Network

Mazen Farhood

  • University of Illinois Urbana-Champaign
  • Department of Mechanical and Industrial Engineering
  • Georgia Institute of Technology
  • School of Aerospace Engineering
  • Department of Mechanical Engineering
  • Department of Aerospace and Ocean Engineering
  • Virginia Tech
  • Delft University of Technology
  • Delft Center for Systems and Control
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Dept. of Mech. and Indust. Eng.
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Dept. of Mech. and Indust. Eng.
  • University of Illinois at Urbana-Champaign
  • Virginia Polytechnic Institute and State University
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • Virginia Tech College of Engineering
  • Georgia Institute of Technology

External person

Yu Wang

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Mechanical Science and Engineering
  • Duke University
  • University of Illinois at Urbana-Champaign
  • Duke University
  • University of Florida
  • Duke University
  • University of Illinois at Urbana-Champaign
  • University of Florida

External person

Vladimeros Vladimerou

  • Lund University
  • Toyota Technical Center
  • University of Illinois Urbana-Champaign
  • Toyota Technical Center
  • Integrated Vehicle Systems Department
  • Dept. of Mech. and Indust. Eng.
  • Department of Automatic Control
  • Dept. of Mech. and Indust. Eng.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Roy Smith

  • University of California at Santa Barbara
  • University of Waterloo
  • California Institute of Technology
  • Rockwell Semiconductor Systems
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Conexant
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • Swiss Federal Institute of Technology Zurich
  • UC Santa Barbara College of Engineering

External person

Jin Zhu

  • Department of Automation, University of Science and Technology of China
  • University of Science and Technology of China
  • Dept. Of Automation

External person

Nima Roohi

  • University of Illinois Urbana-Champaign
  • University of Pennsylvania
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer and Information Science
  • Department of Computer Science, University of Illinois
  • Computer Science and Engineering
  • University of California at San Diego
  • Computer Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Pavithra Prabhakar

  • California Institute of Technology
  • Institut de recherche en informatique et systèmes aléatoires
  • IMDEA Institute
  • University of Illinois Urbana-Champaign
  • Institut national des sciences appliquées de Rennes
  • IMDEA Software Institute
  • Kansas State University
  • CentraleSupélec
  • Department of Computing and Information Sciences
  • Department of Computer Science
  • Dept. of Computer Science
  • CNRS
  • Department of Computer Science, University of Illinois
  • Computer Science, University of Illinois at Urbana-Champaign
  • IMDEA Software Institute
  • Université Paris-Saclay
  • INRIA
  • University of Illinois at Urbana-Champaign
  • California Institute of Technology
  • ComUE Paris-Saclay
  • Kansas State University
  • University of Illinois at Urbana-Champaign

External person

Ji Woong Lee

  • Pennsylvania State University
  • University of Florida
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical Engineering
  • Dept. of Electrical Engineering
  • Department of Mechanical and Nuclear Engineering
  • University of Illinois at Urbana-Champaign
  • University of Florida
  • University of Illinois at Urbana-Champaign

External person

Lei Ying

  • Arizona State University
  • Iowa State University
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • School of Electrical
  • School of ECEE
  • School of Electrical
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Goldenwater Center (GWC)
  • School of Computing
  • Goldwater Center (GWC) 436
  • University of Michigan, Ann Arbor
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • Iowa State University
  • University of Michigan, Ann Arbor
  • University of Michigan
  • University of Michigan
  • Iowa State University
  • University of Illinois at Urbana-Champaign
  • Arizona State University

External person

Sanjay Lall

  • Stanford University
  • Cornell University
  • California Institute of Technology
  • University of Waterloo
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Aeronautics
  • Department of Aeronautics and Astronautics
  • Department of Aeronautics and Astronautics
  • Control and Dynamical Systems 107-81
  • Control and Dynamical Systems
  • Department of Aeronautics and Astronautics 4035
  • Hybrid System Laboratory
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • California Institute of Technology
  • Department of Aeronautics and Astronautics

External person

Joao P. Jansch-Porto

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Qualcomm Incorporated
  • University of Illinois at Urbana-Champaign

External person

Andrew Stubbs

  • Kiva Systems
  • University of Illinois Urbana-Champaign
  • Dept. of Mech. and Indust. Eng.
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Dept. of Mech. and Indust. Eng.
  • Dept. of Mech. and Indust. Eng.
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Ray Essick

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Materials Science and the Coordinated Science Laboratory
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chun Zhang

  • Extreme Networks
  • Cisco Systems
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Keith Glover

  • University of Cambridge
  • California Institute of Technology
  • IEEE
  • Department of Engineering
  • Department of Engineering
  • Department of Eneineering
  • California Institute of Technology

External person

Raffaello D'Andrea

  • Cornell University
  • Swiss Federal Institute of Technology Zurich
  • University of Pittsburgh
  • University of Illinois Urbana-Champaign
  • Dept. of Mechanical/Aerosp. Eng.
  • Sibley Sch. of Mech./Aerosp. Eng.
  • Mechanical and Aerospace Engineering
  • Computational Science and Engineering Laboratory
  • Mechanical and Aerospace Engineering
  • Department of Mechanical Engineering
  • Mechanical and Aerospace Engineering
  • University of Illinois at Urbana-Champaign

External person

Anshuman Mishra

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhenqi Huang

  • University of Illinois Urbana-Champaign
  • Siebel Center for Computer Science
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Peter A. Maginnis

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

W. P.M.H. Heemels

  • Eindhoven University of Technology
  • Control System Technology Group

External person

Andrew R. Teel

  • University of California at Santa Barbara
  • Toyon Research Corporation
  • University of California Office of the President
  • Ctr. for Contr. Eng. and Computation
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Toyon Research Corporation
  • UC Santa Barbara College of Engineering

External person

Ji Woong Lee

  • University of Florida
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Pennsylvania State University
  • University of Florida

External person

Jeffrey Strick

  • Process Analytical Technologies (PAT
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Matthew Philippe

  • Université catholique de Louvain
  • ICTEAM Institute
  • Institute of Information and Communication Technologies

External person

C. L. Pirie

  • Ford Motor Company
  • University of Illinois Urbana-Champaign
  • Dept. of Mech. and Indust. Eng.
  • Department of Mechanical and Industrial Engineering
  • Dept. of Mech. and Indust. Eng.
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

P. Seiler

  • Honeywell
  • University of California, Berkeley
  • Department of Mechanical Engineering, University of California
  • Department of Aerospace Engineering and Mechanics
  • University of Minnesota Twin Cities
  • Aerospace Engineering and Mechanics Department
  • University of Michigan, Ann Arbor
  • University of Minnesota
  • University of California at Berkeley
  • University of Michigan, Ann Arbor
  • University of Minnesota System
  • University of Michigan
  • University of Michigan
  • EECS

External person

Ji Woong Lee

  • Pennsylvania State University

External person

Negin Musavi

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Raphael M. Jungers

  • ICTEAM
  • Université catholique de Louvain
  • University of Illinois Urbana-Champaign
  • ICTEAM
  • Department of Materials Science and the Coordinated Science Laboratory
  • ICTEAM Institute
  • Institute of Information and Communication Technologies
  • University of Illinois at Urbana-Champaign

External person

Adam Thomas Fulford

  • Charles Stark Draper Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mech. and Indust. Eng.
  • Dept. of Mech. and Indust. Eng.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sean E. Bourdon

  • University of Toronto
  • University of Waterloo
  • Dept. of Elec. and Comp. Engineering

External person

Wanqing Xie

  • School of Information Science and Technology, University of Science and Technology of China
  • University of Science and Technology of China
  • School of Information Science and Technology

External person

John Doyle

  • California Institute of Technology
  • University of Pittsburgh
  • IEEE
  • Control and Dynamical Systems
  • California Institute of Technology

External person

Lin Yang

  • Chinese University of Hong Kong
  • University of Science and Technology of China

External person

Zhe Di

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Joel Rubel

  • University of Illinois Urbana-Champaign
  • Dept. of Mech. and Indust. Eng.
  • Dept. of Mech. and Indust. Eng.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mohammad Naghnaeian

  • University of Illinois Urbana-Champaign
  • Massachusetts Institute of Technology
  • Mechanical Science and Engineering Department, University of Illinois
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • University of Illinois at Urbana-Champaign
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Aaron Havens

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Qiang Ling

  • University of Science and Technology of China

External person

N. W.A. Strijbosch

  • Eindhoven University of Technology
  • Control System Technology Group

External person

Hussein Darir

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chaoxiang Li

  • University of Science and Technology of China

External person

Darioush Keivan

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Coordinated Science Laboratory

External person

Atilla Eryilmaz

  • IEEE
  • Laboratory for Information and Decision Systems
  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Lab. for Info. and Decision Systems
  • Ohio State University
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • Ohio State University
  • University of Illinois at Urbana-Champaign
  • Ohio State University

External person

Lucas Buccafusca

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Industrial and Enterprise Systems Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pramod P. Khargonekar

  • University of Florida
  • College of Engr.
  • University of Florida

External person

Kai Xia

  • University of Science and Technology of China
  • University of Science and Technology of China

External person

Minghao Jiang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mark E. Campbell

  • Cornell University
  • Dept. of Mechanical/Aerosp. Eng.

External person

Wei Chen

  • University of Science and Technology of China

External person

Jorge Cortes

  • Department of Mechanical and Aerospace Engineering
  • University of California at San Diego

External person

Hussein Sibai

  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • Washington University St. Louis
  • University of Illinois at Urbana-Champaign

External person

Derek King

  • University of Illinois Urbana-Champaign

External person

Yu Kang

  • University of Science and Technology of China

External person

Elijah Polak

  • University of California, Berkeley
  • Department of Electrical Engineering and Computer Sciences
  • University of California at Berkeley

External person

S. Okubo

  • Ford Motor Company

External person

Yewen Wang

  • University of Science and Technology of China

External person

Sridhar Sastry

  • University of Illinois Urbana-Champaign
  • Dept. of Mech. and Indust. Eng.
  • Department of Mechanical and Industrial Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Jayant E. Kulkarni

  • Columbia University
  • Center for Theoretical Neuroscience

External person

Enric Xargay

  • Department of Aerospace Engineering
  • Dept. of Aerospace Engineering
  • Dept. of Mechanical Science and Engineering
  • Dept. of Mech. and Astronautical Eng.
  • University of Illinois Urbana-Champaign
  • Urbana
  • Department of Mechanical Science and Engineering
  • Dept. of Mechanical Science and Engineering
  • Dept. of Aerospace Engineering
  • Dept. of Mech. and Astronautical Eng.
  • NASA Langley Research Center
  • Department of Mechanical Science and Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Aerospace Engineering, University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Center for the Simulation of Advanced Rockets
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Thomas Wendel

  • Boeing
  • The Boeing Company

External person

Sundeep Rangan

  • University of California, Berkeley
  • New York University
  • Electrical Engineering Department, 147 Cory Hall, University of California
  • Polytechnic Institute
  • University of California at Berkeley

External person

Chiao Hsieh

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Department of Computer Science
  • University of Illinois at Urbana-Champaign
  • Department of Computer Science

External person

Dawei Sun

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mark Yen

  • University of Florida
  • University of Florida

External person

Tong Luo

  • Dept. Of Automation
  • University of Science and Technology of China

External person

Matthew T. Hale

  • Georgia Institute of Technology
  • School of Electrical and Computer Engineering

External person

K. Poolla

  • University of California, Berkeley
  • Mechanical Engineering
  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley

External person

Swarat Chaudhuri

  • University of Pennsylvania
  • Rice University
  • Computer Science Department
  • Rice University

External person

Zhi Xie

  • University of Science and Technology of China

External person

Marie Csete

  • California Institute of Technology
  • California Institute of Technology

External person

Kuan Yu Tseng

  • University of Illinois at Urbana-Champaign

External person

Jinglong Zhang

  • University of Science and Technology of China

External person

Amelia Gosse

  • Department of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jerome Le Ny

  • Ecole Polytechnique de Montreal
  • Department of Electrical Engineering
  • Polytechnique Montreal

External person

Yutong Wei

  • University of Science and Technology of China

External person

V. S. Dolk

  • Eindhoven University of Technology

External person

Sanjay Shakkottai

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • IEEE
  • Stanford University
  • Texas A&M University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical, and Computer Engineering
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering, Texas AandM University
  • Center for Compound Semiconductor Microelectronics
  • UT Austin
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xingang Guo

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Coordinated Science Laboratory

External person

Yun Bo Zhao

  • Hefei Comprehensive National Science Center
  • University of Science and Technology of China

External person

Qing Xu

  • Beihang University

External person

Donghwan Lee

  • Center for Compound Semiconductor Microelectronics
  • University of Illinois Urbana-Champaign
  • UIUC
  • University of Illinois at Urbana-Champaign
  • Korea Advanced Institute of Science and Technology
  • University of Illinois at Urbana-Champaign

External person

D. P. Borgers

  • Eindhoven University of Technology

External person

Peter Du

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Andy Vaughn

  • University of Illinois Urbana-Champaign
  • Dept. of Mech. and Indust. Eng.
  • Dept. of Mech. and Indust. Eng.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ritwika Ghosh

  • University of Illinois Urbana-Champaign
  • Department of Computer Science
  • University of Illinois at Urbana-Champaign
  • Department of Computer Science

External person

Seungho Lee

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Richard E. Devor

  • College of Engineering Distinguished
  • Caterpillar Inc.
  • Georgia Institute of Technology
  • University of Illinois at Chicago
  • General Motors
  • ASME
  • Pennsylvania State University
  • University of Minnesota Twin Cities
  • College of Engineering Distinguished Professor of Manufacturing
  • Cummins Inc.
  • University of Illinois Urbana-Champaign
  • ASME
  • College of Engineering
  • ASME International
  • Dept. of Mech. and Indust. Eng.
  • Department of Mechanical Science and Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Dept. of Mech. and Indust. Eng.
  • Department of Mechanical Science and Engineering
  • Dept. of Mech. and Indust. Eng.
  • Department of Mechanical Engineering and Sciences
  • Department of Mechanical Scienceand Engineering
  • CaterPillar Inc.
  • Department of Mechanical Science and Engineering
  • Department of Mechanical and Industrial Engineering
  • Department of Mechanical and Industrial Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Manufacturing
  • Departmenl of Mechanical and Industrial Engineering
  • Dapartment of Mechanical Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Engineering
  • Department of Mechanical and Industrial Engineering
  • Beckman Inst./Dept.Mech./Indust.Eng.
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Chicago
  • University of Illinois
  • College of Engineering Distinguished Professor of Manufacturing
  • ASME International
  • University of Illinois at Urbana-Champaign

External person

Darioush Kevian

  • University of Illinois at Urbana-Champaign

External person

Jianghai Hu

  • Purdue University
  • School of Electrical and Computer Engineering

External person

Li Chen

  • Rockwell Semiconductor Systems
  • Conexant

External person

Xiaofeng Jiang

  • University of Science and Technology of China

External person

Chunhui Du

  • University of Science and Technology of China

External person

Kan Chen

  • University of Illinois Urbana-Champaign
  • Department of Aerospace Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Magnus Egerstedt

  • Georgia Institute of Technology
  • School of Electrical and Computer Engineering

External person

Bruce Allen Francis

  • University of Cambridge
  • University of Toronto
  • Department of Electrical Engineering

External person

Andrzej Banaszuk

  • University of California at Santa Barbara
  • United Technologies Corporation
  • Control and Embedded Systems Group
  • UTRC
  • Cornell University
  • Systems Department
  • Pratt and Whitney
  • Control and Embedded Systems Group

External person

Tyler Leman

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shuo Han

  • University of Pennsylvania
  • Department of Electrical and Systems Engineering, University of Pennsylvania
  • Stanford University

External person

Scott Miller

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering
  • UC Santa Barbara College of Engineering

External person

Hebron Taylor

  • Department of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

George J. Pappas

  • University of Pennsylvania
  • Department of Electrical and Systems Engineering, University of Pennsylvania
  • Dept. of Electrical and Syst. Eng.

External person

Xinghua Wu

  • Dept. Of Automation
  • University of Science and Technology of China

External person

A. Eryilmaz

  • University of Illinois Urbana-Champaign
  • Massachusetts Institute of Technology
  • Ohio State University
  • IEEE
  • Laboratory for Information and Decision Systems
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Lab. for Info. and Decision Systems
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person