Andreas C Cangellaris

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Research Output

Support Vector Regression-Based Active Subspace (SVR-AS) Modeling of High-Speed Links for Fast and Accurate Sensitivity Analysis

Ma, H., Li, E. P., Cangellaris, A. C. & Chen, X., Jan 1 2020, In : IEEE Access. 8, p. 74339-74348 10 p., 9068208.

Research output: Contribution to journalArticle

Open Access
  • Comparison of Machine Learning Techniques for Predictive Modeling of High-Speed Links

    Ma, H., Li, E. P., Cangellaris, A. C. & Chen, X., Oct 2019, 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019. Institute of Electrical and Electronics Engineers Inc., 9073018. (2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Deep Learning Method for Prediction of Planar Radiating Sources from Near-Field Intensity Data

    Ma, H., Li, E. P., Schutt-Aine, J. & Cangellaris, A. C., Jul 2019, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019. Institute of Electrical and Electronics Engineers Inc., p. 610-615 6 p. 8825271. (2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Stochastic LIM for Transient Solution of Electromagnetic and Circuit Problems with Uncertainties

    Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., May 10 2019, 2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019. Institute of Electrical and Electronics Engineers Inc., 8712858. (2019 International Applied Computational Electromagnetics Society Symposium in Miami, ACES-Miami 2019).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

  • Adaptive wavelet stochastic collocation for resonant transmission line circuits

    Yang, A. S., Chen, X., Schutt-Aine, J. E. & Cangellaris, A. C., Apr 2 2018, 2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017. Institute of Electrical and Electronics Engineers Inc., p. 1-3 3 p. (2017 IEEE 26th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2017; vol. 2018-January).

    Research output: Chapter in Book/Report/Conference proceedingConference contribution