If you made any changes in Pure these will be visible here soon.

Network

Sung Mo Kang

  • IEEE
  • University of Illinois Urbana-Champaign
  • Silicon Perspective Corporation
  • University of California at Santa Cruz
  • University of California, Berkeley
  • Lucent
  • Rutgers - The State University of New Jersey, New Brunswick
  • Marshall University
  • Swiss Federal Institute of Technology Lausanne
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • Baskin School of Engineering
  • Ctr. for Prev. R. and D.
  • Center for Advanced Study
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of California at Santa Cruz

External person

Yang Xiu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Texas Instruments
  • University of Illinois at Urbana-Champaign

External person

Sopan Joshi

  • Intel
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Nathan Jack

  • Intel
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • ESD / LU Reliability Group
  • University of Illinois at Urbana-Champaign

External person

Nicholas Thomson

  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

S. Hyvonen

  • Intel
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • Dept. Elec. Comp. Eng. C.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Chenming Hu

  • University of California, Berkeley
  • Xilinx Inc.
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical Engineering and Computer Science
  • Electrical Engineering Department, 147 Cory Hall, University of California
  • Department of Electrical and Computer Engineering
  • Dept. of Elec. Eng. and Comp. Sci.
  • Department of Electrical Engineering and Computer Sciences
  • Dept. of Elec. Eng. and Comp. Sci.
  • Department of Electrical Engineering and Computer Science
  • Department of EECS
  • University of California Office of the President
  • Electrical Engineering and Computer Sciences Department
  • Department of Electrical Engineering and Computer Sciences
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley

External person

Vrashank Shukla

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Robert Mertens

  • NXP Semiconductor
  • University of Illinois at Urbana-Champaign

External person

Kuo Hsuan Meng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Yi Kan Cheng

  • Synopsys Inc.
  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Farzan Farbiz

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Karan Bhatia

  • University of Illinois Urbana-Champaign
  • Texas Instruments
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Collin Reiman

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Patrick Juliano

  • IBM
  • University of Illinois Urbana-Champaign
  • IBM Semiconductor Research and
  • IBM Research
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

E. Li

  • LSI Logic Corporation
  • Intel
  • University of Illinois Urbana-Champaign
  • IEEE
  • Technology CAD
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Prasun Raha

  • Hewlett-Packard
  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • ULSI Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Tong Li

  • Silicon Perspective Corporation
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Min Sun Keel

  • University of Illinois Urbana-Champaign
  • Samsung
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Zaichen Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Texas Instruments

External person

Jian Wu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Intel
  • University of Illinois at Urbana-Champaign

External person

Sridhar Ramaswamy

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gianluca Boselli

  • Texas Instruments

External person

C. C. Teng

  • Synopsys Inc.
  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign

External person

Junjun Li

  • IBM
  • IBM Research
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Robert Mertens

  • University of California, Berkeley
  • NXP Semiconductor
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley

External person

Sandeep Vora

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

James P. Di Sarro

  • IBM
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Robert Gauthier

  • IBM
  • IBM Research
  • Global Foundries, Inc.

External person

James W. Miller

  • Freescale Semiconductor
  • University of Illinois Urbana-Champaign
  • Motorola
  • Technology Data Systems Lab.
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Akram Salman

  • Advanced Micro Devices
  • Texas Instruments

External person

Alan S. Yang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Nicholas Olson

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

J. Tao

  • Advanced Micro Devices
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

P. Fang

  • University of Illinois Urbana-Champaign
  • IEEE
  • Advanced Micro Devices
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Rouwaida Kanj

  • IBM
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Leonard F. Register

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • Department of Electrical, and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Microelectronics Research Center
  • Microelectronics Research Center
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Mariano Dissegna

  • Texas Instruments

External person

Hongmei Li

  • University of Illinois Urbana-Champaign
  • Global Foundries, Inc.
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Phi Kappa Phi Honor Society
  • IBM
  • University of Illinois at Urbana-Champaign

External person

Ching Han Tsai

  • Silicon Perspective Corporation
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alex Gerdemann

  • Freescale Semiconductor
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

J. Xiong

  • University of Illinois at Urbana-Champaign

External person

Adam C. Faust

  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Ping K. Ko

  • Xilinx Inc.
  • University of California, Berkeley
  • University of California Office of the President
  • Electrical Engineering Department, 147 Cory Hall, University of California
  • Dept. of Elec. Eng. and Comp. Sci.
  • Department of EECS
  • Electrical Engineering and Computer Sciences Department
  • Department of Electrical Engineering and Computer Sciences
  • University of California at Berkeley

External person

Zhihong Liu

  • University of Illinois Urbana-Champaign
  • University of California Office of the President
  • University of California, Berkeley
  • Department of Electrical Engineering and Computer Science
  • Department of EECS
  • University of California at Berkeley

External person

Khandker Quader

  • University of California, Berkeley
  • University of California Office of the President
  • Electrical Engineering Department, 147 Cory Hall, University of California
  • Electrical Engineering and Computer Sciences Department
  • Department of Electrical Engineering and Computer Sciences
  • University of California at Berkeley

External person

P. Hopper

  • Purdue University
  • National Semiconductor Corporation
  • Technology Group

External person

Shudong Huang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Robert H. Tu

  • University of California, Berkeley
  • Electrical Engineering Department, 147 Cory Hall, University of California
  • Electrical Engineering and Computer Sciences Department
  • University of California Office of the President
  • Department of Electrical Engineering and Computer Sciences
  • University of California at Berkeley

External person

Rui Jiang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Michael Stockinger

  • Freescale Semiconductor
  • NXP Semiconductors

External person

Chester C. Li

  • University of California, Berkeley
  • University of California Office of the President
  • Electrical Engineering Department, 147 Cory Hall, University of California
  • Electrical Engineering and Computer Sciences Department
  • Department of Electrical Engineering and Computer Sciences
  • University of California at Berkeley

External person

Richard Ida

  • Motorola
  • University of Illinois Urbana-Champaign

External person

Kiran Chatty

  • IBM Research
  • IBM

External person

Vladislav Vashchenko

  • National Semiconductor Corporation

External person

Vladimir I. Okhmatovski

  • IEEE
  • Sandia National Laboratories
  • University of Manitoba
  • Neolinear Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Cadence Design Systems Incorporated
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Reza Moazzami

  • University of California, Berkeley
  • Dept. of Elec. Eng. and Comp. Sci.
  • Department of Electrical Engineering and Computer Science
  • University of California at Berkeley

External person

A. Kapoor

  • University of Illinois at Urbana-Champaign

External person

Jorge Carballido

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. Joseph

  • IBM
  • IBM Semiconductor Research and
  • IBM Research
  • Global Foundries, Inc.

External person

Sundar Chetlur

  • Alcatel-Lucent
  • University of Kentucky
  • Lucent Laboratories
  • Nokia
  • Lucent Technologies

External person

Danqing Chen

  • Intel
  • University of Illinois Urbana-Champaign
  • Technology CAD
  • University of Illinois at Urbana-Champaign

External person

Srivatsan Parthasarathy

  • Analog Devices, Inc.
  • University of Illinois at Urbana-Champaign

External person

B. S. Meyerson

  • IBM
  • IEEE
  • University of Illinois Urbana-Champaign
  • IBM Semiconductor Research and
  • IBM Research
  • IBM Watson Research Yorktown Heights

External person

N. Schmidt

  • IBM
  • IBM Semiconductor Research and
  • IBM Research
  • Global Foundries, Inc.

External person

D. Suh

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

I. C. Kizilyalli

  • Alcatel-Lucent
  • University of Kentucky
  • University of Illinois Urbana-Champaign
  • Lucent
  • Nokia
  • Lucent Technologies
  • Department of Electrical and Computer Engineering
  • Beckman Institute and Department of Electrical and Computer Engineering
  • Bell Labs
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Amiremad Ghassami

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Departments of Mathematics and ECE
  • University of Illinois at Urbana-Champaign

External person

Jean Jacques Hajjar

  • Analog Devices, Inc.

External person

P. Bendix

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Keven Feng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Abhijit Dharchoudhury

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Dunn

  • IBM Research
  • IBM

External person

Jeffrey K. Lee

  • Johns Hopkins Applied Physics Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Applied Physics Laboratory
  • Center for Compound Semiconductor Microelectronics
  • Applied Physics Laboratory
  • Johns Hopkins University
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

S. Voldman

  • IBM
  • IBM Semiconductor Research and
  • IBM Research
  • Global Foundries, Inc.

External person

D. Harame

  • IBM
  • IBM Semiconductor Research and
  • IBM Research
  • Global Foundries, Inc.

External person

Ankit Srivastava

  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Jeremy C. Smith

  • University of Illinois Urbana-Champaign
  • Motorola
  • Technology Data Systems Lab.
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

R. Sankaralingam

  • University of Notre Dame
  • Department of Electr. Engrg.
  • Texas Instruments
  • University of Notre Dame

External person

Yu Wang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Jinju Lee

  • University of Kentucky
  • Samsung
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Dept. Elec. Comp. Eng. Beckman I.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Microanalysis of Materials
  • University of Illinois at Urbana-Champaign

External person

Hyeon Min Bae

  • Finisar Corporation
  • Intersymbol Communications
  • Korea Advanced Institute of Science and Technology
  • University of Illinois Urbana-Champaign
  • Finisar Corporation
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Finisar Corporation
  • University of Illinois at Urbana-Champaign

External person

Y. J. Huh

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alex Ayling

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Souvick Mitra

  • IBM
  • IBM Research
  • Global Foundries, Inc.

External person

J. Wu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

R. Johnson

  • IBM Research
  • IBM

External person

James Di Sarro

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Charvaka Duvvury

  • Texas Instruments
  • Charvaka Duvvury LLC

External person

Harry H. Yu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ryan Barnes

  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Karl Hess

  • Department of Electrical Engineering, Coordinated Science Laboratory University of Illinois at Urbana-Champaign Urbana, Illinois
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Coordinated Science Laboratory
  • University of Illinois Urbana-Champaign
  • University of Kentucky
  • Samsung
  • Alcatel-Lucent
  • IEEE
  • Nokia
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Beckman Institute and Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Physics
  • Everitt Laboratoy
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Timothy Lehner

  • IBM
  • IBM Corporation
  • EDA Labs.
  • EDA Labs

External person

Dipanjan Das

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Aolin Xu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Xiao Ma

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

James Davis

  • Micron Technology Incorporated

External person

M. Cao

  • Hewlett-Packard
  • ULSI Research Laboratory

External person

Christian Monzio Compagnoni

  • Polytechnic University of Milan

External person

G. C F Yeap

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Samuel Sagan

  • University of Illinois Urbana-Champaign
  • IBM
  • University of Illinois at Urbana-Champaign

External person

Reza Rofan

  • University of California, Berkeley
  • Department of Electrical Engineering and Computer Science
  • University of California at Berkeley

External person

Arjun Kripanidhi

  • Intel
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

V. Kuznetsov

  • National Semiconductor Corporation

External person

Adrien Ille

  • Infineon Technologies AG

External person

Wilson Y. Chan

  • University of California, Berkeley
  • Electrical Engineering Department, 147 Cory Hall, University of California
  • University of California at Berkeley

External person

Mohamed Moosa

  • Freescale Semiconductor

External person

Allan Dobbin

  • Freescale Semiconductor

External person

J. Stathis

  • Research Division
  • IBM
  • IBM Research

External person

Souvik Mahapatra

  • Indian Institute of Technology Bombay

External person

B. J. Gross

  • EECS Department
  • Massachusetts Institute of Technology

External person

Prajwal Mysore Vijayaraj

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Karan S. Bhatia

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

B. Tracy

  • University of Illinois Urbana-Champaign
  • Advanced Micro Devices

External person

Hans Kunz

  • Texas Instruments

External person

Wen Yi Chen

  • National Yang Ming Chiao Tung University
  • Institute of Electronics

External person

Y. C. Cheng

  • City University of Hong Kong

External person

Aravind Appaswamy

  • Texas Instruments

External person

Ming Dou Ker

  • I-Shou University
  • National Yang Ming Chiao Tung University
  • MDepartment of Electronics Engineering
  • Department of Electronic Engineering

External person

Zhi Chen

  • University of Kentucky
  • University of Illinois Urbana-Champaign
  • Samsung
  • University of Illinois at Urbana-Champaign

External person

C. Diaz

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Hei Wong

  • City University of Hong Kong

External person

Andreas Kerber

  • Skorpios Technologies, Inc.

External person

Runsheng Wang

  • Peking University

External person

Lucio Pancheri

  • University of Trento

External person

Ben Kaczer

  • Interuniversitair Micro-Elektronica Centrum

External person

C. Brennan

  • IBM
  • IBM Research

External person

Joseph C. King

  • University of California, Berkeley
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Dept. of Elec. Eng. and Comp. Sci.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley

External person

D. Farrenkopf

  • National Semiconductor Corporation

External person

Martina Cordoni

  • STMicroelectronics

External person

Milan Shah

  • University of Illinois at Urbana-Champaign

External person

L. Lanzerotti

  • IBM
  • IBM Semiconductor Research and
  • IBM Research

External person

Michael Chaine

  • Micron Technology Incorporated

External person

S. M. Kang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

David Lafonteese

  • Texas Instruments

External person

Jean Olivier Plouchart

  • IBM
  • IBM Semiconductor Research and Development Center
  • IBM Research

External person

Gaudenzio Meneghesso

  • University of Padua

External person

Peter M. Lee

  • University of California, Berkeley
  • Dept. of Elec. Eng. and Comp. Sci.
  • University of California at Berkeley

External person

Paolo Colombo

  • STMicroelectronics

External person

Scott Ruth

  • Freescale Semiconductor

External person

P. Vandevoorde

  • University of Illinois Urbana-Champaign
  • Hewlett-Packard
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • ULSI Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

M. R. Lin

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Melanie Etherton

  • Freescale Semiconductor

External person

Advika Battini

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Cole E. Zemke

  • IBM
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

C. Felsch

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chhay Kong

  • IBM
  • University of Illinois Urbana-Champaign
  • IBM
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

K. Kelvin Hsueh

  • United Microelectronics Corp. (UMC)
  • United Microelectronics Corporation

External person

W. Greene

  • Hewlett-Packard
  • ULSI Research Laboratory

External person

Ping Ko

  • University of California, Berkeley
  • University of California at Berkeley

External person

Yue Zu

  • Texas Instruments

External person

Ping Keung Ko

  • University of California, Berkeley
  • Electrical Engineering Department, 147 Cory Hall, University of California
  • University of California at Berkeley

External person

B. MacDonald

  • Advanced Micro Devices

External person

Zhi Chen

  • University of Kentucky
  • University of Illinois Urbana-Champaign
  • Samsung
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

C. Sodini

  • Massachusetts Institute of Technology
  • Department of EECS
  • EECS Department

External person

Sin Hao Ke

  • United Microelectronics Corporation

External person

S. M. Ramey

  • Intel
  • Arizona State University

External person

C. Mouli

  • Micron Technology Incorporated

External person

Yuanzhong Paul Zhou

  • Analog Devices, Inc.

External person

Bhavna Agrawal

  • IBM
  • IBM Corporation
  • EDA Labs.

External person

Yang Yang

  • George Mason University

External person

Zhen Mu

  • Cadence Design Systems

External person

Tso Ping Ma

  • Yale University
  • Southern Connecticut State University
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Elecniccrl Engineering
  • Center for Microelectronic Materials and Structures
  • Department of Physics

External person

Dmitri Klokotov

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Kevin J. Chen

  • Hong Kong University of Science and Technology

External person

Christian Russ

  • Infineon Technologies AG

External person

Artsiom Balakir

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chris Putnam

  • IBM
  • Global Foundries, Inc.

External person

Javier Salcedo

  • Analog Devices, Inc.

External person

P. Givelin

  • University of Illinois Urbana-Champaign
  • Motorola

External person

Kevin Yang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering and Computer Science
  • University of California, Berkeley
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley

External person

S. Furkay

  • IBM Research
  • IBM

External person

Rajan Narasimha

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • DSP Solutions R and D Center
  • University of Illinois at Urbana-Champaign

External person

Weishi Sun

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Eric Minami

  • University of California, Berkeley
  • Electrical Engineering Department, 147 Cory Hall, University of California
  • University of California at Berkeley

External person

G. Manetas

  • Mentor Graphics
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Mentor Graphics Corporation
  • University of Illinois at Urbana-Champaign
  • Center of Computational Electromagnetics
  • IEEE
  • Technical Chamber of Greece

External person

Yujie Zhou

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Stephen Beebe

  • Advanced Micro Devices

External person

Victor Chen

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

David Sheridan

  • Alpha and Omega Semiconductor

External person

Nicolas Guitard

  • STMicroelectronics

External person

Yingyan Lin

  • Huazhong University of Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electronic Science and Technology
  • Rice University
  • University of Illinois at Urbana-Champaign

External person

Robert Huang

  • Alcatel-Lucent
  • Nokia

External person

Dimitris Ioannou

  • George Mason University

External person