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Research Output

2019

Data-driven reliability for datacenter hard disk drives

Yang, A., Ghassami, A. E., Rosenbaum, E. & Kiyavash, N., May 2019, In : Electronic Device Failure Analysis. 21, 2, p. 18-20 3 p.

Research output: Contribution to journalComment/debate

Decomposition Method for Event-Detection State Vector Simulation of Switched-Mode Power Supplies

Reiman, C. & Rosenbaum, E., Jun 2019, 2019 IEEE 20th Workshop on Control and Modeling for Power Electronics, COMPEL 2019. Institute of Electrical and Electronics Engineers Inc., 8769654. (2019 IEEE 20th Workshop on Control and Modeling for Power Electronics, COMPEL 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Discrete-Time Large-Signal Modeling and Numerical Methods for Flyback Converters

Reiman, C., Das, D. & Rosenbaum, E., Apr 24 2019, 2019 IEEE Power and Energy Conference at Illinois, PECI 2019. Institute of Electrical and Electronics Engineers Inc., 8698921. (2019 IEEE Power and Energy Conference at Illinois, PECI 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Guilty As Charged: Computational Reliability Threats Posed by Electrostatic Discharge-induced Soft Errors

Feng, K., Vora, S., Jiang, R., Rosenbaum, E. & Vasudevan, S., May 14 2019, Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019. Institute of Electrical and Electronics Engineers Inc., p. 156-161 6 p. 8715149. (Proceedings of the 2019 Design, Automation and Test in Europe Conference and Exhibition, DATE 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Measurement and simulation of on-chip supply noise induced by system-level ESD

Xiu, Y., Thomson, N. & Rosenbaum, E., Mar 2019, In : IEEE Transactions on Device and Materials Reliability. 19, 1, p. 211-220 10 p., 8640259.

Research output: Contribution to journalArticle

Special Issue on Reliability

Mahapatra, S., Chen, K. J., Kaczer, B., Pancheri, L., Rosenbaum, E., Mouli, C., Wong, H., Kerber, A., Monzio Compagnoni, C., Koval, R., Meneghesso, G., Sheridan, D., Ramey, S., Wang, R. & Stathis, J., Nov 2019, In : IEEE Transactions on Electron Devices. 66, 11, p. 4497-4503 7 p., 8886623.

Research output: Contribution to journalEditorial

2018

Enhanced IC modeling methodology for system-level ESD simulation

Xiong, J., Chen, Z., Xiu, Y., Mu, Z., Raginsky, M. & Rosenbaum, E., Oct 25 2018, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2018. ESD Association, (Electrical Overstress/Electrostatic Discharge Symposium Proceedings; vol. 2018-September).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hardware and software combined detection of system-level ESD-induced soft failures

Vora, S., Jiang, R., Vijayaraj, P. M., Feng, K., Xiu, Y., Vasudevan, S. & Rosenbaum, E., Oct 25 2018, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2018. ESD Association, (Electrical Overstress/Electrostatic Discharge Symposium Proceedings; vol. 2018-September).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Latch-up model of non-collinear PNPN structures

Reiman, C., Jack, N. & Rosenbaum, E., Oct 25 2018, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2018. ESD Association, (Electrical Overstress/Electrostatic Discharge Symposium Proceedings; vol. 2018-September).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Preface

Rosenbaum, E., May 25 2018, In : IEEE International Reliability Physics Symposium Proceedings. 2018-March, 1 p.

Research output: Contribution to journalEditorial

Stochastic modeling of air electrostatic discharge parameters

Xiu, Y., Sagan, S., Battini, A., Ma, X., Raginsky, M. & Rosenbaum, E., May 25 2018, 2018 IEEE International Reliability Physics Symposium, IRPS 2018. Institute of Electrical and Electronics Engineers Inc., p. 2C.21-2C.210 (IEEE International Reliability Physics Symposium Proceedings; vol. 2018-March).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Verilog-A compatible recurrent neural network model for transient circuit simulation

Chen, Z., Raginsky, M. & Rosenbaum, E., Apr 2 2018, 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017; vol. 2018-January).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2017

Chip-level ESD-induced noise on internally and externally regulated power supplies

Xiu, Y., Thomson, N., Mertens, R., Reiman, C. & Rosenbaum, E., Oct 18 2017, Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2017, EOS/ESD 2017. ESD Association, (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

ESD self-protection of high-speed transceivers using adaptive active bias conditioning

Keel, M. S. & Rosenbaum, E., Mar 2017, In : IEEE Transactions on Device and Materials Reliability. 17, 1, p. 113-120 8 p., 7744493.

Research output: Contribution to journalArticle

On-chip monitors of supply noise generated by system-level ESD

Thomson, N., Reiman, C., Xiu, Y. & Rosenbaum, E., Oct 18 2017, Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2017, EOS/ESD 2017. ESD Association, (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Soft-Failures Induced by System-Level ESD

Thomson, N. A., Xiu, Y. & Rosenbaum, E., Mar 2017, In : IEEE Transactions on Device and Materials Reliability. 17, 1, p. 90-98 9 p., 7851026.

Research output: Contribution to journalArticle

2016

Application level investigation of system-level ESD-induced soft failures

Vora, S., Jiang, R., Vasudevan, S. & Rosenbaum, E., Oct 14 2016, Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2016, EOS/ESD 2016. ESD Association, 7592565. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings; vol. 2016-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

A Study of BER-Optimal ADC-Based Receiver for Serial Links

Lin, Y., Keel, M. S., Faust, A., Xu, A., Shanbhag, N. R., Rosenbaum, E. & Singer, A. C., May 2016, In : IEEE Transactions on Circuits and Systems I: Regular Papers. 63, 5, p. 693-704 12 p., 7486052.

Research output: Contribution to journalArticle

Case study of DPI robustness of a MOS-SCR structure for automotive applications

Xiu, Y., Farbiz, F., Salman, A., Zu, Y., Dissegna, M., Boselli, G. & Rosenbaum, E., Oct 14 2016, Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2016, EOS/ESD 2016. ESD Association, 7592538. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings; vol. 2016-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

CDM-reliable T-coil techniques for a 25-Gb/s wireline receiver front-end

Keel, M. S. & Rosenbaum, E., Dec 2016, In : IEEE Transactions on Device and Materials Reliability. 16, 4, p. 513-520 8 p., 7523221.

Research output: Contribution to journalArticle

Compact distributed multi-finger MOSFET model for circuit-level ESD simulation

Meng, K. H., Chen, Z. & Rosenbaum, E., Aug 1 2016, In : Microelectronics Reliability. 63, p. 11-21 11 p.

Research output: Contribution to journalArticle

Experimental study of supply voltage stability during ESD

Xiu, Y., Mertens, R., Thomson, N. & Rosenbaum, E., Sep 22 2016, 2016 International Reliability Physics Symposium, IRPS 2016. Institute of Electrical and Electronics Engineers Inc., p. 6A61-6A66 7574560. (IEEE International Reliability Physics Symposium Proceedings; vol. 2016-September).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Full-component modeling and simulation of charged device model ESD

Meng, K. H., Shukla, V. & Rosenbaum, E., Jul 2016, In : IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. 35, 7, p. 1105-1113 9 p., 7308012.

Research output: Contribution to journalArticle

Improving the long pulse width failure current of NPN in BiCMOS technology

Xiu, Y., Appaswamy, A., Chen, Z., Salman, A., Dissegna, M., Boselli, G. & Rosenbaum, E., Sep 22 2016, 2016 International Reliability Physics Symposium, IRPS 2016. Institute of Electrical and Electronics Engineers Inc., p. EL51-EL54 7574606. (IEEE International Reliability Physics Symposium Proceedings; vol. 2016-September).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Physical basis for CMOS SCR compact models

Mertens, R. & Rosenbaum, E., Jan 1 2016, In : IEEE Transactions on Electron Devices. 63, 1, p. 296-302 7 p., 7365555.

Research output: Contribution to journalArticle

2015

Analysis of active-clamp response to power-on ESD: Power supply integrity and performance tradeoffs

Mertens, R., Thomson, N., Xiu, Y. & Rosenbaum, E., Sep 1 2015, In : IEEE Transactions on Device and Materials Reliability. 15, 3, p. 263-271 9 p., 7177068.

Research output: Contribution to journalArticle

CDM-reliable T-coil techniques for high-speed wireline receivers

Keel, M. S. & Rosenbaum, E., Oct 30 2015, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2015. ESD Association, (Electrical Overstress/Electrostatic Discharge Symposium Proceedings; vol. 2015-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Charged Device Model Reliability of Three-Dimensional Integrated Circuits

Shukla, V. & Rosenbaum, E., Dec 2015, In : IEEE Transactions on Device and Materials Reliability. 15, 4, p. 559-566 8 p., 7299296.

Research output: Contribution to journalArticle

Current challenges in component-level and system-level ESD simulation

Rosenbaum, E., Meng, K. H., Xiu, Y. & Thomson, N., Aug 3 2015, 2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015. Institute of Electrical and Electronics Engineers Inc., p. 333-336 4 p. 7175328. (2015 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2015).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Fast circuit simulator for transient analysis of CDM ESD

Meng, K. H. & Rosenbaum, E., Oct 30 2015, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2015. ESD Association, (Electrical Overstress/Electrostatic Discharge Symposium Proceedings; vol. 2015-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Improved GGSCR layout for overshoot reduction

Chen, Z., Mertens, R., Reiman, C. & Rosenbaum, E., May 26 2015, 2015 IEEE International Reliability Physics Symposium, IRPS 2015. Institute of Electrical and Electronics Engineers Inc., p. 3F21-3F28 7112720. (IEEE International Reliability Physics Symposium Proceedings; vol. 2015-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Piecewise-linear model with transient relaxation for circuit-level ESD simulation

Meng, K. H., Mertens, R. & Rosenbaum, E., Sep 1 2015, In : IEEE Transactions on Device and Materials Reliability. 15, 3, p. 464-466 3 p., 7214270.

Research output: Contribution to journalArticle

Practical methodology for the extraction of SEED models

Reiman, C., Thomson, N., Xiu, Y., Mertens, R. & Rosenbaum, E., Oct 30 2015, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2015. ESD Association, (Electrical Overstress/Electrostatic Discharge Symposium Proceedings; vol. 2015-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

S-parameter based modeling of system-level ESD test bed

Xiu, Y., Thomson, N., Mertens, R. & Rosenbaum, E., Oct 30 2015, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2015. ESD Association, (Electrical Overstress/Electrostatic Discharge Symposium Proceedings; vol. 2015-October).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2014

A co-optimization methodology on ESD robustness and functionality for pad-ring circuitry

Meng, K. H., Gerdemann, A., Miller, J. W. & Rosenbaum, E., Nov 26 2014, In : Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 2014-November, November

Research output: Contribution to journalConference article

A mechanism for logic upset induced by power-on ESD

Xiu, Y., Thomson, N., Mertens, R. & Rosenbaum, E., Nov 26 2014, In : Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 2014-November, November

Research output: Contribution to journalConference article

Custom test chip for system-level ESD investinvestigations

Thomson, N., Xiu, Y., Mertens, R., Keel, M. S. & Rosenbaum, E., Nov 26 2014, In : Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 2014-November, November

Research output: Contribution to journalConference article

Prediction of charged device model peak discharge current for microelectronic components

Shukla, V., Boselli, G., Dissegna, M., Duvvury, C., Sankaralingam, R. & Rosenbaum, E., Sep 1 2014, In : IEEE Transactions on Device and Materials Reliability. 14, 3, p. 801-809 9 p., 6862855.

Research output: Contribution to journalArticle

Theory of active clamp response to power-on ESD and implications for power supply integrity

Mertens, R., Thomson, N., Xiu, Y. & Rosenbaum, E., Nov 26 2014, In : Electrical Overstress/Electrostatic Discharge Symposium Proceedings. 2014-November, November

Research output: Contribution to journalConference article

2013

A physics-based compact model for SCR devices used in ESD protection circuits

Mertens, R. & Rosenbaum, E., Aug 7 2013, 2013 IEEE International Reliability Physics Symposium, IRPS 2013. 6531947. (IEEE International Reliability Physics Symposium Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Comparison of FICDM and wafer-level CDM test methods

Jack, N. & Rosenbaum, E., Jul 1 2013, In : IEEE Transactions on Device and Materials Reliability. 13, 2, p. 379-387 9 p., 6515361.

Research output: Contribution to journalArticle

ESD-resilient active biasing scheme for high-speed SSTL I/Os

Keel, M. S., Jack, N. & Rosenbaum, E., Oct 16 2013, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2013. 6635906. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Investigation of product burn-in failures due to powered NPN bipolar latching of active MOSFET rail clamps

Ruth, S., Miller, J. W., Gerdemann, A., Stockinger, M., Etherton, M., Moosa, M., Dobbin, A., Mertens, R., Meng, K. H., Rosenbaum, E., Colombo, P., Cordoni, M. & Guitard, N., Oct 16 2013, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2013. 6635940. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Layout-aware, distributed, compact model for multi-finger MOSFETs operating under ESD conditions

Meng, K. H. & Rosenbaum, E., Oct 16 2013, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2013. 6635912. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Predictive modeling of peak discharge current during charged device model test of microelectronic components

Shukla, V., Boselli, G., Dissegna, M., Duvvury, C., Sankaralingam, R. & Rosenbaum, E., Oct 16 2013, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2013. 6635951. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Separating SCR and trigger circuit related overshoot in SCR-based ESD protection circuits

Mertens, R. & Rosenbaum, E., Oct 16 2013, Electrical Overstress/Electrostatic Discharge Symposium Proceedings, EOS/ESD 2013. 6635915. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Verification of snapback model by transient I-V measurement for circuit simulation of ESD response

Meng, K. H. & Rosenbaum, E., Jul 1 2013, In : IEEE Transactions on Device and Materials Reliability. 13, 2, p. 371-378 8 p., 6504488.

Research output: Contribution to journalArticle

2012

A flexible simulation model for system level ESD stresses with application to ESD design and troubleshooting

Mertens, R., Kunz, H., Salman, A., Boselli, G. & Rosenbaum, E., Nov 27 2012, Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2012, EOS/ESD 2012. 6333331. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Comparing FICDM and wafer-level CDM test methods: Apples to oranges?

Jack, N. & Rosenbaum, E., Nov 27 2012, Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2012, EOS/ESD 2012. 6333309. (Electrical Overstress/Electrostatic Discharge Symposium Proceedings).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Diode-triggered silicon-controlled rectifier with reduced voltage overshoot for CDM ESD protection

Chen, W. Y., Rosenbaum, E. & Ker, M. D., Mar 1 2012, In : IEEE Transactions on Device and Materials Reliability. 12, 1, p. 10-14 5 p., 6163575.

Research output: Contribution to journalArticle