Network
Sang Hoon Bae
- Washington University St. Louis
- Massachusetts Institute of Technology
- University of California at Los Angeles
- Tsinghua University
- California NanoSystems Institute
External person
Diana Huffaker
- University of California, Los Angeles
- Electrical Engineering Department
- California NanoSystems Institute
- California NanoSystems Institute
- University of California at Los Angeles
- Cardiff University
- University of Texas at Arlington
- California NanoSystems Institute
External person
Chanyeol Choi
- Massachusetts Institute of Technology
- University of California at Los Angeles
External person
Jiho Shin
- Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign
- Beckman Institute for Advanced Science and Technology
- University of Illinois Urbana-Champaign
- Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign
- Department of Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign
- Department of Chemical and Biomolecular Engineering
- Seitz Materials Research Laboratory
- Dept. of Mat. Sci. and Engineering
- Northwestern University
- Center for Bio-Integrated Electronics
- University of Illinois at Urbana-Champaign
- Massachusetts Institute of Technology
- University of Illinois at Urbana-Champaign
External person
Yuan Meng
- Tsinghua University
- Massachusetts Institute of Technology
- Washington University St. Louis
- Tsinghua University
External person
C. Kim
- Massachusetts Institute of Technology
- Korea Institute of Science and Technology
- Department of Nuclear Science and Engineering
- Computational Science Center
External person
Yunpeng Liu
- University of Illinois Urbana-Champaign
- Department of Mechanical Science and Engineering
- University of Illinois at Urbana-Champaign
- Massachusetts Institute of Technology
External person
Wook Jae Lee
- Cardiff University
- University of California at Los Angeles
- Kongju National University
- Electronics and Telecommunications Research Institute
External person
Keng Yuan Meng
- Ohio State University
- Department of Physics
- Ohio State University
- Washington University St. Louis
- Tsinghua University
- Massachusetts Institute of Technology
External person
Jaeyong Lee
- University of British Columbia
- Massachusetts Institute of Technology
- Harvard University
External person
Yong Kweon Kim
- Seoul National University
- School of Electrical Engineering and Computer Sciences
External person
Seunghwan Seo
- Massachusetts Institute of Technology
- Sungkyunkwan University
- Korea Advanced Institute of Science and Technology
External person
Yeongin Kim
- Stanford University
- Department of Chemical Engineering
- Department of Electrical Engineering, Stanford University
- Stanford University
- Massachusetts Institute of Technology
- University of Cincinnati
External person
Jae Wook Lee
- Samsung
- Electronics and Telecommunications Research Institute
- Kongju National University
- Cardiff University
External person
Hanwool Yeon
- Massachusetts Institute of Technology
- Gwangju Institute of Science and Technology
External person
Justin S. Kim
- Division of Nutritional Sciences
- University of Illinois at Urbana-Champaign
- Georgia Institute of Technology
- Washington University St. Louis
External person
Peng Lin
- Washington University St. Louis
- Massachusetts Institute of Technology
- Zhejiang University
External person
Hyung Jun Kim
- Korea Institute of Science and Technology
- University of Science and Technology UST
External person
Jong Hyun Ahn
- Yonsei University
- Sungkyunkwan University
- University of Illinois Urbana-Champaign
- School of Advanced Materials Science and Engineering
- Department of Materials Science and Engineering
- School of Electrical and Electronic Engineering, Yonsei University
- Beckman Institute for Advanced Science and Technology
- Seitz Materials Research Laboratory
- Dept. of Mat. Sci. and Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Wei wei Kong
- Harbin Institute of Technology
- School of Municipal and Environmental Engineering
- Westlake University
- Massachusetts Institute of Technology
External person
Brian T. Zutter
- University of California at Los Angeles
- California NanoSystems Institute
External person
Joshua Robinson
- Pennsylvania State University
- Materials Research Institute
- Stanford University
External person
William A. Hubbard
- NanoElectronic Imaging Inc.
- University of California at Los Angeles
- California NanoSystems Institute
External person
Tony Low
- IBM
- Columbia University
- University of Minnesota Twin Cities
- Department of Electrical and Computer Engineering
- Departments of Physics and Electrical Engineering
External person
Jungwon Park
- University of California, Berkeley
- Harvard University
- Lawrence Berkeley National Laboratory
- Department of Chemistry
- Department of Applied Physics
- School of Engineering and Applied Sciences, Wyss Institute for Biologically Inspired Engineering, Harvard University
- Materials Science Division, Lawrence Berkeley National Laboratory
- Harvard University
- University of California at Berkeley
- Jeonbuk National University
- Seoul National University
- Stony Brook University
- Institute for Basic Science
- Korea Basic Science Institute
External person
Hung Chieh Cheng
- University of California at Los Angeles
- California NanoSystems Institute
External person
Xiangfeng Duan
- University of California, Los Angeles
- Department of Chemistry and Biochemistry, University of California at Los Angeles
- University of California at Los Angeles
- California NanoSystems Institute
External person
Sungsu Kang
- Seoul National University
- Institute for Basic Science
- Korea Basic Science Institute
External person
Xinyuan Zhang
- University of Houston
- Department of Mechanical Engineering
- Fudan University
- Massachusetts Institute of Technology
External person
Gyu Chul Yi
- Seoul National University
- National Creative Research Initiative Center for Semiconductor Nanorods
External person
Sang Ho Lee
- Cubist Pharmaceuticals, Inc.
- Korea Institute of Industrial Technology
- Johns Hopkins University
External person
D. G. Schlom
- Stanford University
- Cornell University
- Kavli Institute at Cornell for Nanoscale Science
- Pennsylvania State University
- Department of Electrical Engineering, Stanford University
- Department of Materials Science and Engineering, Stanford University
- Department of Materials Science and Engineering, Cornell University
- Department of Materials Science and Engineering
- Department of Materials Science and Engineering
- Department of Materials Science and Engineering, Cornell University
- Department of Electrical Engineering, Stanford University
- Department of Materials Science and Engineering
- Materials Science and Engineering
- Department of Electrical Engineering
- Department of Materials Science and Engineering
- Kavli Institute
- Leibniz Institute for Crystal Growth
- Stanford University
External person
Hyun Jae Lee
- University of Texas at Austin
- Department of Kinesiology and Health Education
- Ajou University
External person
He Yu
- University of Electronic Science and Technology of China
- University of Illinois Urbana-Champaign
- Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign
- State Key Laboratory of Electronic Thin Films and Integrated Devices
- Plasma Materials Interactions Group
- University of Illinois at Urbana-Champaign
- University of Illinois
- Massachusetts Institute of Technology
- Harbin Institute of Technology
- University of Illinois at Urbana-Champaign
External person
Meng Zhao
- MOE Key Laboratory of Protein Sciences
- Tsinghua University
- Joint Graduate Program of Peking-Tsinghua-NIBS
- Suzhou University of Science and Technology
External person
R. J. Molnar
- Massachusetts Institute of Technology
- City University of New York
- Physics Dept. and New York State
- Lincoln Laboratory
External person
Kibum Kang
- Cornell University
- Department of Chemistry and Chemical Biology
- Korea Advanced Institute of Science and Technology
External person
J. Perozek
- University of Illinois Urbana-Champaign
- Innovative COmpound SemiconductoR (ICOR) Laboratory
- Micro and Nanotechnology Lab
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- University of Illinois at Urbana-Champaign
- Massachusetts Institute of Technology
- University of Illinois at Urbana-Champaign
External person
Moon Ho Jo
- Pohang University of Science and Technology
- Center for Artificial Low Dimensional Electronic Systems
- Department of Materials Science and Engineering
- Institute for Basic Science
External person
G. Huyet
- University College Cork
- University of Strathclyde
- Department of Physics and Applied Physics
- Department of Physics
- Physics Department
- Munster Technological University
- St. Petersburg National Research University of Information Technologies, Mechanics and Optics (ITMO)
External person
Ki Jun Yu
- Dept. of Mat. Sci. and Engineering
- Departments of Electrical and Computer Engineering, and Bioengineering, University of Illinois at Urbana-Champaign
- University of Illinois Urbana-Champaign
- Yonsei University
- School of Electrical and Electronic Engineering, Yonsei University
- Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
- Seitz Materials Research Laboratory
- Department of Electrical and Computer Engineering
- Department of Materials Science and Engineering
- University of Illinois at Urbana-Champaign
- University of Illinois at Urbana-Champaign
External person
Eugene Park
- University of Illinois Urbana-Champaign
- Dept. of Mat. Sci. and Engineering
- University of Illinois at Urbana-Champaign
- Massachusetts Institute of Technology
- University of Illinois at Urbana-Champaign
External person
Huije Ryu
- Department of Materials Science and Engineering
- Yonsei University
- Seoul National University
- Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University
- Samsung
External person
D. A. Muller
- Cornell University
- Kavli Institute at Cornell for Nanoscale Science
- School of Applied and Engineering Physics
- Stanford University
- Adelphi University
- Boston University
- Brunel University London
- California Institute of Technology
- Columbia University
- National Institute for Nuclear Physics
- University of Ferrara
- University of Padua
- University of Perugia
- University of Pisa
- University of California, Berkeley
- Massachusetts Institute of Technology
- Nagoya University
- Rutgers - The State University of New Jersey, New Brunswick
- Rutherford Appleton Laboratory
- Tohoku University
- University of British Columbia
- University of California at Santa Barbara
- University of California at Santa Cruz
- University of Cincinnati
- University of Colorado Boulder
- University of Genoa
- University of Illinois Urbana-Champaign
- University of Massachusetts
- University of Oregon
- University of Tennessee, Knoxville
- University of Victoria BC
- University of Washington
- University of Wisconsin-Madison
- Vanderbilt University
- Yale University
- Colorado State University
- Lawrence Berkeley National Laboratory
- University of Mississippi
- Sogang University
- School of Applied and Engineering Physics
- Sezione di Bologna
- Istituto Nazionale di Fisica Nucleare
- Istituto Nazionale di Fisica Nucleare
- Istituto Nazionale di Fisica Nucleare
- Istituto Nazionale di Fisica Nucleare
- Istituto Nazionale de Fisica Nucleare Sezione di Ferrara
- INFN
- INFNSezione di Padova
- High Energy Accelerator Research Organization, Tsukuba
- Indiana University Bloomington
- TRIUMF
- Kavli Institute
- Department of Applied Physics
- Kavli Institute
External person
Zhihao Xu
- Xi'an Jiaotong University
- Dongguan University of Technology
- University of Illinois Urbana-Champaign
- Beijing Normal University
- Civil and Environmental Engineering, University of Illinois Urbana-Champaign
- University of Illinois at Urbana-Champaign
- Washington University St. Louis
- Southern Marine Science and Engineering Guangdong Laboratory
- Guangdong University of Technology
- University of Illinois at Urbana-Champaign
External person
H. Paik
- Cornell University
- Department of Materials Science and Engineering, Cornell University
External person
Seokhyeong Kang
- University of California at San Diego
- Department of Electrical and Computer Engineering
- ECE Departments
- Pohang University of Science and Technology
External person
Rachael L. Myers-Ward
- Naval Research Laboratory
- Advanced SiC Epitaxial Research Laboratory
External person
V. Ongun Özçelik
- Princeton University
- Andlinger Center for Energy and the Environment
External person
J. H. Lee
- Cornell University
- Pennsylvania State University
- Argonne National Laboratory
- Korea Atomic Energy Research Institute
- Department of Materials Science and Engineering
- Department of Materials Science and Engineering, Cornell University
- Neutron Science Division
- Department of Materials Science and Engineering
- Department of Materials Science and Engineering, Cornell University
- Department of Materials Science and Engineering
- Materials Science and Engineering
- X-ray Science Division, Argonne National Laboratory
- Department of Materials Science and Engineering
- Kavli Institute at Cornell for Nanoscale Science
- The University of Chicago
- Argonne National Laboratory
External person
Jeongwoon Kim
- University of Illinois at Urbana-Champaign
- Gwangju Institute of Science and Technology
External person
Chee Wei Wong
- Columbia University
- Optical Nanostructures Laboratory
- Optical Nanostructures Laboratory
- Department of Mechanical Engineering
- University of California at Los Angeles
External person
Nicholas R. Parker
- University of California at Santa Barbara
- Department of Mechanical Engineering, University of California, Santa Barbara
- University of California Office of the President
- Department of Mechanical Engineering
- University of California
- Cornell University
External person
Jing Kong
- Massachusetts Institute of Technology
- Dept. of Electrical Engineering and Computer Science
- Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
External person
Tomás Palacios
- Massachusetts Institute of Technology
- Microsystems Technology Laboratories
External person
Wenhao Li
- Internal Research Center for Marine Bioscience (Ministry of Science and Technology)
- Shanghai Ocean University
- Westlake University
External person
Jian Shi
- California Institute of Technology
- California Institute of Technology
- Rensselaer Polytechnic Institute
External person
Donghyuk Kim
- University of Minnesota
- University of Minnesota Twin Cities
- University of California at Los Angeles
External person
Roberto Grassi
- University of Minnesota Twin Cities
- Department of Electrical and Computer Engineering
External person
Yang Yang
- University of Notre Dame
- Department of Computer Science
- University of Notre Dame
- University of California at Los Angeles
- Jilin University
External person
Adam C. Scofield
- University of California at Los Angeles
- California NanoSystems Institute
External person
Jae Hwan Kim
- University of Illinois Urbana-Champaign
- Northwestern University
- University of Illinois at Urbana-Champaign
- Massachusetts Institute of Technology
- University of Illinois at Urbana-Champaign
External person
John Simon
- National Renewable Energy Laboratory
- Yale University
- University of California at Santa Barbara
- Department of Electrical Engineering
- Department of Electrical Engineering
- Department of Electrical Engineering
- Department of Electrical and Computer Engineering
External person
Hyojung Ahn
- Korea Aerospace Research Institute
- University of Science and Technology UST
External person
Junghwan Kim
- University of Illinois Urbana-Champaign
- Department of Geography and Geographic Information Science
- University of Illinois at Urbana-Champaign
- Virginia Polytechnic Institute and State University
- Sejong University
External person