Engineering
Interconnects
100%
Electric Lines
67%
Time Domain
53%
Finite Element Analysis
39%
SPICE
26%
Equivalent Circuit
25%
Electromagnetic Analysis
23%
Dielectrics
23%
Transients
22%
Frequency Domain
19%
Waveguide
19%
Green's Functions
16%
Power Distribution
16%
Multigrid
15%
Ground Plane
15%
Discrete Model
14%
Two Dimensional
14%
Fem Model
14%
Electric Power Distribution
13%
Boundary Condition
13%
Length Unit
13%
Macromodel
12%
Computational Efficiency
11%
Transient Analysis
11%
Integrated Circuit
11%
Numerical Experiment
11%
Scattering Parameters
11%
Computer Aided Design
11%
Power Grid
11%
Reduced Order Model
11%
Printed Circuit Board
10%
Finite Element Approximation
9%
Numerical Solution
9%
Discretization
9%
Equivalent Circuit Model
9%
Skin Effect
9%
Closed Form
9%
Integral Method
8%
Maxwell's Equation
8%
Electric Field
8%
Domain Decomposition
8%
Numerical Example
7%
Truncation
7%
Computational Complexity
7%
Anisotropic
7%
Numerical Stability
7%
Crosstalk
7%
Circuit Model
7%
Current Distribution
6%
Illustrates
6%
Keyphrases
Proposed Methodology
32%
Electromagnetic Modeling
31%
Frequency Dependence
30%
Model Order Reduction
28%
Transmission Line
26%
Electromagnetic Analysis
23%
Interconnected Structure
21%
Partial Element Equivalent Circuit
19%
Lossy
18%
High-speed Interconnects
18%
Finite Element Modeling
16%
Multiconductor Transmission Lines
15%
Two Dimensional
15%
Spices
14%
Power Distribution Network
14%
S-parameters
14%
Green's Function
14%
Macromodeling
14%
Electromagnetic Model
13%
Macromodel
13%
Order Reduction
13%
Discrete Model
12%
Finite Element Method
12%
Multi-conductor
12%
Multiport
12%
Numerical Stability
11%
Computational Efficiency
11%
Transient Simulation
11%
Finite-difference Time-domain
11%
Finite Element
11%
Numerical Experiments
11%
Signal Integrity
11%
Numerical Results
11%
Transient Analysis
10%
Electromagnetic Scattering
10%
Finite Element Approximation
10%
Rational Functions
10%
Rational Function Fitting
10%
Perfectly Matched Layer
10%
Adaptive Integral Method
10%
Transmission Line Model
10%
Electromagnetic Devices
9%
Electromagnetic Field
9%
Multigrid
9%
SPICE-compatible
9%
Computationally Efficient
9%
Power Plane
9%
High-speed Links
9%
Printed Circuit Board
9%
On chip
9%
