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

T. Draher

  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign
  • Northern Illinois University
  • University of Illinois at Urbana-Champaign

External person

J. H. Huang

  • National Institutes of Health
  • National Tsing Hua University
  • Department of Engineering and System Science

External person

Ik Su Chun

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

K. Gjonnes

  • Arizona State University
  • Department of Physics, Arizona State University

External person

Marco Tulio F. Rodrigues

  • Argonne National Laboratory

External person

J. Mayer

  • Max Planck Institute for Intelligent Systems

External person

Y. Trenikhina

  • Fermi National Accelerator Laboratory
  • Illinois Institute of Technology
  • Department of Physics
  • Fermi National Accelerator Laboratory

External person

Zhong Lin Wang

  • Georgia Institute of Technology
  • Chinese Academy of Sciences
  • National Center for Nanoscience and Technology
  • University of Chinese Academy of Sciences
  • Georgia Institute of Technology

External person

T. H. Lo

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Miguel Lopez-Haro

  • University of Cádiz
  • Université Grenoble Alpes
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Departamento de Ciencia de Los Materiales e Ingenieria Metalurgica y Quimica Inorganica

External person

Dieter Isheim

  • Northwestern University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Center for Atom-Probe Tomography (NUCAPT)

External person

A. R. Moodenbaugh

  • Brookhaven Natl Lab
  • Brookhaven National Laboratory
  • Materials Science Division

External person

Jason Hoffman

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Department of Physics
  • Harvard University
  • Argonne National Laboratory
  • Harvard University

External person

Jia Ye

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Lawrence Berkeley National Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

M. R. Fitzsimmons

  • Los Alamos National Laboratory
  • Oak Ridge National Laboratory
  • University of Tennessee, Knoxville

External person

Tomas Polakovic

  • Argonne National Laboratory
  • Drexel University
  • Physics Division
  • Department of Physics
  • The University of Chicago
  • Argonne National Laboratory

External person

Z. J. Xu

  • Brookhaven National Laboratory
  • Department of Condensed Matter Physics and Materials Science
  • National Institute of Standards and Technology

External person

P. R C Kent

  • Cornell University
  • Oak Ridge National Laboratory
  • Department of Physics, Cornell University
  • Center for Nanophase Materials Sciences
  • Geographic Information Science and Technology Group, Computational Science and Engineering Division
  • Center for Nanophase Materials Sciences

External person

A. Chakraborty

  • ArcelorMittal

External person

Y. Zhu

  • Brookhaven National Laboratory

External person

Aniket Datar

  • Southern Illinois University
  • Department of Chemistry and Biochemistry
  • Southern Illinois University

External person

Yoshio Bando

  • National Institute for Materials Science Tsukuba
  • Natl. Inst. for Res. in Inorg. Mat.
  • National Institute for Research in Inorganic Materials

External person

Benjamin J. Pierce

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

X. X. Yu

  • Northwestern University

External person

I. M. Robertson

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Argonne National Laboratory
  • University of Wisconsin-Madison
  • Kyushu University
  • University of Oregon
  • Dept. of Mat. Sci. and Engineering
  • International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University
  • Department of Mechanical Science and Engineering
  • Department of Materials Science
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Materials Science Division, Argonne National Laboratory
  • Department of Materials Science
  • Department of Engineering Physics
  • Department of Materials Science and Engineering and Department of Engineering Physics
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Mechanical Science and Engineering
  • Department of Physics
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • Argonne National Laboratory
  • University of Wisconsin-Madison
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin

External person

Talha Al-Zoubi

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

Chengchun Tang

  • National Institute for Materials Science Tsukuba
  • Natl. Inst. for Res. in Inorg. Mat.
  • National Institute for Research in Inorganic Materials

External person

Eric Pop

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Department of Electrical and Computer Engineering
  • Electrical Engineering, Stanford University
  • Intel
  • Bldg 500
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Department of Mechanical Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Precourt Institute for Energy
  • Dept. of Electrical
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

H. Ghassemi-Armaki

  • Brown University
  • School of Engineering, Brown University
  • General Motors

External person

Youhong Li

  • Engineered Material Arresting Systems
  • University of Illinois Urbana-Champaign
  • Zodiac Aerospace
  • Engineered Material Arresting Systems
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

C. Bougerol

  • Minatec
  • Universite Joseph Fourier
  • Université Grenoble Alpes
  • CNRS Centre National de la Recherche Scientifique
  • Institut NÉEL

External person

Gwan Hyoung Lee

  • Yonsei University
  • Columbia University
  • Sungkyunkwan University
  • Seoul National University
  • Samsung Advanced Institute of Technology
  • Department of Materials Science and Engineering
  • Department of Mechanical Engineering
  • Department of Materials Science and Engineering
  • School of Mechanical Engineering
  • Department of Mechanical Engineering
  • School of Materials Science and Engineering
  • Samsung
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University

External person

M. Schofield

  • Brookhaven National Laboratory
  • Department of Condensed Matter Physics and Materials Science
  • Condensed Matter Physics

External person

S. Zhu

  • Argonne National Laboratory
  • Physics Division
  • The University of Chicago
  • Argonne National Laboratory

External person

Lijun Wu

  • Brookhaven National Laboratory
  • Department of Condensed Matter Physics and Materials Science

External person

M. Suenaga

  • Brookhaven Natl Lab
  • Brookhaven National Laboratory
  • Materials Science Division

External person

Ganesh Subramanian

  • Department of Materials Science and Engineering, Arizona State University
  • Arizona State University
  • Arizona State University

External person

George Crabtree

  • University of Illinois at Chicago
  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • Materials Science Division
  • Physics Department
  • Materials Science Division
  • Departments of Physics, Electrical and Mechanical Engineering
  • The University of Chicago
  • Argonne National Laboratory
  • University of Illinois at Chicago

External person

Hui Gang Zhang

  • University of Illinois Urbana-Champaign
  • Nanjing University
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Collaborative Innovation Center of Advanced Microstructures
  • Department of Mechanical Science and Engineering
  • College of Engineering and Applied Sciences
  • Department of Mechanical Sciences, Institute for Advanced Science and Technology, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Nankai University
  • National Laboratory of Solid State Microstructures
  • College of Engineering and Applied Sciences
  • National Laboratory of Solid State Microstructures
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hyeondeok Shin

  • Argonne National Laboratory
  • Mathematics and Computer Science Division
  • The University of Chicago
  • Mathematics and Computer Science Division
  • Mathematics and Computer Science Division
  • Argonne National Laboratory

External person

Maryam Vatanparast

  • Norwegian University of Science and Technology
  • Department of Physics, Norwegian Univ. of Sci. Technology

External person

Z. W. Lin

  • Brookhaven National Laboratory

External person

A. Romanenko

  • Fermi National Accelerator Laboratory
  • Fermi National Accelerator Laboratory

External person

Yifei Zhang

  • SuperPower Corp
  • Rice University

External person

Anouar Benali

  • Argonne National Laboratory
  • Mathematics and Computer Science Division
  • Mathematics and Computer Science Division
  • The University of Chicago
  • Argonne Leadership Computing Facility
  • Argonne National Laboratory

External person

Waclaw Swiech

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Pearson

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Kavli Institute for Cosmological Physics
  • High Energy Physics Division
  • Stanford University
  • Istituto Nazionale di Ricerca Metrologica
  • Electron Microscopy Center
  • Argonne National Laboratory
  • The University of Chicago
  • Stanford Linear Accelerator Center

External person

S. Sivaramakrishnan

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

B. Q. Li

  • National Institute of Advanced Industrial Science and Technology
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Zidong Wang

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hao Chen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. N. Seidman

  • Northwestern Polytechnical University Xian
  • Argonne National Laboratory
  • Northwestern University
  • Technische Universität Darmstadt
  • Cornell University
  • Department of Materials Science and Engineering
  • Materials Science Division, Argonne National Laboratory
  • Department of Materials Science and Engineering, Cornell University
  • Materials Science Division
  • Department of Materials Science and Engineering
  • Center for Atom-Probe Tomography (NUCAPT)
  • Center for Interdisciplinary Exploration and Research in Astrophysics (CIERA)
  • The University of Chicago
  • Argonne National Laboratory

External person

Yi Gui Gao

  • Dept. of Cell and Structural Biology, Univ. Illinois at Urbana-Champaign
  • 3M Materials Laboratory
  • University of Illinois Urbana-Champaign
  • Academia Sinica Taiwan
  • Brookhaven National Laboratory
  • Leiden University
  • Hiroshima University
  • Department of Chemistry
  • Biocrystallization Facility
  • Departments of Biochemistry, Chemistry
  • George L. Clark X-ray Facility
  • School of Chemical Sciences Biocrystallization Service
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • George L. Clark X-Ray Facility
  • School of Chemical Sciences, University of Illinois
  • Department of Chemistry
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Institute of Biological Chemistry
  • Department of Endocrinology, and Metabolic Diseases
  • Department of Biology, Brookhaven National Laboratory
  • Center for Biophysics and Computational Biology
  • Department of Orthopaedic Surgery
  • School of Chemical Sciences, University of Illinois at Urbana Champaign
  • Dept. of Cell and Structural Biology
  • Department of Biochemistry
  • Academia Sinica - Institute of Biological Chemistry
  • Department of Biochemistry
  • University of Illinois at Urbana-Champaign

External person

Maitri Warusawithana

  • Florida State University
  • Pennsylvania State University
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Materials Science and Engineering
  • Department of Physics
  • Dept. of Physics
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of North Florida
  • University of Illinois at Urbana-Champaign

External person

Daniel Zuo

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. Ikeda

  • Federal Institute for Materials Research and Testing Berlin
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhichu Tang

  • Key Laboratory of Advanced Materials and Applications for Batteries of Zhejiang Province
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yanling Ma

  • Shanghai Jiao Tong University
  • Hydrogen Science Research Center
  • State Key Laboratory of Metal Matrix Composites
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. Estrada

  • Boise State University
  • Materials Science and Engineering, Boise State University
  • University of Illinois Urbana-Champaign
  • Department of Material Science and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Micron School of Materials Science and Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

V. G. Tsirelson

  • Mendeleev University of Chemical Technology
  • Mendeleev University of Chemical Technology

External person

Manohar H. Karigerasi

  • University of Illinois Urbana-Champaign
  • Dept. Mat. Sci. Eng. Mat. Res. Lab.
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Miaofang Chi

  • Oak Ridge National Laboratory

External person

Stephen House

  • Department of Materials Science
  • Department of Chemical and Petroleum Engineering, University of Pittsburgh
  • University of Pittsburgh
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Pittsburgh

External person

R. S. Sun

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

William L. Wilson

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Harvard University
  • Seitz Materials Research Laboratory
  • Center for Nanoscale Systems
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Brown University
  • Harvard University
  • University of Illinois at Urbana-Champaign

External person

A. P. Tedjasaputra

  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

I. Vartanyants

  • Inst. Cristal. Russ. Acad. Sci.
  • Russian Academy of Sciences
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

X. Y. Kong

  • Georgia Institute of Technology
  • School of Material Science and Engineering, Georgia Institute of Technology
  • Sch. of Materials Sci./Engineering
  • Georgia Institute of Technology

External person

Jianguo Wen

  • Electron Microscopy Center
  • Argonne National Laboratory
  • Argonne National Laboratory

External person

Venkat Selvamanickam

  • University of Houston
  • Department of Mechanical Engineering and Texas Center for Superconductivity
  • Department of Mechanical Engineering
  • Cullen College of Engineering

External person

A. E. Koshelev

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Jerome Davis

  • Xerion Advanced Battery Corp.
  • Xerion Advanced Battery Corporation
  • University of Illinois at Urbana-Champaign

External person

A. Gulec

  • Northwestern University

External person

Hyosung An

  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Chonnam National University
  • University of Illinois at Urbana-Champaign

External person

Turid W. Reenaas

  • Norwegian University of Science and Technology
  • Department of Physics, Norwegian Univ. of Sci. Technology

External person

C. Chaparro

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Ho Nyung Lee

  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Oak Ridge National Laboratory

External person

J. S. Wen

  • Brookhaven National Laboratory
  • Department of Condensed Matter Physics and Materials Science

External person

Friederike Wrobel

  • Materials Science Division, Argonne National Laboratory
  • Argonne National Laboratory
  • Argonne National Laboratory

External person

D. Ding

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. A. Chambers

  • Pacific Northwest National Laboratory
  • Pacific Northwest National Laboratory

External person

Scott T. Misture

  • Alfred University
  • Kazuo Inamori School of Engineering

External person

Varun Boehm Verma

  • National Institute of Standards and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Meng Chang Lin

  • Shandong University of Science and Technology

External person

D. Cooper

  • Minatec
  • Commissariat à l’énergie atomique et aux énergies alternatives

External person

Lingqing Yan

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Stéphanie Pouget

  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Université Grenoble Alpes

External person

A. Ourmazd

  • Alcatel-Lucent
  • Lucent
  • University of Wisconsin-Milwaukee
  • Physics Department
  • Nokia

External person

Pengcheng Sun

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Carolyn Monroe

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Eran Rabani

  • Tel Aviv University
  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • Raymond and Beverly Sackler Center for Computational Molecular and Materials Science
  • Department of Chemistry
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • School of Chemistry
  • University of California at Berkeley

External person

Megan Phelan

  • California Institute of Technology
  • California Institute of Technology
  • California Institute of Technology Division of Engineering and Applied Science

External person

See W. Chee

  • Arizona State University
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • LeRoy Eyring Center for Solid State Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xian Zhang

  • Columbia University
  • Department of Mechanical Engineering
  • Stevens Institute of Technology
  • Stevens Institute of Technology

External person

S. Smadici

  • Brookhaven National Laboratory
  • University of Illinois Urbana-Champaign
  • University of Louisville
  • Seitz Materials Research Laboratory
  • Department of Physics
  • Department of Physics
  • Department of Physics and Astronomy
  • National Synchrotron Light Source
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Louisville
  • University of Illinois at Urbana-Champaign

External person

K. C. Hsieh

  • Dept. of Elec. and Comp. Engineering
  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Electrical Engineering Research Laboratory
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Ctr. Compd. Semiconduct. M.
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Kareev

  • University of Arkansas System
  • Department of Physics

External person

Xingyu Gao

  • Chinese Academy of Sciences
  • Shanghai Institute of Applied Physics, Chinese Academy of Sciences
  • Chinese Academy of Sciences

External person

Naheed Ferdous

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Dongdong Xiao

  • CAS - Institute of Physics
  • Songshan Lake Materials Laboratory

External person

Sean T. Sivapalan

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Center for Microanalysis of Materials
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yan Ting Sun

  • KTH Royal Institute of Technology
  • Laboratory of Semiconductor Materials

External person

Jeffrey Huang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hui Xing

  • Shanghai Jiao Tong University
  • University of Illinois at Urbana-Champaign
  • Tufts University
  • University of Illinois at Urbana-Champaign

External person

Erfan Mohammadi

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

R. Zhang

  • Motorola

External person

Narendra K. Jaggi

  • Illinois Wesleyan University

External person

Jian Liu

  • University of Tennessee, Knoxville
  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • Department of Physics and Astronomy
  • Department of Physics
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • University of California at Berkeley

External person

Z. Zhu

  • Pacific Northwest National Laboratory
  • Environmental Molecular Sciences Lab
  • Environmental Molecular Sciences Laboratory
  • Pacific Northwest National Laboratory

External person

Gunn Kim

  • Kyung Hee University
  • Department of Physics, Research Institute for Basic Sciences, Kyung Hee University

External person

Elizabeth J. Gao

  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • United States Army Engineer Research and Development Center
  • University of Illinois at Urbana-Champaign

External person

A. Habrioux

  • Université de Poitiers

External person

Runyu Zhang

  • University of Illinois Urbana-Champaign
  • University of Wisconsin-Madison
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Harvard University
  • University of Illinois at Urbana-Champaign

External person

Guosong Hong

  • Stanford University

External person

Wei Guo

  • Material Science Research and Development
  • Oak Ridge National Laboratory

External person

Edward D. Boyes

  • Departments of Chemistry and Physics
  • University of York

External person

B. B. Nelson-Cheeseman

  • Argonne National Laboratory
  • Material Science Division
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Xiangwen Lu

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Nanjing University of Aeronautics and Astronautics
  • College of Computer Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaodong Wang

  • University of Illinois Urbana-Champaign
  • Shanghai Jiao Tong University
  • Dept. of Mat. Sci. and Engineering
  • School of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yong Huang

  • Georgia Institute of Technology
  • Center for Compound Semiconductors

External person

Qinwen Lu

  • ShanghaiTech University
  • University of Science and Technology of China

External person

H. R. Zhu

  • Arizona State University

External person

Richard I. Masel

  • Department of Dioxide Materials
  • Dioxide Materials
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois Urbana-Champaign
  • Dioxide Materials
  • Department of Chemical and Biomolecular Engineering
  • Roger Adams Laboratory
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Departments of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • Deparment of Chemical Engineering
  • Dioxide Materials
  • Department of Chemical Engineering
  • Department of Ceramic Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Qian Yu

  • Zhejiang University

External person

Michael J. Zachman

  • Oak Ridge National Laboratory

External person

Jian Nong Wang

  • East China University of Science and Technology

External person

Brinn E. Mcdowell

  • University of Illinois at Urbana-Champaign

External person

Zihao Ou

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Peter Reiss

  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Université Grenoble Alpes
  • CNRS Centre National de la Recherche Scientifique
  • CNRS

External person

Timothy E. Day

  • University of Illinois at Urbana-Champaign

External person

Alexander J. Grutter

  • National Institute of Standards and Technology

External person

Huixin He

  • Rutgers - The State University of New Jersey, Newark
  • Department of Chemistry

External person

Jin Gu Kang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Nanophotonics Research Center
  • Korea Institute of Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. Aydinli

  • Physics Department
  • Bilkent University
  • Physics Department

External person

Hongbin Bei

  • Oak Ridge National Laboratory
  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Zhejiang University

External person

B. Bonef

  • Université Grenoble Alpes
  • Commissariat à l’énergie atomique et aux énergies alternatives

External person

W. Jo

  • Ewha Womans University
  • Department of Physics

External person

Andrew Spence

  • Arizona State University
  • University of Miami

External person

Jaseun Lee

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. Hattar

  • Sandia National Laboratories
  • University of Illinois Urbana-Champaign
  • Department of Radiation Solid Interactions
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • Univ. of Tennessee

External person

S. Célérier

  • Université de Poitiers

External person

Vaclav Petricek

  • Czech Academy of Sciences

External person

José J. Calvino

  • University of Cádiz
  • Departamento de Ciencia de Los Materiales e Ingenieria Metalurgica y Quimica Inorganica

External person

V. Roddatis

  • University of Göttingen
  • Institute for Materials Physics

External person

Kristopher D. Matthews

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kaijun Yin

  • University of Illinois at Urbana-Champaign

External person

Lehan Yao

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Adrian Xiao Bin Yong

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Petr Ondrejkovic

  • Czech Academy of Sciences

External person

Heonjae Jeong

  • Korea University
  • University of Illinois Urbana-Champaign
  • Renewable Energy System Laboratory
  • Department of Mechanical Science and Engineering
  • Renewable Energy System Laboratory
  • University of Illinois at Urbana-Champaign

External person

Stephanie Law

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • University of Delaware
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • The Natural History Museum, London
  • Pennsylvania State University
  • University of Illinois at Urbana-Champaign

External person

W. Qian

  • Arizona State University
  • Department of Physics

External person

Jialing Huang

  • Southern Illinois University
  • Materials Technology Center (MTC)
  • Southern Illinois University

External person

Shuangbao Wang

  • Nanjing University
  • College of Engineering and Applied Sciences
  • National Laboratory of Solid State Microstructures

External person

Shinhoo Kang

  • Seoul National University
  • Compound Semiconductor Epitaxy Laboratory

External person

Lane W. Martin

  • Department of Materials Science and Engineering
  • Department of Materials Science
  • University of California, Berkeley
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • Lawrence Berkeley National Laboratory
  • Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • International Institute for Carbon Neutral Research
  • University of California Office of the President
  • Department of Materials Science and Engineering, University of California
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Materials Research Laboratory
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Mat. Sci. and Engineering Department
  • Kyushu University
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering

External person

M. J. Buehler

  • Massachusetts Institute of Technology
  • Department of Civil and Environmental Engineering, Massachusetts Institute of Technology
  • Massachusetts Institute of Technology

External person

Tyler N. Pardue

  • Materials Department
  • University of California at Santa Barbara
  • UC Santa Barbara College of Engineering

External person

A. K. Kuligin

  • Russian Academy of Sciences
  • RAS - Shubnikov Institute of Crystallography
  • RAS - Federal Scientific Research Centre Crystallography and Photonics

External person

Aram Yoon

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Matthew C. Beard

  • National Renewable Energy Laboratory

External person

Hanghui Chen

  • New York University
  • New York University Shanghai

External person

Xuan Zhang

  • Argonne National Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • Argonne National Laboratory
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin

External person

Rui Feng

  • University of Tennessee System
  • University of Tennessee, Knoxville
  • Department of Materials Science and Engineering, The University of Tennessee
  • Department of Materials Science and Engineering, University of Tennessee
  • The University of Tennessee
  • Oak Ridge National Laboratory
  • Univ. of Tennessee

External person

Yuan Chen

  • University of Medicine and Dentistry of New Jersey
  • Rutgers - The State University of New Jersey, Newark
  • Department of Chemistry

External person

Kevin R. Zavadil

  • Sandia National Laboratories
  • Argonne National Laboratory
  • Joint Center for Energy Storage Research, Argonne National Laboratories
  • The University of Chicago
  • Joint Center for Energy Storage Research (JCESR)
  • Argonne National Laboratory

External person

Deshun Hong

  • Argonne National Laboratory
  • Argonne National Laboratory

External person

Y. Zhong

  • University of Illinois Urbana-Champaign
  • University of Delaware
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

P. V. Sushko

  • University College
  • University College London

External person

Yu Tsun Shao

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zuhuang Chen

  • University of California, Berkeley
  • University of California Office of the President
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering, University of California
  • University of California at Berkeley
  • Department of Materials Science and Engineering

External person

Yuxuan Wu

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Liepe

  • Cornell Laboratory for Accelerator-Based Sciences and Education
  • Cornell University

External person

Marvin A. Malone

  • University of Illinois Urbana-Champaign
  • Departments of Chemistry
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

H. Chen

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Materials Science
  • Department of Materials Science
  • City University of Hong Kong
  • Tunghai University
  • Dept. of Phys. and Mat. Sci.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Runyu Liu

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jungchul Lee

  • Sogang University
  • Georgia Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Woodruff School of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Micro and Nanotechnology Lab
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Korea Advanced Institute of Science and Technology
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Susana Trasobares

  • University of Cádiz
  • Departamento de Ciencia de Los Materiales e Ingenieria Metalurgica y Quimica Inorganica

External person

Limin Yang

  • University of Illinois Urbana-Champaign
  • Chongqing University
  • Ministry of Education, China
  • University of Illinois at Urbana-Champaign

External person

Jonghyurk Park

  • Electronics and Telecommunications Research Institute

External person

Myoung Woo Yoo

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Rouse

  • Munro's Electron Beam Software Ltd.

External person

Xinyi Wu

  • University of South Carolina

External person

Xianhong Meng

  • Beihang University
  • School of Aeronautical Science engineering

External person

Y. Martin

  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Université Grenoble Alpes

External person

Hailong Ning

  • University of Illinois Urbana-Champaign
  • Xerion Advanced Battery Corp.
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Xerion Advanced Battery Corporation
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yu Lin

  • Stanford Institute for Materials and Energy Sciences
  • Stanford Linear Accelerator Center

External person

Ce Wen Nan

  • Tsinghua University

External person

T. D. Pounds

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

N. Jiang

  • Arizona State University
  • Department of Physics and Astronomy

External person

Liang Pang

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jianguo Mei

  • Stanford University
  • Purdue University
  • Department of Chemical Engineering
  • Birck Nanotechnology Center
  • Department of Chemistry
  • Stanford University
  • Stanford University

External person

Zhexin Tang

  • CAS - Institute of Physics
  • University of Chinese Academy of Sciences

External person

T. Kjorsvik

  • Norwegian Univ. Sci. Technol., 7034
  • Norwegian University of Science and Technology
  • Department of Physics, Norwegian Univ. of Sci. Technology

External person

J. A. Venables

  • University of Sussex
  • Arizona State University
  • Department of Physics

External person

T. Gustafsson

  • Rutgers - The State University of New Jersey, New Brunswick
  • University of Medicine and Dentistry of New Jersey

External person

Benedict Ofuonye

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Laboratory, Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. X. Gao

  • Chenese Academy of Sciences
  • CAS - Institute of Physics
  • Beijing Lab. of Electron Micoscopy

External person

Hui Cao

  • Argonne National Laboratory

External person

Fanqi Meng

  • Tsinghua University

External person

L. Fang

  • Argonne National Laboratory
  • CAS - Institute of Physics
  • Materials Science Division, Argonne National Laboratory
  • Northwestern University
  • Department of Chemistry
  • Department of Chemistry
  • The University of Chicago
  • Department of Chemistry
  • Argonne National Laboratory

External person

Chun Yu

  • CAS - Institute of Chemistry
  • Key Laboratory of Photochemistry

External person

Y. F. Shi

  • Rensselaer Polytechnic Institute

External person

Yanbin Chan

  • Nanjing University
  • College of Engineering and Applied Sciences
  • National Laboratory of Solid State Microstructures

External person

Darko Makovec

  • University of Illinois Urbana-Champaign
  • J. Stefan Institute
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

B. Chen

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. Blaha

  • Vienna University of Technology
  • Inst. F. Technische Elektrochemie

External person

Xin Ran Zhu

  • Lehrstuhl für Tierphysiologie
  • Ruhr University Bochum

External person

Chuankai Zhao

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

J. Klem

  • Sandia National Laboratories
  • University of Illinois Urbana-Champaign
  • Ctr. Compd. Semiconduct. Technol.
  • Center for Compound Semiconductor Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wei Chen

  • Illinois Institute of Technology

External person

Vikram Bedekar

  • Material Science Research and Development

External person

M. Yu Efremov

  • University of Wisconsin-Madison
  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biological Engineering
  • Department of Materials Science
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin
  • University of Illinois at Urbana-Champaign

External person

Guilin Liu

  • CAS - Institute of Chemistry
  • Key Laboratory of Photochemistry

External person

Hunter McDaniel

  • Los Alamos National Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Chemistry Division
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

H. Claus

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Justin Zachary Wu

  • Stanford University

External person

Wei Li

  • Tianjin University

External person

Yu Zhou

  • Tianjin University
  • University of Illinois at Urbana-Champaign

External person

J. E. Greene

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Linköping University
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Technique and Applications
  • International Union for Vacuum Science
  • Department of Metallurgy
  • Department of Physics (IFM), Linköping University
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Departments of Metallurgy
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yi Siou Huang

  • University of Illinois at Urbana-Champaign

External person

Haiyong Xie

  • China Academy of Electronics and Information Technology

External person

Zhiwei Liu

  • East China Normal University
  • New York University Shanghai

External person

D. Jacob

  • Universite des Sciences et Technologies de Lille
  • Laboratoire de Structure et Propriétés de l'Etat Solide (UMR CNRS 8008)
  • Laboratoire de Structure et Propriétés de l'Etat Solide (UMR CNRS 8008)
  • Université de Lille

External person

J. Liu

  • Department of Physics
  • Arizona State University

External person

Can Zhang

  • University of Illinois at Urbana-Champaign

External person

Feifei Lian

  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

Shun Lien Chuang

  • Dept. of Elec. and Comp. Engineering
  • University of Illinois Urbana-Champaign
  • Princeton Optronics
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Ctr. Compd. Semiconduct. M.
  • Dept. of Etearical and Computer Eng.
  • Engineering and Computer Science Department
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

V. C. Elarde

  • QPC Lasers, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Sarang Gopalakrishnan

  • Harvard University
  • University of California at Santa Barbara
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • Department of Physics and Institute for Condensed Matter Theory
  • City University of New York
  • Department of Engineering Science and Physics
  • University of Illinois at Urbana-Champaign
  • Harvard University
  • University of Illinois at Urbana-Champaign

External person

Arnoud S. Everhardt

  • Lawrence Berkeley National Laboratory
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • University of Groningen

External person

Jing Guo

  • University of Florida

External person

Jacob G. Smith

  • Oak Ridge National Laboratory

External person

Ashish Kulkarni

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Brookhaven National Laboratory

External person

C. S. Hsu

  • National Formosa University
  • Department of Materials Science and Engineering

External person

Andrew H. Comstock

  • North Carolina State University

External person

Jianzhu Tong

  • Arizona State University
  • Center for Solid State Science

External person

Jidong Samuel Jiang

  • Argonne National Laboratory
  • Argonne National Laboratory

External person

Harry Atwater

  • California Institute of Technology
  • Div. of Engrg. and Appl. Sci.
  • Kavli Nanoscience Institute
  • The Joint Center for Artificial Photosynthesis
  • Applied Physics
  • Department of Applied Physics and Materials Science
  • ACS
  • ACS Photonics
  • Acs Omega
  • California Institute of Technology
  • California Institute of Technology Division of Engineering and Applied Science

External person

Numair Ahmed

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Scienceand Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhiheng Lyu

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. Dana

  • Physics Department
  • Bilkent University
  • Physics Department
  • Stanford University

External person

David J. Smith

  • Arizona State University
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Center for Solid State Science
  • University of Illinois at Urbana-Champaign

External person

Ke An

  • Oak Ridge National Laboratory

External person

Cun Zheng Ning

  • Arizona State University
  • School of Electrical
  • Arizona State University

External person

Hua Zhou

  • Argonne National Laboratory
  • The University of Chicago
  • United States Department of Energy

External person

Li Huey Tan

  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Dept. of Chem. and the Beckman Inst.
  • Beckman Institute for Advanced Science and Technology
  • Departments of Chemistry
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Maxime Leroux

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Bon Woong Koo

  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University

External person

Ji Young Oh

  • Electronics and Telecommunications Research Institute
  • University of Texas at Dallas

External person

Yen Ting Lu

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. Moore

  • Georgia Institute of Technology
  • Sch. of Materials Sci./Engineering
  • Georgia Institute of Technology

External person

Wei Zhang

  • Nano Sensors Group
  • University of Illinois Urbana-Champaign
  • Massachusetts Institute of Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • Department of Chemistry
  • Departments of Chemistry
  • Department of Chemistry

External person

R. Darvishi Kamachali

  • Federal Institute for Materials Research and Testing Berlin

External person

Bjørn Ove Fimland

  • Norwegian University of Science and Technology

External person

X. Zhang

  • Arizona State University
  • Department of Physics and Astronomy

External person

E. Breckenfeld

  • Materials Science and Technology Division, Code 6364, Naval Research Laboratory
  • Naval Research Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jun Ma

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Qing Wang

  • ShanghaiTech University

External person

Lan Yu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • IBM Research
  • IBM
  • UIUC
  • UIUC
  • University of Illinois at Urbana-Champaign

External person

R. V K Mangalam

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ting Lin

  • CAS - Institute of Physics
  • University of Chinese Academy of Sciences

External person

Jane Howe

  • Hitachi High Technologies America
  • Hitachi, Ltd.

External person

Ann Se Choi

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Qiaoshi Zeng

  • Center for High Pressure Science & Technology Advanced Research
  • Southeast University, Nanjing

External person

M. B. Weissman

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sangho Lim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

W. Petuskey

  • Arizona State University
  • Department of Chemistry

External person

Shin Muramoto

  • National Institute of Standards and Technology

External person

Armin Gölzhäuser

  • Bielefeld University

External person

Nicholas McDonnell

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

C. C. Fu

  • Taiwan Semiconductor Manufacturing Company
  • Feng Chia University
  • Department of Materials Science and Engineering

External person

Sung Kim

  • Seoul National University

External person

Yalin Lu

  • University of Science and Technology of China

External person

Fufei An

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Middey

  • University of Arkansas System
  • Department of Physics

External person

C. Ma

  • Georgia Institute of Technology
  • Sch. of Materials Sci./Engineering
  • Georgia Institute of Technology

External person

Brent M. Devetter

  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Pacific Northwest National Laboratory
  • Center for Microanalysis of Materials
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tom Wu

  • King Abdullah University of Science and Technology
  • Division of Physical Sciences and Engineering

External person

Qiye Zheng

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Lawrence Berkeley National Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley

External person

J. M. Cowley

  • Arizona State University
  • Department of Physics and Astronomy

External person

Peng Wang

  • Nanjing University

External person

Chong Liu

  • Stanford University
  • Stanford University
  • The University of Chicago
  • Stanford University

External person

Jiangjiexing Wu

  • Tianjin University
  • University of Illinois at Urbana-Champaign
  • Nanjing University

External person

Fengyuan Shi

  • University of Illinois at Chicago

External person

Shankar Sivraramakrishnan

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. Hoiert

  • SINTEF
  • Norwegian University of Science and Technology
  • Department of Physics, Norwegian Univ. of Sci. Technology

External person

M. Den Hertog

  • UPR2940
  • CNRS
  • CNRS Centre National de la Recherche Scientifique
  • Institut NÉEL

External person

J. F. Zasadzinski

  • Illinois Institute of Technology
  • Department of Physics

External person

Colette Lebrun

  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Université Grenoble Alpes

External person

Zhenyao Wu

  • University of South Carolina

External person

Malcolm Durkin

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Colorado Boulder
  • University of Illinois at Urbana-Champaign
  • National Institute of Standards and Technology

External person

D. Gall

  • Rensselaer Polytechnic Institute
  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Iowa

External person

B. Haas

  • Université Grenoble Alpes
  • Commissariat à l’énergie atomique et aux énergies alternatives

External person

Ivan A. Sadovskyy

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

David J. Wetzel

  • Departments of Chemistry
  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ngoc T. Nguyen

  • University of Oregon
  • Department of Chemistry
  • Department of Chemistry and Materials Science Institute, University of Oregon

External person

James J. Pasquesi

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hsien Chih Huang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Changwoo Sun

  • Department of Materials Science and Engineering, KAIST
  • KAIST
  • Korea Advanced Institute of Science and Technology
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chu Yun Hwang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. H. Wen

  • Nanjing University
  • CAS - Institute of Physics
  • Department of Physics
  • Center for Superconducting Physics and Materials

External person

Yujie Xiong

  • University of Washington
  • Washington University St. Louis
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ying Wang

  • Louisiana State University

External person

Kai Tak Lam

  • University of Florida
  • University of Florida

External person

X. Xia

  • University of Illinois Urbana-Champaign
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. Y. Jiang

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hang Xing

  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Hunan University
  • Department of Chemistry
  • Departments of Chemistry
  • Institute of Chemical Biology and Nanomedicine
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemistry
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Munho Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Electrical and Electronic Engineering
  • Nanyang Technological University
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jincai Zhao

  • CAS - Institute of Chemistry
  • Key Laboratory of Photochemistry

External person

D. A. Muller

  • Cornell University
  • Kavli Institute at Cornell for Nanoscale Science
  • School of Applied and Engineering Physics
  • Stanford University
  • Adelphi University
  • Boston University
  • Brunel University London
  • California Institute of Technology
  • Columbia University
  • National Institute for Nuclear Physics
  • University of Ferrara
  • University of Padua
  • University of Perugia
  • University of Pisa
  • University of California, Berkeley
  • Massachusetts Institute of Technology
  • Nagoya University
  • Rutgers - The State University of New Jersey, New Brunswick
  • Rutherford Appleton Laboratory
  • Tohoku University
  • University of British Columbia
  • University of California at Santa Barbara
  • University of California at Santa Cruz
  • University of Cincinnati
  • University of Colorado Boulder
  • University of Genoa
  • University of Illinois Urbana-Champaign
  • University of Massachusetts
  • University of Oregon
  • University of Tennessee, Knoxville
  • University of Victoria BC
  • University of Washington
  • University of Wisconsin-Madison
  • Vanderbilt University
  • Yale University
  • Colorado State University
  • Lawrence Berkeley National Laboratory
  • University of Mississippi
  • Sogang University
  • School of Applied and Engineering Physics
  • Sezione di Bologna
  • Istituto Nazionale di Fisica Nucleare
  • Istituto Nazionale di Fisica Nucleare
  • Istituto Nazionale di Fisica Nucleare
  • Istituto Nazionale di Fisica Nucleare
  • Istituto Nazionale de Fisica Nucleare Sezione di Ferrara
  • INFN
  • INFNSezione di Padova
  • High Energy Accelerator Research Organization, Tsukuba
  • Indiana University Bloomington
  • TRIUMF
  • Kavli Institute
  • Department of Applied Physics
  • Kavli Institute

External person

Huajian Gao

  • Max-Planck-Inst. fur Metallforschung
  • Stanford University
  • Butler Hospital
  • Max Planck Inst. for Metals Research
  • Max Planck Institute for Intelligent Systems
  • Brown University
  • Division of Engineering
  • Department of Mechanical Engineering
  • Stanford University
  • Stanford University
  • Nanyang Technological University
  • Agency for Science, Technology and Research, Singapore

External person

Chaoyang Liu

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

U. Pietsch

  • University of Potsdam

External person

J. J. Kavich

  • Argonne National Laboratory
  • University of Illinois at Chicago
  • Department of Physics
  • Material Science Division
  • The University of Chicago
  • Argonne National Laboratory
  • United States Department of Energy
  • University of Illinois at Chicago

External person

Alexander L. Antaris

  • Stanford University

External person

Emil S. Bozin

  • Brookhaven National Laboratory
  • Department of Condensed Matter Physics and Materials Science

External person

Purnima Balakrishnan

  • National Institute of Standards and Technology

External person

R. André

  • Université Grenoble Alpes
  • CNRS Centre National de la Recherche Scientifique
  • Institut NÉEL

External person

G. Ren

  • Chinese Academy of Sciences
  • Beijing Lab. of Electron Microscopy

External person

A. Lefebvre

  • Universite des Sciences et Technologies de Lille
  • Laboratoire de Structure et Propriétés de l'Etat Solide (UMR CNRS 8008)
  • Laboratoire de Structure et Propriétés de l'Etat Solide (UMR CNRS 8008)
  • Université de Lille

External person

Neil M. Wilson

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

Henning Vieker

  • Bielefeld University

External person

Woo Seok Choi

  • Department of Physics, Sungkyunkwan University
  • Sungkyunkwan University
  • Korean Agency for Defense Development
  • Oregon State University
  • Gwangju Institute of Science and Technology
  • University of Illinois Urbana-Champaign
  • Oak Ridge National Laboratory
  • Materials Science and Technology Division, Oak Ridge National Laboratory

External person

T. Feng

  • Rutgers - The State University of New Jersey, New Brunswick

External person

B. Q. Lee

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Lynch

  • Arizona State University
  • IFP Énergies nouvelles

External person

Dmitry Aldakov

  • Commissariat à l’énergie atomique et aux énergies alternatives
  • Université Grenoble Alpes
  • CNRS Centre National de la Recherche Scientifique
  • CNRS

External person

Jinsong Cui

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

W. K. Kwok

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Yuqi Yan

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

Holger Hellwig

  • University of Illinois Urbana-Champaign
  • Department of Geology
  • Department of Geography
  • Department of Geology, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gangbin Yan

  • The University of Chicago

External person

Sylvia Matzen

  • Université Paris-Saclay
  • CNRS Centre National de la Recherche Scientifique

External person

Tammene Naddo

  • Southern Illinois University
  • Department of Chemistry and Biochemistry
  • Department of Chemistry and Biochemistry
  • Southern Illinois University

External person

Younan Xia

  • University of Washington
  • Harvard University
  • Washington University St. Louis
  • Georgia Institute of Technology
  • Department of Biomedical Engineering
  • Biomedical Engineering
  • Department of Chemistry, University of Washington
  • Department of Chemistry
  • Department of Chemistry
  • Department of Biomedical Engineering
  • Department of Biomedical Engineering
  • Wallace H. Coulter Department of Biomedical Engineering
  • Harvard University
  • Emory University
  • Georgia Institute of Technology

External person

Yasukazu Murakami

  • Tohoku University
  • Institute of Multidisciplinary Research for Advanced Materials

External person

Li Ji

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Neus Domingo

  • Autonomous University of Barcelona

External person

Michael A. Caple

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. K. Weiss

  • Arizona State University
  • Center for Solid State Science

External person

Hua Zhou

  • Tsinghua University

External person

Xianlong Wei

  • Peking University
  • Department of Electronics
  • Key Laboratory for Physics and Chemistry of Nanodevices

External person

Gregory B. Thompson

  • University of Alabama
  • Metallurgical and Materials Engineering Department

External person

S. W. Kim

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Masae Kikuchi

  • Tohoku University

External person

Dong Liu

  • University of Wisconsin-Madison
  • Department of Electrical Engineering, NanoFAB Center, University of Texas at Arlington
  • The University of Texas at Arlington
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Texas at Arlington
  • University of Texas at Arlington College of Engineering
  • University of Wisconsin

External person

Rita Garrido-Menacho

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Timothy K. Yang

  • University of Illinois Urbana-Champaign
  • Department of Chemistry
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Chicago
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Chicago

External person

Wilfrid Prellier

  • École nationale supérieure d'ingénieurs de Caen
  • Laboratoire CRISMAT
  • CNRS
  • CNRS Centre National de la Recherche Scientifique
  • Laboratoire CRISMAT

External person

Kisung Kang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Humboldt University of Berlin
  • University of Illinois at Urbana-Champaign

External person

Ying He

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chadd Kiggins

  • Xerion Advanced Battery Corp.
  • Xerion Advanced Battery Corporation

External person

Mathilde M. Hanchard

  • University of Illinois at Urbana-Champaign

External person

Paul Steadman

  • Diamond Light Source

External person

Dafei Jin

  • Argonne National Laboratory
  • Argonne National Laboratory

External person