Network

Jenny Amos

Person: Academic

Girish Chowdhary

Person: Academic

Blake Everett Johnson

Person: Academic

Nigel D Goldenfeld

  • Physics - Maybelle Leland Swanlund Endowed Chair Emeritus, Professor Emeritus

Person: Academic

William Paul King

Person: Academic

Alexander Gerhard Schwing

Person: Academic

Ryan M. Corey

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Chicago
  • University of Illinois at Urbana-Champaign

External person

Suleyman S. Kozat

  • Koc University
  • IBM
  • Bilkent University
  • IBM Research
  • University of Illinois Urbana-Champaign
  • IBM
  • Department of ECE
  • Electrical and Electronics Department
  • Department of Electrical and Electronics Engineering
  • Department of Computer Engineering
  • EEE Department
  • Electrical and Electronics Engineering Department
  • Electrical Engineeirng and Electronics Department
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Electrial and Electronics Engineering Department
  • Department of Electrical Engineering
  • Electrical Engineering Department
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jun Won Choi

  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign
  • Hanyang University
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Ralf Koetter

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Institute for Communications Engineering
  • Technical University of Munich
  • Department of Electrical and Computer Engineering
  • IEEE
  • University of Wisconsin-Milwaukee
  • Dept. of Electr. Eng. and Comput. Sci.
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Global Foundries, Inc.
  • International Business Machines
  • Center for Compound Semiconductor Microelectronics
  • Beckman Institute for Advanced Science and Technology
  • Coordinated Science Laboratory
  • IBM
  • University of Illinois at Urbana-Champaign
  • Linköping University
  • University of Illinois at Urbana-Champaign

External person

Andrew J. Bean

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

James C. Preisig

  • Woods Hole Oceanographic Institution
  • Applied Ocean Physics and Engineering Department
  • JPAnalytics LLC

External person

Gregory W. Wornell

  • Massachusetts Institute of Technology
  • Lockheed Martin
  • Department of Electrical Engineering
  • Research Laboratory of Electronics, Massachusetts Institute of Technology
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology
  • Bar-Ilan University

External person

Jill K. Nelson

  • George Mason University
  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Byonghyo Shim

  • Korea University
  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign
  • Seoul National University
  • IEEE
  • School of Electrical Engineering
  • School of Information and Communication
  • Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University
  • Department of Electrical and Computer Engineering
  • Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Noyan C. Sevüktekin

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kyeongyeon Kim

  • Samsung Advanced Institute of Technology
  • Samsung
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Thomas J. Riedl

  • University of Illinois at Urbana-Champaign

External person

Georg Zeitler

  • Technical University of Munich
  • University of Illinois Urbana-Champaign
  • Institute for Communications Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Robert J. Drost

  • United States Army Research Laboratory
  • University of Illinois Urbana-Champaign
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Karen Guan

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

M. Tüchler

  • Technical University of Munich
  • Rheinmetall AG
  • University of Illinois Urbana-Champaign
  • Institute for Communications Engineering
  • Rheinmetall AG
  • Ludwig Maximilian University of Munich
  • Inst. for Communication Engineering
  • University of Illinois at Urbana-Champaign

External person

Ananya Sen Gupta

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • University of Illinois at Urbana-Champaign
  • Microsoft USA
  • Woods Hole Oceanographic Institution
  • Microsoft Research Asia
  • University of Illinois at Urbana-Champaign

External person

Sijung Yang

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

S. C. Lee

  • Academia Sinica Taiwan
  • Sungkyunkwan University
  • University of Sydney
  • Korea Institute of Science and Technology
  • CERN
  • Texas Tech University
  • Aristotle University of Thessaloniki
  • Technion-Israel Institute of Technology
  • Centro de Investigacion y de Estudios Avanzados del Instituto Politécnico Nacional
  • Insitute of Physics, Academia Sinica
  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Academia Sinica - Institute of Physics
  • University of Sheffield
  • University of Victoria BC
  • University of Bonn
  • Kyungpook National University
  • Dipartimento di Fisica
  • Kyungpook National University
  • NOVA University Lisbon
  • Transilvania University of Brasov
  • West University of Timisoara
  • University Politehnica of Bucharest
  • Korea University
  • Seoul National University
  • Vilnius University
  • IEEE
  • University of Adelaide
  • Yale University
  • Institute for High Energy Physics
  • Department of Physics
  • Institute of Physics, Academia Sinica
  • Department of Physics and Astronomy
  • Institute of Physics
  • Institute of Physics
  • Department of Physics
  • School of Physics
  • Communication Systems Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Nano-Photonics Center
  • Fachhochschule Wiener Neustadt
  • Department of Physics
  • Stony Brook University
  • Iowa State University
  • Department of Physics and Astronomy
  • University of Applied Sciences Wiener Neustadt
  • Department of Physics
  • University of Illinois at Urbana-Champaign
  • University of Sheffield
  • Stony Brook University
  • Iowa State University
  • University of Illinois at Urbana-Champaign

External person

Meir Feder

  • Tel Aviv University
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical Engineering - Systems
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of EE
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hyeon Min Bae

  • Finisar Corporation
  • Intersymbol Communications
  • Korea Advanced Institute of Science and Technology
  • University of Illinois Urbana-Champaign
  • Finisar Corporation
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Finisar Corporation
  • University of Illinois at Urbana-Champaign
  • II-VI Incorporated
  • University of Illinois at Urbana-Champaign

External person

Toros Arikan

  • University of Illinois Urbana-Champaign
  • Massachusetts Institute of Technology
  • University of Illinois at Urbana-Champaign
  • Rice University

External person

Chunwei Jethro Lam

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Grant Deane

  • University of California at San Diego

External person

Amir Weiss

  • Massachusetts Institute of Technology
  • Bar-Ilan University

External person

Gizem Tabak

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nam Ik Cho

  • Seoul National University
  • School of Electrical Engineering and Computer Sciences
  • Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University
  • School of Electrical Engineering
  • School of Electrical Engineering

External person

Thomas Riedl

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mehmet A. Donmez

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Hari Vishnu

  • National University of Singapore

External person

Manan Mittal

  • University of Illinois at Urbana-Champaign
  • Stony Brook University

External person

Seok Jun Lee

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Communication Systems Laboratory
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Alan V. Oppenheim

  • Massachusetts Institute of Technology
  • Department of Electrical Engineering
  • Research Laboratory of Electronics, Massachusetts Institute of Technology
  • Department of Electrical Engineering

External person

Yibo Jiang

  • Qualcomm Incorporated
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kanad Sarkar

  • University of Illinois at Urbana-Champaign

External person

David C. Munson

  • University of Michigan, Ann Arbor
  • University of Wisconsin-Milwaukee
  • University of Illinois Urbana-Champaign
  • Dept. of Electr. Eng. and Comput. Sci.
  • Department of Electrical Engineering, Coordinated Science Laboratory, University of Illinois
  • Real-Time Computing Laboratory
  • Department of Electrical Engineering and Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Departnent of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Rong Rong Chen

  • University of Utah
  • Department of Electrical and Computer Engineering

External person

Hong Wan

  • University of Utah
  • Department of Electrical and Computer Engineering

External person

Behrouz Farhang-Boroujeny

  • University of Utah
  • Department of Electrical and Computer Engineering

External person

Gerhard Kramer

  • Technical University of Munich
  • Texas Instruments
  • Institute for Communications Engineering

External person

Jaewon Choi

  • University of Illinois Urbana-Champaign
  • Department of Materials Science and Engineering and Frederick Seitz Materials Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jonathan Ashbrook

  • Intersymbol Communications
  • Finisar Corporation
  • International Business Machines
  • Global Foundries, Inc.
  • International Business Machines
  • IBM
  • II-VI Incorporated

External person

Seongwook Song

  • Samsung
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alper Tunga Erdogan

  • Koc University
  • Electrical and Electronics Department
  • EEE Department
  • Electrial and Electronics Engineering Department

External person

Aolin Xu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering and the Coordinated Science Laboratory
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. Radhakrishnan

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Naveen Verma

  • Princeton University
  • Department of Electrical Engineering
  • University of Illinois at Urbana-Champaign
  • EnCharge Ai

External person

Ali H. Sayed

  • University of California, Los Angeles
  • Department of Electrical Engineering
  • University of California at Los Angeles

External person

Upamanyu Madhow

  • University of California at Santa Barbara
  • Department of Electrical and Computer Engineering

External person

Rajan Narasimha

  • Texas Instruments
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • DSP Solutions R and D Center
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Nail Çadalli

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sen Tao

  • Princeton University
  • Department of Electrical Engineering

External person

Jungwoo Lee

  • Seoul National University
  • Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center, Seoul National University

External person

David Null

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Eliot B. Bethke

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Yongjie Zhuang

  • Stony Brook University

External person

Anthony Podkowa

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Bioacoustics Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. Shipley

  • University of Illinois Urbana-Champaign
  • Department of Veterinary Clinical Medicine
  • Department of Clinical Veterinary Medicine, College of Veterinary Medicine, University of Illinois
  • Department of Veterinary Clinical Medicine
  • Department of Veterinary Clinical Medicine
  • Department of Veterinary Clinical Medicine
  • Veterinary Pathobiology
  • University of Illinois at Urbana-Champaign

External person

Peter Kairouz

  • University of Illinois Urbana-Champaign
  • Stanford University
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Alphabet Inc.
  • University of Illinois at Urbana-Champaign
  • Stanford University
  • University of Illinois at Urbana-Champaign

External person

E. L. Daly

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Center for Compound Semiconductor Microelectronics
  • Electromagnetics Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Brian Ricconi

  • Creative Thermal Solutions
  • Inc.

External person

Omar Baltaji

  • University of Illinois Urbana-Champaign
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

P. J. Shargo

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Sanjiv Chopra

  • Intersymbol Communications

External person

Dariush Kari

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Naoki Tsuda

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Alexander Pagano

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jeff Ludwig

  • University of California at Irvine

External person

Evan M. Widloski

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rita J. Miller

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • University of Illinois at Urbana-Champaign

External person

Alexei Ashikhmin

  • Alcatel-Lucent
  • Lucent
  • Nokia

External person

Koeng Mo Sung

  • Seoul National University
  • University of Illinois Urbana-Champaign
  • School of Electrical Engineering

External person

M. J. Lopez

  • Massachusetts Institute of Technology
  • Department of Electrical Engineering and Computer Science

External person

Nargiz Kalantarova

  • Koc University
  • EEE Department
  • Electrical Engineering Department

External person

Rachel D. Switzky

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Minwei Lu

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

James Younce

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Rachel Learned

  • Lockheed Martin

External person

Jinki Park

  • Intersymbol Communications

External person

Yingyan Lin

  • Huazhong University of Science and Technology
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electronic Science and Technology
  • Rice University
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Eric Wood

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Gary Durack

  • University of Illinois Urbana-Champaign
  • UIUC Biotechnology Center
  • Flow Cytometry Facility
  • Department of Food Science and Human Nutrition
  • University of Illinois at Urbana-Champaign
  • Tekmill
  • University of Illinois at Urbana-Champaign

External person

Hans Andrea Loeliger

  • Swiss Federal Institute of Technology Zurich
  • (ISI) ETF E101

External person

Blake J. Landry

  • Ven Te Chow Hydrosystems Laboratory
  • University of Illinois Urbana-Champaign
  • Civil and Environmental Engineering, University of Illinois Urbana-Champaign
  • National Research Council Research
  • Naval Research Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

David Luengo

  • Universidad Carlos III de Madrid
  • Dept. de Teoria de la Senal

External person

Jerry O’Leary

  • Fast Radius, Inc

External person

Gema Piñero

  • Polytechnic University of Valencia
  • Institute of Telecommunications and Multimedia Applications

External person

Max Newberger

  • Fast Radius, Inc

External person

Austin Lu

  • University of Illinois at Urbana-Champaign

External person

Samuel Rylowicz

  • Fast Radius, Inc

External person

Elisabeth Bralts

  • University of Illinois at Urbana-Champaign

External person

Brian Stewart

  • Carle Foundation Hospital

External person

Lucas O’Bryan

  • University of Illinois at Urbana-Champaign

External person

R. D. Nowak

  • University of Wisconsin-Madison
  • Department of Electrical and Computer Engineering
  • University of Nevada, Reno
  • University of Wisconsin-Madison
  • University of Wisconsin-Madison
  • University of Wisconsin

External person

Daniel Baker

  • Fast Radius, Inc

External person

Luca Pizzuto

  • Fast Radius, Inc

External person

Derek J. Milner

  • Center for Advanced Study, Department of Cell and Developmental Biology, Molecular and Integrative, University of Illinois
  • University of Illinois Urbana-Champaign
  • Department of Cell and Development Biology
  • Regenerative Biology and Tissue Engineering
  • Departments of Molecular and Integrative Physiology
  • Institute for Genomic Biology, University of Illinois
  • Wallace H. Coulter Department of Biomedical Engineering
  • Georgia Institute of Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois

External person

Aditya Gupta

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Kyungtae Kim

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • Samsung
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Todd P. Coleman

  • Department of Bioengineering
  • University of California at San Diego
  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Department of Bioengineering
  • Department of Bioengineering
  • Department of Electrical and Computer Engineering
  • Department of Bioengineering
  • Coordinated Science Laboratory
  • University of Illinois at Urbana-Champaign
  • University of Illinois
  • Stanford University
  • University of Illinois at Urbana-Champaign

External person

S. L. Whitney

  • Massachusetts Institute of Technology

External person

Ethaniel Moore

  • University of Illinois at Urbana-Champaign

External person

Ik Cho Nam

  • Seoul National University
  • Coordinated Science Laboratory
  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Geert Leus

  • Delft University of Technology
  • Fac. EEMCS

External person

Andy Musser

  • Creative Thermal Solutions
  • Inc.

External person

John Kolaczynski

  • Fast Radius, Inc

External person

Davis J. McGregor

  • University of Illinois Urbana-Champaign
  • Department of Mechanical Science and Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • Inc

External person

Zhengnan Li

  • Northeastern University

External person

Jake Fava

  • University of Illinois at Urbana-Champaign

External person

G. S. Edelson

  • Massachusetts Institute of Technology

External person

Arya Nallanthighall

  • University of Illinois at Urbana-Champaign

External person

A. Chockalingam

  • Indian Institute of Science Bangalore

External person

Rong Rong Chen

  • University of Utah

External person

Riccardo Raheli

  • University of Parma

External person

Shandra Jamison

  • University of Illinois at Urbana-Champaign

External person

A. O. Hero

  • University of Michigan, Ann Arbor
  • Department of EECS
  • Dept. Elec. Eng. and Comp. Science
  • Department of Electrical Engineering and Computer Science

External person

Milica Stojanovic

  • Department of Electrical and Computer Engineering
  • Northeastern University
  • Massachusetts Institute of Technology

External person

Ralf Moller

  • University of Illinois at Urbana-Champaign

External person

Thomas J. Riedl

  • University of Illinois at Urbana-Champaign

External person

Aseem V. Borkar

  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

C. S. McGahey

  • Georgia Institute of Technology
  • Sch. of History Technology/Society

External person

Eugene Church

  • United States Army
  • ARDEC

External person

Brian Pianfetti

  • University of Illinois Urbana-Champaign
  • Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign

External person

Nicole Herndon

  • University of Illinois at Urbana-Champaign

External person

Dror Baron

  • Rice University
  • University of Illinois Urbana-Champaign
  • IEEE
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Min Sun Keel

  • University of Illinois Urbana-Champaign
  • Samsung
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Zhengchang Kou

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Jonathan Mosley

  • University of Illinois at Urbana-Champaign

External person

John R. Buck

  • ECE Department
  • University of Massachusetts Dartmouth

External person

N. C. Soldner

  • University of Illinois Urbana-Champaign
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Adam C. Faust

  • University of Illinois Urbana-Champaign
  • Intel
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Frances Shin

  • BAE Systems

External person

Michael L. Philpott

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Mario A T Figueiredo

  • Instituto Superior Tecnico Lisboa
  • Technical University of Lisbon
  • University of Lisbon

External person

Charles Wood

  • Fast Radius, Inc
  • Inc

External person

Chin Hui Lee

  • Georgia Institute of Technology
  • Electrical and Computer Engineering

External person

Matthew D. Skarha

  • University of Illinois Urbana-Champaign
  • University of Illinois at Urbana-Champaign

External person

Courtney Hayes

  • University of Illinois at Urbana-Champaign

External person

Bin Yu

  • University of California, Berkeley
  • Department of Statistics 3860
  • University of California at Berkeley

External person

Rachael Dietkus

  • University of Illinois at Urbana-Champaign

External person

Cory Myers

  • BAE Systems

External person

Marcello Rubessa

  • University of Illinois Urbana-Champaign
  • Department of Animal Sciences
  • Institute for Genomic Biology, University of Illinois
  • Dept. Animal Sciences
  • University of Illinois at Urbana-Champaign

External person

Alex Pille

  • Fast Radius, Inc

External person

Weiwei Zhou

  • George Mason University

External person

Amir Houmansadr

  • University of Texas at Austin
  • University of Illinois Urbana-Champaign
  • University of Massachusetts
  • Department of Computer Science
  • Department of Electrical and Computer Engineering, Beckman Institute for Advanced Science and Technology
  • Department of Electrical and Computer Engineering
  • Computer Science, University of Illinois at Urbana-Champaign
  • UT Austin
  • University of Illinois at Urbana-Champaign
  • UIUC
  • University of Illinois School of Dentistry
  • University of Illinois at Urbana-Champaign
  • Department of Computer Science

External person

Or Ordentlich

  • School of Computer Science and Engineering
  • Hebrew University of Jerusalem

External person