Engineering & Materials Science
Electric lines
Rational functions
Integral equations
Equivalent circuits
SPICE
Networks (circuits)
Green's function
Electromagnetic fields
Scattering
Computer simulation
Maxwell equations
Waveguides
Finite element method
Packaging
Acoustic impedance
Substrates
Scattering parameters
Inductance
Uncertainty
Electromagnetic waves
Electric power distribution
Integrated circuits
Transient analysis
Microstrip lines
Microwaves
Boundary conditions
Skin effect
Computational efficiency
Printed circuit boards
Geometry
Finite difference time domain method
Boundary value problems
Semiconductor materials
Convergence of numerical methods
Electric fields
Electromagnetic wave scattering
Multichip modules
Decomposition
Data storage equipment
Dielectric losses
Electrostatics
Fast Fourier transforms
Microwave devices
Simulators
Polynomials
Permittivity
Passive networks
Capacitance
Bandwidth
Macros
Physics & Astronomy
electromagnetism
methodology
transmission lines
finite difference time domain method
formulations
grids
approximation
rational functions
integral equations
perfectly matched layers
equivalent circuits
simulation
waveguides
conductors
electromagnetic fields
microwaves
matrices
impedance
mesh
strip
integrated circuits
computer aided design
chips
Green's functions
printed circuits
circuit boards
numerical stability
electromagnetic scattering
high speed
Maxwell equation
conduction
electromagnetic radiation
collocation
simulators
broadband
finite element method
boundary conditions
electromagnetic compatibility
preconditioning
electronics
decomposition
enclosure
scalars
method of moments
electromagnetic properties
boundary value problems
parallel plates
planar structures
eigenvalues
wire
Chemical Compounds
Electric lines
Packaging
SPICE
Networks (circuits)
Computer simulation
Integral equations
Multichip modules
Maxwell equations
Inductance
Electromagnetic fields
Boundary conditions
Scattering
Green's function
Electric power distribution
Finite difference time domain method
Uncertainty
Capacitance
Helmholtz equation
Substrates
Chip scale packages
Surface emitting lasers
Transient analysis
Optical interconnects
Acoustic impedance
