Network

William Paul King

Person: Academic

Dana D Dlott

Person: Academic

Jeffrey S Moore

Person: Academic

Placid Mathew Ferreira

Person: Academic

Andrew A Gewirth

Person: Academic

J. E. Greene

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Linköping University
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Technique and Applications
  • International Union for Vacuum Science
  • Department of Metallurgy
  • Department of Physics (IFM), Linköping University
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Departments of Metallurgy
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pawel Keblinski

  • Rensselaer Polytechnic Institute
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yee Kan Koh

  • National University of Singapore
  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Dept. of Mat. Sci. and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Richard B. Wilson

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Joseph E. Van Nostrand

  • Wright-Patterson Air Force Base
  • SRMP, CE Saclay, CEA
  • Wright-Patterson AFB
  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Commissariat à l’énergie atomique et aux énergies alternatives
  • ComUE Paris-Saclay
  • Dept. of Mat. Sci. and Engineering
  • Center for Compound Semiconductor Microelectronics
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Université Paris-Saclay
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

I. Petrov

  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Technique and Applications
  • International Union for Vacuum Science
  • Dept. of Mat. Sci. and Engineering
  • Linköping University
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Orlando Coronell

  • University of North Carolina at Chapel Hill
  • University of Illinois Urbana-Champaign
  • Center of Advanced Materials for the Purification of Water with Systems
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Dept. of Environ. Sci. and Eng.
  • Department of Environmental Sciences and Engineering
  • Department of Environmental Sciences and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Jay Chey

  • Dept. of Mat. Sci. and Engineering
  • Materials Research Laboratory
  • University of Minnesota Twin Cities
  • University of Illinois Urbana-Champaign
  • Dept. of Chem. Eng. and Mat. Science
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Center for Compound Semiconductor Microelectronics
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • IBM
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Qiye Zheng

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Lawrence Berkeley National Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley

External person

Ji Cheng Zhao

  • Ohio State University
  • General Electric
  • Department of Materials Science and Engineering
  • Ohio State University

External person

David Johnson

  • University of Oregon
  • Department of Chemistry
  • Department of Chemistry and Materials Science Institute, University of Oregon
  • Department of Chemistry

External person

Dongyao Li

  • University of Illinois Urbana-Champaign
  • Kyushu University
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • International Institute for Carbon Neutral Energy Research
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xuan Zheng

  • Seagate Technology
  • Seagate Corporation
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Xu Xie

  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • Lam Research Corporation
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Guangxin Lv

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kwangu Kang

  • Yonsei University
  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • School of Mechanical Engineering
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • School of Mechanical Engineering
  • Department of Physics
  • Dept. of Mat. Sci. and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Joseph P. Feser

  • Department of Materials Science and Engineering
  • Department of Mechanical Engineering, University of Delaware
  • University of Delaware
  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Lane W. Martin

  • Department of Materials Science and Engineering
  • Department of Materials Science
  • University of California, Berkeley
  • Department of Materials Science and Engineering, Frederick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • Lawrence Berkeley National Laboratory
  • Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • International Institute for Carbon Neutral Research
  • University of California Office of the President
  • Department of Materials Science and Engineering, University of California
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Materials Research Laboratory
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Mat. Sci. and Engineering Department
  • Kyushu University
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign

External person

R. O. Pohl

  • Cornell University
  • Laboratory of Atomic, Solid State Physics Cornell University
  • Solid State Physics Cornell University
  • Laboratory of Atomic
  • Lab. of Atom./Solid State Physics

External person

Arun Majumdar

  • Environmental Energy Technologies Division
  • Lawrence Berkeley National Laboratory
  • Molecular Design Institute
  • University of California, Berkeley
  • Department of Mechanical Engineering
  • United States Department of Energy
  • Department of Mechanical Engineering, University of California
  • Department of Mechanical Engineering
  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Metarials/Engineering
  • Stanford Linear Accelerator Center
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • Stanford University

External person

Hyejin Jang

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • Seoul National University
  • University of Illinois at Urbana-Champaign

External person

Zhe Cheng

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Peking University

External person

Wen Pin Hsieh

  • Stanford University
  • Institute of Earth Sciences, Academia Sinica
  • Academia Sinica Taiwan
  • University of Illinois Urbana-Champaign
  • Academia Sinica - Institute of Earth Sciences
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Stanford Institute for Materials and Energy Sciences
  • Department of Physics
  • Department of Geological and Environmental Sciences
  • Dept. of Mat. Sci. and Engineering
  • Stanford Linear Accelerator Center
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Gyung Min Choi

  • Department of Materials Science and Engineering
  • Center for Spintronics Research, Korea Institute of Science and Technology
  • Korea Institute of Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Energy Science
  • Seitz Materials Research Laboratory
  • Sungkyunkwan University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jun Liu

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • North Carolina State University
  • Dept. of Mat. Sci. and Engineering
  • Department of Mechanical and Aerospace Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gregory T. Hohensee

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. Desjardins

  • École Polytechnique de Montréal
  • Ecole Polytechnique de Montreal
  • University of Illinois Urbana-Champaign
  • Polytechnique Montreal
  • Department of Materials Science
  • Groupe de Recherche en Physique et Technologie des Couches Minces
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

S. M. Lee

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mark D. Losego

  • Department of Chemical and Biomolecular Engineering, North Carolina State University
  • North Carolina State University
  • North Caroline State University
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaoyang Ji

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. Chiritescu

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhu Diao

  • Stockholm University
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Physics
  • School of Information Technology
  • Halmstad University
  • Florida A&M University
  • KTH Royal Institute of Technology
  • University of Illinois at Urbana-Champaign
  • AlbaNova Universitetscentrum
  • University of Illinois at Urbana-Champaign

External person

Xijing Zhang

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Center of Advanced Materials for the Purification of Water with Systems
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Karthik

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Darshan Chalise

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

Thomas Schwarz-Selinger

  • EURATOM Association
  • Iowa State University
  • Max Planck Institute for Plasma Physics
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Centre for Interdisciplinary Plasma Science
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • EURATOM Association, Germany
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. A. Bennett

  • Arizona State University
  • Department of Physics, Arizona State University
  • Department of Physics and Astronomy
  • Department of Physics

External person

Johannes Kimling

  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. Vailionis

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Kenneth E. Goodson

  • Stanford University
  • Department of Mechanical Engineering, Stanford University
  • IBM Zurich Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering, Stanford University
  • Mechanical Engineering Department
  • Department of Electrical Engineering, Stanford University
  • High Temperature Gasdynamics Laboratory
  • Department of Metarials/Engineering
  • Department of Metarials/Engineering
  • IBM
  • University of Illinois at Urbana-Champaign
  • Stanford University

External person

Li Shi

  • University of Texas at Austin
  • Department of Mechanical Engineering, University of Texas
  • Mechanical Engineering Department, University of Texas at Austin
  • Department of Mechanical Engineering
  • Department of Mechanical Engineering
  • Materials Science and Engineering Program
  • University of Texas System

External person

Eric Pop

  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Stanford University
  • Stanford University
  • Department of Electrical and Computer Engineering
  • Electrical Engineering, Stanford University
  • Intel
  • Bldg 500
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Electrical Engineering
  • Beckman Institute for Advanced Science and Technology
  • Micro and Nanotechnology Lab
  • Department of Mechanical Engineering
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering
  • Department of Electrical Engineering and Precourt Institute for Energy
  • Dept. of Electrical
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Bryan C. Gundrum

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Akash Rai

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaoyuan Hu

  • AlliedSignal
  • Research Engineer
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sergei Shenogin

  • Rensselaer Polytechnic Institute
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Shawn A. Putnam

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jungwoo Shin

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign

External person

Elynn Jensen

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Bing Lv

  • Physics Department
  • University of Texas at Dallas

External person

Dongwook Oh

  • University of Illinois Urbana-Champaign
  • Korea Institute of Machinery and Materials
  • Energy Plant Research Division
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kexin Yang

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ngoc T. Nguyen

  • University of Oregon
  • Department of Chemistry
  • Department of Chemistry and Materials Science Institute, University of Oregon

External person

Xiaojia Wang

  • University of Minnesota
  • Department of Materials Science and Engineering
  • University of Minnesota Twin Cities
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Kisung Kang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • Humboldt University of Berlin
  • University of Illinois at Urbana-Champaign

External person

Sheng Li

  • University of Texas at Dallas
  • Physics Department

External person

D. G. Schlom

  • Stanford University
  • Cornell University
  • Kavli Institute at Cornell for Nanoscale Science
  • Pennsylvania State University
  • Department of Electrical Engineering, Stanford University
  • Department of Materials Science and Engineering, Stanford University
  • Department of Materials Science and Engineering, Cornell University
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering, Cornell University
  • Department of Electrical Engineering, Stanford University
  • Department of Materials Science and Engineering
  • Materials Science and Engineering
  • Department of Electrical Engineering
  • Department of Materials Science and Engineering
  • Kavli Institute
  • Leibniz Institute for Crystal Growth
  • Stanford University
  • Kavli Institute at Cornell for NanoScale Science

External person

Wai Lun Chan

  • University of Illinois at Urbana-Champaign

External person

Simon R. Phillpot

  • Argonne National Laboratory
  • University of Florida
  • Department of Materials Science and Engineering, University of Florida
  • Materials Science Division, Argonne National Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Materials Science Division
  • The University of Chicago
  • Argonne National Laboratory

External person

T. Tong

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhenbin Ge

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Andrew J. Bullen

  • San Disk Corp.
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gang Chen

  • Massachusetts Institute of Technology
  • Department of Mechanical Engineering, Massachusetts Institute of Technology
  • University of California, Los Angeles
  • Department of Mechanical Engineering
  • Department of Mechanical and Aerospace Engineering
  • Hatsopoulos Microfluids Laboratory
  • University of California at San Diego
  • University of California at Los Angeles

External person

S. K. Watson

  • Lab. of Atom./Solid State Physics
  • Cornell University

External person

B. C. Daly

  • Physics and Astronomy Department, Vassar College
  • Vassar College
  • Physics and Astronomy Department

External person

C. P. Grigoropoulos

  • University of California, Berkeley
  • Iowa State University
  • Department of Mechanical Engineering, University of California
  • Department of Mechanical Engineering
  • University of California at Berkeley

External person

Ji Yong Park

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Chang Ki Min

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Ma

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Brian W. Karr

  • Seagate Technology
  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Baoxia Mi

  • University of Illinois Urbana-Champaign
  • University of Maryland, College Park
  • Yale University
  • Department of Chemical Engineering
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Department of Civil and Environmental Engineering
  • Center of Advanced Materials for the Purification of Water with Systems
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Paul Zschack

  • Argonne National Laboratory
  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • The University of Chicago
  • UNICAT
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • United States Department of Energy
  • University of Illinois at Urbana-Champaign

External person

Jonglo Park

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Scott Huxtable

  • Virginia Tech
  • University of Illinois Urbana-Champaign
  • Dept. Mat. Sci. Eng. Frederick S.
  • Department of Mechanical Engineering
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Virginia Polytechnic Institute and State University
  • University of Illinois at Urbana-Champaign

External person

A. Botchkarev

  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Fumiya Watanabe

  • University of Illinois at Urbana-Champaign

External person

Manohar H. Karigerasi

  • University of Illinois Urbana-Champaign
  • Dept. Mat. Sci. Eng. Mat. Res. Lab.
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. C. Kim

  • University of Illinois Urbana-Champaign
  • Department of Physics and the Seitz Materials Research Laboratory
  • Division of Chemistry
  • Naval Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Judith Kimling

  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Naisong Shan

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jeffrey A. Carter

  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, University of Illinois at Urbana Champaign
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • School of Chemical Sciences, University of Illinois at Urbana-Champaign, Noyes Laboratory
  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences

External person

Daner Abdula

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Beckman Inst. and Dept. of Elec.
  • Department of Physics
  • Department of Materials Science and Engineering
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Henry E. Fischer

  • Cornell University

External person

R. Ramesh

  • Bellcore
  • Department of Materials Science and Engineering, University of California
  • University of California, Berkeley
  • Lawrence Berkeley Laboratory
  • US Department of Energy
  • Lawrence Berkeley National Laboratory
  • United States Department of Energy
  • Telcordia Technologies
  • Materials Sciences Division
  • Department of Materials Science and Engineering
  • Department of Physics, University of California, Materials and Molecular Research Division
  • Materials Science Division
  • Department of Materials Science and Engineering
  • Department of Physics
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • Natl. Center for Electron Microscopy
  • Department of Materials Science and Engineering
  • University of California at Berkeley

External person

Bikram Bhatia

  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaoru Li

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Larry D. Stephenson

  • University of Illinois Urbana-Champaign
  • United States Army Engineer Research and Development Center
  • University of Illinois at Urbana-Champaign

External person

D. G. Park

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • IBM
  • IBM Semiconductor Research and Development Center
  • IBM Research
  • Center for Compound Semiconductor Microelectronics
  • IBM Semiconduct. Res./Devmt. Ctr.
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Reed

  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Kodambaka

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Benjamin Cho

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Marcel A. Wall

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Dept. Mat. Sci. Frederick Seitz M.
  • Dept. Mat. Sci. Frederick Seitz M.
  • Department of Materials Science
  • Departments of Materials Science and Engineering and Chemistry and the Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Matt Beekman

  • Oregon Institute of Technology
  • California Polytechnic State University, San Luis Obispo
  • Department of Physics

External person

Nak Hyun Seong

  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, University of Illinois at Urbana Champaign
  • Chem. and Life Sciences Laboratory
  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences

External person

Taner Ozel

  • National Institutes of Health
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Department of Physics
  • Laboratory of Chemical Physics
  • Seitz Materials Research Laboratory
  • Department of Physics
  • Department of Physics
  • Department of Physics
  • National Institutes of Health
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jeffrey W. Wood

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jun Ma

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Samuel Graham

  • Georgia Institute of Technology
  • School of Material Science and Engineering, Georgia Institute of Technology
  • Woodruff School of Mechanical Engineering

External person

Hanlin Wu

  • Physics Department
  • University of Texas at Dallas

External person

Tsung Han Tsai

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

A. Lagutchev

  • Box 01-6 CLSL
  • University of Illinois Urbana-Champaign
  • Purdue University
  • Departments of Chemistry
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • School of Chemical Sciences, University of Illinois at Urbana Champaign
  • Birck Nanotechnology Center
  • School of Chemical Sciences and Fredrick Seitz Materials Research Laboratory
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • School of Chemical Sciences, University of Illinois at Urbana-Champaign, Noyes Laboratory
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences

External person

L. I.U. Chuan-Pu

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Justin R. Serrano

  • MS 1310
  • Sandia National Laboratories
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • MS 1310

External person

R. S. Crandall

  • National Renewable Energy Laboratory

External person

David Broido

  • Department of Physics
  • Boston College
  • Department of Physics

External person

W. Siemons

  • Oak Ridge National Laboratory
  • University of California, Berkeley
  • University of Illinois Urbana-Champaign
  • Materials Science and Technology Division, Oak Ridge National Laboratory
  • Department of Physics, University of California, Materials and Molecular Research Division
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley

External person

Qiyin Lin

  • University of Oregon
  • Department of Physics
  • Department of Chemistry and Materials Science Institute, University of Oregon

External person

Jordan M. Dennison

  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • Department of Chemistry
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign

External person

Rebecca Cortez

  • Air Force Research Laboratory
  • Wright-Patterson AFB
  • Sensors Directorate
  • United States Army Engineer Research and Development Center
  • University of Illinois at Urbana-Champaign

External person

M. Tao

  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • University of South Carolina
  • Center for Compound Semiconductor Microelectronics
  • Beckman Institute for Advanced Science and Technology
  • Dept. of Elec. and Comp. Engineering
  • University of Illinois at Urbana-Champaign
  • University of South Carolina
  • University of Illinois at Urbana-Champaign

External person

Kenji Ohmori

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Copel

  • Arizona State University
  • IBM
  • Research Division

External person

Wei Wang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rachel A. Segalman

  • University of California, Berkeley
  • University of California at Santa Barbara
  • Lawrence Berkeley National Laboratory
  • Department of Chemical Engineering and Materials
  • Materials Department
  • Department of Chemical Engineering, University of California, Santa Barbara
  • Department of Chemical and Biomolecular Engineering
  • Joint Center for Artificial Photosynthesis
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • Materials Research Laboratory, University of California
  • Departments of Chemical Engineering and Materials
  • Department of Chemical and Biomolecular Engineering
  • University of California at Berkeley

External person

Mark C. Hersam

  • Northwestern University
  • University of Illinois Urbana-Champaign
  • Department of Medicine
  • Dept. Elec. Comp. Eng. Beckman I.
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Department of Materials Science and Engineering
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiao Liu

  • Naval Research Laboratory

External person

Fumiya Watanabe

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Myung Ho Bae

  • Korea Research Institute of Standards and Science
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Physics
  • Department of Physics
  • Division of Convergence Technology
  • Micro and Nanotechnology Lab
  • Department of Physics and the Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ella Kartika Pek

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. L. Feldman

  • George Mason University
  • Naval Research Laboratory
  • Department of Computation and Data Sciences
  • Center for Computational Materials Science

External person

Jingyu Huang

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Departments of Chemistry
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Jinchi Sun

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhaohui Wang

  • University of Illinois at Urbana-Champaign
  • School of Chemical Sciences

External person

R. M. Costescu

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jayakanth Ravichandran

  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • Materials Sciences Division
  • Applied Science and Technology Graduate Group
  • Materials Science Division
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • University of California at Berkeley
  • University of Southern California

External person

Matthew Highland

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Argonne National Laboratory
  • University of Illinois at Urbana-Champaign

External person

R. J. Hamers

  • University of Wisconsin-Madison
  • Northwestern University
  • Department of Chemistry, University of Wisconsin
  • University of Illinois Urbana-Champaign
  • Department of Chemistry
  • Environmental Chemistry and Technology Program
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Illinois at Urbana-Champaign

External person

Gaohua Zhu

  • Toyota Motor Engineering and Manufacturing North America, Inc.
  • Toyota Research Institute
  • Materials Research Department
  • Toyota Motor
  • Toyota Research Institute of North America

External person

Michael L. Chabinyc

  • University of California at Santa Barbara
  • Materials Research Laboratory, University of California
  • Harvard University
  • Materials Department
  • Departments of Chemical Engineering and Materials
  • Department of Chemistry, Harvard University
  • Harvard University

External person

Sushant Mahat

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

D. M. Photiadis

  • Naval Research Laboratory

External person

A. X. Levander

  • Lawrence Berkeley National Laboratory
  • University of California, Berkeley
  • Department of Materials Science and Engineering
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • Materials Science Division
  • Department of Materials Science and Engineering
  • University of California at Berkeley

External person

Austin S. Lyons

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hany H. Zaghloul

  • US Army Corps of Engineers Construction Engineering Research Laboratory
  • Industrial Operations Division, U.S. Army Constr. Eng. Laboratories
  • U.S. Army Constr. Eng. Laboratories
  • United States Army Engineer Research and Development Center
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Thomas H. Allen

  • JDS Uniphase

External person

Aaron J. Schmidt

  • University of Michigan, Ann Arbor
  • Boston University
  • Department of Mechanical Engineering, Boston University
  • Mechanical Engineering
  • Department of Mechanical Engineering
  • Massachusetts Institute of Technology

External person

Minjee Kang

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of California at Los Angeles
  • University of Illinois at Urbana-Champaign

External person

Ihab F. El-Kady

  • Sandia National Laboratory
  • Sandia National Laboratories
  • University of New Mexico
  • Department of Electrical and Computer Engineering

External person

Jörg Patscheider

  • Laboratory of Nanoscale Materials Science, EMPA
  • Empa
  • Swiss Federal Laboratories for Materials Science and Technology (Empa)

External person

N. Bernstein

  • Naval Research Laboratory
  • Center for Computational Materials Science

External person

Herman Heijmerikx

  • University of California, Berkeley
  • Department of Physics, University of California, Materials and Molecular Research Division
  • University of California at Berkeley

External person

Chen Chen

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. J. Mehl

  • Naval Research Laboratory

External person

Cheng Kang Mai

  • Center for Polymers and Organic Solids, University of California
  • University of California at Santa Barbara
  • Materials Research Laboratory, University of California
  • Department of Chemistry and Biochemistry, University of California, Santa Barbara

External person

Liwei Lin

  • University of California, Berkeley
  • Department of Mechanical Engineering, University of California
  • University of California at Berkeley
  • Tsinghua University

External person

Hseuh An Yang

  • University of California, Berkeley
  • Department of Mechanical Engineering, University of California
  • University of California at Berkeley

External person

R. Zhang

  • Nanjing University
  • University of Illinois at Urbana-Champaign
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Timo Kuschel

  • Bielefeld University
  • University of Groningen
  • Physics Department
  • Physics of Nanodevices

External person

Nelson E. Coates

  • California Maritime Academy
  • California State University Maritime Academy
  • Lawrence Berkeley National Laboratory
  • The California State University
  • Materials Science Division, Lawrence Berkeley National Laboratory

External person

Oliver G. Schmidt

  • Institute for Integrative Materials, IFW Dresden
  • Institute for Integrative Nanosciences
  • Institute for Metallic Materials
  • Chemnitz University of Technology
  • Institute for Integrative Nanosciences
  • Material Systems for Nanoelectronics
  • Leibniz Institute for Solid State and Materials Research Dresden
  • Technische Universität Dresden

External person

Erik Lewin

  • Department of Chemistry, Ångström Laboratory, Uppsala University
  • Empa
  • Uppsala University
  • Swiss Federal Laboratories for Materials Science and Technology (Empa)
  • Laboratory of Nanoscale Materials Science, EMPA

External person

A. B. Mei

  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Shriram Ramanathan

  • Harvard University
  • Intel
  • Div. of Eng. and Applied Sciences
  • Intel Corp.
  • Harvard University
  • Purdue University

External person

Youn Seon Kang

  • Samsung Advanced Institute of Technology
  • Samsung
  • Samsung Advanced Institute of Technology
  • Semiconductor RandD Center
  • Semiconductor Device Laboratory

External person

Tae Yon Lee

  • Samsung Advanced Institute of Technology
  • Samsung
  • Samsung Advanced Institute of Technology
  • Semiconductor RandD Center
  • Semiconductor Device Laboratory

External person

Rahmi Ozisik

  • Rensselaer Polytechnic Institute
  • Department of Materials Science and Engineering

External person

Jung Hyun Lee

  • University of Illinois at Urbana-Champaign

External person

Mei Lin Chan

  • University of California, Berkeley
  • Department of Mechanical and Aerospace Engineering, University of California
  • University of California at Davis
  • Department of Mechanical and Aerospace Engineering
  • University of California at San Diego

External person

G. Glass

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Junqiao Wu

  • Lawrence Berkeley National Laboratory
  • University of California, Berkeley
  • University of California at Berkeley

External person

T. Watanabe

  • University of Florida

External person

Mari Gonzalez

  • University of Illinois Urbana-Champaign
  • Center of Advanced Materials for the Purification of Water with Systems
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Charles M. Brooks

  • Department of Materials Science and Engineering, Cornell University
  • Pennsylvania State University
  • Cornell University
  • Department of Materials Science and Engineering
  • Materials Science and Engineering

External person

Gregory R. Bogart

  • Symphony Acoustics, Inc.
  • Sandia National Laboratories
  • Lucent Technologies
  • Sandia National Laboratory
  • Alcatel-Lucent
  • Lucent
  • Nokia

External person

Guillermo C. Bazan

  • Center for Polymers and Organic Solids, University of California
  • University of California at Santa Barbara
  • Materials Department
  • Materials Research Laboratory, University of California
  • Department of Chemistry and Biochemistry, University of California, Santa Barbara

External person

D. Fu

  • Nanjing University
  • University of California, Berkeley
  • Department of Materials Science and Engineering
  • Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials
  • Department of Materials Science and Engineering
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign

External person

Keith E. O'Hara

  • University of Illinois at Urbana-Champaign
  • Integrated Micromachines Inc.

External person

Torsten Huebner

  • Bielefeld University
  • Physics Department

External person

Matthias Falmbigl

  • Department of Chemistry and Materials Science Institute, University of Oregon
  • University of Oregon
  • Department of Chemistry

External person

J. Murray Gibson

  • Materials Research Laboratory
  • Agency for Science, Technology and Research, Singapore
  • University of Illinois Urbana-Champaign
  • Argonne National Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Materials Science Division, Argonne National Laboratory
  • Department of Materials Science
  • Materials Science Division, Argonne National Laboratory
  • Departments of Physics and Materials Science
  • Department of Physics
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Physics and Science
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • Argonne National Laboratory
  • United States Department of Energy
  • University of Illinois at Urbana-Champaign

External person

S. C. Chen

  • Iowa State University
  • University of California, Berkeley
  • Department of Mechanical Engineering, University of California
  • Department of Mechanical Engineering
  • University of California at Berkeley

External person

M. Katiyar

  • University of Illinois Urbana-Champaign
  • Indian Institute of Technology Kanpur
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. and Metall. Eng.
  • Department of Materials Science and the Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Christos G. Christodoulou

  • Electromagnetics Academy
  • University of New Mexico
  • Department of Electrical and Computer Engineering
  • Electromagnetics Academy
  • IEEE
  • Commission B ot USNC/URSI
  • Electromagnetics Academy
  • Eta Kappa Nu
  • Commission B ot USNC/URSI

External person

D. Gall

  • Rensselaer Polytechnic Institute
  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Iowa

External person

Valery Shklover

  • Swiss Federal Institute of Technology Zurich

External person

Humphrey J. Maris

  • Butler Hospital
  • Department of Physics, Brown University
  • Brown University
  • Dept. of Phys.

External person

Yinon Ashkenazy

  • Hebrew University of Jerusalem
  • University of Illinois Urbana-Champaign
  • Racah Institute of Physics, Hebrew University of Jerusalem
  • Racah Institute of Physics
  • Dept. of Mat. Sci. and Engineering
  • Racah Institute of Physics
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Materials Research Laboratory
  • Center Nanoscience & Nanotechnology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

L. Hultman

  • Linköping University
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University

External person

W. J. Schaff

  • Cornell University
  • School of Electrical Engineering
  • Department of Electrical and Computer Engineering

External person

D. A. Muller

  • Cornell University
  • Kavli Institute at Cornell for Nanoscale Science
  • School of Applied and Engineering Physics
  • Stanford University
  • Adelphi University
  • Boston University
  • Brunel University London
  • California Institute of Technology
  • Columbia University
  • National Institute for Nuclear Physics
  • University of Ferrara
  • University of Padua
  • University of Perugia
  • University of Pisa
  • University of California, Berkeley
  • Massachusetts Institute of Technology
  • Nagoya University
  • Rutgers - The State University of New Jersey, New Brunswick
  • Rutherford Appleton Laboratory
  • Tohoku University
  • University of British Columbia
  • University of California at Santa Barbara
  • University of California at Santa Cruz
  • University of Cincinnati
  • University of Colorado Boulder
  • University of Genoa
  • University of Illinois Urbana-Champaign
  • University of Massachusetts
  • University of Oregon
  • University of Tennessee, Knoxville
  • University of Victoria BC
  • University of Washington
  • University of Wisconsin-Madison
  • Vanderbilt University
  • Yale University
  • Colorado State University
  • Lawrence Berkeley National Laboratory
  • University of Mississippi
  • Sogang University
  • School of Applied and Engineering Physics
  • Sezione di Bologna
  • Istituto Nazionale di Fisica Nucleare
  • Istituto Nazionale di Fisica Nucleare
  • Istituto Nazionale di Fisica Nucleare
  • Istituto Nazionale di Fisica Nucleare
  • Istituto Nazionale de Fisica Nucleare Sezione di Ferrara
  • INFN
  • INFNSezione di Padova
  • High Energy Accelerator Research Organization, Tsukuba
  • Indiana University Bloomington
  • TRIUMF
  • Kavli Institute
  • Department of Applied Physics
  • Kavli Institute
  • Kavli Institute at Cornell for NanoScale Science

External person

Beomjin Kwon

  • MC-244
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Beckman Institute for Advanced Science and Technology
  • School for Engineering of Matter
  • Arizona State University
  • School for Engineering of Matter, Transport and Energy (SEMTE)
  • Mechanical and Aerospace Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. M. Tromp

  • Arizona State University
  • IBM

External person

P. H Michael Böttger

  • Laboratory of Nanoscale Materials Science, EMPA
  • Empa
  • Swiss Federal Laboratories for Materials Science and Technology (Empa)
  • Swiss Federal Institute of Technology Zurich
  • Laboratory of Crystallography
  • Laboratory for Surface Science and Technology

External person

P. K. Schelling

  • Argonne National Laboratory
  • Materials Science Division, Argonne National Laboratory
  • University of Central Florida
  • Adv. Mat. Proc. and Analysis Center
  • AMPAC
  • Department of Physics
  • The University of Chicago
  • Argonne National Laboratory

External person

Matthias Sobiech

  • Oerlikon Balzers Coating AG

External person

Liping Xue

  • Rensselaer Polytechnic Institute
  • Department of Materials Science and Engineering

External person

D. A. Papaconstantopoulos

  • George Mason University
  • Naval Research Laboratory
  • Department of Computation and Data Sciences

External person

Ana M. Saenz De Jubera

  • University of Illinois Urbana-Champaign
  • Center of Advanced Materials for the Purification of Water with Systems
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Safe Global Water Institute
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Justin Kardel

  • University of California, Berkeley
  • Department of Materials Science and Engineering
  • University of California at Berkeley

External person

Oksen T. Baris

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Scienceand Engineering
  • Department of Mechanical Engineering and Sciences
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Kijoon H.P. Kim

  • Samsung
  • Samsung Advanced Institute of Technology

External person

T. Spila

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science
  • Center for Microanalysis of Materials
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Noel S. Gunning

  • University of Oregon
  • Department of Chemistry and Materials Science Institute, University of Oregon

External person

David A. Horsley

  • University of California, Berkeley
  • Department of Mechanical and Aerospace Engineering, University of California
  • University of California at Davis
  • Department of Electrical and Computer Engineering, University of California
  • Department of Mechanical and Aerospace Engineering
  • University of California at San Diego

External person

Joonki Suh

  • University of California at Berkeley
  • Lawrence Berkeley National Laboratory
  • The University of Chicago

External person

Torbjörn I. Selinder

  • Sandvik Coromant
  • AB Sandvik Coromant
  • Sandvik AB

External person

Yoonho Khang

  • Samsung Advanced Institute of Technology
  • Samsung
  • Samsung Advanced Institute of Technology
  • Semiconductor RandD Center
  • Semiconductor Device and Material Lab.
  • Semiconductor Device Laboratory

External person

Debasish Banerjee

  • Toyota Motor
  • Toyota Research Institute of North America

External person

Christopher R. Ryder

  • Northwestern University

External person

Alexei Lagoutchev

  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, University of Illinois at Urbana-Champaign, Noyes Laboratory
  • University of Illinois at Urbana-Champaign

External person

Erik C. Hadland

  • Department of Chemistry
  • University of Oregon

External person

Y. Wang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Brent A. Apgar

  • Department of Materials Science
  • International Institute for Carbon-Neutral Energy Research
  • University of Illinois Urbana-Champaign
  • University of California, Berkeley
  • Department of Materials Science and Engineering, University of California
  • Department of Materials Science and Engineering
  • International Institute for Carbon Neutral Research
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Kyushu University
  • University of Illinois at Urbana-Champaign
  • University of California at Berkeley
  • University of Illinois at Urbana-Champaign

External person

M. Yao

  • Dalian University of Technology
  • University of Florida
  • Department of Materials Science and Engineering
  • School of Materials Science and Engineering

External person

J. Schubert

  • Research Centre Jülich
  • JARA-FIT
  • Forschungszentrum Julich GmbH
  • Jülich Research Centre
  • Technische Universität Dresden
  • Research Centre J�lich
  • Peter Grünberg Institute (PGI9-IT)
  • Peter Gruenberg Institute 9
  • Institute of Bio- and Nano-Systems
  • Peter Gruenberg Institut (PGI-9)

External person

Chunhua Li

  • Department of Physics
  • Boston College
  • Department of Physics

External person

Keisuke Kawamura

  • Air Water Inc.

External person

Marc G. Ghossoub

  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Scienceand Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering and Sciences
  • Department of Mechanical Science and Engineering
  • Department of Mechanical and Science Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

S. J. Moon

  • Iowa State University
  • University of California, Berkeley
  • Department of Mechanical Engineering, University of California
  • University of California at Berkeley

External person

Arun Bodapati

  • Rensselaer Polytechnic Institute
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering

External person

Ki Bum Kim

  • Seoul National University
  • Department of Materials Science and Engineering, Research Institute of Advanced Materials, Seoul National University
  • Department of Materials Science and Engineering
  • Stanford University
  • School of Materials Science and Engineering
  • Materials Science and Engineering Department
  • Sch. of Mat. Science and Engineering
  • Department of Materials Science and Engineering
  • Stanford University

External person

M. Y. Lee

  • Arizona State University

External person

Alexander F. Goncharov

  • Carnegie Institution of Washington
  • CAS - Institute of Solid State Physics
  • Geophysical Laboratory
  • Key Laboratory of Materials Physics

External person

Min Ho Kwon

  • School of Materials Science and Engineering
  • Seoul National University
  • Department of Materials Science and Engineering

External person

Hadi Najar

  • University of California, Berkeley
  • Department of Electrical and Computer Engineering, University of California
  • University of California at Davis

External person

Cheolkyu Kim

  • Samsung Advanced Institute of Technology
  • Samsung
  • Samsung Advanced Institute of Technology
  • Semiconductor RandD Center
  • Semiconductor Device Laboratory

External person

Jianbo Liang

  • Osaka Metropolitan University

External person

Byoung Chul Min

  • Center for Spintronics Research, Korea Institute of Science and Technology
  • Korea Institute of Science and Technology

External person

J. R. Olson

  • Cornell University
  • Lab. of Atom./Solid State Physics
  • Astronomy Department
  • University of Maryland, College Park
  • Lockheed Martin

External person

T. Andrew Taton

  • University of Minnesota Twin Cities
  • University of Minnesota

External person

M. A. Zurbuchen

  • Aerospace Corporation
  • Argonne National Laboratory
  • University of California, Los Angeles
  • Electronics and Photonics Laboratory
  • Department of Microelectronics Technology
  • Materials Science Division
  • Department of Materials Science and Engineering
  • University of California at Los Angeles
  • Argonne National Laboratory

External person

Gerard C L Wong

  • University of California, Los Angeles
  • University of Illinois Urbana-Champaign
  • California NanoSystems Institute
  • California NanoSystems Institute
  • Department of Bioengineering
  • California NanoSystems Institute
  • Department of Chemistry and Biochemistry, University of California at Los Angeles
  • Dept. of Mat. Sci. and Engineering
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Physics
  • Beckman Institute for Advanced Science and Technology
  • Departments of Bioengineering
  • Department of Materials Science and Engineering
  • California NanoSystems Institute
  • Department of Physics
  • Department of Bioengineering
  • Deaprtment of Materials Science and Engineering
  • Department of Bioengineering
  • Departments of Bioengineering, and Chemistry and Biochemistry
  • California Nano-Systems Institute
  • Department of Bioengineering
  • California NanoSystems Institute
  • Department of Physics
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of California at Los Angeles
  • California NanoSystems Institute
  • University of Illinois at Urbana-Champaign

External person

Nian X. Sun

  • Northeastern University
  • Department of Electrical Engineering
  • LLC

External person

Fengyuan Yang

  • Ohio State University
  • Ohio State University

External person

K. Zhao

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Beniamin Zahiri

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hyewon Jeong

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Waclaw Swiech

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gavin Mitchson

  • Department of Chemistry
  • University of Oregon

External person

James L. Langer

  • Serionix Inc.
  • Serionix, Inc.
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

J. Economy

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • ATSP Innovations
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Materials Science and Engineering
  • Center of Advanced Materials for the Purification of Water with Systems
  • Department of Materials Science and Engineering
  • Department of Materials Science
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • ATSP Innovations Inc.
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Yinchuan Lv

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaoyuan Liu

  • Physics Department
  • University of Texas at Dallas
  • Chinese Academy of Agricultural Sciences
  • Northeast Agricultural University

External person

Shanhui Fan

  • Stanford University
  • Department of Electrical Engineering, Stanford University
  • E. L. Ginzton Laboratory, Department of Electrical Engineering, Stanford University
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Department of Electrical Engineering
  • Stanford University

External person

Clay Mortensen

  • University of Oregon
  • Department of Chemistry

External person

Shannon E. Murray

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Seokwoo Jeon

  • Columbia University
  • Korea Advanced Institute of Science and Technology (KAIST)
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois Urbana-Champaign
  • Korea Advanced Institute of Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • Korea Advanced Institute of Science and Technology
  • Seoul National University
  • Department of Materials Science and Engineering
  • Nanoscale Science and Engineering Center
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Sch. of Mat. Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Korea University

External person

H. Morkoc

  • Wright Laboratories
  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Wright-Patterson AFB
  • University of Liverpool
  • Department of Materials Science and Engineering
  • Center for Compound Semiconductor Microelectronics
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • Air Force Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Josh D. Wood

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Northwestern University
  • Micro and Nanotechnology Lab
  • Beckman Institute for Advanced Science and Technology
  • Department of Physics
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Daniel J. Shir

  • Dept. of Mat. Sci. and Engineering
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Department of Chemistry
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

N. E. Lee

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Sungkyunkwan University

External person

Kyung Jin Lee

  • Korea University
  • Department of Materials Science and Engineering
  • KU-KIST, Graduate School of Converging Science and Technology, Korea University

External person

Pawan Koirala

  • Physics Department
  • University of Texas at Dallas

External person

V. Petrova

  • University of Illinois Urbana-Champaign
  • Seitz Materials Research Laboratory
  • Department of Materials Science
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

S. A. Parikh

  • Arizona State University

External person

G. B. Gao

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Leslie M. Phinney

  • Sandia National Laboratories
  • University of Illinois Urbana-Champaign
  • Department of Mechanical and Industrial Engineering
  • Dept. of Mech. and Indust. Eng.
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

C. Dames

  • University of California at Riverside
  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • Materials Science Division, Lawrence Berkeley National Laboratory
  • Department of Mechanical Engineering
  • Mechanical Engineering
  • University of California at Berkeley

External person

Dong Seok Suh

  • Samsung Advanced Institute of Technology
  • Samsung
  • Semiconductor RandD Center
  • Semiconductor Device Laboratory

External person

Gerald D. Mahan

  • Pennsylvania State University
  • Department of Physics
  • Physics Department

External person

Chengtian Shen

  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Naoteru Shigekawa

  • Osaka Metropolitan University

External person

Mehmet F. Su

  • University of New Mexico
  • Department of Electrical and Computer Engineering

External person

H. Kim

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ho Ki Lyeo

  • Korea Research Institute of Standards and Science
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Robert Fischer

  • Department of Chemistry
  • University of Oregon

External person

Nathan J. Fritz

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ho Soon Yang

  • Pusan National University
  • Department of Physics

External person

Arvind Raviswaran

  • Cypress Semiconductor
  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • Cypress Semiconductor
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Phaedon Avouris

  • IBM
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

George Matamis

  • San Disk Corp.
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Colby L. Heideman

  • University of Oregon
  • Department of Chemistry

External person

Z. Fan

  • Materials Research Laboratory
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Center for Compound Semiconductor Microelectronics
  • Micro and Nanotechnology Lab
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Arvind Chari

  • University of California, Berkeley
  • Department of Materials Science and Engineering
  • University of California at Berkeley

External person

Achim Von Keudell

  • Max-Planck-Intitut fur Plasmaphysik
  • Max-Planck-Inst. fur Plasmaphysik
  • Max Planck Institute for Plasma Physics
  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hiroki Uratani

  • Air Water Inc.

External person

X. F. Xu

  • Purdue University
  • Department of Mechanical Engineering

External person

M. Shibahara

  • Osaka University
  • Department of Mechanical Engineering

External person

Madeleine P. Gordon

  • Lawrence Berkeley National Laboratory
  • Molecular Foundry, Lawrence Berkeley National Laboratory, Center of X-Ray Optics

External person

Yang Wang

  • Department of Physics and Astronomy
  • University of Delaware

External person

Yoshifumi Ikoma

  • Kyushu University
  • Department of Materials Science and Engineering

External person

Andrew K. Hafeli

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Matthew R. Rosenberger

  • Department of Mechanical Science and Engineering
  • University of Illinois Urbana-Champaign

External person

Dongbok Lee

  • Seoul National University
  • Department of Materials Science and Engineering

External person

Arun Ramanathan

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pei Yun Lin

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Pengcheng Sun

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

T. R. Anthony

  • General Electric Research and Development Center
  • General Electric

External person

H. Kaiser

  • University of Missouri
  • Research Reactor Center
  • University of Illinois at Urbana-Champaign

External person

Shi En Kim

  • The University of Chicago

External person

Yu Zhong

  • Columbia University
  • Department of Chemistry
  • The University of Chicago

External person

K. Miyazaki

  • Kyushu Institute of Technology
  • Department of Biological Functions and Engineering

External person

Benjamin A. Gray

  • Materials and Manufacturing Directorate
  • Wright-Patterson AFB
  • Air Force Research Laboratory

External person

Ying Fang

  • Rice University
  • University of Illinois Urbana-Champaign
  • School of Chemical Sciences, Fredrick Seitz Materials Research Laboratory, University of Illinois at Urbana-Champaign
  • School of Chemical Sciences, University of Illinois at Urbana Champaign
  • Department of Chemistry
  • University of Illinois at Urbana-Champaign

External person

K. Yubuta

  • Tohoku University

External person

Byung Ki Cheong

  • Korea Institute of Science and Technology
  • Thin Film Materials Research Center

External person

Zhan Shi

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kyung Min Lee

  • Materials and Manufacturing Directorate
  • Wright-Patterson AFB
  • Air Force Research Laboratory

External person

Siddharth Krishnan

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jeffrey Huang

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Daniel Grimm

  • Institute for Integrative Materials, IFW Dresden
  • Institute for Metallic Materials
  • Chemnitz University of Technology
  • Material Systems for Nanoelectronics

External person

T. D. Sands

  • Purdue University
  • And Birck Nanotechnology Center
  • School of Materials Engineering
  • School of Materials Engineering
  • School of Materials Engineering
  • School of Electrical and Computer Engineering

External person

John B. Cook

  • Xerion Advanced Battery Corporation
  • Xerion Advanced Battery Corp.

External person

Geethal Amila Gamage Udalamatta Gamage

  • Department of Physics
  • University of Houston

External person

Ali Shakouri

  • Purdue University
  • Birck Nanotechnology Center

External person

Karsten Rott

  • Fakultät fur Physik, Universität Bielefeld
  • Bielefeld University

External person

Wenrui Wang

  • Department of Physics and Astronomy
  • University of Delaware
  • University of Illinois Urbana-Champaign
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ian P. Blitz

  • University of Illinois Urbana-Champaign
  • Departments of Chemistry
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

R. H. Tait

  • Cornell University
  • Lab. of Atom./Solid State Physics

External person

Peng Zhao

  • Ohio State University
  • Ohio State University

External person

Jie Li

  • University of Michigan, Ann Arbor
  • University of Illinois at Urbana-Champaign
  • Institute of Geology, Chinese Academy of Geological Sciences

External person

Barry L. Zink

  • Department of Physics and Astronomy
  • University of Denver
  • Kavli Institute at Cornell
  • Cornell University

External person

J. Birch

  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • Linköping University

External person

Changdong Wei

  • Ohio State University
  • Ohio State University

External person

R. Ghisleni

  • Empa
  • Swiss Federal Laboratories for Materials Science and Technology (Empa)

External person

Hany H. Zaghlou

  • United States Army Engineer Research and Development Center

External person

Jaeuk Sung

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Michael S. Strano

  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Chemical Engineering, Massachusetts Institute of Technology
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Beckman Institute for Advanced Science and Technology
  • Department of Chemical Engineering
  • Seitz Materials Research Laboratory
  • Department of Chemical Engineering
  • University of Illinois at Urbana-Champaign

External person

Alexander C. Bornstein

  • Stanford University
  • Stanford University

External person

Joshua E. Goldberger

  • Ohio State University
  • Ohio State University

External person

Ankita Bhutani

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • 3M Materials Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Huan Yan

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Center of Advanced Materials for the Purification of Water with Systems
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jizhou Song

  • Zhejiang University
  • University of Miami
  • University of Illinois at Urbana-Champaign

External person

Hendrik Ohldag

  • Stanford University
  • Stanford University
  • United States Department of Energy
  • University of California at Santa Cruz
  • Stanford University

External person

Jin Gu Kang

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Seitz Materials Research Laboratory
  • Nanophotonics Research Center
  • Korea Institute of Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Stephanie L. Fronk

  • Center for Polymers and Organic Solids, University of California
  • University of California at Santa Barbara
  • Department of Chemistry and Biochemistry, University of California, Santa Barbara

External person

Yu Hsuan Tsao

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Krithik Puthalath

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jean Louis Barrat

  • Universite Claude Bernard Lyon 1
  • Université Grenoble Alpes
  • Université de Lyon
  • CNRS-UMR8549

External person

Yu Zhou

  • Yale University

External person

Yoshiki Sakaida

  • Air Water Inc.

External person

B. N. Pantha

  • Texas Tech University
  • Electrical and Computer Engineering

External person

J. Murray David

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rama Venkatasubramanian

  • Research Triangle Institute
  • RTI International
  • Center for Solid State Energetics
  • Center for Semiconductor Research
  • Center for Solid State Energetics

External person

D. B. Bergstrom

  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Suzanne L. Singer

  • University of California, Berkeley
  • Department of Mechanical Engineering
  • University of California at Berkeley

External person

Hwijong Lee

  • University of Texas at Austin

External person

C. J. Vineis

  • Wakonda Technologies
  • Massachusetts Institute of Technology
  • Lincoln Laboratory

External person

Othon Monteiro

  • University of California, Berkeley
  • Lawrence Berkeley National Laboratory
  • University of California at Berkeley

External person

Jeffrey J. Urban

  • Lawrence Berkeley National Laboratory
  • Molecular Foundry, Lawrence Berkeley National Laboratory, Center of X-Ray Optics
  • Materials Science Division, Lawrence Berkeley National Laboratory

External person

S. Guillon

  • Polytechnique Montreal
  • Ecole Polytechnique de Montreal
  • Groupe de Recherche en Physique et Technologie des Couches Minces

External person

K. Hattar

  • Sandia National Laboratories
  • University of Illinois Urbana-Champaign
  • Department of Radiation Solid Interactions
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Tennessee, Knoxville

External person

J. Tyler Gish

  • Northwestern University

External person

E. T. Swartz

  • Cornell University
  • Lab. of Atom./Solid State Physics

External person

Mohit Tuteja

  • University of Illinois Urbana-Champaign
  • University of Maryland, College Park
  • National Institute of Standards and Technology
  • Department of Materials Science and Engineering
  • Maryland Nanocenter
  • Center for Nanoscale Science and Technology
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Limei Tian

  • Dept. of Mechanical Engineering and Materials Science, Washington University
  • Washington University St. Louis
  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Biomedical Engineering
  • Texas A&M University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ralph Greif

  • University of California, Berkeley
  • University of California at Berkeley

External person

Jungwan Cho

  • Kyung Hee University
  • Stanford University
  • Department of Mechanical Engineering, Kyung Hee University
  • Stanford University

External person

K. Fushinobu

  • Tokyo Institute of Technology
  • Department of Mechanical and Control Engineering
  • Institute of Science Tokyo

External person

James H. Herbison

  • University of Illinois Urbana-Champaign
  • Safe Global Water Institute
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Anastassios Mavrokefalos

  • University of Texas at Austin
  • Department of Mechanical Engineering

External person

Rahul Panat

  • University of Illinois Urbana-Champaign
  • Depts. of Theor. and Appl. Mechanics
  • Dept. of Theoretical/Appl. Mechanics
  • Department of Theoretical Mechanics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

John D. Dow

  • Arizona State University
  • Department of Physics and Astronomy

External person

Yuhang Li

  • Northwestern University
  • Harbin Institute of Technology
  • Center for Engineering and Health
  • Zhejiang University
  • Beihang University
  • Solid Mechanics Research Center
  • Department of Civil and Environmental Engineering
  • School of Astronautics
  • Institute of Solid Mechanics
  • Department of Engineering Mechanics
  • School of Aeronautical Science engineering
  • Department of Civil and Environmental Engineering
  • Xi'an Jiaotong University
  • Huazhong University of Science and Technology

External person

T. Pradeep

  • Indian Institute of Technology Madras
  • Indian Institute of Technology Madras
  • Department of Chemistry

External person

H. X. Jiang

  • Texas Tech University
  • Electrical and Computer Engineering

External person

Piranavan Kumaravadivel

  • Yale University
  • Energy Sciences Institute
  • Mechanical Engineering and Materials Science

External person

K. Takahashi

  • Kyushu University
  • Department of Aeronautics and Astronautics

External person

Sanghyeon Kim

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Xiaojing Tan

  • Carnegie Institution of Washington
  • Geophysical Laboratory

External person

Jonathan Jacobsohn

  • University of Hamburg

External person

J. M O Zide

  • University of Delaware
  • Department of Electrical and Computer Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering

External person

Zhi Liang

  • Rensselaer Polytechnic Institute

External person

Roberto Merlin

  • University of Michigan, Ann Arbor
  • Department of Physics

External person

C. L. TIEN

  • University of California, Berkeley
  • Department of Mechanical Engineering
  • University of California at Berkeley

External person

Xiaohui Song

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • Seitz Materials Research Laboratory
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Robert Nidetz

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Tiangui You

  • CAS - Shanghai Institute of Microsystem and Information Technology

External person

Soumitra S. Sulekar

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Woochul Kim

  • Yonsei University
  • School of Mechanical Engineering

External person

L. S. Shuster

  • Ufa State Aviation Technological University
  • Ufa State Aviation Technical University
  • Ufa University of Science and Technology

External person

Wenhui Xu

  • CAS - Shanghai Institute of Microsystem and Information Technology

External person

Yuting Liu

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Fredrik Eriksson

  • Chalmers University of Technology

External person

Hyeuk Jin Han

  • Energy Science Institute, Yale University West Campus
  • Yale University
  • Sungshin Women's University

External person

John S. Cetnar

  • Wright-Patterson AFB
  • Air Force Research Laboratory

External person

Jacopo Buongiorno

  • Massachusetts Institute of Technology

External person

C. Felser

  • Max Planck Institute for Chemical Physics of Solids
  • Swiss Federal Institute of Technology Lausanne

External person

Z. Horita

  • Arizona State University
  • Kyushu University
  • Department of Materials Science and Engineering
  • International Institute for Carbon-Neutral Energy Research (WPI-I2CNER), Kyushu University

External person

Hans Peter Oepen

  • University of Hamburg

External person

G. A. Slack

  • General Electric Research and Development Center
  • General Electric

External person

Elizaveta Golubeva

  • Kiel University

External person

Xue Xiong

  • University of Florida
  • CAS - Institute of Engineering Thermophysics
  • University of Chinese Academy of Sciences

External person

Jungchul Lee

  • Sogang University
  • Georgia Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Mechanical Engineering
  • Woodruff School of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Micro and Nanotechnology Lab
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering, University of Illinois
  • Department of Mechanical Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Science and Engineering
  • Department of Mechanical Engineering
  • Korea Advanced Institute of Science and Technology
  • Beckman Institute for Advanced Science and Technology, Department of Mechanical Engineering, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. Stanley Williams

  • Hewlett-Packard
  • Hewlett Packard Enterprise

External person

Jingbei Liu

  • Yale University
  • Mechanical Engineering and Materials Science

External person

Shi En Kim

  • The University of Chicago

External person

Myoung Woo Yoo

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jonas Kurniawan

  • Department of Electronics and Communication Engineering
  • Tampere University of Technology
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Electronics and Communication Engineering
  • University of Illinois at Urbana-Champaign
  • Tampere University
  • University of Illinois at Urbana-Champaign

External person

R. G. Yang

  • University of Colorado Boulder
  • Department of Mechanical Engineering

External person

Victor Ho

  • University of California, Berkeley
  • Department of Chemical and Biomolecular Engineering
  • University of California at Berkeley

External person

Fei Tian

  • Department of Physics
  • University of Houston

External person

Padraic Shafer

  • Lawrence Berkeley National Laboratory
  • United States Department of Energy

External person

Eugenio Zallo

  • Institute for Integrative Materials, IFW Dresden
  • Institute for Metallic Materials

External person

Thomas Bublat

  • Max-Planck-Institut für Intelligente Systeme
  • Max Planck Institute for Intelligent Systems

External person

T. Inoue

  • Tokyo Institute of Technology
  • Department of Mechanical Sciences and Engineering
  • Institute of Science Tokyo

External person

N. Taylor

  • Department of Materials Science
  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • Hokkaido University
  • Rice University
  • University of Houston
  • University of Illinois at Urbana-Champaign

External person

Krishnamurthy Mahalingam

  • Air Force Research Laboratory
  • Wright-Patterson AFB
  • Materials and Manufacturing Directorate

External person

H. Morkoç

  • University of Illinois Urbana-Champaign
  • Materials Research Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Seitz Materials Research Laboratory
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yutaka Ohno

  • Tohoku University
  • Institute for Materials Research, Tohoku University

External person

Maxwell Schmitt

  • Air Force Research Laboratory
  • Wright-Patterson AFB
  • Materials and Manufacturing Directorate

External person

Bezuayehu Teshome

  • Institute for Integrative Materials, IFW Dresden
  • Institute for Metallic Materials

External person

Yuyi Wei

  • Northeastern University

External person

Maxime Szybowski

  • UBS AG
  • Union Bank of Switzerland

External person

Janak Tiwari

  • University of Utah

External person

Samy Merabia

  • Universite Claude Bernard Lyon 1
  • Université de Lyon

External person

Jr Wen Lin

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Y. Jia

  • Pennsylvania State University
  • Argonne National Laboratory
  • Cornell University
  • Department of Materials Science and Engineering
  • Materials Science and Engineering

External person

Jie Li

  • University of Illinois Urbana-Champaign
  • University of Michigan, Ann Arbor
  • CAS - Institute of Geology and Geophysics
  • Chinese Academy of Geological Sciences
  • Institute of Geology, Chinese Academy of Geological Sciences
  • Chinese Academy of Geological Sciences
  • Department of Geological Sciences
  • Department of Geology
  • Department of Geology
  • Department of Geology
  • Department of Geology, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Ravishankar Sundararaman

  • Rensselaer Polytechnic Institute

External person

Ho Won Jang

  • Seoul National University
  • Pohang University of Science and Technology

External person

Neville Sun

  • Northeastern University

External person

Che Hui Lee

  • Cornell University

External person

Tamlin D. Matthews

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Center of Advanced Materials for the Purification of Water with Systems
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

G. Dosbaeva

  • McMaster University
  • Department of Mechanical Engineering

External person

H. Lu

  • Nanjing University
  • Jiangsu Provincial Key Laboratory of Advanced Photonic and Electronic Materials

External person

Yuri Suzuki

  • Stanford University

External person

Katharina Theis-Bröhl

  • Ruhr University Bochum
  • Inst. Experimentalphysik / F.

External person

K. Harnacher

  • University of Missouri
  • Research Reactor Center

External person

Eden Rephaeli

  • Stanford University
  • E. L. Ginzton Laboratory, Department of Electrical Engineering, Stanford University
  • Stanford University

External person

Wei Wang

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Satoru Emori

  • Stanford University
  • Stanford University
  • Virginia Polytechnic Institute and State University

External person

Daizhen Li

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yun Suk Nam

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Monica L. Usrey

  • University of Illinois Urbana-Champaign
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • Beckman Institute for Advanced Science and Technology
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign

External person

Yifan He

  • Northeastern University

External person

S. D. Calawa

  • Massachusetts Institute of Technology
  • Lincoln Laboratory

External person

Gaurav Singhal

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Feifei Lian

  • Stanford University
  • University of Illinois Urbana-Champaign
  • Department of Electrical Engineering, Stanford University
  • Department of Electrical and Computer Engineering and Micro and Nanotechnology Laboratory
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign

External person

K. Yamamoto

  • Kobe Steel, Ltd.

External person

Kiran Sasikumar

  • Rensselaer Polytechnic Institute

External person

Raimar Rostek

  • Fraunhofer Institut für Physikalische Messtechnik
  • Fraunhofer - BW
  • Fraunhofer Institute for Physical Measurement Techniques

External person

V. C. Elarde

  • QPC Lasers, Inc.
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Micro and Nanotechnology Lab
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

John Q. Xiao

  • University of Delaware
  • Department of Physics and Astronomy

External person

Youngjong Kang

  • University of Minnesota Twin Cities
  • University of Minnesota

External person

Weijun Zhou

  • Dow Chemical

External person

Eugene J. Ragasa

  • University of Florida

External person

Theodore I. Kamins

  • Hewlett-Packard Laboratories
  • Hewlett-Packard

External person

Pramod Reddy

  • University of Michigan, Ann Arbor
  • Department of Materials Science and Engineering

External person

Ren Liang Yuan

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Seitz Materials Research Laboratory
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Intel

External person

Fauzia Mujid

  • The University of Chicago

External person

Y. Michiue

  • International Center for Materials Nanoarchitectonics (MANA), National Institute for Materials Science (NIMS)
  • National Institute for Materials Science (NIMS)
  • National Institute for Materials Science Tsukuba

External person

Ravi S. Prasher

  • Intel
  • Sheetak Inc.
  • Assembly Technology Development

External person

Keng Yuan Meng

  • Ohio State University
  • Department of Physics
  • Ohio State University
  • Washington University St. Louis
  • Tsinghua University
  • Massachusetts Institute of Technology

External person

John M. Woods

  • Yale University
  • Energy Sciences Institute
  • Mechanical Engineering and Materials Science
  • University of Essex

External person

Rasmus E. Christiansen

  • Technical University of Denmark

External person

L. D. Madsen

  • Linköping University
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University

External person

P. M. Norris

  • University of Virginia
  • Department of Mechanical and Aerospace Engineering

External person

Bin He

  • Ohio State University

External person

I. Kuzmych-Ianchuk

  • International Center for Materials Nanoarchitectonics (MANA), National Institute for Materials Science (NIMS)
  • National Institute for Materials Science (NIMS)
  • National Institute for Materials Science Tsukuba

External person

Tadatomo Suga

  • Meisei University

External person

J. A. Mundy

  • Cornell University
  • School of Applied and Engineering Physics, Cornell University
  • School of Applied and Engineering Physics

External person

Neil D. Treat

  • University of California at Santa Barbara
  • Materials Department

External person

Yanfu Lu

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yonggang Huang

  • Northwestern University
  • University of Illinois at Urbana-Champaign
  • University of Connecticut
  • Tsinghua University
  • Department of Chemistry
  • Center for Engineering and Health and Skin Disease Research Center
  • CAS - Institute of Semiconductors
  • University of Pennsylvania
  • Center for Engineering and Health
  • University of Illinois at Urbana-Champaign
  • Zhejiang University

External person

H. E. Patel

  • Indian Institute of Technology Madras
  • Indian Institute of Technology Madras
  • Department of Mechanical Engineering

External person

Hayder Al-Atabi

  • University of Technology- Iraq
  • Kansas State University

External person

Joseph Peoples

  • Air Force Research Laboratory
  • Wright-Patterson AFB
  • Materials and Manufacturing Directorate

External person

E. Breckenfeld

  • Materials Science and Technology Division, Code 6364, Naval Research Laboratory
  • Naval Research Laboratory
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

R. V K Mangalam

  • Department of Materials Science and Engineering
  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • Department of Materials Science
  • Department of Materials Science
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. Morkoç

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering
  • University of Liverpool
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Air Force Research Laboratory

External person

Maria G. Catarello

  • University of Illinois Urbana-Champaign
  • Department of Chemistry, Medical Scholars Program, College of Medicine, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

A. Malachias

  • Europ. Synchrt. Radiation Facility
  • European Synchrotron Radiation Facility
  • Universidade Federal de São Carlos
  • Universidade Federal de Minas Gerais
  • Departamento de Física

External person

Jangho Choi

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rui Ning

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

I. K. Robinson

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • Materials Research Laboratory
  • Department of Physics
  • University College London
  • Departments of Physics Astronomy
  • Department of Physics
  • Department of Physics
  • Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

H. Daiguji

  • The University of Tokyo
  • Department of Mechanical Engineering

External person

Bong Sub Lee

  • University of Illinois Urbana-Champaign
  • Invensas Corporation
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. Kycia

  • Lab. Nac. de Luz Síncrotron
  • Laboratório Nacional de Luz Síncrotron
  • Centro Nacional de Pesquisa em Energia e Materiais

External person

Polly A. Berseth

  • University of Oregon
  • Department of Chemistry and Materials Science Institute, University of Oregon

External person

Jared J. Lynch

  • Nanosys Inc.

External person

Ariana Ray

  • Cornell University

External person

Mitsuru Tabara

  • Kyushu University
  • Department of Mechanical Engineering

External person

S. G. Volz

  • CentraleSupélec
  • École Centrale Paris
  • Université Paris-Saclay
  • ComUE Paris-Saclay

External person

Paul W. Barone

  • Massachusetts Institute of Technology
  • University of Illinois Urbana-Champaign
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical Engineering
  • Department of Chemical and Biomolecular Engineering
  • Department of Chemical and Biomolecular Engineering
  • University of Illinois at Urbana-Champaign

External person

Heiner Linke

  • Box 118
  • Lund University
  • University of Oregon
  • Solid State Physics and the Nanometer Structure Consortium
  • Department of Physics
  • Solid State Physics and the Nanometer Structure Consortium

External person

Elke Arenholz

  • Lawrence Berkeley National Laboratory

External person

Mari I. González

  • University of Illinois Urbana-Champaign
  • Center of Advanced Materials for the Purification of Water with Systems
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • Department of Pathobiology, College of Veterinary Medicine, University of Illinois at Urbana-Champaign
  • 2522 VMBSB
  • University of Illinois at Urbana-Champaign

External person

Ruth A. Schlitz

  • Materials Research Laboratory, University of California
  • University of California at Santa Barbara
  • Materials Department

External person

Vinod K. Sangwan

  • Northwestern University

External person

S. C. Veldhuis

  • McMaster University
  • Department of Mechanical Engineering

External person

Urusa S. Alaan

  • Stanford University
  • Stanford University

External person

J. E. Sundgren

  • Linköping University
  • Department of Physics (IFM), Linköping University
  • University of Illinois Urbana-Champaign
  • Department of Materials Science
  • Materials Research Laboratory
  • Thin Film Physics Division, Department of Physics (IFM), Linköping University
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

I. Ferguson

  • University of North Carolina at Charlotte
  • Department of Electrical and Computer Engineering

External person

Y. L. Foo

  • University of Illinois at Urbana-Champaign

External person

Shane R. Allen

  • Department of Physics and Astronomy
  • University of Denver

External person

S. Jay Chey

  • University of Minnesota Twin Cities
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Bo Sun

  • National University of Singapore

External person

Haibo Gao

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mathew R. Rosenberger

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jason D. Forster

  • Lawrence Berkeley National Laboratory

External person

Donald A. Walko

  • Advanced Photon Source Argonne National Laboratory
  • Argonne National Laboratory
  • University of Illinois Urbana-Champaign
  • The University of Chicago
  • University of Illinois at Urbana-Champaign
  • United States Department of Energy

External person

William L. Henstrom

  • University of Illinois Urbana-Champaign
  • Department of Physics
  • University of Illinois at Urbana-Champaign

External person

Quynh P. Sam

  • Cornell University

External person

Shreyan Majumdar

  • University of Illinois at Urbana-Champaign

External person

K. A. Bratland

  • University of Illinois Urbana-Champaign
  • Dept. of Mat. Sci. and Engineering
  • University of Illinois at Urbana-Champaign

External person

Fengwen Mu

  • Waseda University

External person

Carlos H. Hidrovo

  • Mechanical Engineering Department, University of Texas at Austin
  • University of Texas at Austin
  • Stanford University
  • Department of Mechanical Engineering
  • Stanford University

External person

Jeffrey A. Eastman

  • Argonne National Laboratory
  • Materials Science Division
  • Materials Science Division, Argonne National Laboratory
  • The University of Chicago
  • Argonne National Laboratory

External person

Bhaskar Soman

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person