Network
Olgica Milenkovic
- Electrical and Computer Engineering - Franklin W. Woeltge Professor, Professor
- Coordinated Science Lab - Professor
- Statistics - Professor
- Carl R. Woese Institute for Genomic Biology - Affiliate
- Siebel School of Computing and Data Science - Professor
Person: Academic
John Michael Dallesasse
- Grainger College of Engineering - Associate Dean of Facilities and Capital Planning
- Electrical and Computer Engineering - Professor
- Micro and Nanotechnology Lab - Professor
Person: Academic
Can Bayram
- Electrical and Computer Engineering - Intel Alumni Endowed Faculty Scholar, Associate Professor
- Micro and Nanotechnology Lab - Associate Professor
- Coordinated Science Lab - Associate Professor, Health Care Engineering Systems Center
- Biomedical and Translational Sciences - Associate Professor
Person: Academic
Xiuling Li
- Electrical and Computer Engineering - Donald Biggar Willett Professor Emerita
Person: Academic
Umberto Ravaioli
- Coordinated Science Lab - Professor
- Electrical and Computer Engineering - Professor
- Micro and Nanotechnology Lab - Professor
- Grainger College of Engineering - Director of Academic Programs for ZJU-Illinois Joint Institute
Person: Academic
Charles M Schroeder
- Materials Science and Engineering - James Economy Professor, Professor
- Chemical and Biomolecular Engineering - Dr. Ray and Beverly Mentzer Professor, Professor
- Bioengineering - Professor
- Materials Research Lab - Professor
- Chemistry - Affiliate
- Beckman Institute for Advanced Science and Technology - Professor
Person: Academic
Aleksei Aksimentiev
- Physics - Professor
- National Center for Supercomputing Applications (NCSA) - Professor
- Carl R. Woese Institute for Genomic Biology - Affiliate
- Bioengineering - Professor
- Beckman Institute for Advanced Science and Technology - Professor
Person: Academic
Joseph W Lyding
- Electrical and Computer Engineering - Professor, Robert C. MacClinchie Distinguished Professor
- Beckman Institute for Advanced Science and Technology - Professor
- Coordinated Science Lab - Professor
- Materials Science and Engineering - Professor
- Micro and Nanotechnology Lab - Professor
Person: Academic
Andreas C Cangellaris
- Electrical and Computer Engineering - Professor
- Coordinated Science Lab - Professor
Person: Academic
Lav R Varshney
- Electrical and Computer Engineering - Associate Professor
- Siebel School of Computing and Data Science - Associate Professor
- Industrial and Enterprise Systems Engineering - Associate Professor
- Coordinated Science Lab - Associate Professor
- Neuroscience Program - Associate Professor
- National Center for Supercomputing Applications (NCSA) - Associate Professor, Center for Digital Agriculture
- Beckman Institute for Advanced Science and Technology - Associate Professor
- Carl R. Woese Institute for Genomic Biology - Affiliate
Person: Academic
Jianming Jin
- Electrical and Computer Engineering - Y. T. Lo Chair, Professor
- Grainger College of Engineering - Assistant Dean for Zhejiang University-UIUC Institute Engagement, Professor, Zhejiang University-UIUC Institute
Person: Academic
Bo Li
- Siebel School of Computing and Data Science - Assistant Professor
- Electrical and Computer Engineering - Assistant Professor
- Information Trust Institute - Assistant Professor
- National Center for Supercomputing Applications (NCSA) - Assistant Professor
Person: Academic
Huimin Zhao
- Chemical and Biomolecular Engineering - Steven L. Miller Chair, Professor
- Bioengineering - Professor
- Biomedical and Translational Sciences - Professor
- Chemistry - Department Affiliate
- Carl R. Woese Institute for Genomic Biology - Professor
Person: Academic
Christopher J Fields
- Biotechnology Center - Director, High-Performance Biological Computing (HPCBio)
Person: Academic
Dmitriy V. Melnikov
- Clarkson University
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- Physics Department
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
J. Wang
- University of Illinois Urbana-Champaign
- Computer Engineering University of Illinois at Urbana
- Hebrew University of Jerusalem
- Engineering Research Center for Compound Semiconductor Microelectronics
- Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Beckman Institute for Advanced Science and Technology and Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
D. Jovanovic
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Center for Compound Semiconductor Microelectronics
- Materials Research Laboratory
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
- University of Illinois
- University of Illinois at Urbana-Champaign
External person
S. Briggs
- Department of Electrical and Computer Engineering
- Beckman Institute for Advanced Science and Technology
- University of Illinois Urbana-Champaign
- Department of Electrical Engineering University of Illinois at Urbana
- Coordinated Science Laboratory
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
- University of Illinois
- University of Illinois at Urbana-Champaign
External person
P. Matagne
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Karl Hess
- Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Beckman Institute for Advanced Science and Technology
- Center for Compound Semiconductor Microelectronics
- Coordinated Science Laboratory
- University of Illinois Urbana-Champaign
- University of Kentucky
- Samsung
- Alcatel-Lucent
- IEEE
- Nokia
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Beckman Institute and Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering
- Department of Physics
- Everitt Laboratoy
- University of Illinois at Urbana-Champaign
- University of Illinois
- University of Illinois at Urbana-Champaign
External person
Hui Zeng
- Hunan University
- Yangtze University
- School of Physics and Optoelectronic Engineering, Yangtze University
- University of Illinois Urbana-Champaign
- College of Physical Science and Technology
- Beckman Institute for Advanced Science and Technology
- College of Material Science and Engineering
- College of Material Science and Engineering
- University of Illinois at Urbana-Champaign
External person
Nagendra Bala Murali Athreya
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Maria E. Gracheva
- Clarkson University
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Physics Department
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
F. H. Julien
- Universite Paris XI
- Université Paris-Sud
- Hebrew University of Jerusalem
- Bâtiment 220
- Bat 220
- CNRS
- ComUE Paris-Saclay
- CNRS Centre National de la Recherche Scientifique
- Universite Paris-Sud XI
- Institut d'Electronique Fondamentale
- Université Paris-Saclay
External person
L. X. Zhang
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Yu B. Lyanda-Geller
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
Weidong Sheng
- Fudan University
- National Research Council of Canada
- National Research Council of Canada
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology and Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering
- Department of Physics
- Inst. for Microstructural Sciences
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Richard M. Martin
- Stanford University
- University of Illinois Urbana-Champaign
- University of Cambridge
- Jülich Research Centre
- Department of Physics
- Beckman Institute for Advanced Science and Technology
- Department of Physics
- Department of Physics
- Department of Physics
- Department of Applied Physics, Stanford University
- Department of Physics
- Department of Physics
- Department of Applied Physics
- Institut für Festkörperforschung
- Natl. Ctr. for Supercomp. Applic.
- University of Illinois at Urbana-Champaign
- Stanford University
- University of Illinois at Urbana-Champaign
External person
Aaron Thean
- Motorola
- Freescale Semiconductor
- Motorola Incorporated
- Coordinated Science Laboratory
- Motorola Inc.
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Advanced Product Research and Development Laboratory
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- National University of Singapore
- Singapore Hybrid-Integrated Next-Generation μ-Electronics Centre (SHINE)
External person
S. Tarucha
- The University of Tokyo
- NTT Basic Research Laboratories
- Beckman Institute for Advanced Science and Technology
- JST
- Nippon Telegraph & Telephone
- Japan Science and Technology Agency
- University of Illinois Urbana-Champaign
- ERATO Mesoscopic C
- Department of Applied Physics
- Tarucha Mesoscopic Correlation Project ERATO
- Department of Applied Physics
- ICORP Spin Information Project
- Department of Applied Physics
- ERATO Mesoscopic Correlation Project & Department of Physics
External person
J. S. De Sousa
- Departamento de Física
- Universidade Federal do Ceará
- Campus do Pici
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- Departamento de Física
- University of Illinois at Urbana-Champaign
External person
D. G. Austing
- NTT Basic Research Laboratories
- Beckman Institute for Advanced Science and Technology
- National Research Council of Canada
- National Research Council of Canada
- Nippon Telegraph & Telephone
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Inst. for Microstructural Sciences
- Inst. for Microstructural Sciences
- Inst. of Microstructural Sciences
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Jianwei Wei
- Chongqing University
- College of Optoelectronic Information, Chongqing University of Technology
- Chongqing Institute of Technology
- College of Mathematics and Physics
- College of Optoelectronic Information
External person
J. L. Educato
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- Coordinated Science Laboratory
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
- University of Illinois
- University of Illinois at Urbana-Champaign
External person
Aditya Sarathy
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Anuj Girdhar
- Department of Physics
- Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign
- University of Illinois Urbana-Champaign
- Department of Physics
- Department of Physics
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
K. B. Kahen
- Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Department of Electrical and Computer Engineering
- Coordinated Science Laboratory
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
J. M. Bigelow
- Illinois, Urbana, IL, USA
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Dept of Electr Eng, Univ of
- Center for Compound Semiconductor Microelectronics
- Beckman Institute for Advanced Science and Technology
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
- Universidade de São Paulo
- University of Illinois at Urbana-Champaign
External person
Mingye Xiong
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Satyadev Nagaraja
- Beckman Institute for Advanced Science and Technology
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
M. Wagner
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois
- University of Illinois at Urbana-Champaign
External person
V. N. Freire
- Departamento de Física
- Universidade Federal do Ceará
- Universidade Federal de Ceará
- Campus do Pici
- Departamento de Física
External person
L. X. Zhang
- University of Illinois Urbana-Champaign
- IEEE
- Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
P. Boucaud
- Hebrew University of Jerusalem
- Université Paris-Sud
- ComUE Paris-Saclay
- CNRS
- Universite Paris-Sud XI
- Universite Paris XI
- Université Paris-Saclay
- CNRS Centre National de la Recherche Scientifique
- Universite Cote d'Azur
External person
Marcelo A. Kuroda
- University of Illinois Urbana-Champaign
- Department of Computer Science
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
R. Planel
- CNET-Bagneux
- UPR CNRS 20
- Hebrew University of Jerusalem
- Universite Paris XI
- Orange Labs
- LPN Laboratoire de Photonique et de Nanostructures
- Université Paris-Sud
- Université Paris 7
- Universite Paris-Sud XI
- ComUE Paris-Saclay
- Lab. Microstructures Microlectron.
- CNRS
- Université Paris-Saclay
- Lab. Microstructures Microlectron.
- Lab. Microstucture et Microlectron.
External person
T. Kawamura
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
E. Yoon
- Seoul National University
- School of Materials Science and Engineering
- Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University
- Department of Materials Science and Engineering
- Compound Semiconductor Epitaxy Laboratory
- Sch. of Mat. Science and Engineering
External person
Huifang Hu
- Hunan University
- College of Physics and Mircoelectronic Science
- College of Material Science and Engineering
- College of Material Science and Engineering
External person
Leornado R C Fonseca
- Motorola
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
Marcelo A. Kuroda
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Hu Qiu
- University of Illinois Urbana-Champaign
- Nanjing University of Aeronautics and Astronautics
- State Key Laboratory of Mechanics and Control of Mechanical Structures, Nanjing University of Aeronautics and Astronautics
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
Marcos H. Degani
- Center for Compound Semiconductor Microelectronics
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- Coordinated Science Laboratory
- University of Illinois at Urbana-Champaign
- Universidade de São Paulo
- University of Illinois at Urbana-Champaign
External person
Chaitanya Sathe
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
E. F. Da Silva
- Universidade Federal de Pernambuco
- Cidade Universitária
- Universidade Federal de São Carlos
- Cidade Universitaria
- Departamento de Física
- Departamento de Física
- Departamento de Física
External person
Z. Moussa
- Université Paris-Sud
- Hebrew University of Jerusalem
- Universite Paris XI
- ComUE Paris-Saclay
- Universite Paris-Sud XI
- Université Paris-Saclay
- CNRS
External person
Zhuoran Wang
- University of Electronic Science and Technology of China
- School of Optoelectronic Information
- School of Information and Communication Engineering
External person
W. Jiang
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
Zhiyuan Lin
- School of Information and Communication Engineering
- University of Electronic Science and Technology of China
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- School of Optoelectronic Information
- University of Illinois at Urbana-Champaign
External person
Samwel Sekwao
- University of Illinois Urbana-Champaign
- Department of Physics
- Department of Physics and Beckman Institute
- Department of Bioengineering and Beckman Institute
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
H. Noguchi
- The University of Tokyo
- Institute of Industrial Science
- Research Center for Advanced Science and Technology
External person
Julien Vidal
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Hassan Kaatuzian
- Amirkabir University of Technology
- Photonics Research Laboratory
- Photonics Research Laboratory
External person
Gregory Timp
- University of Illinois Urbana-Champaign
- University of Notre Dame
- University of Illinois at Urbana-Champaign
- University of Notre Dame
- University of Illinois at Urbana-Champaign
External person
Jun Zhao
- Yangtze University
- College of Physical Science and Technology
- School of Physics and Optoelectronic Engineering, Yangtze University
External person
Rajat Chakraborty
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
R. Hanson
- Delft University of Technology
- ERATO Mesoscopic Correlation Project
- Kavli Institute of Nanoscience Delft
- Department of NanoScience
External person
J. Jimenez
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
L. P. Kouwenhoven
- Delft University of Technology
- ERATO Mesoscopic Correlation Project
- Kavli Institute of Nanoscience Delft
- Department of NanoScience
- Microsoft Station Q Delft
- Microsoft Quantum Lab Delft
External person
V. Berger
- Thomson-CSF
- Universite Paris XI
- Thales
- Université Paris-Sud
- Universite Paris-Sud XI
- Laboratoire Central de Recherche
- ComUE Paris-Saclay
- Université Paris-Saclay
External person
Iman Taghavi
- Amirkabir University of Technology
- University of Illinois Urbana-Champaign
- Photonics Research Laboratory
- Beckman Institute for Advanced Science and Technology
- Photonics Research Laboratory
- University of Illinois at Urbana-Champaign
External person
H. Sakaki
- The University of Tokyo
- Institute of Industrial Science
- Research Center for Advanced Science and Technology
External person
H. Chang
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Mueen Nawaz
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
J. Nagle
- Thomson-CSF
- Universite Paris XI
- Thales
- Université Paris-Sud
- Universite Paris-Sud XI
- Laboratoire Central de Recherche
- ComUE Paris-Saclay
- Université Paris-Saclay
External person
J. Kolodzey
- University of Illinois Urbana-Champaign
- University of Delaware
- Center for Compound Semiconductor Microelectronics
- Department of Electrical and Computer Engineering
- Center for Compound Semiconductor Microelectronics
- Department of Electrical Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Center for Compound Semiconductor Microelectronics
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Apratim Khandelwal
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
R. Prazeres
- Bat. 209D
- Universite Paris XI
- Université Paris-Sud
- ComUE Paris-Saclay
- Universite Paris-Sud XI
- Université Paris-Saclay
External person
Khalid Ismail
- Cairo University
- IBM
- IEEE
- University of Illinois Urbana-Champaign
- Department of Electronics
- University of Illinois at Urbana-Champaign
External person
Joseph S. Friedman
- Northwestern University
- University of Texas at Dallas
- Center for Quantum Devices
- Department of Electrical and Computer Engineering
- University of Texas at Dallas
External person
John Shumway
- Arizona State University
- University of Illinois Urbana-Champaign
- National Renewable Energy Laboratory
- Department of Physics
- Beckman Institute for Advanced Science and Technology
- Department of Physics and Astronomy
- Department of Physics, Arizona State University
- Department of Physics
- Department of Physics
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
K. Kim
- North Carolina State University
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
External person
Jihan Kim
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
J. M. Ortega
- Bat. 209D
- Universite Paris XI
- Université Paris-Sud
- ComUE Paris-Saclay
- Universite Paris-Sud XI
- Université Paris-Saclay
External person
Yong Hoon Kim
- University of Illinois Urbana-Champaign
- Department of Physics
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
G. A. Farias
- Departamento de Física
- Universidade Federal do Ceará
- Departamento de Física
External person
Guohui Yuan
- School of Information and Communication Engineering
- University of Electronic Science and Technology of China
External person
Aleksandra Radenovic
- Swiss Federal Institute of Technology Lausanne
- Laboratory of Nanoscale Biology
- University of Lausanne
- School of Medicine
- School of Engineering
External person
Yi Chia Tsai
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Micro and Nanotechnology Lab
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
R. Grundbacher
- University of Illinois Urbana-Champaign
- Ctr. Compd. Semiconduct. M.
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering
- Materials Research Laboratory
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
J. J. Coleman
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Materials Research Laboratory
- Engineering Research Center for Compound Semiconductor Microelectronics
- University of Illinois Urbana-Champaign
- IEEE
- Department of Electrical and Computer Engineering
- NASA Goddard Space Flight Center
- University of Texas at Dallas
- Ctr. Compd. Semiconduct. M.
- Microelectronics Laboratory
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering and Materials Science and Engineering
- Department of Electrical Engineering
- Department of Electrical Engineering and Department of Materials Science
- Microeectronics Laboratory
- Materials Research Laboratory and Everitt Laboratory
- Dept. of Mat. Sci. and Engineering
- Center for Nutrition
- Materials Research Laboratory and Microelectronics Laboratory
- Micro and Nanotechnology Lab
- Department of Electrical Engineering
- Seitz Materials Research Laboratory
- Department of Electrical and Computer Engineering
- Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Dept. of Mat. Sci. and Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois
- University of Illinois at Urbana-Champaign
- University of Texas at Dallas
External person
A. Sugg
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Richard I. Masel
- Department of Dioxide Materials
- Dioxide Materials
- Department of Chemical and Biomolecular Engineering
- University of Illinois Urbana-Champaign
- Dioxide Materials
- Department of Chemical and Biomolecular Engineering
- Roger Adams Laboratory
- Department of Chemical and Biomolecular Engineering
- Department of Chemical and Biomolecular Engineering
- Departments of Chemical and Biomolecular Engineering
- Department of Chemical Engineering
- Deparment of Chemical Engineering
- Dioxide Materials
- Department of Chemical Engineering
- Department of Ceramic Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois
- University of Illinois at Urbana-Champaign
External person
M. Ausloos
- University of Liege
- University of Leicester
- School of Business
- Thomas Jefferson University
- Guy's and St Thomas' NHS Foundation Trust
- Bucharest University of Economic Studies
External person
C. M. Herzinger
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Nahil Sobh
- Department of Mechanical Science and Engineering
- University of Illinois Urbana-Champaign
- Ctr. for Proc. Simulation and Design
- Beckman Institute for Advanced Science and Technology
- Civil and Environmental Engineering, University of Illinois Urbana-Champaign
- Center for Nanoscale Science and Technology
- Department of Theoretical Mechanics
- Dept. of Theoretical/Appl. Mechanics
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
In Ho Lee
- Korea Institute for Advanced Study
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
R. Evrard
- Université de Liège, Institut de Physique
- Institut de Physique
- University of Liege
- Institut de Physique
External person
Kangguo Cheng
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Michael Graf
- Swiss Federal Institute of Technology Lausanne
- Laboratory of Nanoscale Biology
- School of Engineering
External person
Y. Weng
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Fatemeh Khalili-Araghi
- The University of Chicago
- Department of Physics
- University of Illinois Urbana-Champaign
- University of Illinois at Chicago
- Beckman Institute
- Department of Physics
- Beckman Institute for Advanced Science and Technology
- Department of Physics
- Physics Department
- Department of Biochemistry and Molecular Biology
- Department of Biochemistry and Molecular Biology, University of Chicago
- Department of Biochemistry and Molecular Biology
- Department of Biochemistry and Molecular Biology
- University of Illinois at Urbana-Champaign
- The University of Chicago
- University of Illinois at Chicago
- University of Illinois at Urbana-Champaign
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Hooman Mohseni
- Northwestern University
- Sarnoff Corporation
- Center for Quantum Devices
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S. Kasra Tabatabaei
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
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O. Gauthier-Lafaye
- Universite Paris XI
- Université Paris-Sud
- ComUE Paris-Saclay
- Universite Paris-Sud XI
- Université Paris-Saclay
- CNRS Centre National de la Recherche Scientifique
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S. Sauvage
- Universite Paris XI
- Université Paris-Sud
- ComUE Paris-Saclay
- Universite Paris-Sud XI
- Université Paris-Saclay
- CNRS Centre National de la Recherche Scientifique
- CNRS
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Alan V. Sahakian
- Northwestern University
- Center for Quantum Devices
- Department of Biomedical Engineering
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G. Yu
- National Research Council of Canada
- National Research Council of Canada
- Inst. for Microstructural Sciences
- Inst. for Microstructural Sciences
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Kwangmin Park
- School of Materials Science and Engineering
- Seoul National University
- Department of Materials Science and Engineering
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D. W. Bailey
- Beckman Institute for Advanced Science and Technology
- University of South Carolina
- Coordinated Science Laboratory
- University of Illinois Urbana-Champaign
- Dept. of Elec. and Comp. Engineering
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
- University of South Carolina
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J. Laskar
- QDI
- Georgia Institute of Technology
- University of Illinois Urbana-Champaign
- University of Delaware
- Tektronix Inc.
- Allied Corporation
- University of Hawai'i at Mānoa
- VP Advanced Technologies
- Center for Compound Semiconductor Microelectronics
- Department of Electrical Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Center for Compound Semiconductor Microelectronics
- Bendix Aerospace Technology Center
- Department of Elec. Engg.
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Department of Electrical and Computer Engineering
- Center for Compound Semiconductor Microelectronics and the Department of Electrical and Computer Engineering
- Center for Compound Semiconductor Microelectronics
- Tektronix Incorporated
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Hawaii at Manoa
- University of Illinois at Urbana-Champaign
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Allen Taflove
- Northwestern University
- Electrical Engineering and Computer Science Department
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- Center for Quantum Devices
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Karl R. Hofmann
- Leibniz Universität Hannover
- Leibniz University Hannover
- Institute of Electronic Materials and Devices
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Yang Xu
- Zhejiang University
- University of Illinois Urbana-Champaign
- Department of Information Science and Electronic Engineering
- Beckman Institute for Advanced Science and Technology
- Dept. of Mech. and Indust. Eng.
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
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A. Salehi-Khojin
- University of Illinois at Chicago
- Department of Dioxide Materials
- Dioxide Materials
- Department of Chemical and Biomolecular Engineering
- University of Illinois Urbana-Champaign
- Department of Mechanical and Industrial Engineering
- Department of Chemical and Biomolecular Engineering
- Dioxide Materials
- University of Illinois at Urbana-Champaign
- University of Illinois at Chicago
- University of Illinois at Urbana-Champaign
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Nagendra B Athreya
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J. E. Zucker
- AT and T Bell Laboratories
- Alcatel-Lucent
- University of Illinois Urbana-Champaign
- Lucent
- Nokia
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J. Kim
- Korea University
- University of Seoul
- University of Illinois Urbana-Champaign
- CERN
- Chonnam National University
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
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Jacques Destiné
- University of Liege
- Department of Electrical Engineering and Computer Science
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Brett W. Scott
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
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Andras Kis
- Swiss Federal Institute of Technology Lausanne
- Laboratory of Nanoscale Electronics and Structures
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Kevin Y. Lin
- Department of Chemical and Biomolecular Engineering
- University of Illinois Urbana-Champaign
- Department of Chemical and Biomolecular Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
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Yue Li
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
- University of Illinois at Urbana-Champaign
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T. A. Detemple
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
- Department of Electrical and Computer Engineering
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
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B. A. Mason
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Oklahoma
- University of Illinois at Urbana-Champaign
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Fu Chen Hsiao
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- North Carolina State University
- University of Illinois at Urbana-Champaign
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F. Glotin
- Universite Paris XI
- Université Paris-Sud
- ComUE Paris-Saclay
- Universite Paris-Sud XI
- Université Paris-Saclay
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Jin Wang
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
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Robby Peibst
- Institute for Solar Energy Research Hameln
- Institut für Solarenergieforschung Hameln (ISFH)
- Institut fur Solarenergieforschung GmbH Hameln/Emmerthal GmbH Hameln/Emmerthal
- Leibniz University Hannover
- Institute of Electronic Materials and Devices
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Ryan M. Gelfand
- Northwestern University
- University of Central Florida
- Center for Quantum Devices
- College of Optics and Photonics (CREOL), University of Central Florida
External person
Farzad Tehranchi
External person
P. Morin
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F. Bobard
- (EPFL)
- Swiss Federal Institute of Technology
- Swiss Federal Institute of Technology Lausanne
External person
Bohao Wu
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
J. Pozela
- Semiconductor Physics Institute Vilnus
- Semiconductor Physics Institute
- Lithuanian Br. of ICSC-World Lab.
- Center for Physical Sciences and Technology
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Wen Yan Yin
- Zhejiang University
- Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
- Key Laboratory of Advanced Micro/Nano Electronic Devices
- College of Information and Electronic Engineering
- Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
External person
R. Ravishankar
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
L. C. So
External person
M. Klejwa
- & Comput Eng, Urbana, IL, USA
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Won Jun Choi
- Korea Institute of Science and Technology
- Center for OptoElectronic Convergence System
- Nano-Photonics Center
External person
M. E. Givens
- Engineering Research Center for Compound Semiconductor Microelectronics
- University of Illinois Urbana-Champaign
- Materials Research Laboratory
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Eberhard Bugiel
- Leibniz Universität Hannover
- Leibniz University Hannover
- Institute of Electronic Materials and Devices
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Gil De Aquino Farias
External person
J. M. Elzerman
- ERATO Mesoscopic Correlation Project
- Kavli Institute of Nanoscience Delft
- Delft University of Technology
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S. B. Naran
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
A. Pelet
External person
Yu B. Lyanda-Geller
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
F. K. Reinhart
- (EPFL)
- Swiss Federal Institute of Technology
- Swiss Federal Institute of Technology Lausanne
External person
Joseph G. Pellegrino
- National Institute of Standards and Technology
- Natl. Inst. of Standard and Technol.
External person
A. Munnich
External person
B. R. Tuttle
- Behrend College
- Pennsylvania State University
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Beckman Institute for Advanced Science and Technology
- Department of Physics
- University of Illinois at Urbana-Champaign
External person
A. Rudra
- (EPFL)
- Swiss Federal Institute of Technology
- Swiss Federal Institute of Technology Lausanne
External person
A. G. Cullis
- University of Sheffield
- Department of Electronic Engineering
- University of Sheffield
External person
Anlin Xiong
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Luca Pirro
- EPFL
- Swiss Federal Institute of Technology Lausanne
- University of Illinois Urbana-Champaign
- Microelectronic System Laboratory
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
I. J. Chung
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
T. Kawanura
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
P. Vagos
- Bâtiment 220
- Université Paris-Sud
- CNRS
- ComUE Paris-Saclay
- Universite Paris XI
- Université Paris-Saclay
External person
J. M. Biglow
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Paul von Allmen
- Motorola
- Jet Propulsion Laboratory, California Institute of Technology
- University of Illinois Urbana-Champaign
- Solid State Research Center
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
Zhi Chen
- University of Kentucky
- University of Illinois Urbana-Champaign
- Samsung
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
N. Shuall
- Technion-Israel Inst. of Technology
- Technion-Israel Institute of Technology
- Department of Electrical Engineering and Solid State Institute
External person
Jack W. Judy
- University of California, Los Angeles
- Electrical Engineering
- University of California at Los Angeles
External person
J. P. Vigneron
External person
Michael Q. Tu
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
David Soloveichik
- Department of Electrical, and Computer Engineering
- University of Texas at Austin
External person
P. D. Swanson
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
M. A. Dupertuis
- (EPFL)
- Swiss Federal Institute of Technology
- Swiss Federal Institute of Technology Lausanne
External person
J. E. Stocker
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
M. Di Ventra
- University of California at San Diego
- University of Illinois Urbana-Champaign
- Department of Physics
- University of Illinois at Urbana-Champaign
External person
Robert B. Kaufman
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Wenchao Chen
- University of Florida
- Department of Electrical and Computer Engineering
- Zhejiang University
- Now at ZJU-UIUC Institute
- Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
- College of Information Science and Electronic Engineering
- ZJU-UIUC Institute
- Key Lab. of Sci. and Technol. on Electromagnetic Environ. Effects and Electro-optical Engineering
- College of Information Science and Electronic Engineering
- College of Information Science and Electronic Engineering
- Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province
- Logistical Engineering University China
- ZJU-UIUC Institute
- University of Florida
External person
A. R. Sugg
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- Center for Compound Semiconductor Microelectronics and the Department of Electrical and Computer Engineering
- Electrical Engineering Research Laboratory
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
- University of Illinois
External person
Guy Cantraine
External person
Ke Liu
- Swiss Federal Institute of Technology Lausanne
- Laboratory of Nanoscale Biology
- University of Lausanne
- School of Medicine
- School of Engineering
External person
Behnam Enghiad
- University of Illinois Urbana-Champaign
- Department of Chemical and Biomolecular Engineering
- University of Illinois at Urbana-Champaign
External person
S. W. Johnston
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
Er Ping Li
- Agency for Science, Technology and Research, Singapore
- Zhejiang University
- Department of Electromagnetics and Electronic System
- Cyber Innovation Joint Research Center
- College of Information Science and Electronic Engineering
- Laboratory of Advanced Micro/Nano Electronic Devices and Smart System Applications of Zhejiang
- Key Lab of AMESS
- College of Information Science and Electronic Engineering
- ZJU-UIUC Institute
External person
H. Julien
- ComUE Paris-Saclay
- Université Paris-Sud
- Université Paris-Saclay
- CNRS Centre National de la Recherche Scientifique
- CNRS
External person
T. Wang
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Kewei Song
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
David H. Christensen
- Optical Electronic Metrology Group
- National Institute of Standards and Technology
External person
J. C. Van Hay
External person
E. Schacham
- Ariel University
- Department of Electrical and Electronic Engineering
- College of Judea and Samaria
External person
J. Tang
- Center for Compound Semiconductor Microelectronics
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
E. Brocard
- (EPFL)
- Swiss Federal Institute of Technology
- Swiss Federal Institute of Technology Lausanne
External person
Slava V. Rotkin
- Lehigh University
- University of Illinois Urbana-Champaign
- Department of Physics
- Center for Advanced Materials and Nanotechnology
- Department of Physics
- Beckman Institute for Advanced Science and Technology
- Department of Physics
- University of Illinois at Urbana-Champaign
External person
J. L. Dufier
External person
T. Van Der Straaten
- Rush University
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- 3255 Beckman Institute
- Department of Molecular Biophysics
- Department of Molecular Biophysics and Physiology
- University of Illinois at Urbana-Champaign
External person
Shang Chun Lu
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Microsystems Technology Laboratories
- Massachusetts Institute of Technology
- Beckman Institute and Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- Massachusetts Institute of Technology
External person
J. Wang
- (EPFL)
- Swiss Federal Institute of Technology
- Swiss Federal Institute of Technology Lausanne
External person
Robert K. Hickernell
- National Institute of Standards and Technology
- Optical Electronic Metrology Group
External person
W. McMahon
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
D. E. Wohlert
- University of Illinois Urbana-Champaign
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- University of Illinois at Urbana-Champaign
External person
Jeanlex Soares De Sousa
External person
S. Agarwal
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
M. Lu
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
J. Lee
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
K. Požela
- Semiconductor Physics Institute Vilnus
- Semiconductor Physics Institute
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- Center for Physical Sciences and Technology
- University of Illinois at Urbana-Champaign
External person
T. M. Cockerill
- Engineering Research Center for Compound Semiconductor Microelectronics
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering
- Texas Advanced Computing Center
- University of Texas at Austin
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
M. P. Anantram
External person
Kanuo Chen
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
J. Berrocosa
- (EPFL)
- Swiss Federal Institute of Technology
- Swiss Federal Institute of Technology Lausanne
External person
Benoît Vanderheyden
- University of Liege
- Department of Electrical Engineering and Computer Science
External person
D. J. Lockwood
External person
James Kolodzey
External person
S. A. Shah
- Dow Chemical
- University of Illinois Urbana-Champaign
- Dept. of Chem./Biomolec. Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Beckman Institute for Advanced Science and Technology
- Department of Chemical and Biomolecular Engineering
- Dept. of Mat. Sci. and Engineering
- Department of Chemical Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
K. Y. Cheng
- University of Illinois Urbana-Champaign
- National Tsing Hua University
- IEEE
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Center for Compound Semiconductor Microelectronics
- Department of Electrical and Computer Engineering
- Dept. of Mat. Sci. and Engineering
- Department of Electrical Engineering
- Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
- Electrical Engineering Research Laboratory
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Center for Compound Semiconductor Microelectronics
- Center for Compound Semiconductor Microelectronics
- University of Illinois at Urbana-Champaign
- University of Illinois
- University of Illinois at Urbana-Champaign
External person
Alfredo X. Sánchez
- University of Illinois Urbana-Champaign
- Department of Physics and Beckman Institute
- University of Illinois at Urbana-Champaign
External person
Milena Erenburg
- Technische Universität Braunschweig
- Technical University of Braunschweig
- Leibniz University Hannover
- Institute of Semiconductor Technology
- Institute of Electronic Materials and Devices
External person
Mark A. Reed
- Yale University
- Department of Electrical Engineering
- Department of Electrical Engineering
External person
M. Camras
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
S. Seal
External person
L. H. Zhang
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Xueqing Zou
- Peking University
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- School of Physics
- Department of Physics
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
L. H Willems Van Beveren
- ERATO Mesoscopic Correlation Project
- Kavli Institute of Nanoscience Delft
- Delft University of Technology
External person
J. W. Cockburn
- University of Sheffield
- Department of Physics and Astronomy
- Department of Physics
- Department of Physics and Astronomy
- University of Sheffield
External person
J. Frezal
External person
Jinju Lee
- University of Kentucky
- Samsung
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Dept. Elec. Comp. Eng. Beckman I.
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Center for Microanalysis of Materials
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Yusuf Leblebici
- EPFL
- Swiss Federal Institute of Technology Lausanne
- Microelectronic System Laboratory
External person
L. M K Vandersypen
- ERATO Mesoscopic Correlation Project
- Kavli Institute of Nanoscience Delft
- Delft University of Technology
External person
H. Hasegawa
External person
Edwin C. Kan
- University of Illinois Urbana-Champaign
- Stanford University
- Center for Compound Semiconductor Microelectronics
- Department of Electrical and Computer Engineering
- Cornell University
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- Stanford University
- University of Illinois at Urbana-Champaign
- Stanford University
External person
W. Shengh
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Valder Nogueira Freire
External person
Jiandong Feng
- Swiss Federal Institute of Technology Lausanne
- Laboratory of Nanoscale Biology
- School of Engineering
- Zhejiang University
- Zhejiang Lab
External person
P. Guo
External person
John Fettig
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Amandine Leroux
- University of Liege
- Department of Electrical Engineering and Computer Science
External person
Jae Dong Lee
- Daegu Gyeongbuk Institute of Science and Technology
- Department of Emerging Materials Science
External person
F. Fossard
- Universite Paris XI
- Université Paris-Sud
- ComUE Paris-Saclay
- Université Paris-Saclay
- CNRS Centre National de la Recherche Scientifique
- CNRS
External person
S. L. Liew
- University of Sheffield
- Department of Electronic Engineering
- University of Sheffield
External person
Zhendong Yang
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Texas at Austin
- University of Illinois at Urbana-Champaign
External person
V. Thierry-Mieg
- UPR CNRS 20
- LPN Laboratoire de Photonique et de Nanostructures
- Université Paris 7
- Lab. Microstucture et Microlectron.
- Université Paris-Saclay
External person
J. Kaplan
External person
T. Wilkens
- University of Illinois Urbana-Champaign
- Department of Physics
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
N. Holonyak
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Physics
- Department of Electrical and Computer Engineering
- Department of Physics
- Department of Electrical and Computer Engineering
- Center for Compound Semiconductor Microelectronics
- Electrical Engineering Research Laboratory
- Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
- Materials Research Laboratory
- Beckman Institute for Advanced Science and Technology
- IEEE
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Dumitru Dumcenco
- Swiss Federal Institute of Technology Lausanne
- Laboratory of Nanoscale Electronics and Structures
External person
Vinayak P. Dravid
- Northwestern University
- Department of Materials Science and Engineering
- Department of Materials Science and Engineering
External person
N. Koshida
External person
A. J. Sengers
- University of Illinois Urbana-Champaign
- University of Washington
- Department of Electrical and Computer Engineering
- University of Washington
External person
Lukas Janavicius
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
David J. Brady
- Duke University
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
- Duke University
External person
Kang Hun Ahn
- Max-Planck-Inst. F. Physik K.
- Max-Planck-Institute for the Physics of Complex Systems
External person
M. Hopkinson
- University of Sheffield
- Department of Electronic Engineering
- University of Sheffield
External person
T. K. Tang
- Engineering Research Center for Compound Semiconductor Microelectronics
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
L. M. Miller
- Engineering Research Center for Compound Semiconductor Microelectronics
- University of Illinois Urbana-Champaign
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Department of Electrical and Computer Engineering
- Department of Electrical and Computer Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
M. Cahay
External person
Voon Yew Thean
- University of Illinois Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
External person
Mansun Chan
- Hong Kong University of Science and Technology
- The University of Hong Kong
- Department of Electronic and Computer Engineering
- Department of Chemistry
External person
M. Razeghi
- Northwestern University
- Center for Quantum Devices
- Center for Quantum Devices
- Center for Photonic Communication and Computing
- Center for Quantum Devices
- Center for Quantum Devices
- Department of Electrical Engineering and Computer Science
- Department of Electrical Engineering and Computer Science
- EECS Department
- Department of Electrical Engineering and Computer Science
- Department of Electrical Engineering and Computer Sciences
- Center for Quantum Devices
- Department of Electrical Engineering and Computer Science
- Center for Quantum Devices
- Electrical Engineering and Computer Science Department
External person
Seyedkasra Tabatabaei
External person
Aditya Sarathya
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
E. Finkman
- Technion-Israel Inst. of Technology
- Technion-Israel Institute of Technology
- Department of Electrical Engineering and Solid State Institute
External person
S. Bandyopadhyay
External person
A. Stella
External person
M. Urquidi-Macdonald
External person
P. H. Jouneau
- (EPFL)
- Swiss Federal Institute of Technology
- Université Grenoble Alpes
- Commissariat à l’énergie atomique et aux énergies alternatives
- Swiss Federal Institute of Technology Lausanne
External person
R. Miles
- (EPFL)
- Swiss Federal Institute of Technology
- Swiss Federal Institute of Technology Lausanne
External person
G. Bahir
- Technion-Israel Inst. of Technology
- Technion-Israel Institute of Technology
- University of California at Santa Barbara
- Department of Electrical Engineering and Solid State Institute
- Department of Electrical and Computer Engineering
- UC Santa Barbara College of Engineering
External person
Raman Kumar
- University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Boya Wang
- Department of Electrical, and Computer Engineering
- University of Texas at Austin
External person