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Network

Wen-Mei W Hwu

Person: Academic

Jian Huang

Person: Academic

Alexander Gerhard Schwing

Person: Academic

Kyle Rupnow

  • Advanced Digital Sciences Center
  • Nanyang Technological University
  • Advanced Digital Sciences Center (ADSC)
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Inspirit IoT, Inc.
  • Inspirit IoT Inc
  • School of Computer Engineering
  • Advanced Digital Sciences Center
  • Inc.
  • Inc

External person

Jason Cong

  • University of California, Los Angeles
  • Peking University
  • Computer Science Dept.
  • Center for Energy-Efficient Computing and Applications
  • Computer Science Department
  • School of Computer Science
  • Computer Science Department
  • Department of Computer Science
  • CS Department
  • PKU
  • University of Illinois Urbana-Champaign
  • Department of Computer Science, University of Illinois
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Computer Sciences
  • University of Texas at Austin
  • University of Illinois at Urbana-Champaign
  • University of California at Los Angeles
  • Cornell University

External person

Xiaofan Zhang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • Inc
  • University of Illinois at Urbana-Champaign

External person

Jinjun Xiong

  • IBM
  • Cognitive Computing Systems Research
  • IBM Research
  • University of Illinois Urbana-Champaign
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • University of Technology Sydney
  • California State Polytechnic University Pomona
  • IBM
  • University of Illinois at Urbana-Champaign
  • HiKonv: High Throughput Quantized
  • SUNY Buffalo

External person

Yao Chen

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center of UIUC
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Nankai University
  • College of Electronic Information and Optical Engineering
  • University of Illinois Urbana-Champaign
  • XMotors.ai
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign
  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte.
  • Advanced Digital Sciences Center
  • Create Tower

External person

Swathi T. Gurumani

  • Advanced Digital Sciences Center
  • Singapore Pvt. Ltd.
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Inspirit IoT Inc
  • Advanced Digital Sciences Center of Illinois
  • Inspirit IoT, Inc.

External person

Yun Liang

  • Advanced Digital Sciences Center
  • Peking University
  • Advanced Digital Sciences Center (ADSC)
  • National University of Defense Technology
  • Advanced Digital Sciences Center
  • Center for Energy-Efficient Computing and Applications
  • School of Electrical Engineering and Computer Science
  • Collaborative Innovation Center of High Performance Computing
  • School of EECS

External person

Cong Hao

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • IBM
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • University of Illinois at Urbana-Champaign
  • Advanced Digital Sciences Center
  • Georgia Institute of Technology

External person

Sitao Huang

  • University of Illinois Urbana-Champaign
  • ECE and Coordinated Science Lab
  • ECE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • UIUC

External person

Chen Dong

  • Magma Design Automation Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Wei Zuo

  • Beijing Institute of Technology
  • University of Illinois Urbana-Champaign
  • Inspirit IoT, Inc.
  • School of Information and Electronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Keith Campbell

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Ying Yu Chen

  • University of Illinois Urbana-Champaign
  • Synopsys Inc.
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Lu Wan

  • Cadence Design Systems
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Xinheng Liu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Inspirit IoT, Inc.
  • Department of Electrical and Computer Engineering
  • Inspirit IoT
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • IBM
  • Inc.
  • University of Illinois at Urbana-Champaign

External person

Alexandros Papakonstantinou

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Ashutosh Dhar

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • IBM
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • University of Illinois at Urbana-Champaign

External person

Anand Ramachandran

  • University of Illinois Urbana-Champaign
  • Inspirit IoT, Inc.
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Subhasish Mitra

  • Stanford University
  • Intel
  • IEEE
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical Engineering
  • Department of CS
  • Department of EE
  • Department of Electrical Engineering and Computer Science
  • Stanford University

External person

Zhiru Zhang

  • Cornell University
  • University of California at Los Angeles
  • Xilinx Inc.

External person

Liwei Yang

  • Nanyang Technological University
  • School of Computer Engineering
  • School of Computer Engineering
  • Nanyang Technological University
  • Inspirit IoT, Inc.

External person

Di He

  • University of Illinois Urbana-Champaign
  • Inspirit IoT, Inc.
  • NovuMind Inc.
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • NovuMind Inc.
  • University of Illinois at Urbana-Champaign
  • UIUC

External person

Scott Chilstedt

  • IBM
  • University of Illinois Urbana-Champaign
  • IBM
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Morteza Gholipour

  • University of Tehran
  • Babol Noshirvani University of Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Advanced VLSI Lab.
  • School of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Donghui Guo

  • Xiamen University
  • Department of Electronic Engineering
  • Dept. of Electronic Engineering
  • Department of Electronic Engineering
  • IC Design and IT Research Center of Fujian Province
  • School of Information Science and technology
  • School of Information Science and Engineering

External person

Hanchen Ye

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yuhong Li

  • University of Illinois Urbana-Champaign
  • Beijing University of Posts and Telecommunications
  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • University of Illinois at Urbana-Champaign

External person

Yi Liang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • UIUC
  • UIUC

External person

Hyunmin Jeong

  • University of Illinois at Urbana-Champaign

External person

Izzat El Hajj

  • University of Illinois Urbana-Champaign
  • Hewlett-Packard
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • American University of Beirut
  • ECE
  • University of Illinois at Urbana-Champaign
  • Georgia Institute of Technology

External person

Amit Sangai

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Junhao Pan

  • University of Illinois at Urbana-Champaign

External person

Quang Dinh

  • University of Illinois at Urbana-Champaign

External person

Lei Cheng

  • Synplicity, Inc.
  • University of Illinois Urbana-Champaign
  • CS Dept.
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign

External person

Yiping Fan

  • AutoESL Design Technologies, Inc.
  • University of California, Los Angeles
  • Computer Science Dept.
  • University of California at Los Angeles

External person

Tan Nguyen

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Gregory Lucas

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

S. T Choden Konigsmark

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Chen Hsuan Lin

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Mohamed El-Hadedy

  • University of Illinois Urbana-Champaign
  • California State Polytechnic University Pomona
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • ECE
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory

External person

Xinyu Chen

  • National University of Singapore

External person

Yun Heo

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

John A. Stratton

  • University of Illinois Urbana-Champaign
  • Colgate University
  • SPEC High Performance Group (HPG)
  • NVIDIA
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Reliable and High-Performance Computing
  • Center for Reliable and High Performance Computing
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign

External person

Chuanhao Zhuge

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Junsong Wang

  • IBM Business Consulting Services
  • IBM Research
  • IBM
  • Easy-visible
  • IBM China Research Laboratory

External person

Marianne Winslett

  • Advanced Digital Sciences Center
  • University of Illinois Urbana-Champaign
  • Advanced Digital Sciences Center
  • Computer Science, University of Illinois at Urbana-Champaign
  • Advanced Digital Sciences Center
  • University of Illinois at Urbana-Champaign
  • Advanced Digital Sciences Center

External person

Hongshi Tan

  • National University of Singapore

External person

Scott Cromar

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Weng Fai Wong

  • National University of Singapore

External person

Karthik Gururaj

  • University of California, Los Angeles
  • Computer Science Dept.
  • Department of Computer Science
  • University of California at Los Angeles

External person

Lei He

  • University of California, Los Angeles
  • IEEE
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • University of California at Los Angeles

External person

Prakhar Ganesh

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte.
  • Advanced Digital Sciences Center

External person

Bingsheng He

  • Nanyang Technological University
  • School of Computer Engineering
  • National University of Singapore

External person

Yonghua Lin

  • IBM Business Consulting Services
  • IBM Research
  • IBM
  • University of Illinois Urbana-Champaign
  • Easy-visible
  • University of Illinois at Urbana-Champaign
  • IBM China Research Laboratory

External person

Hongbin Zheng

  • Advanced Digital Sciences Center
  • Singapore Pvt. Ltd.
  • Advanced Digital Sciences Center
  • Sun Yat-Sen University
  • Advanced Digital Sciences Center of Illinois
  • School of Physics and Engineering

External person

Fei Li

  • University of California, Los Angeles
  • Actel Corp
  • IEEE
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • University of California at Los Angeles

External person

Wei Ren

  • University of Illinois at Urbana-Champaign

External person

Hye Gang Jun

  • University of Illinois at Urbana-Champaign

External person

Wei Wang

  • Indiana University-Purdue University Indianapolis

External person

Sai Rahul Chalamalasetti

  • Hewlett-Packard
  • Hewlett Packard Enterprise
  • Hewlett-Packard Laboratories

External person

Seung Won Min

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • UIUC
  • NVIDIA

External person

David Lin

  • Stanford University
  • Department of EE
  • Stanford University

External person

Zheng Cui

  • Advanced Digital Sciences Center

External person

Niraj K. Jha

  • Princeton University
  • Department of Electrical Engineering

External person

Cheng Gong

  • Nankai University
  • Tianjin Key Laboratory of Network and Data Security Technology

External person

Xiaohao Wang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xuesong Yang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Beckman Institute for Advanced Science and Technology
  • Amazon.com, Inc.
  • University of Illinois at Urbana-Champaign

External person

Jong Bin Lim

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • University of Illinois at Urbana-Champaign

External person

Artem Rogachev

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Boon Pang Lim

  • Agency for Science, Technology and Research, Singapore
  • NovuMind Inc.
  • Novumind
  • NovuMind Inc.
  • NovuMind Inc.

External person

Jianwei Zheng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electronic Engineering
  • Xiamen University
  • University of Illinois at Urbana-Champaign
  • Hong Kong University of Science and Technology
  • Access - Ai Chip Center For Emerging Smart Systems

External person

Tao Li

  • Nankai University
  • Tianjin Key Laboratory of Network and Data Security Technology

External person

Mang Yu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Junjuan Xu

  • Peking University
  • 14-16F Zhaofeng Plaza
  • University of California, Los Angeles
  • Synopsys Inc.
  • Computer Science and Technology Department
  • Computer Science Dept.
  • Computer Science and Technology Department
  • Dept. of Computer Science and Technology
  • University of California at Los Angeles

External person

Eric Klee

  • Mayo Clinic Rochester, MN
  • Biomedical Informatics
  • Department of Health Sciences Research

External person

Yinan Li

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Kun Wu

  • University of Illinois at Urbana-Champaign
  • UIUC

External person

Chao Zhu

  • IBM Research
  • IBM Business Consulting Services
  • IBM
  • IBM China Research Laboratory

External person

Qin Li

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Stephen Neuendorffer

  • Xilinx Inc.
  • Advanced Micro Devices

External person

Louis Nöel Pouchet

  • University of California, Los Angeles
  • Ohio State University
  • Colorado State University
  • Computer Science Department
  • Department of Computer Science and Engineering
  • PKU
  • Ohio State University
  • University of California at Los Angeles

External person

Shoaib Akram

  • University of Illinois at Urbana-Champaign

External person

Gianluca Fiori

  • University of Pisa
  • Dipartimento di Ingegneria dell'Informazione, Elettronica, Informatica, Telecomunicazioni
  • Dipartimento di Ingegneria DellInformazione

External person

Chi Chen Peng

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Junli Gu

  • University of Illinois Urbana-Champaign
  • XMotors.ai
  • University of Illinois at Urbana-Champaign

External person

Hyungmin Cho

  • Hongik University

External person

Zelei Sun

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Guangyu Sun

  • Peking University
  • National University of Defense Technology
  • Center for Energy-Efficient Computing and Applications
  • Collaborative Innovation Center of High Performance Computing

External person

Luca Benini

  • University of Bologna
  • Swiss Federal Institute of Technology Zurich
  • ETH Zïrich
  • ETH Zïrich
  • Eth Zïrich

External person

Alper Buyuktosunoglu

  • IBM Research
  • IBM Reaserch
  • IBM

External person

Z. Huang

  • University of California, Los Angeles
  • Synopsys Inc.
  • Computer Science Department
  • University of California at Los Angeles

External person

M. D. Ercegovac

  • University of California, Los Angeles
  • Computer Science Department
  • Computer Science Dept.
  • University of California at Los Angeles

External person

Edward Richter

  • University of Illinois at Urbana-Champaign

External person

Chao Lu

  • Southern Illinois University

External person

Qiang Ma

  • Synopsys Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Shaojun Wei

  • Tsinghua University
  • Institute of Microelectronics
  • Institute of Microelectronics

External person

Muhammad Teguh Satria

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center

External person

Atif Sarwari

  • XMotors.ai

External person

Yuan Zhou

  • Cornell University

External person

Cong Xu

  • University of Illinois at Urbana-Champaign
  • Hewlett-Packard

External person

M. R. Stan

  • University of Virginia
  • Intel
  • Electrical and Computer Engineering

External person

Peng Wei

  • University of California at Los Angeles

External person

Kevin Skadron

  • University of Virginia
  • SPEC High Performance Group (HPG)
  • Department of Computer Science
  • Department of Computer Science

External person

Dongbo Min

  • Advanced Digital Sciences Center
  • Advanced Digital
  • Advanced Digital Sciences Center (ADSC)
  • Chungnam National University
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • ADSC
  • ADSC
  • Department of Computer Science and Engineering

External person

Saranyu Chattopadhyay

  • Stanford University
  • Stanford University

External person

Leon He

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Nasser Masoumi

  • University of Tehran
  • School of Electrical and Computer Engineering

External person

Dae Hee Kim

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sansiri Haruehanroengra

  • Indiana University-Purdue University Indianapolis
  • ECE Department

External person

Giuseppe Iannaccone

  • University of Pisa
  • Dipartimento di Ingegneria dell'Informazione, Elettronica, Informatica, Telecomunicazioni
  • Dipto. Ingegneria dell'I.
  • Dipartimento di Ingegneria DellInformazione

External person

Jiong He

  • Alibaba Group Holding Ltd.
  • Advanced Digital Sciences Center
  • Institute of High Performance Computing

External person

Chang Wu

  • Fudan University

External person

Simon Garcia De Gonzalo

  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • CS and Cordinated Science Lab
  • CS and Cordinated Science Lab
  • cs
  • Barcelona Supercomputing Center
  • University of Illinois at Urbana-Champaign
  • UIUC
  • CS and Coordinated Science Lab

External person

H. Franke

  • IBM
  • University of Illinois Urbana-Champaign
  • IBM Research
  • UIUC
  • University of Illinois at Urbana-Champaign

External person

Subho S. Banerjee

  • University of Illinois Urbana-Champaign
  • Computer Science, University of Illinois at Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • Department of Computer Science
  • University of Illinois at Urbana-Champaign

External person

Yin Yang

  • Hamad bin Khalifa University

External person

Pradip Bose

  • IBM
  • IBM Research
  • IBM Reaserch

External person

Carl Pearson

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Daryl Sew

  • XMotors.ai

External person

Li Wen Chang

  • University of Illinois Urbana-Champaign
  • Microsoft AI and Research Group
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Microsoft Research Asia
  • Microsoft USA
  • University of Illinois at Urbana-Champaign

External person

Tan Yan

  • Synopsys Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Dejan S. Milojicic

  • Hewlett-Packard
  • The Open Group Research Institute
  • University of Córdoba
  • Hewlett Packard Enterprise
  • Hewlett-Packard Laboratories
  • The Open Group Research Institute

External person

Peng Li

  • Peking University
  • University of California, Los Angeles
  • University of California at Los Angeles

External person

Warren Kemmerer

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Shengkui Zhao

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center (ADSC), No08-10 Connexis North Tower
  • Illinois at Singapore Pte. Ltd.
  • Advanced Digital Sciences Center (ADSC)
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center (ADSC)
  • Illinois at Singapore Private Limited
  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte.

External person

Dongdong Fu

  • XMotors.ai
  • Whitehead Institute for Biomedical Research

External person

Florian Lonsing

  • Stanford University
  • Stanford University

External person

Chengyue Wang

  • Zhejiang University
  • University of Illinois at Urbana-Champaign

External person

Clark Barrett

  • Stanford University
  • Stanford University
  • Cornell University

External person

Gowthami Jayashri Manikandan

  • University of Illinois at Urbana-Champaign

External person

Leslie K. Hwang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Eric Cheng

  • Stanford University
  • Stanford University

External person

Paolo Faraboschi

  • Hewlett-Packard
  • Hewlett Packard Enterprise
  • University of Illinois at Urbana-Champaign

External person

Xin Lou

  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Advanced Digital Sciences Center
  • Illinois at Singapore Pte.
  • Advanced Digital Sciences Center
  • Singapore Institute of Technology

External person

Ye Lu

  • Nankai University
  • University of Illinois at Urbana-Champaign

External person

Paul Reckamp

  • University of Illinois at Urbana-Champaign

External person

Jacob A. Abraham

  • University of Texas at Austin
  • Computer Engineering Research Center

External person

Hongyin Luo

  • Xiamen University
  • Dept. of Electronic Engineering
  • Department of Electronic Engineering

External person

Bryan Wu

  • IBM-Illinois Center for Cognitive Computing Systems Research (C3SR)
  • University of Illinois Urbana-Champaign
  • XMotors.ai
  • IBM
  • University of Illinois at Urbana-Champaign

External person

Huiren Li

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

David Z. Pan

  • University of Texas at Austin
  • Department of Electrical, and Computer Engineering

External person

Juan Gómez Luna

  • University of Córdoba
  • Computer Architecture and Electronics
  • Swiss Federal Institute of Technology Zurich
  • Department of Computer Science

External person

Xiaolong Xie

  • Peking University
  • Center for Energy-Efficient Computing and Applications

External person

Cheng Yong Cher

  • Stanford University
  • Stanford University

External person

Tobias Fischer

  • Imperial College London

External person

Richard Everson

  • University of Exeter

External person

John Paul Strachan

  • Hewlett-Packard
  • Hewlett Packard Enterprise
  • Daresbury Laboratory

External person

Shunan Zhong

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  • Access - Ai Chip Center For Emerging Smart Systems

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  • Linköping University
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  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
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  • Facebook Reality Labs Research

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  • Tianjin University

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Onur Mutlu

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External person

Daijin Kim

  • Pohang University of Science and Technology

External person

Haojie Zhao

  • Dalian University of Technology

External person

Eiman Ebrahimi

  • NVIDIA
  • NVIDIA Austin

External person

Ramesh Karri

  • New York University
  • University of Illinois at Urbana-Champaign

External person

A. Aydin Alatan

  • Middle East Technical University

External person

Yi Liang

  • University of Illinois at Urbana-Champaign

External person

Manqiang Che

  • Beijing Key Laboratory of Urban Intelligent Control

External person

Lijun Wang

  • Dalian University of Technology

External person

Feng Li

  • Harbin Institute of Technology

External person

Shinichi Shiraishi

  • Toyota Info Technology Center
  • Toyota InfoTechnology Center USA
  • TOYOTA Info Technology Centre Co., Ltd.
  • Toyota Info. Technology Center
  • Toyota InfoTechnology Center
  • Toyota Research Institute - Advanced Development

External person

Sihang Wu

  • South China University of Technology

External person

Qian Ruihe

  • Institute of Information Engineering

External person

Ning Wang

  • University of Science and Technology of China

External person

Hyung Jin Chang

  • University of Birmingham

External person

Christos Vezyrtzis

  • Stanford University
  • Stanford University

External person

Herschel Gelman

  • University of Pittsburgh
  • Department of Computer Science

External person

Yuan Xie

  • Pennsylvania State University
  • Dept. of Comp. Sci. and Engineering
  • Dept. of Comp. Sci. and Engr.

External person

Daniel Mueller-Gritschneder

  • Technical University of Munich
  • Ludwig Maximilian University of Munich

External person

G. U.O. Jiefeng

  • Xiamen University

External person

Vikram S. Mailthody

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • UIUC
  • NVIDIA

External person

Jorge Rodríguez Herranz

  • Technical University of Madrid
  • University of Ljubljana

External person

Changsheng Xu

  • Chinese Academy of Sciences
  • CAS - Institute of Automation
  • Institute of Automation
  • National Laboratory of Pattern Recognition
  • China-Singapore Institute of Digital Media

External person

Kristof Denolf

  • Advanced Micro Devices

External person

Steve Wilton

  • University of British Columbia

External person

Rama Krishna Gorthi

  • Indian Institute of Space Science and Technology

External person

Miodrag Potkonjak

  • UCLA CS Dept.
  • University of California, Los Angeles
  • CS Department
  • Department of Computer Science
  • University of California at Los Angeles

External person

Kiyoung Choi

  • School of Electrical Engineering
  • Seoul National University

External person

Haojie Li

  • South China University of Technology

External person

Yuxuan Sun

  • Dalian University of Technology

External person

A. V. Raghunathan

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign

External person

Zehua Yuan

  • University of Illinois at Urbana-Champaign

External person

Xiao Jun Wu

  • Jiangnan University

External person

Lukasz Szafaryn

  • IBM Reaserch
  • IBM

External person

Seokeon Choi

  • Korea Advanced Institute of Science and Technology

External person

Uzair Sharif

  • Technical University of Munich
  • Ludwig Maximilian University of Munich

External person

Pierce Chuang

  • Facebook Reality Labs Research

External person

Jianyi Cheng

  • Imperial College London

External person

Yang Zhao

  • Rice University

External person

Glaucimar Aguiar

  • Hewlett Packard Enterprise

External person

Huchuan Lu

  • Dalian University of Technology

External person

Sergio Vivas

  • Universidad Autónoma de Madrid

External person

Priyank Kalla

  • University of Utah
  • Department of Electrical and Computer Engineering

External person

Roman Pflugfelder

  • Austrian Institute of Technology
  • Vienna University of Technology

External person

Yi Wu

  • Indiana University Bloomington
  • Nanjing Audit University

External person

Yingyan Lin

  • Huazhong University of Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electronic Science and Technology
  • Rice University
  • University of Illinois at Urbana-Champaign

External person

Adam McPadden

  • IBM Systems
  • IBM

External person

Mario Edoardo Maresca

  • University of Naples Parthenope

External person

Ming Hsuan Yang

  • Honda Motor Co., Ltd.
  • University of Illinois Urbana-Champaign
  • Honda Fundamental Research Labs
  • University of California Merced
  • IEEE
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Computer Science and Beckman Institute
  • School of Engineering
  • Computer Science, University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Jeffrey J. Cook

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering and Department of Computer Science
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Youjie Li

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • UIUC
  • UIUC

External person

Wenxun Huang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Renato Mancuso

  • University of Illinois Urbana-Champaign
  • Al Volo LLC
  • Computer Science, University of Illinois at Urbana-Champaign
  • Department of Aerospace Engineering, University of Illinois Urbana-Champaign
  • Boston University
  • University of Illinois at Urbana-Champaign

External person

Ronak Bajaj

  • National University of Singapore

External person

Houman Homayoun

  • George Mason University

External person

Mert Hidayetoglu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • UIUC

External person

S. T. Choden Konigsmark

  • University of Illinois at Urbana-Champaign

External person

Chunan Wei

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Yingyan Celine Lin

  • Rice University

External person