Network

Taylor L Hughes

Person: Academic

Jose E Schutt-Aine

Person: Academic

T. Carmon

  • University of Michigan, Ann Arbor
  • Technion-Israel Institute of Technology
  • Real-Time Computing Laboratory
  • Mechanical Engineering
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering and Computer Science
  • Radiation Laboratory
  • Mechanical Engineering
  • Department of Electrical Engineering and Computer Science
  • EECS and 2BME Departments
  • Real-Time Computing Laboratory
  • University of Michigan, Ann Arbor

External person

Thomas W. Kenny

  • Stanford University
  • Department of Mech.Eng.
  • Department of Mech.Eng.
  • Department of Mechanical Engineering
  • Mechanical Engineering Department
  • Department of Mechanical Engineering
  • Mechanical Engineering Department
  • Department of Mechanical Engineering, Stanford University
  • Departments of Mechanical and Electrical Engineering
  • High Temperature Gasdynamics Laboratory
  • Department of Electrical Engineering, Stanford University
  • Departments of Applied Physics and Mechanical Engineering
  • Stanford University
  • Stanford University

External person

Renata Melamud

  • Stanford University
  • SiTime Corporation
  • PhD Alumni of Stanford
  • Departments of Mechanical and Electrical Engineering
  • Department of Mechanical Engineering
  • High Temperature Gasdynamics Laboratory
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • PhD Alumni of Stanford
  • Stanford University

External person

Bongsang Kim

  • Stanford University
  • University of California, Berkeley
  • Sandia National Laboratories
  • PhD Alumni of Stanford
  • Departments of Mechanical and Electrical Engineering
  • Department of Mechanical Engineering
  • High Temperature Gasdynamics Laboratory
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • University of California at Berkeley
  • PhD Alumni of Stanford
  • Stanford University

External person

Donggyu B. Sohn

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Kewen Han

  • Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • ACRC
  • MechSE department
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Matthew Tomes

  • University of Michigan, Ann Arbor
  • Real-Time Computing Laboratory
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering and Computer Science
  • Radiation Laboratory
  • University of Michigan, Ann Arbor

External person

Junhwan Kim

  • Department of Mechanical Science and Engineering
  • Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • ACRC
  • MechSE department
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

James Salvia

  • Stanford University
  • SiTime Corporation
  • PhD Alumni of Stanford
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical Engineering, Stanford University
  • Departments of Mechanical and Electrical Engineering
  • Department of Mechanical Engineering
  • Stanford University
  • PhD Alumni of Stanford
  • Stanford University

External person

Saurabh A. Chandorkar

  • Stanford University
  • University of California, Los Angeles
  • Department of Electrical Engineering, Stanford University
  • Mechanical Engineering Department
  • Department of Electrical Engineering
  • Sensors and Technology Laboratory
  • Departments of Mechanical and Electrical Engineering
  • Department of Mechanical Engineering
  • High Temperature Gasdynamics Laboratory
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • University of California at Los Angeles
  • Stanford University

External person

Matthew A. Hopcroft

  • Stanford University
  • University of California, Berkeley
  • PhD Alumni of Stanford
  • Departments of Mechanical and Electrical Engineering
  • Department of Mechanical Engineering, Stanford University
  • Department of Electrical Engineering
  • Department of Mechanical Engineering
  • High Temperature Gasdynamics Laboratory
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • University of California at Berkeley
  • PhD Alumni of Stanford
  • Stanford University

External person

Oğulcan E. Örsel

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Department of Electrical & Computer Engineering

External person

Seunghwi Kim

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • City University of New York
  • University of Illinois at Urbana-Champaign

External person

Christopher W. Peterson

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

X. Fan

  • University of Michigan, Ann Arbor
  • University of Illinois Urbana-Champaign
  • Department of Biomedical Engineering
  • BME departments
  • Dept. Of Biomedical Engineering
  • Biomedical Engineering
  • EECS and 2BME Departments
  • BME Departments
  • University of Illinois at Urbana-Champaign
  • University of Michigan, Ann Arbor

External person

Wonsuk Lee

  • University of Michigan, Ann Arbor
  • University of Illinois Urbana-Champaign
  • Department of Biomedical Engineering
  • Department of Electrical Engineering and Computer Science
  • BME departments
  • Dept. Of Biomedical Engineering
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering and Computer Science
  • Biomedical Engineering
  • EECS and 2BME Departments
  • BME Departments
  • University of Illinois at Urbana-Champaign
  • University of Michigan, Ann Arbor

External person

K. H. Kim

  • University of Michigan, Ann Arbor
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering and Computer Science
  • EECS and 2BME Departments
  • Real-Time Computing Laboratory
  • University of Michigan, Ann Arbor

External person

Wladimir A. Benalcazar

  • Department of Physics
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • Beckman Institute for Advanced Science and Technology
  • Pennsylvania State University
  • Department of Physics
  • Department of Physics and Institute for Condensed Matter Theory
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • Princeton University
  • Emory University
  • University of Illinois at Urbana-Champaign

External person

Manu Agarwal

  • Stanford University
  • PhD Alumni of Stanford
  • Department of Electrical Engineering
  • Departments of Mechanical and Electrical Engineering
  • Department of Mechanical Engineering
  • High Temperature Gasdynamics Laboratory
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • PhD Alumni of Stanford
  • George Mason University
  • Stanford University

External person

Shingo Yoneoka

  • Stanford University
  • PhD Alumni of Stanford
  • Department of Mechanical Engineering
  • Stanford University
  • PhD Alumni of Stanford
  • Stanford University

External person

Jiho Noh

  • Pennsylvania State University
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Robert N. Candler

  • Robert Bosch GmbH
  • Stanford University
  • University of California, Los Angeles
  • PhD Alumni of Stanford
  • Department of Mechanical Engineering, Stanford University
  • Stanford University
  • University of California at Los Angeles
  • PhD Alumni of Stanford
  • Stanford University

External person

Jing Liu

  • University of Michigan, Ann Arbor
  • University of Illinois Urbana-Champaign
  • BME departments
  • Department of Biomedical Engineering
  • EECS and 2BME Departments
  • BME Departments
  • University of Illinois at Urbana-Champaign
  • University of Michigan, Ann Arbor

External person

Gary Yama

  • Robert Bosch GmbH
  • Robert Bosch LLC Research and Technology Center

External person

Hyung Kyu Lee

  • Stanford University
  • PhD Alumni of Stanford
  • Mechanical Engineering Department
  • Stanford University
  • PhD Alumni of Stanford
  • Stanford University

External person

John Zehnpfennig

  • University of Michigan, Ann Arbor
  • United States Military Academy at West Point
  • United States Military Academy
  • Real-Time Computing Laboratory
  • Electrical Engineering and Computer Science
  • Electrical Engineering and Computer Science
  • University of Michigan, Ann Arbor

External person

Harsh Mehta

  • Stanford University
  • Departments of Mechanical and Electrical Engineering
  • Department of Mechanical Engineering
  • High Temperature Gasdynamics Laboratory
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Stanford University

External person

Chandra M. Jha

  • Stanford University
  • Departments of Mechanical and Electrical Engineering
  • Department of Mechanical Engineering
  • High Temperature Gasdynamics Laboratory
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Stanford University

External person

Jacob M. Taylor

  • University of Maryland, College Park
  • National Institute of Standards and Technology
  • Joint Quantum Institute
  • Joint Center for Quantum Information and Computer Science
  • College Park
  • University of Oxford
  • Australian National University
  • Pennsylvania State University

External person

Soonwook Kim

  • Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Inbar Grinberg

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Florian Marquardt

  • Max Planck Institute for the Science of Light
  • Friedrich-Alexander University Erlangen-Nürnberg
  • Institut für Theoretische Physik
  • Center for Medical Physics and Technology
  • Max Planck Institute for the Science of Light

External person

Yin Chung Chen

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Roger T. Howe

  • Stanford University
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical Engineering
  • Stanford University
  • Stanford University

External person

Jeewon Suh

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

M. Messana

  • Stanford University
  • PhD Alumni of Stanford
  • Stanford University
  • PhD Alumni of Stanford

External person

Meng Lu

  • Iowa State University
  • SRU Biosystems Incorporated
  • SRU Biosystems
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • SRU Biosystems, Inc.
  • Nano Sensors Group
  • University of Illinois Urbana-Champaign
  • SRU Biosystems
  • Department of Electrical and Computer Engineering
  • Department of Mechanical Engineering
  • Laboratory of Integrated Optical Sensors
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Iowa State University
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • Iowa State University

External person

Sujin Seo

  • Micro and Nanotechnology Lab
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Miro and Nanotechnology Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Boris Murmann

  • Stanford University
  • High Temperature Gasdynamics Laboratory
  • Department of Mechanical Engineering
  • Stanford University
  • Stanford University

External person

Xunnong Xu

  • University of Maryland, College Park
  • Joint Quantum Institute
  • College Park

External person

Te Wei Chang

  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Manas Ranja Gartia

  • Micro and Nanotechnology Lab
  • Department of Nuclear, Plasma, and Radiological Engineering, University of Illinois at Urbana Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Lawrence Livermore National Laboratory
  • Department of Electrical and Computer Engineering
  • Louisiana State University
  • University of Illinois Urbana-Champaign
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Mechanical and Industrial Engineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Carle Foundation Hospital
  • Research Park
  • Department of Electrical and Computer Engineering, Department of Bioengineering, Beckman Institute for Advanced Science and Technology, College of Medicine, University of Illinois at Urbana-Champaign (UIUC)
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Center for Micro- and Nanotechnology
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Deptartment of Nuclear, Plasma and Radiological Engineering
  • Department of Bioengineering
  • Carle Clinic Association
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Bioengineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • Louisiana State University

External person

Julian Schulz

  • University of Kaiserslautern
  • The University of Kaiserslautern-Landau

External person

Ali Kanj

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Jiheng Jing

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mark C. Kuzyk

  • University of Oregon
  • Department of Physics

External person

Hailin Wang

  • University of Oregon
  • Department of Physics

External person

Yu Qiao Qu

  • Stanford University
  • Stanford University
  • Stanford University

External person

Mao Lin

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics and Institute for Condensed Matter Theory
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Andrew B. Graham

  • Stanford University
  • PhD Alumni of Stanford
  • Stanford University
  • PhD Alumni of Stanford

External person

Rhinithaa P. Thanalakshme

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tianhe Li

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Georg von Freymann

  • The University of Kaiserslautern-Landau
  • Fraunhofer Institute for Industrial Mathematics

External person

Shasha Wang

  • Stanford University
  • PhD Alumni of Stanford
  • Stanford University
  • PhD Alumni of Stanford

External person

K. L. Chen

  • Stanford University
  • PhD Alumni of Stanford
  • Stanford University
  • PhD Alumni of Stanford

External person

E. Ng

  • Department of Mech.Eng.
  • Department of Mech.Eng.
  • Stanford University

External person

C. H. Ahn

  • Department of Mech.Eng.
  • Department of Mech.Eng.
  • Stanford University

External person

Kaiyuan Zhu

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jing Liu

  • University of Michigan, Ann Arbor
  • Department of Biomedical Engineering
  • Dept. Of Biomedical Engineering
  • Biomedical Engineering
  • University of Michigan, Ann Arbor

External person

David Elata

  • Technion-Israel Institute of Technology
  • Faculty of Mechanical Engineering
  • Stanford University
  • Stanford University

External person

V. A. Hong

  • Department of Mech.Eng.
  • Department of Mech.Eng.
  • Stanford University

External person

Jianing Zhao

  • University of Illinois at Urbana-Champaign

External person

James M.L. Miller

  • University of Illinois at Urbana-Champaign

External person

Eli Wilken-Resman

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. Yang

  • Department of Mech.Eng.
  • Department of Mech.Eng.
  • Stanford University

External person

Robert G. Hennessy

  • Stanford University
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Stanford University

External person

Josephine Melia

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. K. Lee

  • Stanford University
  • Department of Mechanical Engineering
  • Stanford University

External person

Chengzhang Li

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Anudeep Mangu

  • University of Illinois at Urbana-Champaign

External person

Stefan Imhof

  • University of Würzburg

External person

Gregory Moille

  • University of Maryland, College Park

External person

Alexander Stegmaier

  • University of Würzburg

External person

Hohyun Keum

  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Peter T. Rakich

  • Yale University
  • Department of Applied Physics

External person

Ronny Thomale

  • University of Würzburg

External person

Lavi K. Upreti

  • University of Konstanz
  • University of Würzburg

External person

Eric A. Kittlaus

  • Jet Propulsion Laboratory, California Institute of Technology
  • California Institute of Technology

External person

Gabrielle Vukasin

  • Stanford University

External person

John Kulikowski

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mengze Sha

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Michael J. Steel

  • MQ Photonics Research Centre and Department of Physics and Astronomy
  • Macquarie University

External person

Kaihao Zhang

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Hong Kong University of Science and Technology
  • University of Illinois at Urbana-Champaign
  • The Hong Kong University of Science and Technology (Guangzhou)

External person

C. L M Everhart

  • Department of Mech.Eng.
  • Department of Mech.Eng.
  • Stanford University

External person

Tobias Helbig

  • University of Würzburg

External person

Igor Bargatin

  • Stanford University
  • Stanford University

External person

Alexander Fritzsche

  • University of Rostock
  • University of Würzburg

External person

Hailin Wang

  • University of Oregon
  • Department of Physics

External person

Daniel G. Suarez-Forero

  • University of Maryland, College Park

External person

Xiao Qi Sun

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nayan E. Myerson-Jain

  • University of Illinois at Urbana-Champaign

External person

Indronil Ghosh

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. B. Heinz

  • Department of Mech.Eng.
  • Department of Mech.Eng.
  • Stanford University

External person

C. F. Chiang

  • PhD Alumni of Stanford
  • Stanford University
  • Stanford University
  • PhD Alumni of Stanford

External person

Kenneth E. Goodson

  • Stanford University
  • Department of Mechanical Engineering, Stanford University
  • IBM Zurich Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Stanford University
  • Mechanical Engineering Department
  • Department of Electrical Engineering, Stanford University
  • High Temperature Gasdynamics Laboratory
  • Department of Metarials/Engineering
  • Department of Metarials/Engineering
  • IBM
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • Stanford University

External person

A. Partridge

  • SiTime Inc

External person

M. Lutz

  • SiTime Inc

External person

P. G. Hartwell

  • University of California at Santa Barbara

External person

Sunil Mittal

  • University of Maryland, College Park
  • Joint Quantum Institute
  • Institute for Systems Research
  • College of Engineering

External person

X. Fan

  • University of Michigan, Ann Arbor
  • University of Michigan, Ann Arbor

External person

Gengming Liu

  • University of Illinois at Urbana-Champaign

External person

Nils T. Otterstrom

  • Sandia National Laboratories

External person

J. Liu

  • University of Illinois at Urbana-Champaign

External person

Rakibul Islam

  • University of Illinois at Urbana-Champaign

External person

Mohammad Hafezi

  • Institute for the Research in Electronics and Applied Physics
  • Joint Quantum Institute
  • University of Maryland, College Park
  • Physics Department
  • Institute for Systems Research
  • University of Maryland

External person

Md Farhadul Haque

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Lida Xu

  • University of Maryland, College Park

External person

Christopher G. Poulton

  • School of Mathematical and Physical Sciences
  • University of Technology Sydney

External person

Nicholas E. Bousse

  • Stanford University

External person

Ching Hua Lee

  • Agency for Science, Technology and Research, Singapore
  • National University of Singapore

External person

V. Qu

  • PhD Alumni of Stanford
  • Stanford University
  • Stanford University
  • PhD Alumni of Stanford

External person

I. Flader

  • Department of Mech.Eng.
  • Department of Mech.Eng.
  • Stanford University

External person

Zining Yang

  • Department of Mechanical Science and Engineering, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Drew E. Handler

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kartik Srinivasan

  • National Institute of Standards and Technology
  • Center for Nanoscale Science and Technology
  • University of Maryland, College Park

External person

Yanne Chembo

  • University of Maryland

External person

M. Ohline

  • Stanford University
  • Stanford University

External person

Saurabh Saxena

  • Oregon State University
  • Department of Electrical and Computer Engineering, University of Illinois
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, University of Illinois
  • Indian Institute of Technology Madras
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical and Computer Engineering, University of Illinois
  • Department of Electrical Engineering
  • School of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • School of EECS
  • University of Illinois at Urbana-Champaign
  • Oregon State University
  • School of Civil and Construction Engineering, Oregon State University
  • University of Illinois at Urbana-Champaign

External person

Jintark Kim

  • University of Illinois at Urbana-Champaign

External person

Sorina Dumitrescu

  • McMaster University
  • Dept. of Electrical Eng.

External person

K. L. Turner

  • University of California at Santa Barbara

External person

R. N. Candler

  • Robert Bosch GmbH

External person

Igor Boettcher

  • University of Alberta

External person

R. G. Walmsley

  • University of California at Santa Barbara

External person

Tobias Kießling

  • University of Würzburg

External person

Y. Chen

  • Department of Mech.Eng.
  • Department of Mech.Eng.
  • Stanford University

External person

Sasha S. Yamada

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hauke Brand

  • University of Würzburg

External person

Tobias Hofmann

  • University of Würzburg

External person

Rajendar Bahl

  • Indian Institute of Technology Delhi

External person

Thong Nguyen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Wentao Jiang

  • Stanford University

External person

K. Zhu

  • University of Illinois at Urbana-Champaign

External person

Shengtai Shi

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Cameron Harris

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ryan Kwon

  • Stanford University

External person

G. J. O'Brien

  • Robert Bosch GmbH

External person

Penghao Zhu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jianing Zhao

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nathan Dostart

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Martin Greiter

  • University of Würzburg

External person

Christopher J. Flower

  • University of Maryland, College Park

External person

B. E. DeMartini

  • University of California at Santa Barbara

External person

Mahmoud Jalali Mehrabad

  • University of Maryland, College Park

External person

Georg von Freymann

  • University of Kaiserslautern
  • Fraunhofer Institute for Industrial Mathematics
  • The University of Kaiserslautern-Landau

External person

Alireza Safaei

  • University of Illinois at Urbana-Champaign

External person

Alexander Szameit

  • University of Rostock

External person

Xiaolin Wu

  • Polytechnic University - Brooklyn
  • New York University
  • Dept. of Computer Science
  • New York University

External person

Benjamin J. Eggleton

  • Lucent Technologies
  • OFS Fitel
  • OFS Laboratories
  • Furukawa Electric Co., Ltd.
  • Lucent Technol., 700 Mountain Avenue
  • Centre for Ultrahigh-bandwidth Devices for Optical Systems (CUDOS), School of Physics A28, University of Sydney
  • Bell Laboratories
  • University of Sydney
  • Alcatel-Lucent
  • Specialty Fiber Devices
  • Lucent
  • Nokia
  • Lucent Technologies
  • Specialty Photonics Division

External person