Network

Brian T Cunningham

Person: Academic

Songbin Gong

Person: Academic

Sung Jin Park

  • Baen Park IIlumination
  • Eden Park Illumination
  • Eden Park lllumination Inc.
  • Society for Information Display
  • EP Purification, Inc.
  • University of Illinois Urbana-Champaign
  • IEEE
  • American Chemical Society
  • Directed Energy Professional Society
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Eden Park Illumination, Inc.
  • Laboratory for Optical Physics and Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign
  • Cygnus Photonics
  • University of Illinois
  • Eden Park Foundation
  • University of Illinois at Urbana-Champaign

External person

Clark J. Wagner

  • Department of Electrical and Computer Engineering
  • Nano Sensors Group
  • Philips Lighting
  • Philips
  • University of Illinois Urbana-Champaign
  • National Instruments
  • Philips Research
  • Philips Medical Systems US
  • Philips Lighting
  • Koninklijke Philips N.V.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Laboratory for Optical Physics and Engineering
  • National Institute of Standards and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

J. Gao

  • Advanced Lighting Technology, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Everitt Laboratoy
  • Applied Physics Laboratory
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

A. E. Mironov

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Laboratory for Optical Physics and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Laboratory for Optical Physics and Engineering
  • Cygnus Photonics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

A. A. Senin

  • YAG Business Unit
  • II-VI Incorporated
  • RAS - P.N. Lebedev Physics Institute
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

A. W. McCown

  • University of Illinois Urbana-Champaign
  • Los Alamos National Laboratory
  • Laser Physics Group
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Laser Physics Group (P16)
  • Everitt Laboratoy
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Jose A. Rivera

  • Micro and Nanotechnology Lab
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Laboratory for Optical Physics and Engineering
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Meng Lu

  • Iowa State University
  • SRU Biosystems Incorporated
  • SRU Biosystems
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • SRU Biosystems, Inc.
  • Nano Sensors Group
  • University of Illinois Urbana-Champaign
  • SRU Biosystems
  • Department of Electrical and Computer Engineering
  • Department of Mechanical Engineering
  • Laboratory of Integrated Optical Sensors
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Iowa State University
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • Iowa State University

External person

Y. Xiao

  • Alfalight, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

N. P. Ostrom

  • Nuvonyx, Inc.
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. J. Zhu

  • Xi'an Polytechnic University
  • Korea Advanced Institute of Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Physics
  • Department of Physics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Princeton University
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Sehyun Park

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Rice University
  • University of Illinois at Urbana-Champaign

External person

J. T. Verdeyen

  • CU Aerospace
  • University of Illinois Urbana-Champaign
  • CU Aerospace
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Electrical Engineering Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. N. Ediger

  • Naval Research Laboratory
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Everitt Laboratoy
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

J. D. Readle

  • Oak Ridge National Laboratory
  • Agile Technologies, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

D. B. Geohegan

  • University of Illinois Urbana-Champaign
  • Oak Ridge National Laboratory
  • Department of Electrical and Computer Engineering
  • Solid State Division
  • Department of Physics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

C. M. Herring

  • Caviton, Inc.
  • Eden Park Illumination
  • University of Illinois Urbana-Champaign
  • Eden Park Illumination, Inc.
  • Laboratory for Optical Physics and Engineering
  • Everitt Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Inc.
  • University of Illinois at Urbana-Champaign

External person

David S. Funk

  • Scion Photonics
  • University of Illinois Urbana-Champaign
  • National Instruments
  • University of Puget Sound
  • Department of Electrical and Computer Engineering
  • Department of Physics
  • Everitt Laboratory
  • National Institute of Standards and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

J. Darby Hewitt

  • Department of Electrical and Computer Engineering
  • Abilene Christian University
  • University of Illinois Urbana-Champaign
  • Department of Engineering and Physics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Thomas C. Galvin

  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign
  • Lawrence Livermore National Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Laboratory for Optical Physics and Engineering
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

D. P. Greene

  • Los Alamos National Laboratory
  • University of Illinois Urbana-Champaign
  • Laser Physics Group (P16)
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. H. Cho

  • Myongji University
  • Laboratory for Optical Physics and Engineering, Department of Electrical and Computer Engineering, University of Illinois
  • University of Illinois Urbana-Champaign
  • EP Purification, Inc.
  • Department of Chemistry
  • Department of Electrical and Computer Engineering
  • Laboratory for Optical Physics and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign
  • Lam Research Corporation
  • Eden Park Illumination
  • University of Illinois at Urbana-Champaign

External person

K. S. Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Harvard University
  • Laboratory of Genetic Neuropharmacology
  • University of Illinois at Urbana-Champaign
  • Harvard University
  • University of Illinois at Urbana-Champaign

External person

Seung Hoon Sung

  • Intel
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Chang Liu

  • Northwestern University
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Quantum Devices
  • Department of Bioengineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Austin W. Steinforth

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Peter P. Sun

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Old Dominion University
  • Old Dominion University
  • Micro and Nanotechnology Lab
  • Laboratory for Optical Physics and Engineering
  • Frank Reidy Center for Bioelectrics
  • University of Illinois at Urbana-Champaign
  • Intel
  • Old Dominion University
  • University of Illinois at Urbana-Champaign

External person

Vitaly S. Zuev

  • RAS - P.N. Lebedev Physics Institute
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David J. Wheeler

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

F. Shen

  • University of Illinois Urbana-Champaign
  • Laboratory for Optical Physics and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Brian J. Ricconi

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

K. P. Killeen

  • Sandia National Laboratories
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Kuo Feng Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

P. C. John

  • Oration, LLC
  • University of Illinois Urbana-Champaign
  • Lockheed Martin
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. M. Spinka

  • Lawrence Livermore National Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

R. W. Waynant

  • Naval Research Laboratory
  • Laser Physics Branch
  • Laser Physics Branch

External person

J. K. Yoon

  • University of Illinois Urbana-Champaign
  • LG Corporation
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

C. C. Abele

  • University of Illinois Urbana-Champaign
  • Cynosure, Inc
  • Everitt Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

David L. Carroll

  • CU Aerospace
  • CU Aerospace
  • Winston-Salem State University
  • Department of Physics and Center for Nanotechnology and Molecular Materials
  • Wake Forest University
  • Center for Nanotechnology and Molecular Materials
  • University of Illinois Urbana-Champaign
  • Center for the Simulation of Advanced Rockets
  • AIAA
  • University of Illinois at Urbana-Champaign
  • CUA
  • CU Aerospace

External person

Jie Zheng

  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Washington University St. Louis
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

H. C. Tran

  • Northrop Grumman
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Everitt Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Marshall L. Ginter

  • University of Maryland, College Park
  • Institute for Physical Science and Technology
  • University of Maryland

External person

Jinhong Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Intel
  • Eden Park Illumination
  • University of Illinois at Urbana-Champaign

External person

D. J. Kane

  • University of Illinois at Urbana-Champaign
  • Los Alamos National Laboratory
  • Southwest Sciences, Inc.

External person

D. J. Sievers

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Cygnus Photonics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jack Chen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. R. Allen

  • Northrop Grumman
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Richard D. Fraser

  • Realized Technologies Inc.
  • Building 21
  • University of Illinois Urbana-Champaign
  • Everitt Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. A. Tchertchian

  • Exponent, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

T. J. Houlahan

  • United States Army
  • University of Illinois Urbana-Champaign
  • Starfire Industries
  • Department of Electrical and Computer Engineering
  • Laboratory for Optical Physics and Engineering
  • U.S. Army Corps of Engineers
  • Laboratory for Optical Physics and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sung O. Kim

  • National Yang Ming Chiao Tung University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Display Institute
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Photonics
  • Laboratory for Micro Plasma and Display
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Photonics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Christopher J. Zietkiewicz

  • Helios, Inc.
  • Melles-Griot, Inc.
  • Melles Griot Electro-Optics
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Everitt Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. M. Talmadge

  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Everitt Laboratoy
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Comouter Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

J. H. Schloss

  • Marsh, Inc.
  • SSI Technologies, Inc.
  • Los Alamos National Laboratory
  • University of Illinois Urbana-Champaign
  • Everitt Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Z. H. Lu

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Friedrich-Alexander University Erlangen-Nürnberg

External person

Chun Ge

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Andrew J. Price

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

M. H. Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • EP Purification, Inc.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. F. Osmundsen

  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

S. K. Searles

  • Naval Research Laboratory
  • Laser Physics Branch
  • Laser Physics Branch

External person

Benjamin Hunt

  • University of Illinois at Urbana-Champaign
  • University of Colorado Boulder
  • National Institute of Standards and Technology
  • University of Illinois at Urbana-Champaign

External person

H. J. Yang

  • University of Illinois Urbana-Champaign
  • Purdue University
  • Department of Electrical and Computer Engineering
  • Laboratory for Optical Physics and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. Hawkins

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

J. Ballato

  • Clemson University
  • University of Illinois Urbana-Champaign
  • The American Ceramic Society
  • Center for Optical Materials Science and Engineering Technologies
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Holcombe Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Chemistry
  • University of Illinois at Urbana-Champaign
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

J. W. Frame

  • University of Illinois Urbana-Champaign
  • Advantest America Corporation
  • Advantest Corporation
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. L. Kim

  • University of Illinois Urbana-Champaign
  • Micron Technology Incorporated
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Manas Ranja Gartia

  • Micro and Nanotechnology Lab
  • Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Lawrence Livermore National Laboratory
  • Department of Electrical and Computer Engineering
  • Louisiana State University
  • University of Illinois Urbana-Champaign
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Mechanical and Industrial Engineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Carle Foundation Hospital
  • Research Park
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Center for Micro- and Nanotechnology
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Deptartment of Nuclear, Plasma and Radiological Engineering
  • Department of Bioengineering
  • Carle Clinic Association
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • Louisiana State University

External person

Kavita V. Desai

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Viken Tavitian

  • Columbia University
  • University of Illinois Urbana-Champaign
  • Everitt Laboratory
  • University of Illinois at Urbana-Champaign

External person

S. B. Kim

  • ICE, Inc.
  • California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Everitt Laboratory
  • University of Illinois Marvel Undergraduate Research Awardee
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology

External person

D. E. Johnson

  • University of Illinois at Urbana-Champaign
  • Kirtland AFB
  • University of Illinois at Urbana-Champaign

External person

Kai Shinbrough

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Brent A. Knecht

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Washington
  • Paul Scherrer Institute
  • University of Zurich
  • University of Illinois at Urbana-Champaign

External person

Kathleen Oolman

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tegan Loveridge

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Amy L. Oldenburg

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Physics and Astronomy, University of North Carolina
  • University of North Carolina at Chapel Hill
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Chicago
  • Biophotonics Imaging Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Physics and Astronomy and the Biomedical Research Imaging Center
  • Department of Physics and Astronomy
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Chicago
  • University of Illinois at Urbana-Champaign

External person

S. M. Stazak

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wenyuan Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology Division of Engineering and Applied Science

External person

M. L. Dlabal

  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

B. A. Vojak

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Motorola
  • Cellular Research Laboratory
  • IEEE
  • University of Houston
  • Department of Electrical and Computer Engineering
  • Personal Communications Systems Research Laboratories
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

L. D. Mikheev

  • RAS - P.N. Lebedev Physics Institute
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. C. Shannon

  • JDS Uniphase
  • University of Illinois Urbana-Champaign
  • Everitt Laboratory
  • University of Illinois at Urbana-Champaign

External person

R. B. Jones

  • Northrop Grumman
  • Oak Ridge National Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Everitt Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Anusha Pokhriyal

  • Department of Physics
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • Department of Bioengineering
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. B. Stevens

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Everitt Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sujin Seo

  • Micro and Nanotechnology Lab
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Miro and Nanotechnology Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ju Gao

  • APL Engineered Materials, Inc.

External person

G. Rodriguez

  • University of Illinois Urbana-Champaign
  • United States Department of Energy
  • MST-CINT
  • Everitt Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Los Alamos National Laboratory
  • University of Illinois at Urbana-Champaign

External person

J. J. Alwan

  • Micron Technology Incorporated
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micron Display Technology, Inc.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

S. B. Hutchison

  • University of Illinois Urbana-Champaign
  • OSRAM Licht AG
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Te Wei Chang

  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. J. Kushner

  • Wright-Patterson AFB
  • University of Michigan, Ann Arbor
  • National Central University
  • University of Illinois Urbana-Champaign
  • Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Mechanical and Industrial Engineering
  • Environmental Engineering Institute
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for the Simulation of Advanced Rockets
  • Dept. of Mech. and Indust. Eng.
  • University of Illinois at Urbana-Champaign
  • University of Michigan, Ann Arbor
  • University of Illinois at Urbana-Champaign

External person

Jay Ewing

  • E Ink Corporation
  • Lucent Technologies
  • Ewing Technology Associates
  • Alcatel-Lucent
  • University of Illinois Urbana-Champaign
  • Lucent
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

S. T. McCain

  • University of Illinois at Urbana-Champaign

External person

I. V. Mel'Nikov

  • RAS - General Physics Institute
  • University of Toronto
  • University of Illinois Urbana-Champaign
  • National Research University of Electronic Technology
  • Department of Electrical Engineering
  • Laboratory for Optical Physics and Engineering
  • Department of Electronic Materials
  • E.S. Rogers Sr. Department of Electrical and Computer Engineering
  • Department of Electronic Materials
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign

External person

E. B. Mejia

  • Centro de Investigaciones en Optica
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Centro de Ivestigaciones en Optica

External person

K. E. Keister

  • Earlham College
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

T. A. Detemple

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. J. Kiely

  • University of Illinois at Urbana-Champaign
  • University of Liverpool

External person

N. Yu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Junhwan Kim

  • Department of Mechanical Science and Engineering
  • Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • ACRC
  • MechSE department
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

B. E. Cherrington

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

B. Li

  • University of Illinois at Urbana-Champaign
  • Intel
  • University of Illinois at Urbana-Champaign

External person

M. Cavillon

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Université Paris-Sud
  • Université Paris-Saclay
  • ComUE Paris-Saclay
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Nan Yu

  • Jet Propulsion Laboratory, California Institute of Technology
  • California Institute of Technology

External person

J. W. Carlson

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. H. Ni

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

O. Sakai

  • Kyoto University
  • The University of Shiga Prefecture
  • Department of Electronic Science and Engineering

External person

Sang K. Chung

  • Jet Propulsion Laboratory, California Institute of Technology
  • California Institute of Technology

External person

Thanh Le

  • Jet Propulsion Laboratory, California Institute of Technology
  • California Institute of Technology

External person

Paul von Allmen

  • Motorola
  • Jet Propulsion Laboratory, California Institute of Technology
  • University of Illinois Urbana-Champaign
  • Solid State Research Center
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

J. E. Greene

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Linköping University
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Technique and Applications
  • International Union for Vacuum Science
  • Department of Metallurgy
  • Department of Physics (IFM), Linköping University
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Departments of Metallurgy
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

F. Zenhausern

  • Motorola
  • Solid State Research Center

External person

Robert Ginn

  • Acumen Scientific

External person

Christopher Holland

  • SRI International

External person

William Goldshlag

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Laboratory for Optical Physics and Engineering
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Sameer A. Al-Bataineh

  • Mawson Institute
  • University of South Australia

External person

C. J. Kucera

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Hyung Woo Ju

  • Hallym University
  • Nano-Bio Regenerative Medical Institute

External person

C. Liu

  • Xi'an Jiaotong University
  • Key Laboratory of Physical Electronics and Devices

External person

F. A. Pudonin

  • RAS - P.N. Lebedev Physics Institute

External person

John D. Prestage

  • Jet Propulsion Laboratory, California Institute of Technology
  • California Institute of Technology

External person

Endre J. Szili

  • University of South Australia
  • Mawson Institute

External person

Guillermo L. Monroy

  • Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Department of Bioengineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chan Hum Park

  • Department of Otorhinolaryngology-Head and Neck Surgery, Chuncheon Sacred Heart Hospital, Hallym University College of Medicine
  • Hallym University
  • Department of Otorhinolaryngology-Head and Neck Surgery
  • Nano-Bio Regenerative Medical Institute
  • Department of Otorhinolaryngology-Head and Neck Surgery

External person

X. Zhang

  • Xi'an Jiaotong University
  • Key Laboratory of Physical Electronics and Devices

External person

Ralph Burnham

  • Naval Research Laboratory
  • Laser Physics Branch
  • Laser Physics Branch

External person

Y. Wang

  • Xi'an Jiaotong University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Key Laboratory of Physical Electronics and Devices
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Robert D. Short

  • University of South Australia
  • Mawson Institute

External person

S. Hamaguchi

  • Osaka University
  • IBM
  • Center for Atomic and Molecular Physics
  • Center for Atomic and Molecular Technologies
  • Center for Atomic and Molecular Technologies

External person

S. K. Lee

  • Goldman Sachs
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Goldman Sachs Group
  • University of Illinois at Urbana-Champaign

External person

C. Jensen

  • Motorola
  • Solid State Research Center

External person

D. Lubben

  • Department of Materials Science
  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Departments of Metallurgy
  • University of Illinois at Urbana-Champaign

External person

S. Zhong

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nantotechnology Laboratory
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jeffrey H. Ma

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Steven Choi

  • Nano Sensors Group
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. J. Coleman

  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Materials Research Laboratory
  • Engineering Research Center for Compound Semiconductor Microelectronics
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • NASA Goddard Space Flight Center
  • University of Texas at Dallas
  • Ctr. Compd. Semiconduct. M.
  • Microelectronics Laboratory
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering and Materials Science and Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Department of Materials Science
  • Microeectronics Laboratory
  • Materials Research Laboratory and Everitt Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Center for Nutrition
  • Materials Research Laboratory and Microelectronics Laboratory
  • Micro and Nanotechnology Lab
  • Department of Electrical Engineering
  • Seitz Materials Research Laboratory
  • Department of Electrical and Computer Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Texas at Dallas

External person

Jane Gragg

  • Clemson University
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

J. L. Putney

  • Diagnostic Photonics, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

A. Croteau

  • INO.
  • National Optics Institute

External person

Runyu Zhang

  • University of Illinois Urbana-Champaign
  • University of Wisconsin-Madison
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Harvard University
  • University of Illinois at Urbana-Champaign

External person

H. L. Chen

  • Old Dominion University
  • Department of Electrical and Computer Engineering, Old Dominion University
  • Frank Reidy Center for Bioelectrics
  • Old Dominion University

External person

J. S. Osinski

  • JDS Uniphase
  • National Institute of Standards and Technology

External person

K. J. Beernink

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory and Everitt Laboratory
  • Materials Research Laboratory
  • Materials Research Laboratory and Microelectronics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kavita Desai Kabelitz

  • University of Illinois at Urbana-Champaign

External person

Irving P. Herman

  • Columbia University
  • Department of Applied Physics
  • Electrical Engineering Dept.
  • Department of Applied Physics and Applied Mathematics

External person

Yin Huang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Conghui Huang

  • University of Illinois Urbana-Champaign
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. P. Riley

  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Brian Chung

  • University of Southern California
  • Department of Molecular Microbiology and Immunology
  • University of Southern California

External person

Michael G. Kong

  • Old Dominion University
  • Department of Electrical and Computer Engineering, Old Dominion University
  • Frank Reidy Center for Bioelectrics
  • Old Dominion University

External person

Wen Huang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • EHF Key Laboratory of Fundamental Science
  • University of Electronic Science and Technology of China
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
  • Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER)
  • Department of Electrical and Computer Engineering Micro and Nanotechnology Laboratory International Institute for Carbon-Neutral Energy Research (I2CNER)
  • School of Microelectronics Engineering
  • Hefei University of Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Dimitrios Peroulis

  • Purdue University
  • School of Electrical and Computer Engineering
  • Network for Computational Nanotechnology
  • School of Electrical and Computer Engineering
  • Birck Nanotechnology Center

External person

David A. Steele

  • University of South Australia
  • Mawson Institute

External person

T. O. Reboli

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. J. Sadler

  • Motorola
  • Solid State Research Center

External person

Z. G. Figen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. A. Mahaffey

  • Naval Research Laboratory

External person

K. K. King

  • Cutting Edge Optronics, Inc.
  • University of Illinois Urbana-Champaign
  • Cutting Edge Optronics
  • Department of Physics
  • Department of Electrical and Computer Engineering
  • Department of Physics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Robert L. Tjoelker

  • Jet Propulsion Laboratory, California Institute of Technology

External person

Sidhartha Gupta

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yuh Shiuan Liu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Lin Yi

  • Jet Propulsion Laboratory, California Institute of Technology

External person

Pierre Wiltzius

  • University of California at Santa Barbara
  • Bell Laboratories
  • Department of Physics
  • Bell Laboratories, Lucent Technologies
  • Lucent Technologies
  • Alcatel-Lucent
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • Lucent
  • Division of Mathematical, Life, and Physical Sciences
  • Department of Materials Science and Engineering
  • Department of Physics
  • Bell Labs
  • Beckman Institute for Advanced Science and Technology
  • Department of Materials Science and Engineering
  • Department of Physics
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Nokia
  • University of Illinois at Urbana-Champaign

External person

Shengkun Dong

  • University of Illinois Urbana-Champaign
  • Safe Global Water Institute
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Safe Global Water Institute
  • Sun Yat-Sen University
  • Guangdong Engineering Technology Research Center of Water Security Regulation and Control for Southern China
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Harald Giessen

  • University of Stuttgart
  • 4th Physics Institute and Research Center SCOPE, University of Stuttgart
  • 4. Physikalisches Institut
  • Physics Institute
  • 4. Physics Institute and Research Center SCoPE

External person

J. M. Hafez

  • Intel
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. Y. Gu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sherine George

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Department of Bioengineering
  • Micro and Nanotechnology Lab
  • Department of Bioengineering
  • Depts. of Bioeng.
  • Bioengineering
  • Depts. of ECE and BioE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Bioengineering and Beckman
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Z. Liang

  • Xi'an Jiaotong University
  • Key Laboratory of Physical Electronics and Devices
  • Eden Park Illumination
  • University of Illinois at Urbana-Champaign

External person

Richard S. Moss

  • University of Illinois Urbana-Champaign
  • Department of Mechanical and Industrial Engineering
  • Department of Mechanical Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Dept. of Mech. and Indust. Eng.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

James W. Rinne

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. L. Wilcox

  • Motorola
  • University of Illinois Urbana-Champaign
  • Solid State Research Center
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Michael Sinanis

  • Purdue University

External person

Julian Michaels

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Micro and Nano Technology Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

N. Djeu

  • Naval Research Laboratory

External person

A. D. Palla

  • CU Aerospace
  • University of Illinois Urbana-Champaign
  • CU Aerospace
  • AIAA
  • University of Illinois at Urbana-Champaign

External person

D. S. Lee

  • Osaka University

External person

H. Cheng

  • South China University of Technology
  • Xiamen University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electronic Engineering
  • Guangdong Provincial Key Laboratory of Fiber Laser Materials and Applied Techniques
  • State Key Laboratory of Luminescent Materials and Devices
  • Guangdong Engineering Technology Research and Development Center of Special Optical Fiber Materials and Devices
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. M. Farkas

  • University of Illinois Urbana-Champaign
  • Everitt Laboratory
  • University of Illinois at Urbana-Champaign

External person

R. J. Roth

  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. S. Wu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kevin A. Arpin

  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Taegon Oh

  • University of Illinois at Urbana-Champaign

External person

G. E. Fernández

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory and Everitt Laboratory
  • Materials Research Laboratory
  • Materials Research Laboratory and Microelectronics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhendong Yang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Texas at Austin
  • University of Illinois at Urbana-Champaign

External person

K. H. Park

  • University of Cambridge
  • Department of Engineering
  • Department of Engineering

External person

L. F. Champagne

  • Naval Research Laboratory

External person

K. H. Schoenbach

  • Old Dominion University
  • Department of Electrical and Computer Engineering, Old Dominion University
  • Old Dominion University

External person

P. K. York

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory and Everitt Laboratory
  • Materials Research Laboratory
  • Materials Research Laboratory and Microelectronics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ok Joo Lee

  • Hallym University
  • Nano-Bio Regenerative Medical Institute

External person

S. A. Piette

  • Columbia University
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. S. Kim

  • University of Illinois Urbana-Champaign
  • Samsung
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sergey O. Macheret

  • Purdue University
  • School of Aeronautics and Astronautics

External person

Mingye Xiong

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

K. H. Becker

  • Stevens Institute of Technology
  • Department of Physics and Engineering Physics
  • Stevens Institute of Technology

External person

Hubert H. Burke

  • Columbia University
  • Department of Applied Physics

External person

G. S. Heimberg

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Thai M. Hoang

  • California Institute of Technology
  • Jet Propulsion Laboratory, California Institute of Technology

External person

E. S. Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • LSIS
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Department of Electrical Engineering, University of Southern California

External person

Daniel Dregely

  • University of Stuttgart

External person

J. A. Pasour

  • Naval Research Laboratory

External person

M. Tuggle

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Department of Materials Science and Engineering
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Department of Materials Science and Engineering and the Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Abbas Semnani

  • Purdue University

External person

James W. Bradley

  • University of Liverpool
  • Department of Electrical Engineering and Electronics
  • Department of Electrical Engineering and Electronics

External person

Steven Solomon

  • Acumen Scientific
  • University of Southern California

External person

J. Golden

  • Naval Research Laboratory

External person

D. X. Liu

  • Xi'an Jiaotong University
  • State Key Laboratory of Electrical Insulation and Power Equipment

External person

Meng Zhang

  • Department of Physics
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • China Aerospace Science and Technology Corporation
  • University of Illinois at Urbana-Champaign

External person

Ji Seung Lee

  • Hallym University

External person

N. Delegan

  • Argonne National Laboratory

External person

Ya E. Krasik

  • Technion-Israel Institute of Technology
  • Department of Physics
  • Technion

External person

F. J. Heremans

  • Argonne National Laboratory
  • The University of Chicago

External person

B. Bozeman

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Winter

  • Ruhr University Bochum
  • Center for Plasma Science and Technology

External person

C. Kim

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

I. D. Kaganovich

  • Princeton Plasma Physics Laboratory

External person

P. P. Sun

  • Old Dominion University
  • Old Dominion University

External person

Hyun Jung Park

  • Nano-Bio Regenerative Medical Institute
  • Hallym University

External person

Yuval Alfiya

  • Technion-Israel Institute of Technology

External person

Kanti Jain

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Anvik Corporation
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. C. Richardson

  • University of Rochester
  • Laboratory for Laser Energetics

External person

Z. Yang

  • South China University of Technology

External person

Apurva Mishra

  • University of South Australia
  • Mawson Institute

External person

Yael Dubowski

  • Technion-Israel Institute of Technology

External person

Sung Jin Park

  • University of Illinois at Urbana-Champaign

External person

Hans J. Griesser

  • University of South Australia
  • Ian Wark Research Institute

External person

Joong Seob Lee

  • Hallym University

External person

S. S. Choi

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Zihao Ou

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. W. Andreatta

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. D. Baalrud

  • University of Iowa
  • Department of Physics and Astronomy
  • University of Iowa
  • University of Iowa
  • University of Michigan, Ann Arbor

External person

Gregory C B Clarke

  • University of Liverpool
  • Department of Electrical Engineering and Electronics

External person

H. J. Yang

  • University of Illinois at Urbana-Champaign

External person

Harm Tolner

  • Southeast University, Nanjing
  • Display Center

External person

K. L. Gabally-Kinney

  • 20 New England Business Center
  • Physical Sciences Inc.

External person

A. Vardelle

  • Université de Limoges
  • University of Limoges

External person

Jungeun Won

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. Martinez

  • Centro de Investigaciones en Optica

External person

Ju Gao

  • University of Illinois Urbana-Champaign
  • Everitt Laboratoy
  • Advanced Lighting Technology, Inc.
  • Applied Physics Laboratory
  • Department of Electrical and Comouter Engineering
  • University of Illinois at Urbana-Champaign

External person

Chan Hum Park

  • Hallym University

External person

Ananth Saran Yalamarthy

  • Stanford University
  • Stanford University

External person

I. Adamovich

  • Ohio State University
  • Department of Mechanical and Aerospace Engineering
  • Ohio State University

External person

Y. Zhou

  • South China University of Technology
  • Guangdong Provincial Key Laboratory of Fiber Laser Materials and Applied Techniques
  • State Key Laboratory of Luminescent Materials and Devices
  • Guangdong Engineering Technology Research and Development Center of Special Optical Fiber Materials and Devices

External person

A. M. Chojnacki

  • Calient Optical Components
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

N. W. Harris

  • Naval Research Laboratory

External person

Wei Hung Chiang

  • National Taiwan University of Science and Technology
  • Case Western Reserve University
  • Industrial Technology Research Institute of Taiwan
  • Case Western Reserve University
  • Case Western Reserve University

External person

Edgar W. Xie

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. Qiao

  • South China University of Technology
  • Guangdong Provincial Key Laboratory of Fiber Laser Materials and Applied Techniques
  • State Key Laboratory of Luminescent Materials and Devices
  • Guangdong Engineering Technology Research and Development Center of Special Optical Fiber Materials and Devices

External person

Karen Y. Kane

  • University of Illinois Urbana-Champaign
  • BDM International, Inc.
  • Everitt Laboratory
  • University of Illinois at Urbana-Champaign

External person

R. Su

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. Favia

  • University of Bari
  • Department of Biosciences

External person

L. Sang

  • University of Illinois Urbana-Champaign
  • University of Electronic Science and Technology of China
  • EHF Key Laboratory of Fundamental Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • School of Microelectronics Engineering
  • Hefei University of Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Waskoenig

  • Queen's University Belfast
  • Ruhr University Bochum
  • Centre for Plasma Physics
  • Center for Plasma Science and Technology

External person

D. C. Shih

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ok Joo Lee

  • Hallym University

External person

Joseph W. Zimmerman

  • University of Illinois Urbana-Champaign
  • CU Aerospace
  • CUA
  • Center for the Simulation of Advanced Rockets
  • Department of Aerospace Engineering, University of Illinois Urbana-Champaign
  • CU Aerospace
  • AIAA
  • University of Illinois at Urbana-Champaign
  • CU Aerospace

External person

P. D. Goldstone

  • Los Alamos National Laboratory

External person

Gilson Khang

  • Jeonbuk National University
  • Department of BIN Fusion Technology

External person

Christopher Campbell

  • Abilene Christian University

External person

Mark D. Kraman

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ji Heui Kim

  • Nano-Bio Regenerative Medical Institute
  • Department of Otorhinolaryngology-Head and Neck Surgery
  • Hallym University

External person

M. Bradley

  • University of Illinois Urbana-Champaign
  • Everitt Laboratoy
  • Department of Electrical and Comouter Engineering
  • University of Illinois at Urbana-Champaign

External person

W. Wang

  • South China University of Technology

External person

G. S. Oehrlein

  • University of Maryland, College Park
  • Department of Materials Science and Engineering, University of Maryland

External person

A. Y. Chang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. H. Cho

  • University of Illinois at Urbana-Champaign

External person

K. Terashima

  • The University of Tokyo
  • Department of Advanced Materials Science

External person

J. E. Gallagher

  • Wright-Patterson AFB
  • United States Air Force Institute of Technology
  • Department of Engineering Physics

External person

Eric Pop

  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Stanford University

External person

Feifei Lian

  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

Andrew Michelmore

  • University of South Australia
  • Mawson Institute

External person

K. D. Kang

  • Samsung Advanced Institute of Technology
  • R and D Center
  • Samsung

External person

Jun Li

  • University of Illinois Urbana-Champaign
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. Yarmolich

  • Technion-Israel Institute of Technology
  • Department of Physics
  • Technion

External person

Hao Wang

  • University of California at Davis

External person

A. Mizuno

  • Toyohashi University of Technology
  • Department of Environmental and Life Sciences

External person

Tyler S. Anderson

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Lack Chen

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Paul M. Bryant

  • Department of Electrical Engineering and Electronics
  • University of Liverpool

External person

D. A. Carroll

  • CU Aerospace

External person

Zhida Xu

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. B. Efrain

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. O'Connell

  • Ruhr University Bochum
  • Center for Plasma Science and Technology
  • University of York
  • Technique and Applications
  • International Union for Vacuum Science
  • York Plasma Institute

External person

S. Rauf

  • Applied Materials Incorporated

External person

Xiaoqin Ma

  • Xi'an Jiaotong University

External person

C. H. Fann

  • University of Illinois at Urbana-Champaign
  • University of Rochester

External person

G. Pien

  • University of Rochester
  • Laboratory for Laser Energetics

External person

E. J. Kwon

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Russell Bradley

  • Naval Research Laboratory

External person

Kaiping Tai

  • Chinese Academy of Sciences
  • Shenyang National Laboratory for Materials Science (SYNL), Chinese Academy of Sciences (CAS)
  • Dept. of Mat. Sci. and Engineering
  • Shenyang National Laboratory for Materials Science (SYNL), Institute of Metal Research (IMR), Chinese Academy of Sciences (CAS)
  • CAS - Institute of Metal Research
  • University of Illinois Urbana-Champaign
  • Shenyang National Laboratory for Materials Science
  • Functional Films and Interfaces Division
  • Department of Materials Science and Engineering
  • Shenyang National Laboratory for Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yoonjin Lee

  • Inje University

External person

Steve Solomon

  • University of Southern California
  • Institute for Creative Technologies
  • Institute for Creative Technologies
  • University of Southern California

External person

Sander Nijdam

  • Eindhoven University of Technology

External person

Heesun Hong

  • Hallym University

External person

J. R. Renzas

  • Oxford Instruments Group Plc

External person

Jeong Hyun Seo

  • Incheon National University
  • University of Illinois Urbana-Champaign
  • Department of Electronics Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. A. Kumar

  • University of Medicine and Dentistry of New Jersey
  • Rutgers - The State University of New Jersey, New Brunswick
  • Department of Ceramics Engineering

External person

Zihao Ou

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Debra Barki

  • Technion-Israel Institute of Technology

External person

R. T. Ku

  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

E. Moreau

  • Université de Poitiers
  • PPRIME Institute

External person

I. C. Hwang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. M. Kang

  • University of Illinois at Urbana-Champaign

External person

Suganya Subburaj

  • Technion-Israel Institute of Technology

External person

Victoria Chen

  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Stanford University

External person

Shouyan Li

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Z. Lj Petrovic

  • University of Belgrade
  • Institute of Physics

External person

Gilles Desmet

  • University of South Australia
  • Mawson Institute

External person

B. Lu

  • JDS Uniphase
  • National Instruments
  • National Institute of Standards and Technology

External person

R. Koripella

  • Motorola
  • Solid State Research Center

External person

C. A. Kapetanakos

  • Naval Research Laboratory

External person

Kyu Young Choi

  • Hallym University

External person

James F. Zachary

  • Washington State University Pullman
  • University of Illinois Urbana-Champaign
  • Departments of Bioengineering
  • Department of Pathobiology
  • Department of Pathobiology
  • Department of Pathobiology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Veterinary Microbiology Dept.
  • Depts. of Bioeng.
  • Department of Veterinary Pathology
  • Department of Veterinary Pathology
  • Department of Computer Engineering
  • Department of Pathobiology, College of Veterinary Medicine, University of Illinois at Urbana-Champaign
  • Bioengineering Program
  • Department of Bioengineering
  • Veterinary Pathobiology
  • Department of Veterinary Clinical Medicine
  • Bioengineering Program
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Jing Jiang

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • LifeFoundry, Inc.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Scott Crane

  • Naval Research Laboratory

External person

Dong Kyu Kim

  • Hallym University
  • Nano-Bio Regenerative Medical Institute
  • Department of Otorhinolaryngology-Head and Neck Surgery

External person

R. Y. Choi

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jonathan Tennyson

  • University College London
  • Department of Physics and Astronomy, London Center for Nanotechnology, University College London

External person

M. C.M. Van De Sanden

  • Eindhoven University of Technology
  • Dutch Institute for Fundamental Energy Research
  • Department of Applied Physics
  • Dutch Institute for Fundamental Energy Research

External person

David L. Carroll

  • CU Aerospace

External person

Jr J. Houlahan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Starikovskaia

  • École polytechnique
  • ComUE Paris-Saclay

External person

J. Dong

  • Xiamen University

External person

U. Czarnetzki

  • Ruhr University Bochum
  • Institute for Plasma and Atomic Physics

External person

S. Cai

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

F. Ameduri

  • Los Alamos National Laboratory

External person

M. A. Klosner

  • Light Age, Inc.
  • Anvik Corporation

External person

J. Stewart Aitchison

  • University of Toronto
  • E.S. Rogers Sr. Department of Electrical and Computer Engineering

External person

K. Ostrikov

  • CSIRO
  • International Union for Vacuum Science
  • Technique and Applications
  • Queensland University of Technology

External person

Qing Li

  • Southeast University, Nanjing
  • Display Center

External person

Q. Qian

  • South China University of Technology
  • Guangdong Provincial Key Laboratory of Fiber Laser Materials and Applied Techniques
  • State Key Laboratory of Luminescent Materials and Devices
  • Guangdong Engineering Technology Research and Development Center of Special Optical Fiber Materials and Devices

External person

B. C. Masters

  • University of Illinois Urbana-Champaign
  • United States Army
  • Center for Plasma Material Interactions
  • U.S. Army Corps of Engineers
  • Plasma Materials Interactions Group
  • Beckman Institute for Advanced Science and Technology
  • Department of Nuclear
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

R. Kogler

  • University of Hamburg
  • CERN
  • University of Illinois Urbana-Champaign
  • Max Planck Institute for Physics (Werner Heisenberg Institute)
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • German Electron Synchrotron
  • University of Illinois at Urbana-Champaign

External person

Joon Yeong Kim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Young Jin Lee

  • Hallym University

External person

Debbie G. Senesky

  • Stanford University
  • Department of Aeronautics and Astronautics
  • Stanford University
  • Department of Aeronautics and Astronautics

External person

T. S. Varzhapetyan

  • National Academy of Sciences of the Republic of Armenia

External person

S. Mazouffre

  • Université d'Orléans
  • Institut de Combustion Aérothermique Réactivité et Environnement (ICARE)

External person

Zhenhuan Yi

  • Texas A&M University

External person

W. Lin

  • South China University of Technology
  • Guangdong Provincial Key Laboratory of Fiber Laser Materials and Applied Techniques
  • State Key Laboratory of Luminescent Materials and Devices
  • Guangdong Engineering Technology Research and Development Center of Special Optical Fiber Materials and Devices

External person

Yun Shen

  • University of Illinois Urbana-Champaign
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • University of Michigan, Ann Arbor
  • Dept. of Civil and Environmental Engineering
  • Department of Chemical and Environmental Engineering
  • University of California at Riverside
  • University of Illinois at Urbana-Champaign
  • University of Michigan, Ann Arbor
  • Harvard University
  • Dana-Farber Cancer Institute
  • University of California at Riverside
  • University of Illinois at Urbana-Champaign

External person

David D. Awschalom

  • University of California at Santa Barbara
  • Center for Spintronics and Quantum Computation
  • Ctr. for Spintronics/Quant. Comp.
  • Department of Physics
  • The University of Chicago
  • Argonne National Laboratory
  • The University of Chicago

External person

Elbashir Araud

  • University of Illinois Urbana-Champaign
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. S. Agarwal

  • Physical Research Laboratory India
  • Texas A&M University

External person

K. W. Lee

  • Myongji University
  • Department of Chemistry

External person

C. G. Carlson

  • United States Air Force Academy
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Laser and Optics Research Center
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Paul M. Bryant

  • University of Liverpool
  • Department of Electrical Engineering and Electronics

External person

Xuan Zhou

  • Key Laboratory of Physical Electronics and Devices
  • Xi'an Jiaotong University

External person

V. Schulz- Von Der Gathen

  • Ruhr University Bochum
  • Center for Plasma Science and Technology

External person

Miguel Muñoz Rojo

  • Department of Electrical Engineering, Stanford University
  • University of Twente
  • Stanford University
  • Stanford University
  • Stanford University

External person

James P. Blue

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Pathobiology
  • Department of Electrical and Computer Engineering
  • Department of Pathobiology, College of Veterinary Medicine, University of Illinois at Urbana-Champaign
  • Veterinary Pathobiology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. M. Myoung

  • Samsung Advanced Inst of Technology
  • University of Illinois Urbana-Champaign
  • Samsung Advanced Institute of Technology
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Depts. of Mat. Sci. and Eng.
  • Department of Electrical and Computer Engineering
  • Samsung
  • University of Illinois at Urbana-Champaign
  • Yonsei University
  • University of Illinois at Urbana-Champaign

External person

Thai M. Hoang

  • Jet Propulsion Laboratory, California Institute of Technology
  • California Institute of Technology

External person

H. S. Tran

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. Mehrotra

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Z. Dai

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jorge J. Rocca

  • Colorado State University
  • Optoelectron. Comp. Systems Center
  • Colorado State University

External person

V. Colombo

  • University of Bologna
  • Department of Industrial Engineering (DIN)

External person

Rita J. Miller

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Zikang Tong

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bruce A. Vojak

  • University of Illinois Urbana-Champaign
  • Enterprise Systems Engineering

External person

A. V. Frantsesson

  • National Research University of Electronic Technology
  • RAS - Kotelnikov Institute of Radio Engineering and Electronics

External person

H. R. Metelmann

  • University of Greifswald
  • Department for Oral and Maxillofacial Surgery

External person

L. Dong

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies
  • Holcombe Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

Hanna Lee

  • Hallym University

External person

Chang Lin

  • University of Illinois at Urbana-Champaign

External person

Ed Peters

  • Imaging Systems Technology

External person

Wen Jian Kuang

  • Southeast University, Nanjing
  • Display Center

External person

Alan Garscadden

  • Wright-Patterson AFB
  • Air Force Research Laboratory

External person

Baochun Li

  • University of Toronto
  • ACM
  • University of Illinois Urbana-Champaign
  • Tsinghua University
  • IEEE
  • Dept. of Elec. and Comp. Engineering
  • Computer Science, University of Illinois at Urbana-Champaign
  • Dept. of Computer Science
  • Department of Electrical and Computer Engineering
  • Dept. of Electrical Engineering
  • Department of Computer Science, University of Illinois
  • Department of Electrical Engineering
  • ACM
  • Intel
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign

External person

S. J. Davis

  • 20 New England Business Center
  • Physical Sciences Inc.

External person

Haotian Yu

  • School of Microelectronics Engineering
  • Hefei University of Technology

External person

Jimmy H. Ni

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

J. Burdon

  • Motorola
  • Solid State Research Center

External person

E. A.P. Cheng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Aleksei M. Zheltikov

  • Texas A&M University

External person

S. Gorbatkin

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign

External person

Qingyi Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

L. Meng

  • SRU Biosystems, Inc.

External person

B. A. Niemira

  • United States Department of Agriculture

External person

Y. Tsaturyan

  • The University of Chicago

External person

L. J. Palumbo

  • Naval Research Laboratory

External person

Siyu Liu

  • University of Illinois Urbana-Champaign
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Md Tipu Sultan

  • Hallym University

External person

Jaewook Yang

  • Inje University
  • T2B Infrastructure Center for Ocular Diseases
  • Department of Ophthalmology

External person

G. P. Perram

  • Wright-Patterson AFB
  • United States Air Force Institute of Technology
  • Department of Engineering Physics

External person

E. Stambulchik

  • Weizmann Institute of Science
  • Department of Physics

External person

O. Sakai

  • The University of Shiga Prefecture
  • Department of Electronic Systems Engineering

External person

Soon Hee Kim

  • Hallym University

External person

C. Shin

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Hori

  • Nagoya University
  • Plasma Nanotechnology Research Center

External person

K. H. Shim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Depts. of Mat. Sci. and Eng.
  • Samsung Advanced Institute of Technology
  • Samsung
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. R. Foy

  • Clemson University
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Center for Optical Materials Science and Engineering Technologies (COMSET)
  • Center for Optical Materials Science and Engineering Technologies
  • Clemson University College of Engineering, Computing and Applied Sciences

External person

U. Ebert

  • Centrum voor Wiskunde en Informatica
  • Eindhoven University of Technology
  • Group Multiscale Dynamics
  • Department of Applied Physics

External person

D. H. Sarkisyan

  • National Academy of Sciences of the Republic of Armenia

External person

J. A. Conway

  • University of Illinois Urbana-Champaign
  • Laboratory for Optical Physics and Engineering
  • Department of Physics
  • Laboratory for Optical Physics and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. Epp

  • Naval Research Laboratory

External person

Bo Mi Moon

  • Hallym University
  • Nano-Bio Regenerative Medical Institute

External person

W. J. Yi

  • Samsung Advanced Institute of Technology
  • R and D Center
  • Samsung

External person

Joong Seob Lee

  • Department of Otorhinolaryngology-Head and Neck Surgery, Chuncheon Sacred Heart Hospital, Hallym University College of Medicine
  • Hallym University
  • Nano-Bio Regenerative Medical Institute
  • Department of Otorhinolaryngology-Head and Neck Surgery

External person

B. Herrera

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. B. Jones

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tracie Whittle

  • University of Sheffield
  • Department of Chemistry, University of Sheffield
  • University of Sheffield

External person

B. Li

  • University of Illinois Urbana-Champaign
  • Intel
  • University of Illinois at Urbana-Champaign

External person

Nicolas H. Voelcker

  • Flinders University
  • University of South Australia
  • Faculty of Science and Engineering
  • ARC Centre of Excellence in Convergent Bio-Nano Science and Technology

External person

C. P. Marsh

  • United States Army Engineer Research and Development Center
  • University of Illinois Urbana-Champaign
  • United States Army
  • Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign
  • U.S. Army Corps of Engineers
  • Engineering Research and Development Center
  • Deptartment of Nuclear, Plasma and Radiological Engineering
  • Department of Nuclear
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Oleg Gluschenkov

  • IBM
  • University of Illinois Urbana-Champaign
  • IBM Semiconductor Research and Development Center
  • IBM Research
  • IBM Semiconduct. Res./Devmt. Ctr.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Depts. of Mat. Sci. and Eng.
  • University of Illinois at Urbana-Champaign

External person

P. R. Mackin

  • Air Force Research Laboratory
  • United States Air Force Academy
  • Air Force Research Laboratory

External person

J. M. Bulson

  • Eden Park Illumination

External person

Joseph W. Carlson

  • University of Illinois Urbana-Champaign
  • Center for Biophysics and Computational Biology
  • Beckman Institute for Advanced Science and Technology
  • Biophysics Center
  • University of Illinois at Urbana-Champaign

External person

S. Xu

  • South China University of Technology

External person

Soon Hee Kim

  • Hallym University

External person

Z. H. Lu

  • University of Illinois at Urbana-Champaign

External person

David L. Carroll

  • CU Aerospace
  • CU Aerospace
  • Winston-Salem State University
  • Wake Forest University
  • Department of Physics and Center for Nanotechnology and Molecular Materials
  • Center for Nanotechnology and Molecular Materials
  • AIAA

External person

Kyle T. Raymond

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. G. Berger

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Andrey A. Machnev

  • National Research University of Electronic Technology
  • National Research University of Electronic Technology
  • Department of Electronic Materials
  • Department of Electronic Materials

External person

Sung Jin Park

  • Baen Park IIlumination

External person

L. C. Pitchford

  • Université Fédérale Toulouse Midi-Pyrénées
  • Université Paul Sabatier Toulouse III
  • Institut national polytechnique de Toulouse
  • UPS

External person

S. B. Hutchinson

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Samukawa

  • Tohoku University

External person

Eran Friedler

  • Technion-Israel Institute of Technology

External person

Timothy A. Flood

  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Departments of Chemistry
  • University of Illinois at Urbana-Champaign

External person

P. Y. Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

B. Lu

  • JDS Uniphase

External person

W. J. Kessler

  • 20 New England Business Center
  • Physical Sciences Inc.

External person

Alexei V. Sokolov

  • Texas A&M University
  • Baylor University
  • Baylor University

External person

M. M. Turner

  • Dublin City University
  • School of Physical Sciences

External person

L. Z. Hua

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wynter Chen

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jun Li

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

V. Bernshtam

  • Weizmann Institute of Science
  • Department of Physics

External person

J. C. Asinugo

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Omeed Momeni

  • University of California at Davis

External person

Z. H. Lu

  • University of Illinois Urbana-Champaign
  • Friedrich-Alexander University Erlangen-Nürnberg
  • Department of Electrical and Computer Engineering
  • Institut für Optik, Information und Photonik
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Michael C. Heaven

  • Emory University

External person

A. Bogaerts

  • University of Antwerp
  • Department of Chemistry

External person

Jeff Guy

  • Imaging Systems Technology

External person

G. Hieftje

  • Indiana University Bloomington
  • Department of Chemistry

External person

Katelyn E. Tobin

  • Cypress Semiconductor
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Cypress Semiconductor
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. J. Zhu

  • University of Illinois at Urbana-Champaign

External person

D. B. Graves

  • Chemical and Biomolecular Engineering
  • University of California, Berkeley
  • Department of Chemical Engineering
  • University of California at Berkeley
  • University of California
  • Princeton University
  • Princeton Plasma Physics Laboratory

External person

G. G. Carlson

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

N. J. Mason

  • Open University Milton Keynes
  • Department of Physical Sciences

External person

M. H. Ediger

  • University of Illinois at Urbana-Champaign

External person

Davide Mariotti

  • Ulster University

External person

Hyesook Lee

  • Inje University

External person

P. J. Bruggeman

  • University of Minnesota Twin Cities
  • University of Minnesota

External person

C. Jones

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. H. Day

  • Los Alamos National Laboratory

External person

Viktor Trushin

  • Moscow Institute of Physics and Technology

External person

Olatunji Ajiteru

  • Hallym University

External person

A. W. Ali

  • Naval Research Laboratory

External person

Marlan O. Scully

  • Texas A&M University
  • Baylor University
  • Baylor University

External person

U. Kortshagen

  • University of Minnesota Twin Cities
  • University of Minnesota

External person

S. B. Ban

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. J. Lee

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. W. Herrick

  • University of Illinois Urbana-Champaign
  • Boeing
  • Everitt Laboratory
  • University of Illinois at Urbana-Champaign

External person

Z. Fan

  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person